KR20070024824A - Laser thermal transfer imaging method and fabricating method of organic light emitting diode using the same - Google Patents

Abstract

A laser induced thermal imaging apparatus and a method of manufacturing an organic light emitting diode using the same are provided to firmly attach an acceptor substrate to a donor film by using a magnetic force, which is generated between a permanent magnet on the donor film and a magnetic unit on the acceptor substrate. An acceptor substrate(270) is positioned on a substrate stage(220) inside reaction chambers(200a,200b). A magnetic material is formed on at least one surface of the acceptor substrate. A donor film(280) to include a permanent magnet layer is formed on the acceptor substrate. The donor film is laminated on the acceptor substrate by using a magnetic force generated between the magnetic material on the donor film and the permanent magnet on the acceptor substrate. A laser beam is irradiated on the donor film, so that at least a portion of a transfer layer is transferred on the acceptor substrate.

Description

LASER THERMAL TRANSFER IMAGING METHOD AND FABRICATING METHOD OF ORGANIC LIGHT EMITTING DIODE USING THE SAME}

1 is a partial cross-sectional view of a laser thermal transfer apparatus according to the prior art.

2A to 2H are step-by-step cross-sectional views of a process for explaining the laser thermal transfer method according to an aspect of the present invention.

3 is a cross-sectional view showing a first embodiment of a laser transfer donor film according to the present invention.

Figure 4 is a cross-sectional view showing a second embodiment of the laser transfer donor film according to the present invention.

5 is a cross-sectional view showing a third embodiment of the donor film for laser transfer according to the present invention.

6 is a cross-sectional view showing a fourth embodiment of the laser transfer donor film according to the present invention.

7 is a cross-sectional view showing a first embodiment of an acceptor substrate according to the present invention.

8 is a cross-sectional view showing a second embodiment of an acceptor substrate according to the present invention.

9 is a sectional view showing a third embodiment of an acceptor substrate according to the present invention.

10A to 10E are cross-sectional views illustrating a method of manufacturing an organic light emitting diode according to another aspect of the present invention.

♣ Explanation of symbols for the main parts of the drawing ♣

280, 1200: donor film 270: acceptor substrate

200a: process chamber 200b: transfer chamber

222: first mounting groove 221: second mounting groove

271, 330, 420: permanent magnets 530, 620: permanent magnet nanoparticles

The present invention relates to a laser thermal transfer method and a method of manufacturing an organic light emitting device using the same. More specifically, when the organic film layer is formed on an acceptor substrate using a laser thermal transfer method, a donor film and an acceptor substrate are formed by magnetic force. The present invention relates to a laser thermal transfer method capable of laminating and an organic light emitting device using the same.

Among the methods of forming the organic film layer, the deposition method is a method of forming an organic film layer by vacuum depositing an organic light emitting material using a shadow mask, and it is difficult to form a high-definition fine pattern by deformation of the mask. Difficult to apply

In order to solve the problem of the vapor deposition method, an inkjet method of directly patterning an organic film layer has been proposed. The inkjet method is a method in which an organic film layer is formed by dissolving or dispersing a light emitting material in a solvent and discharging it from a head of an inkjet printing apparatus as a discharge liquid. The inkjet method has a relatively simple process, but has a problem of low yield and nonuniformity in film thickness, which is difficult to apply to a large-area display device.

On the other hand, a method of forming an organic film layer using a laser thermal transfer method has been proposed. In the laser thermal transfer method, a donor film including a base substrate, a light-heat conversion layer, and a transfer layer is irradiated with a laser to convert a laser beam passing through the base substrate into a heat in the light-heat conversion layer to expand the light-heat conversion layer, The transfer layer is bonded to the acceptor substrate by expanding the adjacent transfer layer. Laser thermal transfer is a laser-induced imaging process with inherent advantages such as high resolution pattern formation, film thickness uniformity, multilayer stacking capability, and scalability to large mother glass.

In the conventional laser thermal transfer method, it is preferable that the inside of the chamber in which the transfer is performed is performed in a vacuum state so as to be synchronized with the deposition process at the time of forming the light emitting device. However, when the laser thermal transfer is performed in a conventional vacuum state, foreign matters or spaces are generated between the donor film and the acceptor substrate, so that the transfer characteristics of the transfer layer are poor. Therefore, in the laser thermal transfer method, a method of laminating a donor film and an acceptor substrate has an important meaning, and various methods for solving this problem have been studied.

Hereinafter, with reference to the drawings will be described in detail the laser thermal transfer method and the laser thermal device according to the prior art.

1 is a partial cross-sectional view of a laser thermal transfer apparatus according to the prior art.

Referring to FIG. 1, the laser thermal transfer apparatus 100 includes a substrate stage 120 positioned inside the chamber 110 and a laser irradiation apparatus 130 positioned above the chamber 110.

The substrate stage 120 is used to sequentially position the acceptor substrate 140 and the donor film 150 introduced into the chamber 110. The substrate stage 120 includes the acceptor substrate 140 and the donor film ( The first mounting groove 121 and the second mounting groove 123 are formed to align the 150, respectively. The first mounting groove 121 is formed along the circumferential direction of the acceptor substrate 140, and the second mounting groove 123 is formed along the circumferential direction of the donor film 150. Typically, since the acceptor substrate 140 has a smaller area than the donor film 150, the acceptor substrate 140 may have a smaller first mounting groove 121 than the second mounting groove 123.

At this time, the first mounting groove 121 and the vacuum do not maintain the inside of the chamber 110, the laser thermal transfer is made in order to lamination without foreign matter or space between the acceptor substrate 140 and the donor film 150 The pipes 161 and 163 are connected to one lower portion of the second mounting groove 123, and suctioned by the vacuum pump P to bond the acceptor substrate 140 and the donor film 150.

However, the method of adhering the acceptor substrate and the donor film by the vacuum pump does not maintain the vacuum state inside the chamber, unlike other processes of manufacturing the organic light emitting device maintains the vacuum state. There is a problem that adversely affects.

Therefore, the present invention is an invention devised to solve the above-mentioned conventional problems, the object of the present invention, while the laser thermal transfer is made in a vacuum state, there is no foreign matter or space between the donor film and the acceptor substrate, magnetic force The present invention provides a laser thermal transfer method for laminating a donor film and an acceptor substrate, and a method of manufacturing an organic light emitting device using the same.

In order to achieve the above object, the laser thermal transfer method according to the present invention comprises the steps of placing an acceptor substrate having a magnetic material formed on at least one surface on a substrate stage in a process chamber, and a donor including a permanent magnet layer on the acceptor substrate. Positioning the film, laminating the donor film and the acceptor substrate by a magnetic force acting between the magnetic material formed on the donor film and the permanent magnet of the acceptor substrate, and irradiating a laser on the donor film Transferring at least one region of the transfer layer onto the acceptor substrate.

Preferably, the donor film is formed on at least one surface of the substrate, the light-heat conversion layer formed on the substrate, the transfer layer formed on the light-heat conversion layer and the light-heat conversion layer. Contains permanent magnets. An interlayer insertion layer is further included between the light-to-heat conversion layer and the transfer layer.

The permanent magnet formed on the donor film is formed in the form of permanent magnet nanoparticles in the substrate or the light-heat conversion layer, and the magnetic material is Fe, Ni, Cr, Fe ₂ O ₃ , Fe ₃ O ₄ , CoFe ₂ O ₄ , It is any one selected from the group consisting of magnetic nanoparticles and mixtures thereof. The permanent magnet nanoparticles and the magnetic nanoparticles are formed by spin coating, E-Beam deposition, or inkjet method. It is preferable to include a magnetic support metal line formed on at least one surface of a driving power outer region formed on the acceptor substrate and a region other than the pixel region of the image display unit.

In the method of manufacturing an organic light emitting device using the laser thermal transfer method according to the present invention, an acceptor substrate transfer step of forming a pixel region on the substrate stage, positioning the acceptor substrate containing a magnetic material, and on the acceptor substrate A donor film transfer step of transferring a donor film including a permanent magnet to the light emitting layer, and a magnetic force between the magnetic material formed on the acceptor substrate and the permanent magnet included in the donor film. A lamination step of bonding a donor film, a transfer step of transferring the light emitting layer to the pixel definition film of the acceptor substrate by irradiating a laser to the donor film, and forming a second electrode layer on the light emitting layer and the pixel definition film. Steps.

Hereinafter, a laser thermal transfer method and a method of manufacturing an organic light emitting device using the same will be described in detail with reference to the drawings showing an embodiment of the present invention.

2A to 2H, an embodiment of a laser thermal transfer method according to the present invention will be described. The laser thermal transfer apparatus for performing the laser thermal transfer method according to the present invention includes the process chambers 200a and 200b, the substrate stage 220, and the laser oscillator 210.

The chamber may use a process chamber 200a used in a conventional laser thermal transfer apparatus, and the donor film 280 or the magnetic body 271 including a permanent magnet (not shown) may be disposed outside the process chamber 200a. A transfer chamber 200b including a robot arm 260, an end effector 261, and the like for transferring the acceptor substrate 270 into the process chamber 200a is provided. The gate valve 250 exists between the process chamber 200a and the transfer chamber 200b. The gate valve 250 serves to block the process chamber 200a and the transfer chamber 200b.

On the other hand, the substrate stage 220 may further include a driving means (not shown) for moving. For example, when the laser is irradiated in the longitudinal direction, it may further include a driving means for moving the substrate stage 220 in the horizontal direction.

In addition, the substrate stage 220 may have respective mounting means for accommodating and accepting the acceptor substrate 270 and the donor film 280. The mounting means includes an acceptor substrate 270 transferred into the process chamber 200a by a transfer means such as the robot arm 260 and the end effector 261 in the transfer chamber 200b at a predetermined position of the substrate stage 220. Make sure that it is mounted correctly.

In this embodiment, the mounting means may comprise a through hole (not shown), guide bars (231, 241), moving plates (230, 240), support (not shown) and mounting grooves (221, 222). have. In this case, the guide bars 231 and 241 move up or down in conjunction with the movable plates 230 and 240 and the support, while the guide bars 231 and 241 rise through the through holes and move the acceptor substrate 270. It accommodates and descends, and the acceptor substrate 270 is seated in the mounting grooves 221 and 222. In this case, in order to mount the acceptor substrate 270 and the donor film 280 at the correct position, the mounting grooves 221 and 222 may be formed to have an oblique wall surface.

The through hole is a hole formed in the substrate stage 220 so that the guide bars 231 and 241 supporting the donor film 280 and the acceptor substrate 270 can be moved up and down. In addition, the support supports the guide bars 231 and 241 and the movable plates 230 and 240 so as to be movable up and down, and is connected to a separate motor (not shown).

The laser oscillator 210 may be installed outside or inside the process chamber 200a, and the laser oscillator 210 may be installed to allow the laser to shine from above.

In the present embodiment applied to the fabrication of the organic light emitting device, the laser thermal transfer method includes an acceptor substrate 270 transfer step, a donor film 280 transfer step, a lamination step, and a transfer step.

The acceptor substrate 270 transfer step is to position the acceptor substrate 200a into the process chamber 200a of the laser thermal transfer apparatus. In this case, the acceptor substrate 270 including the magnetic material 271 is transferred to the transfer chamber. The end effector 261 is positioned on the end effector 261, which is a conveying means of the 200a. (FIG. 2A) Then, the end effector 261 is moved into the process chamber 200a by the robot arm 260, and the substrate stage 220 is disposed. The acceptor substrate 270 transferred into the process chamber 200a is supported by the guide bar 231 raised through the through hole. Then, the end effector 261 exits the process chamber 200a and moves back to the transfer chamber 200b. (FIG. 2C) The guide bar 231 supporting the acceptor substrate 270 is lowered again. The acceptor plate 270 is accurately positioned on the first mounting groove 222 of the substrate stage 220 (FIG. 2D).

The donor film 280 transfer step is performed in the process chamber 200a by a transfer means such as an end effector 261 attached to the robot arm 260 located in the transfer chamber 200b as in the transfer step of the acceptor substrate 270. In this case, the donor film 280 is preferably transported by the film tray 290 at the time of transport. The donor film 280 transferred into the process chamber 200a is supported by the guide bar 241 raised through the through hole. When the donor film 280 is supported by the guide bar 241, the end effector 261 moves out of the process chamber 200a by the robot arm 260 and moves back to the transfer chamber 200b (FIG. 2F). The guide bar 241 which supported the donor film 280 descends again, and correctly places the donor film 280 on the 2nd mounting groove 221 of the board | substrate stage 220 (FIG. 2G).

The lamination step is a magnetic attraction formed between the magnetic material 271 formed on the acceptor substrate 270 and the permanent magnet (not shown) formed on the donor film 280, and the acceptor substrate 270 and the donor film 280 are formed. It is a step of joining. At this time, since the inside of the process chamber 200a maintains a vacuum state, the generation of foreign matter or space between the donor film 280 and the acceptor substrate 270 is minimized, and the transfer efficiency is increased.

In the transfer step, a light emitting layer formed on the donor film 280 is irradiated with a laser on the donor film 280 and the donor film 280 laminated with the acceptor substrate 270. Transferring to the area and the opening. When the laser is irradiated, the light-to-heat conversion layer of the donor film 280 swells, so that the adjacent light emitting layer also swells in the direction of the acceptor substrate 270 so that the light emitting layer contacts the acceptor substrate 270. By doing so, the transcription is made (FIG. 2H).

Hereinafter, a laser thermal transfer donor film including a permanent magnet according to the present invention will be described. The donor film is a film having a transfer layer to be transferred to an acceptor substrate, and includes a substrate substrate, a light-to-heat conversion layer, and a transfer layer that are sequentially stacked. In this case, a buffer layer (not shown) and an interlayer insertion layer may be further included between the light-to-heat conversion layer and the transfer layer to improve performance.

The laser thermal transfer donor film according to the present invention includes a permanent magnet. In this case, at least one permanent magnet layer may be formed between the various layers of the donor film, or a permanent magnet composed of nanoparticles may be included in at least one of the layers.

3 is a cross-sectional view showing a first embodiment of a laser transfer donor film according to the present invention.

Referring to FIG. 3, the donor film includes a substrate substrate 310, a light-to-heat conversion layer 320, a permanent magnet layer 330, an interlayer insertion layer 340, and a transfer layer 350.

The base substrate 310 is a substrate serving as a supporter of the donor film, and is made of a transparent polymer, and the thickness thereof is preferably 10 μm to 500 μm. In this case, polyester, polyacryl, polyepoxy, polyethylene, polystyrene, etc. may be used as the transparent polymer, but is not limited thereto.

The light-to-heat conversion layer 320 is a layer made of a light-absorbing material that absorbs laser light and converts it into heat. The thickness of the light-to-heat conversion layer 320 depends on the light-absorbing material and the forming method used, but the metal or In the case of the metal oxide or the like, it is formed by vacuum deposition, electron beam deposition, or sputtering at 100 kPa to 5000 kPa. It is preferable.

When the thickness of the light-to-heat conversion layer 320 is formed to be thinner than the above range, the energy absorption rate is low so that the amount of energy converted from light to heat is reduced, so that the expansion pressure is lowered. Edge open defects may occur due to a step generated between the substrate and the acceptor substrate.

The light absorbing material composed of a metal or metal oxide or the like has an optical density of 0.1 to 0.4, and includes aluminum, silver, chromium, tungsten, tin, nickel, titanium, cobalt, zinc, gold copper, tungsten, molybdenum, lead, and the like. There is an oxide.

In addition, the photosynthetic material composed of the organic film includes a polymer to which carbon black, graphite, or infrared dye is added. In this case, examples of the material for forming the polymer binder resin include (meth) such as acrylic (meth) acrylate oligomer, ester (meth) acrylate oligomer, epoxy (meth) acrylate oligomer, urethane (meth) acrylate oligomer, and the like. Acrylate oligomers, or mixtures of such oligomer (meth) acrylate monomers, but are not limited thereto.

The permanent magnet layer 330 is a layer inserted to form a magnetic force with the magnetic material to be inserted into the acceptor substrate to be described later. For example, an Alnico magnet, a ferrite magnet, a rare earth magnet, a rubber magnet, a plastic magnet, or the like may be used.

Although not shown in the drawing, the buffer layer is a layer introduced between the permanent magnet layer 330 and the transfer layer 350 to improve the transfer characteristics of the transfer layer and the device life after the transfer, and is a metal oxide, a metal sulfide, or a nonmetal inorganic compound. However, polymer or low molecular weight organic materials can be used.

The interlayer insertion layer 340 is to protect the light-to-heat conversion layer 320, and preferably has a high thermal resistance, and may be formed of an organic or inorganic film.

The transfer layer 350 is a layer which is separated from the donor film and transferred to the acceptor substrate. When the transfer layer 350 is used for fabricating an organic light emitting device, the transfer layer 350 may be formed of a polymer or a low molecular weight organic light emitting material. In addition, to form an electron transport layer (ETL), an electron injection layer (EIL), a hole transport layer (HTL), a hole injection layer (HIL) may be made of a material suitable for each. At this time, the material of each transfer layer is not limited, any material that can be easily pursued by those skilled in the art is possible, and may be formed by extrusion, gravure, spin, knife coating, vacuum deposition, CVD, or the like.

As described above, by inserting the permanent magnet layer 330 into the donor film, the donor film has a magnetic property, and forms a mutual magnetic attraction with the acceptor substrate into which the magnetic material is inserted when positioned on the acceptor substrate. Therefore, the donor film and the acceptor substrate are brought into close contact with each other by magnetic force.

Figure 4 is a cross-sectional view showing a second embodiment of the laser transfer donor film according to the present invention. Referring to FIG. 4, unlike the permanent magnet layer 330 formed between the light-to-heat conversion layer 320 and the interlayer insertion layer 340 in FIG. 3, the substrate substrate 410 and the light-to-heat conversion layer The permanent magnet layer 420 is formed between the 430. Since the function of each layer is the same as that of FIG. 3, a detailed description thereof will be omitted.

5 is a cross-sectional view showing a third embodiment of the donor film for laser transfer according to the present invention. Referring to FIG. 5, unlike the permanent magnets formed as one layer in FIGS. 3 and 4, the permanent magnets are dispersed as nanoparticles 530 in the light-to-heat conversion layer 520.

6 is a cross-sectional view showing a fourth embodiment of the laser transfer donor film according to the present invention. Referring to FIG. 6, unlike the permanent magnets dispersed in the light-to-heat conversion layer 630 in FIG. 5, the permanent magnet nanoparticles 620 are dispersed in the base substrate 610. Thereby, of course, the same effect as the donor film of FIG. 5 can be exhibited.

7 is a cross-sectional view showing a first embodiment of an acceptor substrate according to the present invention.

Referring to FIG. 7, the structure on the acceptor substrate will be briefly described. A magnetic layer 701 is formed on the substrate 700, and a magnetic material 701 is formed on the other surface of the substrate 700 facing the surface on which the buffer layer 702 is formed. ) Layer is formed.

The magnetic material 701 is Fe, Ni, Cr, Fe ₂ O ₃ , Fe ₃ O ₄ , CoFe ₂ O ₄ , It is any one selected from the group consisting of magnetic nanoparticles and mixtures thereof. Among them, magnetic nanoparticles are formed by spin coating, E-Beam deposition, or inkjet method.

A semiconductor layer including an LDD layer (not shown) is formed between the active channel layer 703a and the ohmic contact layer 703b on one region of the buffer layer 702. On the semiconductor layer, a gate insulating film 704 and a gate electrode 705 are patterned and sequentially formed. A source and drain electrode formed on the gate electrode 705 to contact the interlayer insulating layer 706 formed to expose the ohmic contact layer 703b of the semiconductor layer, and the exposed ohmic contact layer 703b. 707a and 707b are formed on one region of the interlayer insulating layer 706.

In addition, a via hole is formed so that the planarization layer 708 is formed on the interlayer insulating layer 706, and one region of the planarization layer 708 is etched on the planarization layer 708 to expose the drain electrode 707b. The drain electrode 707b and the first electrode layer 709 are electrically connected through each other. The first electrode layer 709 is formed in one region of the planarization layer 708, and a pixel definition in which an opening 711 is formed on the planarization layer 708 to at least partially expose the first electrode layer 709. Membrane 710 is formed.

8 and 9 are cross-sectional views showing another embodiment of the acceptor substrate according to the present invention, and the description of the same components as in FIG. 7 will be omitted.

8 is a cross-sectional view showing a second embodiment of an acceptor substrate according to the present invention. 8 shows Fe, Ni, Cr, Fe ₂ O ₃ , Fe ₃ O ₄ , CoFe ₂ O ₄ , between the substrate 800 and the buffer layer 802. The magnetic layer 801 is formed of any one selected from the group consisting of magnetic nanoparticles and mixtures thereof.

9 is a sectional view showing a third embodiment of an acceptor substrate according to the present invention. 9, an image display unit 960, a scan driver 940, a data driver 930, a driving power source 910, and a base power source having at least one pixel area 970 on the acceptor substrate 900. 920 and the like are formed.

A magnetic force supporting metal line 950 is formed on at least one surface of the driving power source 910 formed on the acceptor substrate 900 and an area other than the pixel area 970 of the image display unit 960. . Magnetic support metal line 950 is a magnetic material, the magnetic material is Fe, Ni, Cr, Fe ₂ O ₃ , Fe ₃ O ₄ , CoFe ₂ O ₄ , It is any one selected from the group consisting of magnetic nanoparticles and mixtures thereof.

The scan driver 940 controls a selection signal for driving an organic light emitting element (not shown) in each pixel area 970, and supplies the controlled selection signal to the scan line. The selection signal is transmitted to a switching element (not shown) in each pixel area 970 via a scan line to function to turn on or off the switching element.

The data driver 930 controls the data voltage or current representing the image signal of each pixel region 970 and supplies the controlled data voltage or current to each data line.

10A through 10E are cross-sectional views illustrating a method of manufacturing an organic light emitting diode according to the present invention.

As shown in FIG. 10A, when forming the light emitting layer by the laser thermal transfer method according to the present invention, first, an acceptor substrate including the magnetic layer 1010 is prepared. As described above, in the acceptor substrate, a thin film transistor is formed on the substrate 1000, and a magnetic layer 1010 is formed on the other surface of the substrate 1000 facing the thin film transistor. The magnetic layer 1010 may be formed of nanoparticles, and may be formed using spin coating, E-Beam deposition, or inkjet method. A pixel definition layer 1100 having a first electrode layer 1090 and an opening 1110 exposing at least one region of the first electrode layer 1090 is formed on the thin film transistor.

Then, as shown in FIG. 10B, the donor film 1200 is laminated on the acceptor substrate. The better the adhesion between the donor film 1200 and the substrate, the better the transfer efficiency in the subsequent transfer process. The adhesion property is improved by the magnetic force. The donor film according to the embodiment of the present invention is composed of a substrate substrate 1210, permanent magnet layer 1220, light-to-heat conversion layer 1230, interlayer insertion layer 1240, transfer layer 1250, but is permanent Other structures of the donor film which may include a magnet layer or permanent magnet nanoparticles may be applied.

Thereafter, as shown in FIG. 10C, in a state where the acceptor substrate and the donor film 1200 are laminated, the laser is locally irradiated only on the region where the emission layer 1250 is to be transferred on the donor film 1200. When the laser is irradiated, as the light-to-heat conversion layer 1230 expands in the acceptor substrate direction, the transfer layer 1250 also expands, so that the transfer layer 1250 in the laser irradiated region is moved from the donor film 1200. As it is separated, it is transferred to the acceptor substrate.

As shown in FIG. 10D, when the transfer layer 1250b is transferred onto the acceptor substrate, the donor film 1200 and the acceptor substrate are separated. On the separated acceptor substrate, the transfer layer 1250b is formed in at least one region and the opening of the pixel definition layer 1100, and only the transfer layer 1250b of the region irradiated with laser is transferred onto the donor film 1200, and the rest is transferred. The portion 1250a remains on the donor film 1200 as it is.

Finally, as shown in FIG. 10E, after the transfer layer 1250b is transferred onto the acceptor substrate, the second electrode layer 1320 is formed on the emission layer 1250b, which is the transfer layer, and the organic light emitting device is protected. The encapsulation film 1300 is formed to be able to do so. An absorbing member 1310 is formed on an inner surface of the encapsulation film 1300, and the absorbing member 1310 absorbs moisture and the like that penetrate the organic light emitting device. Accordingly, it is possible to prevent the light emitting layer 1250b of the organic light emitting element from being damaged or corroded by moisture or the like.

Although the technical spirit of the present invention has been described in detail according to the above-described preferred embodiment, it should be noted that the above-described embodiment is for the purpose of description and not of limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical idea of the present invention.

As described above, according to the present invention, when laminating the donor film and the acceptor substrate by the laser thermal transfer method, there is no foreign matter and space between the donor film and the acceptor substrate while the laser thermal transfer is performed in a vacuum state. At the same time, the donor film and the acceptor substrate are laminated by the magnetic force generated between the permanent magnet formed on the donor film and the magnetic material formed on the acceptor substrate, thereby improving the adhesion, lifetime, yield and reliability of the organic light emitting device. Can be.

Claims (9)

Positioning an acceptor substrate having a magnetic material formed on at least one surface thereof on a substrate stage in the process chamber; Placing a donor film including a permanent magnet layer on the acceptor substrate; Laminating the donor film and the acceptor substrate by a magnetic force acting between the magnetic material formed on the donor film and the permanent magnet of the acceptor substrate; And Irradiating a laser onto the donor film to transfer at least one region of the transfer layer onto an acceptor substrate. The method of claim 1, wherein the donor film, Substrate; A light-to-heat conversion layer formed on the base substrate; A transfer layer formed on the light-to-heat conversion layer; And Laser thermal transfer method comprising a permanent magnet layer formed on at least one surface of the light-to-heat conversion layer. The laser thermal transfer method of claim 2, further comprising an interlayer insertion layer between the light-to-heat conversion layer and the transfer layer. The method of claim 1, wherein the permanent magnet is formed in the form of permanent magnet nanoparticles in the substrate or the light-heat conversion layer. The laser thermal transfer method of claim 4, wherein the permanent magnet nanoparticles and the magnetic nanoparticles are formed by spin coating, E-Beam deposition, or an inkjet method. The method of claim 1, wherein the magnetic material is Fe, Ni, Cr, Fe ₂ O ₃ , Fe ₃ O ₄ , CoFe ₂ O ₄ , Laser thermal transfer method which is any one selected from the group consisting of magnetic nanoparticles and mixtures thereof. The laser thermal transfer method of claim 6, wherein the permanent magnet nanoparticles and the magnetic nanoparticles are formed by spin coating, E-Beam deposition, or an inkjet method. The laser thermal transfer method of claim 1, further comprising: a magnetic support metal line formed on at least one surface of a driving power outer region formed on the acceptor substrate and a region other than the pixel region of the image display unit. In the manufacturing method of the organic light emitting element in which a light emitting layer is formed between a 1st electrode and a 2nd electrode by the laser thermal transfer method, An acceptor substrate transfer step of forming a pixel region on the substrate stage and positioning an acceptor substrate including a magnetic material; A donor film transfer step of transferring a donor film including a permanent magnet on the acceptor substrate and having a light emitting layer; A lamination step of bonding the acceptor substrate and the donor film by a magnetic force between the magnetic material formed on the acceptor substrate and the permanent magnet included in the donor film; And And a transfer step of irradiating the donor film with a laser to transfer the light emitting layer to the pixel region of the acceptor substrate.

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