KR20060100695A - Probe card for multi-chip test - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe chip for a multi-chip test used in a wafer test process in a semiconductor manufacturing process. In particular, an epoxy coating layer is formed on one side or both sides of a contact pin bar constituting the probe card, and the assembly of the contact pin on the epoxy coating layer is performed. The present invention relates to a multi-chip test probe card having a slit groove for processing.

Probe card for the multi-chip test according to the present invention is a plate-like, or coated on both sides or one side of the contact pin bar made of ceramic or quartz with epoxy or EMC to form an epoxy coating layer, each of the epoxy coating layer has a predetermined depth and thickness Process the slit groove, the contact pin bar is protruded at both ends to one side so that the space between the adjacent contact pin bar is uniformly spaced, and the contact pin inserted into the slit groove has a substantially "W" shape to form the same The upper and lower tips protrude in the direction, and the opposite side of the upper and lower tips are inserted into the slit groove, and the contact pin bar housing of the contact pin bar housing to which the contact pin bar is assembled is placed on both ends of the contact pin bar at the edge of the opening. Characterized in that the stepped surface is formed.

Description

Probe card for Multi-chip test

1 is an exploded perspective view of a conventional multi-chip test probe card

Figure 2 is an exploded perspective view of a probe chip for multi-chip test according to the present invention

Figure 3 is a perspective view of the contact pin bar constituting the probe card according to the present invention

4 is a plan view of a state in which a plurality of contact pin bars 200 structured according to the present invention are assembled to the contact pin bar storage stand 120.

5 is a perspective view and a front view of the contact pin constituting the probe card according to the present invention;

Figure 6 is a front sectional view of the contact pin and the contact pin bar assembled state according to the present invention

Figure 7 is a plan view of a state in which the contact pin bar assembled in the contact pin according to the present invention is configured in

8 is a schematic plan view of a chip having different pad positions according to the type of semiconductor;

**** Description of the major symbols in the drawings ***

100: contact pin bar housing 110: contact pin bar housing cover

120: contact pin bar storage 121: opening

122: step surface 123: capacitor formation prevention passage

200: contact pin bar 210: epoxy coating layer

220: slit groove 300: contact pin

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-chip test probe card used in a process of testing a plurality of chips formed on a wafer during a semiconductor manufacturing process. In particular, an epoxy coating layer is formed on one side or both sides of a contact pin bar constituting a probe card. The present invention relates to a probe card for multi-chip test processing a slit groove for assembling a contact pin on a coating layer.

Generally, wafers are discs of 6, 8, 10, and 12 inches and have hundreds of chips for each plate, and each chip has a large capacity such as DRAM, SRAM, or non-memory.

Each chip installed on the wafer is inspected for abnormality. For this inspection, a specific signal must be made by the test system and sent to the chip, and the result of the transmitted signal is received for analysis and determination. Should be able to see.

At this time, the probe card serves as a means of transmitting and receiving signals between the test system and the chips in the wafer.

1 is an exploded perspective view of a conventional multi-chip test probe card.

The prop card is basically a contact pin bar housing cover (11) consisting of a contact pin bar housing cover (11) and a contact pin bar storage stand (12) and a contact pin bar (20) that is stored in a pair of contact pin bars (20). ) And a plurality of thin plate-like contact pins 30 assembled between the contact pin bar 20 and the contact pin bar 20.

Vertical contact slit grooves 21 on both sides of the contact pin bar 20 in the center of the contact pin bar 20 to be assembled between the contact pin bar 20 and the contact pin bar 20, respectively. And the two contact pin bars 20 on both sides, respectively, to process the slit grooves 21 on one side only to correspond to the slit grooves 21 processed on the center contact pin bar 20, The contact pin bar is spaced at equal intervals to assemble the contact pin 30 in the slit groove 21 to assemble the probe chip for multi-chip test.

In the conventional multi-chip test probe card having the above structure, as described above, the plurality of slit grooves 21 are vertically disposed on the opposite surface of the contact pin bar 20. The material of the contact pin bar is ceramic. Since it is manufactured by sintering, the physical properties are brittle and it is difficult to dig a groove.

However, in recent years, the wafer for semiconductor chip manufacturing has been largely sizing from 8 inches to 12 inches, so the development of a probocard capable of testing hundreds of chips on one wafer at a time is not possible. In the trend of increasing the number of chips to be processed per unit area of a wafer due to the development of semiconductor technology, the contact pin bar constituting the pro card is used in the narrow pitch trend of narrowing the pad-to-pad spacing. It is required to reduce the number or to process the interval between the slit grooves 21 finely.

FIG. 8 is a schematic plan view of a chip having different pad positions formed on a wafer according to a type of semiconductor. The chip 1 of the chip 3 of FIG. 8 is a 1-shaped pad array chip having pads p arranged in a “1” shape. The chips 4 to 9 of FIG. 8 are mixed pad array chips in which pads p are arranged in a "1" shape and pads arranged in a "-" shape.

In the case of a conventional probe card, even if a chip having a row of pads (chip 2 in FIG. 8) is to be tested, a plurality of contact pins 30 must be assembled in one row with two contact pin bars 20, and two rows of pads are provided. In order to test the formed chip (chip 2 of FIG. 8), three contact pin bars (chip 1 of FIG. 8) are required.

As described above, a plurality of contact pin bars 20 are required to fix the plurality of contact pins 30, thus occupying a large volume, so that even if the pads are arranged in a single shape, the spacing between the pads having a single line and the pads is shortened. In particular, in order to test mixed pad array chips in which pads p are arranged in a "1" type and pads arranged in a "-" shape, as in the case of chips 4 to 9 of FIG. Pin bars should be vertically intersected, and at least two contact pin bars must be in a pair and take the shape of a crisscross, which makes them difficult to manufacture due to their volume.

The present invention has been made to solve the conventional problems as described above, the conventional probe card is focused on the problem of processing the slit groove in the contact pin bar, epoxy or epoxy to a predetermined thickness on the surface of the contact pin bar Coating with a molding compound, wherein the epoxy or epoxy molding compound is characterized in that the thermal expansion in the temperature range of 100 ℃ to 150 ℃ has a physical property having a considerable strength in the solid state, and the slit on the epoxy coated contact pin bar In forming the slits to be processed in the epoxy coating layer to reduce the number of contact pin bars used in the probe card or to reduce the distance between the slits to provide a probe card that meets the trend of fine pitch.

Probe card for multi-chip test according to the present invention is coated on both sides of the plate-like contact pin bar with epoxy or epoxy molding compound (hereinafter referred to as EMC) to form an epoxy coating layer, each predetermined on the epoxy coating layer The depth and thickness of the slit groove is processed, the contact pin bar is protruded at both ends to one side so that the space between the adjacent contact pin bar is constantly spaced, the contact pin inserted into the slit groove is approximately erect "W "The upper and lower tips protrude in the same direction so that the upper and lower tips are inserted into the slit groove, and the contact pin bar housing of the contact pin bar housing, to which the contact pin bar is assembled, contacts at both edges of the opening. Characterized in that the stepped surface is assembled by mounting both ends of the pin bar.

The multi-chip test probe card according to the present invention having the configuration as described above will be described in detail with the accompanying drawings.

However, the terms or words used in the present specification and claims are regarded as concepts selected by the inventors as the best way to explain the present invention and the meanings consistent with the technical spirit of the present invention in grasping the technical contents of the present invention. It should be properly interpreted as a concept.

2 is an exploded perspective view of a multi-chip test probe card according to the present invention.

The probe card according to the present invention is accommodated in the opening of the contact pin bar housing 100 and the contact pin bar housing 120 including the contact pin bar housing cover 110 and the contact pin bar housing 120 as shown in FIG. 2. The contact pin bar 200 is composed of a plurality of thin plate-like contact pin 300 assembled in the slit groove 210 formed on both sides of the contact pin bar 200, the contact pin bar storage unit 120 is a rectangular plate-like body A rectangular opening 121 is formed at the center of the furnace, and the size of the opening 121 is determined by the length of the contact pin bars and the number of contact pin bars assembled, and both side walls of the opening 121 facing each other are stepped. Each one of the stepped surface 122 is formed by assembling the both ends of the contact pin bar is assembled, and the contact pin bar is assembled on the surface of the contact pin bar storage 120 of the portion formed with the stepped surface 122 Direction Two fine grooves are formed, and the grooves are capacitor formation preventing passages 123, and the number of capacitor formation preventing passages 123 is determined by the number of contact pin bars 200 to be assembled (for one contact pin bar). Two lines of capacitor formation prevention passage is needed.)

The capacitor formation preventing passage 123 is a plurality of contact pins 200 which are conductors, and thus are arranged at narrow intervals, and are passages for preventing charge accumulation in order to prevent the occurrence of electrical capacitors. There is also a heat dissipation function that prevents the accumulation of resistance heat generated when the pin 200 is energized.

As shown in FIG. 2, the contact pin bar 200 is a rod-shaped plate having a relatively thin thickness. The material of the contact pin bar 200 is made of ceramic or quartz, and epoxy or EMC has a constant thickness on both sides or one side. The epoxy coating layer 210 is formed by coating. The epoxy or EMC is a resin having no deformation due to thermal expansion at a high temperature, that is, 100 ° C. to 150 ° C., and is a resin of a material having a significant mechanical strength when cured.

When the contact pin 300 is pressed into the slit groove 220 of the epoxy coating layer 210 and assembled, the slit groove 220 is processed to a width and depth such that the contact pin 300 is not separated even if a significant external force is applied.

As described above, since the contact pin bar 200 according to the present invention forms the epoxy coating layer 210 and processes the slit groove 220 therein, the method of processing the slit groove 220 is also in addition to the processing method by cutting as in the prior art. The chemical processing method by etching or the processing method by laser also became available, and thus the distance between the slit grooves 220 can also be adjusted to the near distance as desired.

As described above, since the contact pin bar 200 according to the present invention has the slit grooves 220 formed on both sides thereof, the contact pins 300 are assembled on both sides thereof. In the conventional case, three contact pin bars are required to form a bee contact pin, but the contact pin bar 200 according to the present invention requires only one contact pin bar.

And the contact pin bar 200 as shown in Figure 3 when the side is standing sideways protruding forward and takes the form of approximately Hangul "C", the protruding portion is adjacent to the contact pin bar assembled as a predetermined Spacing protrusions 230 to be spaced at intervals.

The protruding length of the protrusion 230 is slightly shorter than the sum of the widths of the two contact pins 300.

4 is a perspective view illustrating a state in which a plurality of contact pin bars 200 having a structure according to the present invention are assembled to the contact pin bar housing 120 of the contact pin bar housing 100.

As shown in FIG. 4, in the state where a plurality of contact pins 300 are formed on both sides, the contact pin bar 200 spans two step surfaces 122 of the contact pin bar storage stand 120 and adjacent contact pin bars 200. ) Is assembled without contact between the contact pins 300 facing each other while being separated by a spaced-apart protrusion 230, and not illustrated, but a plurality of contact pin bars 200 as described above are omitted. After storing in the 120, the contact pin bar housing cover 110 is assembled to the upper surface of the contact pin bar storage stand 120 to fix the contact pin bar 200 and the contact pin 300.

The contact pin 300 has a "W" shape that is approximately laterally erected as shown in FIG. 5 so that the upper tip 310 and the lower tip 320 protrude in the same direction (but in some cases, the upper tip). And the lower tip may be configured to face in the opposite direction, which is not excluded from the protection scope of the present invention.) The opposite sides of the upper and lower tips 310 and 320 form an insertion part 330 inserted into the slit groove. And, the insertion part 330 is cut in the longitudinal direction and the groove is formed concave, the groove between the contact pin 300 adjacent when the contact pin 300 is assembled to the slit groove 210 of the contact pin bar 200 Since the spacing becomes minute, the capacitor is electrically formed by the contact pins 300, so that there is a risk of generating an error in measuring the electrical characteristics of the chip. Therefore, charges are collected to prevent the formation of the capacitor. To prevent It is a groove forming a capacitor formation prevention passage 340 for.

FIG. 6 is a partial perspective view of the contact pin 300 having the above-described configuration assembled to the contact pin bar 200. The capacitor pin preventing passage 340 is well illustrated.

Therefore, the capacitor formation preventing passage 340 is formed in each of the contact pin bar 200, or two each, one by one, the number corresponding to the formation of the capacitor pin preventing passage 123 is formed on the surface of the contact pin bar storage 120 do.

FIG. 7 is a perspective view illustrating a state in which a contact pin bar assembled with a contact pin according to the present invention has a shape of a U-shaped, which is configured to test the mixed pad array chip of FIG. 8. That is, according to the present invention, one or two-row contact pins may be assembled on one or both sides of one contact pin bar, and thus, spatially advantageous, the contact pins may be constructed to cross the assembled contact pin bars.

As described above, the probe pin may be configured by vertically crossing the contact pin bar and the contact pin bar to test the chip in which the contact pin bar is a mixed pad array.

As described above, the multi-chip test probe card according to the present invention processes the slit groove by forming an epoxy coating layer on one or both sides of the contact pin bar, so that the processing of the slit groove is performed by etching in addition to the conventional processing method by cutting. It is also possible to use a laser processing method or a deeper slit groove, so that one or two rows of contact pins can be assembled with a single contact pin, which is advantageous for testing chips that are miniaturized. In addition, the distance between the slit groove and the slit groove can be reduced to meet the trend of shortening the distance between the pads of the chip.

In addition, as described above, the contact pin bar according to the present invention has a structure capable of assembling one or two lines of contact pins with one contact pin bar, so that the contact pin bar can be structurally formed crosswise so that the pad is "1" type. It is also possible to cope with the diversification of chips with the emergence of chips with a mixture of arrays and "-" arrays.

Claims (5)

A contact pin bar housing composed of a contact pin bar housing cover and a contact pin bar housing, a plurality of contact pin bars accommodated in the contact pin bar storage slot, and a slit groove processed in a vertical groove on one or both sides of the contact pin bar and a part of the slit groove. In the probe card consisting of a contact pin inserted and assembled, on one side or both sides of the contact pin bar 200 to form an epoxy coating layer coated with epoxy of a material that is not deformed by heat at 100 ℃, and a slit groove in the epoxy coating layer Probe card characterized by processing The probe card of claim 1, wherein the contact pin bar is made of quartz. A contact pin bar housing composed of a contact pin bar housing cover and a contact pin bar housing, a plurality of contact pin bars accommodated in the contact pin bar storage slot, and a slit groove processed in a vertical groove on one or both sides of the contact pin bar and a part of the slit groove. In the probe card composed of contact pins inserted and assembled, the contact pin bars 200 are spaced apart from each other so that the contact pin bars adjacent to each other are formed at a predetermined interval by taking a front “H” shape of the front end portions of the contact pins. Protruding portion 230 is formed, the contact pin bar storage 120 is formed in the opposite side walls of the opening 121 formed in the center facing each other stepped to form a step surface 122, respectively, the protrusion of the contact pin bar Probe card, characterized in that assembled on According to claim 3, the plurality of contact pin bar 200 accommodated in the contact pin bar storage 120 120 is assembled so that the contact pin bar 200 and the contact pin bar 200 perpendicularly cross each other and the "1" type array and Probe cards characterized by the ability to test chips with mixed pads of "-" type arrays A contact pin bar housing composed of a contact pin bar housing cover and a contact pin bar housing, a plurality of contact pin bars accommodated in the contact pin bar storage slot, and a slit groove processed in a vertical groove on one or both sides of the contact pin bar and a part of the slit groove. In the probe card consisting of a contact pin inserted and assembled, the contact pin 300 takes the shape of a standing “W” so that the upper tip 310 and the lower tip 320 face in the same direction, and the upper and lower tips 310 and 320. The opposite side of) forms an insertion portion 330 inserted into the slit groove of the contact pin bar 200. The insertion portion 330 is cut in the longitudinal direction and recessed to process the groove to prevent the formation of a capacitor. A capacitor formation prevention passage 340 is formed to prevent the condensation, and communicates with the capacitor formation prevention passage 340 to form a capacitor on the surface of the contact pin bar storage 120. The probe card is characterized in that the anti-passage 123 formed

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