KR20060106963A - Module test socket - Google Patents

Abstract

The present invention includes a socket including a plurality of contact pins respectively connected to a contact portion of a module and a contact portion of a test apparatus, and having an insertion groove for insertion of the module, and disposed on both sides of the socket and inserting the module into the insertion groove. Or a pair of latches that rotate in a predetermined range for discharging or discharging, and the pair of latches and the module are in contact with each other and the module is loaded into an insertion groove of the socket. A pair of module contacts for transferring the pressure according to the rotational movement of the pair of latches to the module so as to stably insert the module into the socket when pressure is applied to the upper portion of the module through the rotational movement of the latch; It relates to a module test socket comprising a connection lever for connecting the pair of latches to operate at the same time.

According to the present invention, by inserting the memory module by applying pressure to the groove portion of the side of the memory module, the module for inserting the memory module by applying pressure from the upper portion of the memory module, as compared with the conventional method in which the defective rate due to damage or wear of the memory module was high. Including the contact portion, it is possible to reduce defects caused by damage or wear of the memory module.

Module Test Sockets, Module Test Units, Memory Modules, Module Contacts

Description

Module Test Sockets {MODULE TEST SOCKET}

1 shows an example of a memory module according to the prior art;

2A-2B are cross-sectional views of sockets for testing memory modules according to the prior art;

3 is a perspective view of a memory module test apparatus according to the prior art.

4a to 4b is a block diagram of a module test socket according to the present invention.

5 shows an embodiment of a module test apparatus using a module test socket according to the invention.

<Description of the symbols for the main parts of the drawings>

210: insertion groove 220: contact pin

230: latch 235: protrusion

240: auxiliary latch 310: socket

325: projection 320: operating lever

330: connection bar 410: socket

420: latch 430: module contact

440: connection lever 450: ejector

510: module test socket 520: test PCB

The present invention relates to a module test socket and a module test apparatus using the same. More particularly, the present invention relates to a conventional method in which a defect rate due to damage or wear of a memory module is high by inserting a memory module by applying pressure to a groove portion of a side surface of the memory module. In contrast, the present invention relates to a module test socket that can reduce a failure due to damage or wear of a memory module, including a module contact part for inserting a memory module by applying pressure from an upper portion of the memory module.

As is well known, a memory module has a high density mounted with a plurality of semiconductor memory integrated circuits, that is, memory components on a printed circuit board in order to expand the capacity of the semiconductor memory.

1 is a view showing an example of a memory module according to the prior art.

As shown there are various types of memory modules. For example, FIG. 1A illustrates a 200-pin DDR1 small outline dual inline memory module (SODIMM) and a DDR2 SODIMM module, and FIG. 1B illustrates a 144-pin SODIMM module, and FIG. 1C. 144 pin μSODIMM, Figure 1 (d) is a 172 pin μDIMM (dual inline memory module), Figure 1 (e) is a 168 pin SyncDIMM module, Figure 1 (f) is a 184 pin DDR DIMM module FIG. 1G illustrates a 184 pin Rambus inline memory module (RIMM) module, and FIG. 1H illustrates a 240 pin DDR2 DIMM module.

In order to test whether the memory module is defective by the test apparatus, the test is performed by connecting the memory module to the test apparatus through a socket.

Various techniques have been disclosed for the technique of testing such a memory module.

For example, Patent Application No. 10-2001-73037, filed on November 22, 2001, published by Samsung Electronics Co., Ltd., and published on May 28, 2003, or published in 2002. Patent No. 10-452957, entitled "Module for Socket", filed May 9 and registered on October 5, 2004, discloses a socket and a test apparatus for testing such a memory module. .

2A to 2B are cross-sectional views of the memory module test socket disclosed in Patent Registration No. 10-452957.

As shown, the memory module test socket disclosed in the Patent Registration No. 10-452957 has a contact pin 220 for electrically connecting the contact portion of the memory module and the contact of the test device is formed so that the memory module is mounted A socket in which the insertion groove 210 is formed, and two latches 230a to 230b rotatably supported at upper ends of the sockets, and the two latches are inserted into grooves (not shown) of the memory module. Losing fixing protrusions 235a to 235b are formed. In addition, it comprises two auxiliary latches (240a to 240b) rotatably supported at the lower end of both ends of the socket is configured to facilitate the ejection of the memory module.

The memory module test socket disclosed in the Patent Registration No. 10-452957 is subjected to excessive force when the memory module is inserted into the socket while the conventional memory module test socket manually mounts and ejects the memory module. In order to improve the disadvantage that the damage of the socket or the memory module increases, the memory module is disposed in the insertion groove 210 of the test socket, and the fixing protrusions 235a to 235b correspond to the grooves of the memory module, and then latch 230a. To 230b) is rotated upward to insert the memory module with a constant force, and additionally configured to be discharged using the auxiliary latches 240a to 240b when discharging.

However, in such a configuration, when a force is applied to the groove of the memory module by the fixing protrusions 235a to 235b according to the miniaturization of the memory module, breakage or wear of the memory module occurs. It may cause a defect. In addition, in particular, when the memory module is loaded inclined rather than vertically in the socket, that is, when the memory module is not exactly aligned with the insertion groove 210, the force is applied by the fixing protrusions 235a to 235b in the groove of the memory module. Since it is applied in an inclined direction, the possibility of damage to the memory module becomes higher.

3 is a perspective view of a memory module test apparatus disclosed in Patent Application No. 10-2001-73037.

As shown, the memory module test apparatus disclosed in Patent Application No. 10-2001-73037 includes a plurality of sockets 310a to 310d mounted on a test substrate and protrusions 325a to 325d or 325a 'to 325d'. And actuating levers 320a to 320d or 320a 'to 320d', and connecting bars 330a or 330b connecting the actuating levers 320a to 320d or 320a 'to 320d'.

In this configuration, a plurality of memory modules are disposed in the sockets 310a to 310d, the protrusions 325a to 325d or 325a 'to 325d' correspond to the grooves of the memory module, and the connection bars 330a or 330b are operated at the same time. It is configured to insert a plurality of memory modules into the socket.

However, this configuration also has only a difference in expression, and replaces the fixing protrusions 235a to 235b shown in FIG. 2 with the names of the projections 325a to 325d or 325a 'to 325d', and with reference to FIGS. As described above, when a force is applied to the grooves on the side surface of the memory module according to the miniaturization of the memory module, breakage or wear of the memory module occurs, and such breakage or wear may be caused by the force of the protrusions (325a to 325d or 325a 'to 325d'). This can cause a defect in the memory module test.

Therefore, by inserting the memory module by applying pressure to the groove part on the side of the memory module, the method of reducing the defective rate by configuring the memory module to be stably inserted into the socket by improving the existing method of having a high defective rate due to damage or wear of the memory module. The need for is growing.

An object of the present invention is to insert a memory module by applying a pressure to the groove portion of the side of the memory module by inserting the memory module by applying a pressure from the upper portion of the memory module as compared to the conventional method where the failure rate due to damage or wear of the memory module was high The purpose of the present invention is to provide a module test socket including a contact part to reduce a defect caused by damage or wear of a memory module.

In order to achieve the above technical problem, the present invention includes a socket having a plurality of contact pins respectively connected to the contact portion of the module and the contact portion of the test device and having an insertion groove for insertion of the module, and disposed on both sides of the socket And a pair of latches that rotate in a predetermined range to insert or discharge the module into or into the insertion groove, and the pair of latches and the module in contact with each other and the module is loaded into the insertion groove of the socket. (loading) transmits pressure to the module according to the rotational movement of the pair of latches to reliably insert the module into the socket when pressure is applied to the upper portion of the module through the rotational movement of the pair of latches. A module test socket comprising a pair of module contacts and a connection lever connecting the pair of latches to operate at the same time. The ball.

In the module test socket according to the present invention, the pair of module contacts are preferably configured to move in the horizontal direction at the top of the module to disperse the pressure transmitted to the module.

In the module test socket according to the present invention, it is preferable that the pair of module contacts are coupled to the pair of latches corresponding to each other using a hinge capable of rotational movement within a predetermined range.

In addition, in the module test socket according to the present invention, the connection lever is preferably configured to be bent in an L-shape.

In addition, in the module test socket according to the present invention, it is preferable that each of the pair of module contacts is in contact with an upper portion of the module to be grooved to fix the module within a predetermined range.

In addition, in the module test socket according to the present invention, it is preferable to further include a pair of ejectors (ejector) connected to the lower end of the pair of latches to operate for the discharge of the module.

Hereinafter, the module test socket of the present invention will be described in more detail with reference to the drawings.

4A-4B are exemplary diagrams of modular test sockets in accordance with the present invention.

As shown through FIGS. 4A-4B, a module test socket according to the present invention includes a socket 410, a pair of latches 420a through 420b, a pair of module contacts 430a through 430b, and a connection lever. 440. In addition, the module test socket according to the present invention may further include a pair of ejectors (ejector, 450a to 450b).

The socket 410 is for inserting a module to perform a test. The socket 410 includes a plurality of contact pins (not shown) respectively connected to a contact portion of a module and a contact portion of a test device (not shown). It has an insertion groove for. Since the configuration of the contact pin or the insertion groove of the socket is a known configuration, detailed description thereof will be omitted. The module may also refer to a general memory module, but may also be a general PCB module rather than a memory module.

The pair of latches 420a to 420b are disposed at both sides of the socket 410 and operate to insert or eject the module into the insertion groove of the socket 410. For example, it may be configured to be rotatably supported at both ends of the socket, such as the memory module test socket disclosed in the Patent Registration No. 10-452957, the pair of latches (420a to 420b) according to the present invention is a module Direct contact with these modules is not made in direct contact with the pair of module contacts 430a through 430b.

The pair of module contacts 430a through 430b are disposed at a portion where the pair of latches 420a through 420b come into contact with the module. The pair of module contacts 430a through 430b may press the pair of latches 420a through 420b manually or using an automated device to apply pressure to the top of the module after the module has been loaded into the insertion groove of the socket 410. When the module is to be stably inserted into the socket 410 while not applying excessive force

Although the pair of module contacts 430a through 430b are shown in the form of a cuboid, the contact, ie, the contact with the module or the contact with the latches 420a through 420b, may take the shape of a semicircle. This configuration is particularly advantageous because the pair of module contacts 430a through 430b are fixed to rotate within a certain range with respect to the pair of latches 420a through 420b and move along the top of the module with respect to the module. In the case where the pair of module contacts 430a to 430b and the pair of latches 420a to 420b are in contact with each other, it is easy to have a constant curvature for the rotational motion.

In addition, the pair of module contacts (430a to 430b) is configured to slide in the horizontal direction from the upper portion of the module. In other words, if excessive force is applied, the upper part of the module is configured to be able to dissipate by sliding the upper part.

In addition, although the pair of module contacts 430a to 430b are not shown, the grooves are formed to be in close contact with the upper part of the module, so that the module is allowed when a pair of latches 420a to 420b is applied to the module to apply a force to the module. It can serve as a guide to be located within. That is, in the existing module test socket configuration, when a module is loaded in an inclined manner rather than vertically in a socket, a pair of module contacts may be located so that the memory module is located within a certain range by reducing the disadvantage that breakage or wear occurs during the insertion of the module. 430a to 430b may be configured such that a groove is dug in close contact with the upper portion of the module.

In addition, the pair of module contacts 430a to 430b and the pair of latches 420a to 420b may be connected using a member capable of reciprocating rotation, such as a hinge (not shown).

The connection lever 440 connects the pair of latches 420a to 420b to each other so that the pair of latches 420a to 420b operate simultaneously. As shown, the connection lever 440 may take the form of an L shape so as not to be disturbed when loading or unloading the module 300 into the module test socket by a handler or the like. By configuring the connection lever 440 in the L-shape it is possible to minimize the mechanical interference when the test is performed by the automated device.

In addition, the module test socket according to the present invention may further include a pair of ejectors (ejector, 450a to 450b) which are connected to the lower ends of the pair of latches 420a to 420b and operate to discharge the module. This configuration is designed to reduce mechanical interference when performing manual or automated module discharge.

4B illustrates a state in which the module 300 is fixed in the socket by moving the latches 420a to 420b after the module 300 is loaded into the socket 410.

As shown, the pressure applied by the pair of latches 420a through 420b is transmitted to the module 300 through the pair of module contacts 430a through 430b, indicating that the module 300 is stably fixed to the socket. Can be.

5 is a view showing an embodiment of a module test apparatus using a module test socket according to the present invention.

As shown, the module test apparatus using the module test socket according to the present invention has one or more module test sockets 510a and 510b according to the present invention coupled to the test PCB 520 using fastening means such as screws. By using such a module test apparatus, the module can be stably inserted and discharged, thereby minimizing the possibility of module breakage during the test operation.

Although the present invention has been described in detail, this is for illustrative purposes only, and the protection scope of the present invention is not limited thereto, and the protection scope of the present invention is defined through the description of the claims. For example, although the present invention has been described with respect to a socket for testing a memory module, the module test socket according to the present invention may be applied to a test of a general PCB module.

As described above, according to the present invention, by inserting the memory module by applying pressure to the groove portion of the side surface of the memory module, the memory is applied by applying pressure from the upper portion of the memory module as compared to the conventional method in which the defective rate due to damage or wear of the memory module is high. Including the module contact portion for inserting the module can reduce the failure caused by damage or wear of the memory module.

Claims (6)

A socket including a plurality of contact pins respectively connected to the contact portion of the module and the contact portion of the test apparatus, and having an insertion groove for insertion of the module; A pair of latches disposed on both sides of the socket and rotatably moving within a predetermined range for inserting or ejecting the module into the insertion groove; When the pair of latches and the module is in contact with the module and the module is loaded in the insertion groove of the socket (load) when the pressure is applied to the upper portion of the module through the rotational movement of the pair of latches A pair of module contacts for transmitting pressure to the module according to the rotational movement of the pair of latches to stably insert the module into the socket; Connecting levers connected to each other such that the pair of latches operate simultaneously; Module test socket comprising a. The method of claim 1, And the pair of module contacts are configured to move in a horizontal direction at the top of the module to disperse the pressure delivered to the module. The method of claim 1, And the pair of module contacts are coupled to the pair of latches corresponding to each other using a hinge capable of rotational movement within a predetermined range. The method of claim 1, And the connecting lever is configured to be bent in an L shape. The method of claim 1, Wherein each of the pair of module contacts is grooved to be in close contact with an upper portion of the module to secure the module within a predetermined range. The method of claim 1, And a pair of ejectors connected to the lower ends of the pair of latches and operative for ejection of the module.

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