KR20060133057A - 단극쌍투 ｍｅｍｓ 스위치 - Google Patents

단극쌍투 ｍｅｍｓ 스위치 Download PDF

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Publication number
KR20060133057A
KR20060133057A KR1020067022064A KR20067022064A KR20060133057A KR 20060133057 A KR20060133057 A KR 20060133057A KR 1020067022064 A KR1020067022064 A KR 1020067022064A KR 20067022064 A KR20067022064 A KR 20067022064A KR 20060133057 A KR20060133057 A KR 20060133057A
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KR
South Korea
Prior art keywords
layer
toggle
frit
switch
toggles
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Ceased
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KR1020067022064A
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English (en)
Korean (ko)
Inventor
개리 조셉 파쉬비
티모시 지. 슬레이터
글렌 고틀리엡
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시베르타 인코퍼레이티드
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Publication of KR20060133057A publication Critical patent/KR20060133057A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays

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  • Micromachines (AREA)
KR1020067022064A 2004-04-12 2005-04-12 단극쌍투 ｍｅｍｓ 스위치 Ceased KR20060133057A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US56119204P 2004-04-12 2004-04-12
US60/561,192 2004-04-12
US62993104P 2004-11-23 2004-11-23
US60/629,931 2004-11-23

Publications (1)

Publication Number Publication Date
KR20060133057A true KR20060133057A (ko) 2006-12-22

Family

ID=35150451

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067022064A Ceased KR20060133057A (ko) 2004-04-12 2005-04-12 단극쌍투 ｍｅｍｓ 스위치

Country Status (5)

Country Link
US (1) US7816999B2 (https=)
EP (1) EP1756848A4 (https=)
JP (1) JP2007533105A (https=)
KR (1) KR20060133057A (https=)
WO (1) WO2005099410A2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100661602B1 (ko) * 2005-12-09 2006-12-26 삼성전기주식회사 수직 구조 질화갈륨계 ｌｅｄ 소자의 제조방법
US20080175159A1 (en) * 2006-12-13 2008-07-24 Panduit Corp. High Performance Three-Port Switch for Managed Ethernet Systems
US9159514B2 (en) * 2013-11-18 2015-10-13 Tyco Electronics Corporation Relay connector assembly for a relay system
CN104183425B (zh) * 2014-08-29 2016-03-02 电子科技大学 一种射频mems单刀双掷开关
US9758366B2 (en) 2015-12-15 2017-09-12 International Business Machines Corporation Small wafer area MEMS switch
EP4464657B1 (de) * 2023-05-05 2025-12-10 Hahn-Schickard-Gesellschaft für angewandte Forschung e. V. Halbleiterbauteil umfassend einen mems-sensor oder mems-aktuator sowie verfahren zu dessen herstellung

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EP1012890A1 (en) * 1997-04-01 2000-06-28 Xros, Inc. Adjusting operating characteristics of micromachined torsional oscillators
US5903099A (en) * 1997-05-23 1999-05-11 Tini Alloy Company Fabrication system, method and apparatus for microelectromechanical devices
DE19823690C1 (de) 1998-05-27 2000-01-05 Siemens Ag Mikromechanisches elektrostatisches Relais
KR100620341B1 (ko) * 1998-09-02 2006-09-13 엑스로스, 인크. 비틀림 굴곡 힌지에 의해 상대 회전하도록 연결된 미세가공 구조체
US6326682B1 (en) * 1998-12-21 2001-12-04 Kulite Semiconductor Products Hermetically sealed transducer and methods for producing the same
US6410360B1 (en) * 1999-01-26 2002-06-25 Teledyne Industries, Inc. Laminate-based apparatus and method of fabrication
US6069540A (en) * 1999-04-23 2000-05-30 Trw Inc. Micro-electro system (MEMS) switch
US6228675B1 (en) * 1999-07-23 2001-05-08 Agilent Technologies, Inc. Microcap wafer-level package with vias
US6452238B1 (en) 1999-10-04 2002-09-17 Texas Instruments Incorporated MEMS wafer level package
US6384353B1 (en) * 2000-02-01 2002-05-07 Motorola, Inc. Micro-electromechanical system device
US6307169B1 (en) * 2000-02-01 2001-10-23 Motorola Inc. Micro-electromechanical switch
DE10004393C1 (de) * 2000-02-02 2002-02-14 Infineon Technologies Ag Mikrorelais
US6441481B1 (en) * 2000-04-10 2002-08-27 Analog Devices, Inc. Hermetically sealed microstructure package
KR100370398B1 (ko) * 2000-06-22 2003-01-30 삼성전자 주식회사 전자 및 ｍｅｍｓ 소자의 표면실장형 칩 규모 패키징 방법
US6465281B1 (en) * 2000-09-08 2002-10-15 Motorola, Inc. Method of manufacturing a semiconductor wafer level package
US6535091B2 (en) * 2000-11-07 2003-03-18 Sarnoff Corporation Microelectronic mechanical systems (MEMS) switch and method of fabrication
US20020146919A1 (en) 2000-12-29 2002-10-10 Cohn Michael B. Micromachined springs for strain relieved electrical connections to IC chips
US6537892B2 (en) * 2001-02-02 2003-03-25 Delphi Technologies, Inc. Glass frit wafer bonding process and packages formed thereby
KR100387239B1 (ko) * 2001-04-26 2003-06-12 삼성전자주식회사 Ｍｅｍｓ 릴레이 및 그 제조방법
US6756310B2 (en) * 2001-09-26 2004-06-29 Rockwell Automation Technologies, Inc. Method for constructing an isolate microelectromechanical system (MEMS) device using surface fabrication techniques
US6589625B1 (en) * 2001-08-01 2003-07-08 Iridigm Display Corporation Hermetic seal and method to create the same
US6507097B1 (en) * 2001-11-29 2003-01-14 Clarisay, Inc. Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the same
US6624003B1 (en) * 2002-02-06 2003-09-23 Teravicta Technologies, Inc. Integrated MEMS device and package
US6603182B1 (en) * 2002-03-12 2003-08-05 Lucent Technologies Inc. Packaging micromechanical devices
US6701779B2 (en) * 2002-03-21 2004-03-09 International Business Machines Corporation Perpendicular torsion micro-electromechanical switch
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US7551048B2 (en) 2002-08-08 2009-06-23 Fujitsu Component Limited Micro-relay and method of fabricating the same
US6806557B2 (en) * 2002-09-30 2004-10-19 Motorola, Inc. Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum
KR100451409B1 (ko) * 2002-10-15 2004-10-06 한국전자통신연구원 마이크로 광스위치 및 그 제조방법
US7045868B2 (en) 2003-07-31 2006-05-16 Motorola, Inc. Wafer-level sealed microdevice having trench isolation and methods for making the same
US7087134B2 (en) * 2004-03-31 2006-08-08 Hewlett-Packard Development Company, L.P. System and method for direct-bonding of substrates
US7407826B2 (en) * 2005-03-21 2008-08-05 Honeywell International Inc. Vacuum packaged single crystal silicon device
US7449765B2 (en) * 2006-02-27 2008-11-11 Texas Instruments Incorporated Semiconductor device and method of fabrication

Also Published As

Publication number Publication date
US7816999B2 (en) 2010-10-19
WO2005099410A3 (en) 2007-08-23
JP2007533105A (ja) 2007-11-15
WO2005099410A2 (en) 2005-10-27
EP1756848A4 (en) 2009-12-23
EP1756848A2 (en) 2007-02-28
US20070205087A1 (en) 2007-09-06

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