KR20060116611A - System for eliminating impurities and method eliminating impurities in tape cutting - Google Patents

Abstract

System and method for removing impurities in a tape cutting process are provided to prevent the damage of a wafer by restraining the generation of impurities using a vacuum unit. A system of removing impurities in a tape cutting process includes a wafer loading unit for loading a wafer(150), an attachment table(100) with first and second grooves, a working table(200) for loading the attachment table, a cutting unit, and a vacuum unit. The cutting unit(400) is installed on the attachment table. The cutting unit includes a cutter for cutting a predetermined tape. The vacuum unit(300) includes a vacuum pipeline and a vacuum generating part. The vacuum pipeline is connected with the first and the second groove of the attachment table to form a vacuum state.

Description

System for eliminating impurities and method eliminating impurities in tape cutting}

1 is a perspective view briefly showing a taping operation by a laminator.

2 is a schematic view showing a tape cutting operation briefly.

3 is a perspective view showing the appearance of foreign matters during the tape cutting operation.

Figure 4a is a perspective view showing the overall appearance of the foreign matter removal system according to an embodiment of the present invention.

FIG. 4B is a plan view of an attachment table taped out of the overall system of FIG. 4A.

4C is a cross-sectional view of the portion I-I of FIG. 4A.

FIG. 4D is a cross-sectional view of the II-II part of FIG. 4A.

5a to 5b are flow charts schematically showing the process of the foreign material removal method according to an embodiment of the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package manufacturing apparatus and a manufacturing method, and more particularly, to a foreign substance removing system for removing foreign substances generated during a tape cutting process by a laminator using a vacuum apparatus and a foreign substance removing method employing the system.

In recent years, as electronic devices have been miniaturized, semiconductor devices used in electronic devices have also been reduced in size and weight. Accordingly, development of a new type of semiconductor package is ongoing to reduce the thickness of the semiconductor package.

In addition, in a general semiconductor package, for example, a thin small out-line package (TSOP), a thin quad flat package (TQFP), and the like, a wire bonding process of lowering a loop height of a wire and BACKGROUND OF THE INVENTION A process of grinding the back side of a semiconductor chip or the like has been adopted to reduce the thickness of a semiconductor package.

In general, the backside polishing of the semiconductor chip is performed on a wafer basis, and is performed before the assembly process of the semiconductor device. On the other hand, by applying an electrical signal to the pad part of the chip by the EDS (Electrical Die Sorting) process before the wafer back surface polishing process, the normal and abnormality of the chip is tested. The purpose of the EDS process is to determine and discriminate early for defects on each chip on the wafer, and to reduce the assembly cost, packaging costs, and post-packaging test costs for the defective chips. In addition, it is possible to determine the cause of the failure, to take early steps to solve the same problem, and to reproduce the defective chips.

After the above-mentioned EDS process, the wafer enters the wafer backside polishing process. The wafer backside polishing process is largely comprised of i) a step of attaching the tape to the front surface of the wafer, ii) a step of polishing the back side of the wafer on which the tape is taped, and iii) a step of removing the tape from the finished wafer. .

The tape-tapping process is performed to prevent contaminants and other foreign matter from adhering to the front surface of the wafer during polishing of the back surface of the wafer, thereby preventing deterioration of characteristics of the semiconductor device.

1 is a perspective view briefly illustrating a process of taping a tape on a front surface of such a wafer. Referring to FIG. 1, the attachment table 40 on which the wafer 50 is placed moves in the direction (arrow direction) of the tape chuck 30 for holding the tape 20, and by the pressing roller 10. An ultraviolet tape 20 is taped to the attachment table 40.

The ultraviolet tape 20 is taped not only on the wafer 50 but also throughout the attachment table 40 and continuously. Therefore, it is necessary to cut the ultraviolet tape 20 from the attachment table 40 and to cut along the outer periphery of the wafer 50 on the attachment table.

2 is a schematic view showing a tape cutting operation. The cutter 60 separates and cuts the ultraviolet tape 20 from the attachment table 40 while linearly reciprocating in the direction of the two arrows in FIG. 2. On the other hand, after the separation cutting, the cutter 60 cuts the tape in the direction of the arrow of the curve along the outer periphery of the wafer 50 to which the tape 20 is bonded. Although not shown in FIG. 2, generally, grooves are formed on the attachment table 40 along the path where the cutting is performed so that the cutting is performed smoothly.

However, as can be seen in Figure 3, during the cutting process, the residue of the tape, scum and foreign matter (hereinafter referred to as 'foreign materials') is generated. The foreign matters are generated because the tape chuck 30 does not hold the tape 20 when the tape is cut. If the tape 20 is not held in a stationary manner, the tape 20 is loosely fixed so that cutting is not performed well, and a phenomenon of instantaneous bounce during cutting occurs. At this time, foreign substances on the tape are generated.

FIG. 3 is the same as FIG. 2 except for foreign matters (stars or rasters in the drawing) of the tape, and thus description of the components will be omitted. However, it can be seen that the groove is formed along the path in which the cutting described in FIG. 2 is performed. That is, the linear groove 42a and the circular groove 42b are formed in the attachment table 40. The attachment table 40 also consists of a lower plate 41 and an upper plate 42 to form the grooves.

In the absence of a system for removing debris when tape debris occurs, debris may cling to the wafer 50 or accumulate on the attachment table 40. The foreign matter accumulated on the attachment table 40 adheres to the inner or outer surfaces or edges of the wafer 50 during wafer taping, which is a subsequent process.

The wafers 50 to which foreign matters are stuck may cause chipping of the wafer 50, cracking of the wafer, or cracking in the wafer backside polishing process. Eventually, despite the wafers having completed the EDS process, there was a problem of generating wafers or semiconductor chips of poor quality.

Therefore, the technical problem to be achieved by the present invention is to form holes in the groove formed along the cutting line of the attachment table, and to connect the holes to the vacuum device through the vacuum pipe, by using a vacuum device during tape cutting to remove the foreign materials of the tape The present invention provides a foreign matter removal system that can be removed and a foreign material removal method employing the system.

In order to achieve the above object, the present invention provides a wafer mounting portion on which a wafer is placed, a first groove in a circular groove formed along the outer circumference of the wafer mounting portion, and an attachment table in which a second groove in a straight line is formed on the outside of the wafer mounting portion. an attachment table, a working table on which the attachment table is placed, a cutting unit located on the attachment table and a cutter for cutting a tape taped to the attachment table; and Provided is a foreign material removal system for cutting a tape including a vacuum pipe unit including a vacuum pipe and a vacuum pipe connected to the first and second grooves of the attachment table to form a vacuum.

According to a preferred embodiment of the present invention, it is preferable to include an ionizer in the cutter to prevent static electricity generated when cutting the tape. In addition, the vacuum device unit includes a filter and a vacuum control device, it is preferable to perform the foreign matter removal operation through the filter only when cutting the tape.

In order to achieve the above object, the present invention also provides a step of placing a wafer on a wafer mounting portion, a circular first groove recessed along the outer periphery of the wafer mounting portion and a straight second groove recessed outside the wafer mounting portion are formed. Taping the front surface of the attachment table with tape, cutting the tape covering the first and second grooves of the attachment table with a cutter and connecting to the first and second grooves of the attachment table. By using a vacuum unit (vacuum unit) including a vacuum pipe (vacuum) to form a vacuum and a vacuum generating device to provide a method for removing foreign matters during tape cutting comprising the step of removing foreign matters generated during tape cutting.

According to a preferred embodiment of the present invention, by performing the cutting step and the foreign material removal step at the same time, it is preferable to perform an effective foreign material removal operation.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention;

Figure 4a is a perspective view showing the overall appearance of the foreign matter removal system when cutting the tape according to a preferred embodiment of the present invention. The debris removal system includes an attachment table 100 carrying a wafer 150, a work table 200, a vacuum device unit 300, and a cutting device unit 400.

The attachment table 100 includes a lower plate 101 and an upper plate 102. The attachment table 100 has a rectangular structure and is formed with a circular groove 102b recessed around the wafer mounting portion (not shown) and a straight groove 102a recessed for separating and cutting the tape outside the wafer mounting portion.

The circular groove 102b and the straight groove 102a are attached to the lower plate 101 by carving the upper plate 102 in the form of a groove, but not limited thereto, and may be formed by digging a groove in one plate. The lower plate 101 has at least one vacuum hole 101a, 101b connected to each of the circular groove 102b and the straight groove 102a of the upper plate 102. In addition, a base vacuum hole 101d is formed below the vacuum holes 101a of the straight groove 012a and a base vacuum hole 101d is formed below the vacuum holes 101b of the circular groove 102b.

Meanwhile, the cutting operation is performed after the wafer 150 is placed on the wafer mounting part (not shown) in the attachment table 100 and the UV tape (not shown) is taped over the wafer 150. 4A shows the state after the attachment table 100 and the wafer 150 are taped.

The work table 200 serves as a pedestal for placing the attachment table 100 and cutting the tape and removing the foreign matter. The work table 200 has connection holes 200a and 200b connected to the base vacuum holes 101c and 101d formed in the lower plate 101 of the attachment table 100.

The vacuum apparatus unit 300 includes a vacuum piping unit 310, a filter unit 320, a vacuum adjusting device 330 and a vacuum generating device 340.

The vacuum pipe part 310 includes a vacuum large pipe 313 and vacuum small pipes 311 and 312. The vacuum small pipes 311 and 312 are combined to form a vacuum large pipe 313. The vacuum small pipes 311 and 312 of the vacuum pipe part 310 are connected to the connection holes 200a and 200b of the work table 200 and the grooves through the vacuum holes 101a and 101b of the attachment table 100. To 102a and 102b.

The vacuum generator 340 generates a vacuum. When the vacuum generator 340 is operated, the grooves 102a and 102b of the attachment table 100 are in a vacuum state (a state in which the pressure is lowered precisely), so that foreign matters accumulated around the grooves due to the pressure difference are accumulated in the vacuum pipe portion. It is removed via 310.

In FIG. 4A, the vacuum pipe part 310 is connected to the base vacuum holes 101c and 101d of the lower plate 101 of the attachment table 100 through the two vacuum small pipes 311 and 312 and the base vacuum holes 101c. It is connected to the grooves 102a and 102b by a plurality of vacuum holes 101a and 101b formed on, 101d, respectively. In general, since a large amount of foreign matter is generated at the beginning and the end of the cutting, both ends of the straight groove 102a (it is appropriate to form a little inward at the end) and the circular groove 102b. It is preferable to form a lot of vacuum holes at the start of cutting (same as the end). In the case of the circular groove 102b in FIG. 4A, a portion in which the vacuum holes 101b are densely formed is the start portion of the cutting.

It is preferable to form a vacuum hole in the lower bottom surface of the groove rather than the left and right sides of the groove from the structural aspect, and the size of the vacuum hole in terms of vacuum pressure is preferably about 1 to 2 mm in diameter. Although a plurality of vacuum holes 101a and 101b are formed in FIG. 4A, three to four vacuum holes may be formed, and one vacuum hole may be formed in each of the grooves 102a and 102b.

The filter unit 320 includes a filter 322 and first and second sensors 323 and 324 for measuring the pressure of the vacuum. The filter unit 320 is mounted on the vacuum large pipe 313 of the vacuum pipe unit 310, the filter 322 can be separated and replaced. The first and second sensors 323 and 324 are installed on both sides of the filter, respectively, and inform the filter replacement by the difference in the vacuum pressure of the first and second sensors 323 and 324.

The vacuum regulator 330 adjusts the pressure and time of the vacuum of the vacuum generator 340. The vacuum adjusting device 330 is electrically connected to the cutting device unit 400 so that the vacuum generating device 340 operates only when the tape is cut.

Although the vacuum adjusting device 330 is installed on the vacuum pipe 310, the vacuum adjusting device 330 may be installed in the vacuum generating device 340 or at any position that may be electrically connected to the vacuum generating device 340. Preferably it is located on the vacuum large pipe 313 between the filter unit 320 and the vacuum generator 340, it is appropriate to serve as the second sensor 324 of the filter unit 320. In addition, although the vacuum apparatus part 300 is isolate | separated from the work table 200, it is also possible to provide the vacuum apparatus part 300 in the work table 200. FIG.

The cutting device unit 400 includes a cutter 460 for cutting a tape (not shown). In general, a separate cut is performed to cut a tape (not shown) from the attachment table 100 along the straight groove 102a, and then a tape (not shown) is cut along the circular groove 102b of the outer periphery of the wafer 150. . However, two cutters may be provided to simultaneously perform separate cutting of the tape (not shown) along the straight groove 102a and cutting of the tape (not shown) around the wafer 150 along the circular groove 102b.

Static electricity is generated between the tape (not shown) and the cutter 460 during the cutting operation, and the tape foreign matters adhere to the tape (not shown) or the cutter 460 taped to the wafer 150. By mounting the small ion generator 461 in the cutter 460, it is possible to prevent the generation of static electricity. By preventing the generation of static electricity by the ion generator 461, it is possible to effectively remove the foreign matter by the vacuum, it is advantageous in terms of power consumption as the required vacuum pressure is lowered. Although the ion generator is shown to be connected to an external power source through the wires 462, it is a matter of course that the power supply can be built in the cutter 460.

FIG. 4B is a plan view of the attachment table 100 of the overall system of FIG. 4A, showing the details of the circular groove 102b and the straight groove 102a in more detail. It can be seen that the circular groove 102b is formed from the outer portion of the wafer 150 (solid solid line outside the wafer edge) to the portion covered by the wafer 150 (dotted wafer mounting portion 103). A plurality of vacuum holes 101a and 101b are formed in the straight groove 102a and the circular groove 102b. In the case of the circular groove 102b, the portion where the vacuum holes 101b are formed densely is a start portion of the cutting. The remaining part has been described in FIG. 4A and will be omitted.

4C is a cross-sectional view of a portion of I-I of FIG. 4A. That is, it is sectional drawing which cut | disconnected the part with the vacuum hole 101a and the vacuum hole 101b of the circular groove 102b in the middle part of the linear groove 102a. In the attachment table 100 on which the tape 120 is tapered, grooves 102b are formed at both ends of the wafer mounting portion 103 on which the wafer 150 is placed, and grooves 102a are formed outside the mounting portion 103. The straight groove 102a is connected to the vacuum small pipe 312 through the vacuum hole 101a and the base vacuum hole 101c formed in the lower plate 101 of the attachment table 100 and the connection hole 200a of the work table 200. ) In the case of the circular groove 102b, the vacuum hole 101b and the base vacuum hole 101d are shown on the right side, and only the base vacuum hole 101d is shown on the left side. Since the cross-sectional view, the connection hole 200b does not appear. The remaining part has been described in FIG. 4A and will be omitted.

4D is a cross-sectional view of a portion of II-II in FIG. 4A. A plurality of vacuum holes 101a and base vacuum holes 101c are formed in the lower plate 101 along the straight grooves 102a of the upper plate 102. The base vacuum holes 101c are connected to the vacuum small pipe 312 through the connection hole 200a of the work table 200. The wafer 150 and tape 120 are shown on top of the attachment table 100. The remaining part has been described in FIG. 4A and will be omitted.

4A to 4D, the connection between the grooves 102a and 102b of the attachment table 100 and the vacuum pipe 310 is connected through the vacuum holes 101a and 101b and the connection holes 200a and 200b. Although described, the present invention is not limited thereto and can be connected by other methods obvious to those skilled in the art.

5A and 5B are schematic flowcharts of a method for removing foreign matter during a tape cutting operation. Referring to FIG. 5A, in the foreign material removal method according to the present invention, first, a wafer is mounted on a wafer mounting unit (S510), and then the attachment table and the wafer are taped by the laminator in the same manner as in FIG. 1 (S520). Next, the tape cutting operation is performed by the cutter (S530). Finally, the foreign matter removal operation is performed by the vacuum apparatus (S540). In general, the EDS process is performed as described above before the wafer mounting step (S510), and the wafer back surface polishing process is performed after the foreign matter removing operation step (S540).

FIG. 5B is a flowchart showing a state in which the cutting operation step S530 and the foreign matter removing operation step S540 in FIG. 5A are simultaneously performed. That is, the tape cutting operation and the foreign matter removal operation are simultaneously performed after the attachment table and the wafer taping step (S520) (S550). By performing the tape cutting operation and the tape foreign matter removal operation at the same time, it is possible to effectively remove the foreign substances. In addition, less vacuum pressure is required in terms of vacuum pressure, which is preferable in terms of power consumption.

By effectively removing foreign substances on the tape during the tape cutting process through the above-described foreign substance removing system and foreign substance removing method, it is possible to prevent chipping of the wafer or cracking or cracking of the wafer in the subsequent wafer backside polishing process.

So far, the present invention has been described with reference to the embodiments shown in the drawings, which are merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. will be. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

As described in detail above, the present invention effectively removes the tape foreign substances generated during the tape cutting process using a vacuum device, thereby preventing chipping, cracking and cracking of the wafer in the wafer backside polishing process, thereby preventing wafers of poor quality. Occurrence and can increase the value of the EDS process.

In addition, by using the vacuum adjusting device to perform the removal operation by the vacuum only during the tape cutting, it is possible to enable efficient operation and maintenance of the equipment.

Furthermore, the ion generator can be attached to the cutter to efficiently remove foreign substances.

Claims (15)

A wafer mounting part for placing a wafer; An attachment table having a first circular groove recessed along the outer periphery of the wafer mounting portion and a second straight groove recessed outside the wafer mounting portion; A work table on which the attachment table is placed; A cutting unit positioned above the attachment table and including a cutter for cutting tape taped to the attachment table; And And a vacuum unit unit including a vacuum pipe and a vacuum generating device connected to the first and second grooves of the attachment table to form a vacuum. According to claim 1, The cutting device unit includes two cutters, And removing each of the tapes covering the first and second grooves of the attachment table at the same time. The method of claim 1, The cutter of the cutting device unit is a foreign material removal system when cutting a tape, characterized in that it comprises an ionizer (ionizer). According to claim 1, At least one hole is formed in each of the first groove and the second groove of the attachment table, And the vacuum pipe is connected to the first and second grooves through the holes. According to claim 1, And the vacuum pipe is connected to the first groove and the second groove of the attachment table through the work table. According to claim 1, The vacuum device unit is a foreign material removal system for cutting the tape, characterized in that it comprises a filter mounted filter. The method of claim 6, The filter unit is mounted to the vacuum pipe, The filter unit of the filter unit, the foreign matter removal system when cutting the tape, characterized in that the separation. The method of claim 7, wherein The filter unit includes a first and a second sensor for measuring the vacuum pressure, The first sensor is located on one side of the filter, the second sensor is located on the other side of the filter, The foreign material removal system during the tape cutting, characterized in that for indicating the filter replacement time due to the difference in the vacuum pressure of the first and second sensors. According to claim 1, The vacuum device unit is a foreign material removal system for cutting tape, characterized in that it comprises a vacuum adjusting device that can adjust the pressure and time of the vacuum. The method of claim 9, The vacuum adjusting device is electrically connected to the cutting device unit, A foreign material removal system when cutting a tape, wherein the foreign material removal operation is performed only when the tape is cut. According to claim 1, The foreign material removal system when cutting the tape, characterized in that for mounting the vacuum device unit on the work table. Placing the wafer on a wafer mount; Taping the entire surface of an attachment table in which a first circular groove recessed along the outer circumference of the wafer mounting portion and a second straight groove recessed on the outside of the wafer mounting portion are formed with a tape; Cutting the tape covering the first and second grooves of the attachment table using a cutter; And Removing foreign substances generated during tape cutting by using a vacuum unit including a vacuum pipe and a vacuum generating device connected to the first and second grooves of the attachment table to form a vacuum. How to remove foreign substances when cutting the tape. The method of claim 12, The foreign material removal method when cutting the tape, characterized in that for cutting each of the tape covering the first and second grooves of the attachment table at the same time using two cutters. The method of claim 12, The vacuum device unit is a foreign material removal method when cutting a tape, characterized in that it comprises a vacuum adjusting device that can adjust the pressure and time of the vacuum. The method of claim 14, The vacuum adjusting device is electrically connected to the cutter, The foreign material removal method during the tape cutting, characterized in that for performing the cutting operation and the foreign material removal operation at the same time.

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