KR20060080481A - Effusion cell for depositing material and deposition system having it - Google Patents

Effusion cell for depositing material and deposition system having it Download PDF

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KR20060080481A
KR20060080481A KR1020050000963A KR20050000963A KR20060080481A KR 20060080481 A KR20060080481 A KR 20060080481A KR 1020050000963 A KR1020050000963 A KR 1020050000963A KR 20050000963 A KR20050000963 A KR 20050000963A KR 20060080481 A KR20060080481 A KR 20060080481A
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heating
organic material
body
heater
organic
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KR100796148B1 (en
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강희철
이성호
조원석
황민정
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삼성에스디아이 주식회사
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0002Deposition of organic semiconductor materials on a substrate
    • H01L51/0008Deposition of organic semiconductor materials on a substrate using physical deposition, e.g. sublimation, sputtering
    • H01L51/001Vacuum deposition
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0002Deposition of organic semiconductor materials on a substrate
    • H01L51/0008Deposition of organic semiconductor materials on a substrate using physical deposition, e.g. sublimation, sputtering
    • H01L51/0011Deposition of organic semiconductor materials on a substrate using physical deposition, e.g. sublimation, sputtering selective deposition, e.g. using a mask
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0002Deposition of organic semiconductor materials on a substrate
    • H01L51/0012Deposition of organic semiconductor materials on a substrate special provisions for the orientation or alignment of the layer to be deposited

Abstract

본 발명은 물질증착용 증착원 및 이를 구비한 증착시스템에 관한 것으로서, 진공챔버; The present invention relates to a vapor deposition material evaporation source and a vapor deposition system including the same, a vacuum chamber; 상기 진공챔버의 일측에 설치되는 기판과 마스크를 정렬된 상태로 지지하는 척을 갖는 스테이지; Stage having a chuck for supporting a substrate in an ordered and mask, which is installed at one side of the vacuum chamber state; 상기 진공챔버의 타측에 설치되는 구동축; A drive shaft installed in the other side of the vacuum chamber; 및 상기 구동축을 따라서 이동가능하도록 설치되는 증착원으로 구성되고, 상기 증착원은 유기물질이 저장되어 있는 도가니와, 상기 도가니를 가열하는 제1가열체와, 상기 제1가열체의 가열작용에 의해서 상기 유기물질이 증발하여 형성되는 유기기상물질이 분사되는 분사노즐부와, 상기 분사노즐부를 가열하고 상기 제1가열체에 비하여 고온으로 유지되어 있는 제2가열체로 이루어진 것을 특징으로 하므로 노즐막힘현상 및 스플래시 현상을 방지하여 기판에 유기물질을 균일하게 증착하여 대면적 디스플레이를 효율적으로 수행할 수 있다. And it consists of a vapor source, which is installed to be movable along the drive shaft, wherein the evaporation source is by the heating of the first heating body, and the first heating member for heating the crucible which the organic material is stored, the furnace and the spray nozzle unit that organic vapor phase materials on which the organic material evaporation to form the injection, the heating section the injection nozzle, and wherein the so characterized by comprising body second heating is maintained at a high temperature than the first heating body clogging nozzle developer and and to prevent the splash phenomenon uniformly deposit the organic material on the substrate can be carried out large-scale display efficiently.
가열체, 열효율, 유기기상물질 The heating body, the thermal efficiency, the organic material vapor

Description

물질증착용 증착원 및 이를 구비한 증착시스템{EFFUSION CELL FOR DEPOSITING MATERIAL AND DEPOSITION SYSTEM HAVING IT} Material deposition evaporation source and a vapor deposition system including the same {EFFUSION CELL FOR DEPOSITING MATERIAL AND DEPOSITION SYSTEM HAVING IT}

도 1은 본 발명에 따른 가열장치가 내장된 증착원이 버퍼영역에 위치하고 있는 진공증착 시스템을 나타내는 개략도; Figure 1 is a schematic view showing a vacuum deposition system in which the evaporation source heating unit is built according to the invention is located in a buffer area;

도 2는 본 발명에 따른 가열장치가 내장된 증착원이 성막영역에 위치하고 있는 진공증착 시스템을 나타내는 개략도; Figure 2 is a schematic view showing a vacuum deposition system in which the evaporation source heating unit is built in accordance with the present invention located in the deposition area;

도 3은 본 발명에 따른 가열장치가 증착원에 설치되어 있는 상태를 도시한 단면도. 3 is installed in the evaporation source heating unit according to the invention a cross-sectional view showing the state.

< 도면의 주요부분에 대한 부호의 설명 > <Description of the Related Art>

10 : 진공챔버 10: vacuum chamber

20 : 증착원 20: deposition source

22 : 도가니 22: crucible

24 : 분사노즐부 24: injection nozzle unit

30 : 기판 30: substrate

40 : 마스크 40: Mask

50 : 척 50: Chuck

100 : 진공증착 시스템 100: vacuum deposition system

본 발명은 저장되어 있는 유기물질을 증발시켜서 형성되는 유기기상물질을 분사하는 증착원 및 이를 구비한 증착시스템에 관한 것이고, 더 상세하게는 분사되는 유기기상물질의 응축현상에 의한 분사노즐부에서의 노즐막힘 및 스플래시 현상을 방지하고 유기기상물질이 기판에 균일하게 증착될 수 있도록 유기물질이 저장되어 있는 도가니를 가열하는 가열체의 가열작용에 비하여 유기기상물질이 분사되는 분사노즐부를 가열하는 가열체의 가열작용을 증대시킬 수 있는 증착원 및 이를 구비한 증착시스템에 관한 것이다. The present invention in the sub-eject nozzle by the condensation of an organic gas phase material to be directed to a vapor deposition source and a deposition system including the same for ejecting the organic vapor phase material formed by evaporating an organic material which is stored and, more particularly injection prevent nozzle clogging and splash phenomenon, and the heating body to heat parts of the injection nozzle, which is the organic vapor phase material injection as compared to the heating action of the heating body to heat the crucible which the organic material is stored to the organic vapor phase material it can be uniformly deposited on the substrate heating evaporation source that can increase the action and relates to a vapor deposition system having the same.

일반적으로, 평판 디스플레이 중의 하나인 전계발광 디스플레이 장치는 발광층으로 사용하는 물질에 따라서 무기전계발광 디스플레이 장치와, 유기전계발광 디스플레이 장치로 구분되고, 유기전계발광 디스플레이 장치는 저전압으로 구동이 가능하고, 경량의 박형이면서 시야각이 넓을 뿐만 아니라 응답속도 또한 빠르다는 장점을 구비하고 있기 때문에 각광을 받고 있다. In general, one of the EL display device of the flat panel display is separated by the inorganic electroluminescent display device, an organic electroluminescent display device according to materials used for the light emitting layer, the organic light emitting display device can be driven at a low voltage, and light-weight yet thin as wide a viewing angle as a response speed also is under the spotlight because it offers the advantages is fast.

이러한 유기전계발광 디스플레이 장치의 유기전계 발광소자는 기판 상에 적층식으로 형성되는 양극, 유기물층 및 음극으로 구성된다. The organic electroluminescence device of the organic EL display apparatus is of a positive electrode, an organic material layer and a negative electrode formed of the laminated on a substrate. 상기 유기물층은 정공과 전자가 재결합하여 여기자를 형성하고 빛을 방출하는 유기 발광층의 유기물층을 포함하고, 또한 정공과 전자를 유기 발광층으로 원활하게 수송하여 발광효율을 향상시키기 위하여 상기 음극과 유기 발광층 사이에 전자 주입층과 전자 수송층의 유기물층을 개재시키면서 양극과 유기 발광층 사이에 정공 주입층과 전자 수송층의 유기물층을 개재시킨다. Between the organic compound layer and holes and electrons recombine and includes an organic material layer of the organic light emitting layer to form an exciton and emit light, and holes and electrons to order to smoothly transported to the organic light emitting layer to improve luminous efficiency the negative electrode, an organic emission layer while sandwiching the organic compound layer of an electron injecting layer and the electron transport layer thereby sandwiching the organic layer of the hole injection layer and the electron transport layer between the anode and the organic emission layer.

상술된 구조로 이루어진 유기전계 발광소자는 일반적으로, 진공증착법, 이온 플레이팅법 및 스퍼터링법 등과 같은 물리기상 증착법 또는 가스 반응에 의한 화학기상 증착법으로 제작된다. The organic electroluminescent device comprising the structure described above is commonly manufactured by vacuum deposition method, an ion plating method and physical vapor deposition or chemical vapor deposition method by a gas reaction, such as a sputtering method. 특히, 유기전계 발광소자의 유기물층을 형성하기 위해서는 진공중에서 증발시킨 유기물질을 기판에 증착시키는 진공증착법이 널리 사용되고 있으며, 이러한 진공증착법에는 진공챔버 내에서 증발되는 유기물질을 기판에 분사시키는 증착원(effusion cell)이 사용된다. In particular, in order to form an organic layer of an organic EL device, and a vacuum deposition method is widely used to deposit the organic material is evaporated in a vacuum to the substrate, the vacuum deposition method, the deposition source to spray an organic material to be evaporated in the vacuum chamber on the substrate ( this effusion cell) is used.

상기 증착원은 유기물질이 수용되어 있는 도가니와, 상기 도가니를 가열시키는 가열수단과, 상기 가열수단에 의해서 증발되는 유기기상물질을 분사하는 분사노즐부와, 상기 도가니로부터 상기 분사노즐까지 유기기상물질을 안내하는 유도로가 포함된다. Wherein the evaporation source is an organic vapor phase material to the injection nozzle and the crucible which is accommodated the organic material, the heating means, and the injection nozzle part for injecting the organic gaseous substances to be evaporated by said heating means, and the crucible for heating the crucible. that the guide is included for guiding.

따라서, 기판이 진공챔버 내에 장착된 상태에서, 가열수단에 의해서 가열되어 증발되는 유기물질은 유도로를 경유하여 분사노즐을 통해서 기판으로 분사되어 증착된다. Thus, in the substrate is mounted in a vacuum chamber condition, is heated by the heating means is an organic material to be evaporated is deposited by way of an induction jet to the substrate through a spray nozzle. 이때, 진공증착법의 취급자는 기판에 형성되는 유기물층의 스텝 커버리지 및 균일도를 향상시키기 위한 노력을 경주하고 있다. At this time, the person handling the vacuum deposition racing efforts to improve the step coverage and uniformity of the organic compound layer formed on the substrate.

특히, 기판이 대형화되는 추세하에서, 양호한 스텝 커버리지와 균일도를 갖는 유기물층을 기판에 형성하기 위하여 증착원이 진공챔버 내에서 수직 상하방향으 로 이동하면서 정지되어 있는 기판에 유기물질을 증발시킴으로써 형성되는 유기기상물질을 분사하는 수직 이동형 유기물 증착장치가 개발되었다. In particular, under the tendency that the substrate is large, the organic is formed by evaporating the organic material in the substrate, to which the evaporation source is stopped while moving in a vertical up and down direction in the vacuum chamber to form an organic layer having a good step coverage and uniformity on a substrate the vertical portable organic vapor deposition apparatus for injecting a substance has been developed.

그러나, 이러한 수직 이동형 유기물 증착장치에 있어서, 유기물층의 성막면적을 증대시키기 위하여 증착원의 분사노즐의 개구를 확대하였으며, 이는 유기기상물질의 응축현상 등에 의한 분사노즐의 막힘, 스플래시 현상 등의 문제점을 수반하였다. However, the problems such as in this vertical removable organic material deposition apparatus, was enlarged to the opening of the injection nozzle in the evaporation source in order to increase the deposition area of ​​the organic layer, which clogging of the injection nozzle due to condensation of the organic vapor phase material, the splash phenomenon It was involved. 결과적으로, 분사노즐을 통한 유기기상물질의 불균일한 분사를 유발시켜 기판에 형성되는 유기물층의 균일성을 저하시키는 원인으로 작용하였다. As a result, served as a cause to lead to non-uniform spraying of the organic vapor phase material through the injection nozzle decreases the uniformity of the organic compound layer formed on the substrate.

또한, 유기기상물질을 도가니로부터 분사노즐부로 안내하기 위한 유도로에 의해서 증착원의 크기를 소형화시키는 것이 불가능하였다. In addition, it has been impossible to miniaturize the size of the evaporation source by induction in the injection nozzle portion for guiding the organic material vapor from the crucible.

따라서, 수직 이동형 유기물 증착장치에 있어서, 증착원의 크기를 소형화시키면서 상대적으로 양호한 균일도를 갖는 유기물층을 기판에 형성하기 위한 방안이 요구되었다. Therefore, in the vertically movable organic material deposition apparatus, it has been required a scheme for forming an organic compound layer having a relatively good uniformity while downsizing the size of the evaporation source to the substrate. 또한, 분사노즐부에서 유기기상물질의 응축현상에 의한 분사노즐부의 막힘현상 및 스플래시 현상을 방지할 수 있는 방안이 요구되었다. In addition, the ways in the injection nozzle portion can be prevented from clogging the injection nozzle portion and a splash phenomenon caused by condensation of the gaseous organic substance was required.

본 발명은 상기된 바와 같은 종래의 문제점을 해결하기 위하여 제안된 것으로, 기판의 대형화에 대응하기 위한 수직 이동형 유기물 증착장치에 있어서 증착원의 크기를 소형화시키면서 도가니에서 유기물질이 증발되어 형성되는 유기기상물질에 의한 분사노즐의 노즐막힘 현상 또는 스플래시 현상을 방지하여 기판에 형성되는 유기물층의 균일도를 향상시킬 수 있는 증착원 및 이를 구비한 증착시스템을 제 공하는 데 그 목적이 있다. The present invention has been that, while downsizing the size of the evaporation source in the vertical removable organic material deposition apparatus to respond to upsizing of the substrate organic vapor that is formed by the organic material evaporated from the crucible proposed to solve the conventional problems as described above preventing the nozzle clogging or the splash phenomenon of the spray nozzle by the material deposited to improve the uniformity of the organic compound layer formed on the substrate and the source to provide a vapor deposition system having the same has the purpose.

상기 목적을 달성하기 위하여, 본 발명의 실시예에 따르면, 물질증착용 증착원은 유기물질이 저장되어 있는 도가니와; In order to achieve the above object, according to an embodiment of the present invention, the deposition material deposition source crucible is in the organic material is stored and; 상기 도가니를 가열하는 제1가열체와; And a first heater for heating the crucible; 상기 제1가열체의 가열작용에 의해서 상기 유기물질이 증발하여 형성되는 유기기상물질이 분사되는 분사노즐부와; Wherein said ejection nozzle portion is the organic material vapor formed by the evaporation of the organic material injected by the heating action of the heating body 1 and; 상기 분사노즐부를 가열하는 제2가열체로 이루어지고, 상기 제2가열체는 상기 제1가열체에 비하여 고온으로 유지되어 있는 것을 특징으로 한다. Body comprises a second heating portion for heating the injection nozzle, and the second heating element is characterized in that it is maintained at a high temperature than in the first heating body.

본 발명의 다른 실시예에 따르면, 증착시스템은 진공챔버; In accordance with another embodiment of the invention, the vapor deposition system has a vacuum chamber; 상기 진공챔버의 일측에 설치되는 기판과 마스크를 정렬된 상태로 지지하는 척을 갖는 스테이지; Stage having a chuck for supporting a substrate in an ordered and mask, which is installed at one side of the vacuum chamber state; 상기 진공챔버의 타측에 설치되는 구동축; A drive shaft installed in the other side of the vacuum chamber; 및 상기 구동축을 따라서 이동가능하도록 설치되는 증착원으로 구성되고, 상기 증착원은 유기물질이 저장되어 있는 도가니와, 상기 도가니를 가열하는 제1가열체와, 상기 제1가열체의 가열작용에 의해서 상기 유기물질이 증발하여 형성되는 유기기상물질이 분사되는 분사노즐부와, 상기 분사노즐부를 가열하고 상기 제1가열체에 비하여 고온으로 유지되어 있는 제2가열체로 이루어진 것을 특징으로 한다. And it consists of a vapor source, which is installed to be movable along the drive shaft, wherein the evaporation source is by the heating of the first heating body, and the first heating member for heating the crucible which the organic material is stored, the furnace and the spray nozzle unit is a gas phase organic material to be evaporated to form the organic material injected, heated parts of the injection nozzle, and is characterized in that the second body made of heat, which is held at a high temperature than in the first heating body.

바람직하게, 상기 제2가열체의 열선의 권취수는 상기 제1가열체의 권취수보다 높게 하여 상기 분사노즐부에 더 많은 발열이 이루어지도록 한다. Preferably, the first number of windings of the heating coil of the heating body 2 is such that more heat conducted to the injection nozzle unit to higher than the number of windings of the first heater.

더 바람직하게, 상기 제1가열체와 제2가열체에 대한 가열제어를 개별적으로 수행할 수 있는 제어부를 더 포함한다. More preferably, further comprises a control unit capable of performing the heating control individually for the first heater and the second heater.

이하, 첨부도면을 참조하여 본 발명의 바람직한 실시예를 설명한다. With reference to the accompanying drawings will be described a preferred embodiment of the present invention. 그리고, 용어 '유기물질'은 기판에 유기물층을 형성하기 위하여 도가니에 액체상태 또는 고체상태로 저장되어 있는 물질을 의미하고, 용어 '유기기상물질'은 도가니를 가열할 때 유기물질이 증발함으로써 형성되는 기체상태의 물질을 의미한다. And, in which the term "organic material" means a material that is stored in a liquid state or solid state in a crucible to form an organic layer on the substrate, the term "organic vapor phase material, is formed by the organic material evaporates when heated crucible It means a substance in a gaseous state. 이와 같이, 본 발명을 설명함에 있어서 사용되는 특정용어는 설명의 편리성을 위하여 정의된 것이므로 당 분야에 종사하는 기술자의 의도 또는 관례 등에 따라 달라질 수 있고 또한 본 발명의 기술적 구성요소를 한정하는 의미로 이해되어서는 아니될 것이다. In this way, certain terms used in describing the present invention, because it is defined for convenience of description may vary depending on the intention or practice of a technician working in the art also as a means to limit the technical components of the present invention It will not be understood.

먼저, 유기전계 발광소자의 유기물층을 형성하기 위한 진공증착법은 진공챔버를 포함하는 진공증착 시스템에서 수행된다. First, a vacuum deposition method for forming the organic compound layer of the organic EL device is carried out in a vacuum vapor deposition system including a vacuum chamber.

도 1을 참조하면, 진공증착 시스템(100)의 진공챔버(10)에는 유기물층을 형성하고자 하는 기판(30)과, 기판(30)의 전면에 설치되는 마스크(40)와, 마스크(40)로부터 소정 간격으로 이격되어 있는 증착원(20)이 설치된다. 1, from the front mask 40 is provided on the substrate 30 and the substrate 30 to the formation of the organic layer vacuum chamber 10 of the vacuum deposition system 100, the mask 40 the evaporation source (20) that are spaced apart at a predetermined interval is provided. 마스크(40)와 기판(30)은 얼라인먼트 시스템(미도시)에 의해서 정렬된 상태로 척(50)에 서로 밀착된 상태로 고정된다. Mask 40 and the substrate 30 is fixed in a state in close contact with each other in the chuck 50 to the alignment by the alignment system (not shown). 마스크(40)는 기판(30)에 형성하고자 하는 유기물층에 대응하는 패턴이 형성되어 있는 패턴형성부(가상선으로 표시됨)와, 마스크 프레임(미도시)에 용접을 통해서 고정되는 고정부로 구성된다. Mask 40 is composed of a fixed part which is fixed via welding to the substrate 30 (not shown), the organic layer pattern forming unit that the pattern is formed, and a mask frame (shown in phantom) corresponding to the to be formed in . 이때, 진공챔버(10)는 마스크(40) 및 기판(30)의 설치위치에 대응하는 성막영역(B)과 상기 성막영역(B) 이외의 위치에 대응하는 버퍼영역(A)으로 구분된다. At this time, the vacuum chamber 10 is divided into a buffer area (A) corresponding to a position other than the film formation area (B) and the film formation area (B) corresponding to the installation position of the mask 40 and the substrate 30.

증착원(20)은 이동수단(미도시)의 작동에 의해서 진공챔버(10) 내에서 수직 상하방향으로 이동한다. Evaporation source 20 by the operation of the moving means (not shown) moves up and down in the vertical direction in the vacuum chamber 10.

도 3을 참조하면, 증착원(20)은 유기물질이 저장되어 있는 도가니(22)와, 도가니를 가열하기 위한 제1가열체(20a)와, 제1가열체(20a)의 가열작용에 의해서 증발되는 유기기상물질이 분사되는 분사노즐부(24)와, 분사노즐부(24)를 가열하기 위한 제2가열체(20b)로 구성된다. 3, the evaporation source 20 by the heating of the crucible 22 in the organic material is stored, the first heating member (20a), a first heater (20a) for heating the crucible. and that this organic material vapor that is evaporated spray injection nozzle 24, comprises a second heater (20b) for heating the injection nozzle part (24).

제1가열체(20a)의 가열작용에 의해 도가니(22)가 가열됨으로써 도가니(22)에 저장되어 있는 유기물질은 증발한다. The first is stored in the crucible 22, thereby heating the crucible 22 by heating the organic material in the heating body (20a) is evaporated. 그리고, 제2가열체(20b)의 가열작용에 의해 분사노즐부(24)가 가열됨으로써 도가니(22)에서 증발한 유기기상물질은 응축현상없이 분사노즐부(24)를 기체상태로 통과하여 기판에서 응축된다. The second heat, organic gaseous substances evaporated in the crucible 22, thereby heating the injection nozzle unit 24 by the heating action of the body (20b) are substrates through the injection nozzle portion 24 without condensation in a gaseous state It is condensed in.

이때, 제1가열체(20a)와 제2가열체(20b)는 열선과 같이 통전 등에 의해서 열을 발산시키는 부재를 의미하지만 이에 한정되지는 않는다. At this time, the first heating member (20a) and a second heater (20b) refers to a member to dissipate heat by conduction or the like, such as hot wire, but are not limited to.

본 발명에 따르면, 제1가열체(20a)에 의한 열효율에 비하여 제2가열체(20b)에 의한 열효율이 크게 유지되도록 한다. According to the invention, the first to the second is largely maintaining the thermal efficiency by the heating body (20b) than the heat efficiency by the heating body (20a). 이는 후술하는 바와 같이 제1가열체(20a)의 가열작용에 의해서 유기물질이 증발됨으로써 형성되는 유기기상물질이 분사노즐부(24)를 통과할 때 응축되는 것을 방지하기 위함이다. This is to prevent the organic material vapor, as formed by the organic material evaporated by the heating action of the first heater (20a) described later is condensed when passing through the injection nozzle unit 24.

또한, 상술된 가열작용은 도가니(22)와 분사노즐부(24)에 설치되는 열발산부재의 권취횟수, 예를 들어 열선의 권취횟수에 비례한다. In addition, the above-described heating furnace is 22 and the winding number of the heat dissipating member provided in the injection nozzle 24, for example in proportion to the winding number of the hot line. 즉, 열선의 권취횟수가 많을수록 가열작용이 증가한다. That is, the heating increases the more the number of winding of the heating wire. 따라서, 분사노즐부(24)의 주위에 설치되는 열선 의 권취횟수를 도가니(22)의 주위에 설치되는 열선의 권취횟수에 비하여 증가시킴으로써 별도의 제어변수 없이 동일 파워를 상기 열선에 인가하면 분사노즐부(24)는 도가니(22)에 비하여 신속하게 가열된다. Thus, by increasing than the winding number of the hot line that is provided around the injection nozzle part 24 to the winding number of the hot line that is provided around the crucible 22 is applied to the hot wire by the same power without any control variable injection nozzle section 24 is rapidly heated than the crucible (22).

특히, 제1가열체(20a)와 제2가열체(20b)에 대한 가열제어는 개별적으로 수행되는 것이 바람직하다. Specifically, a first heating control for the heating body (20a) and a second heater (20b) is preferably carried out separately. 이러한 개별 제어는 분사노즐부(24)가 도가니(22)에 비하여 상대적으로 신속하게 가열될 수 있도록 제어부(미도시)에 의해서 수행된다. This individual control is performed by a controller (not shown) to the injection nozzle part 24 it can be relatively rapidly heated as compared to the crucible (22).

한편, 열선의 권취횟수가 증가함에 따라 열보유량이 증가하므로, 유기물층 형성작업을 중지할 필요성이 있는 경우, 예를 들어 도가니(22)에 저장되어 있는 유기물질이 전부 소모된 경우에는 가열체(20a, 20b)에 인가되는 동력을 차단하여도 분사노즐부(24)는 도가니(22)에 비하여 장시간 열을 보유하게 된다. On the other hand, the heat retention because it increases as the winding number of the hot line is increased, if there is a need to stop the organic layer forming operation, for example when the organic material stored in the crucible 22 is depleted, the heating body (20a and Fig injection nozzle unit (24 to block the power to be applied to 20b)), is to hold the heat for a long time compared with the crucible (22).

도 1을 다시 참조하면, 상술된 구조로 이루어진 진공증착 시스템(100)에 있어서, 진공챔버(10)의 일측에는 기판(30)과 마스크(40)를 정렬된 상태로 지지하는 척(50)이 제공된다. Referring back to Figure 1, in the vacuum deposition system 100 is composed of the above-described structure, the chuck (50) for supporting a is aligned to the substrate 30 and the mask 40 state one side of the vacuum chamber 10 is It is provided. 진공챔버(10)의 타측에는 구동축이 제공되고, 상기 구동축에는 유기기상물질을 분사하는 증착원(20)이 수직 상하방향으로 이동가능하게 설치된다. The other side of the drive shaft of the vacuum chamber 10 is provided, the drive shaft is provided to enable the evaporation source (20) for injecting a gaseous organic matter is moved vertically up and down.

증착원(20)은 진공챔버(10) 내에서 버퍼영역(A)에 위치한다. An evaporation source (20) is located in the buffer area (A) in the vacuum chamber 10. 마스크(40)와 기판은 증착원(20)으로부터 이격해서 위치하고, 이들은 서로 정렬된 상태로 얼라인먼트 시스템(미도시)의 척(50)에 밀착된다. Mask 40 and the substrate is positioned by remote from the evaporation source 20, which are aligned with each other, the close contact to the chuck 50 of the alignment system (not shown).

그리고, 기판(30) 상에 유기물층을 형성하기 위하여 제어부(미도시)에 의해서 가열체(20a, 20b; 도 3 참조)에 동력이 인가되면, 제1가열체(20a)와 제2가열체 (20b)의 가열작용에 의해서 도가니(22)와 및 분사노즐부(24)는 가열된다. Then, the heating member by a controller (not shown) to form an organic layer on a substrate (30) when the power on (20a, 20b, see Fig. 3) is applied, the first heating member (20a) and a second heater ( 20b) and the crucible 22 by the heating operation and an ejection nozzle portion (24) is heated. 이때, 상기 제어부는 제1가열체(20a)와 제2가열체(20b)에 대한 가열제어를 개별적으로 수행할 수도 있다. At this time, the control unit may perform the heating control for the first heating member (20a) and a second heater (20b) separately. 결과적으로, 열선이 상대적으로 많이 설치되어 있는 분사노즐부(24)는 도가니(22)에 비하여 신속하게 가열된다. As a result, the injection nozzle unit 24, which heating coil is disposed relative to the lot is rapidly heated than the crucible (22).

따라서, 도가니(22)의 유기물질이 증발함으로써 형성되는 유기기상물질은 응축현상없이 분사노즐부(24)를 통해서 분사되므로 분사노즐부(24)에서의 노즐막힘현상 및 스플래시 현상이 방지된다. Therefore, the organic material vapor is formed by the organic material of the crucible 22 is evaporated, so the injection through the injection nozzle portion 24 without condensation is prevented from nozzle clogging and the splash phenomenon of the ejection nozzle portion 24.

이 후에, 도 2에 도시한 바와 같이, 증착원(20)이 진공챔버(10)의 성막영역(B)에서 상기 구동축을 따라 수직 상하방향으로 이동하는 동안, 제1가열체(20a)의 가열작용에 의해서 도가니(22)에 저장되어 있는 유기물질이 증발하여 발생되는 유기기상물질은 분사노즐부(24)를 통해서 분사된다. After this, even during the evaporation source 20 is moved in the vertical down direction along the drive shaft in the film forming region (B) of the vacuum chamber 10 as shown in Fig. 2, the heating of the first heating member (20a) the organic material vapor is generated by evaporation of organic material is stored in the crucible 22 by the action is sprayed through the spray nozzle unit 24. 그리고, 분사되는 유기기상물질이 기판(30)에서 응축함으로써 기판(30) 상에 유기물층을 형성하는 성막공정을 수행한다. Then, the organic material vapor is condensed in a spray board (30) performs the film formation step of forming an organic layer on a substrate (30).

상술된 성막공정을 중지할 필요성이 있는 경우, 예를 들어 도가니(22)에 저장되어 있는 유기물질이 전부 소모된 경우에는 증착원(20)을 진공챔버(10)의 버퍼영역(A)으로 이동시킨다. If there is a need to stop the above-described film formation process, if for example, the organic material stored in the crucible 22 is depleted, move the evaporation source 20 to the buffer zone (A) of the vacuum chamber 10 thereby. 그리고, 상기 제어부의 제어동작에 의해서 가열체(20a, 20b)에 인가되는 동력을 차단한다. Then, the blocking force to be applied to the heating member (20a, 20b) by the control operation of the controller.

결과적으로, 도가니(22)에 대한 제1가열체(20a)의 가열작용과 분사노즐부(24)에 대한 제2가열체(20b)의 가열작용이 정지되어 유기기상물질이 분사노즐부(24)를 통해 분사되는 것을 중지시킨다. As a result, the crucible 22, the first second heating action of the heating body (20b) for heating the injection nozzle 24 of the heating member (20a) is stopped portion are injection nozzle organic vapor phase material to the (24 ) it stops being injected through.

상술된 바와 같이 열선이 상대적으로 많이 설치되어 있는 분사노즐부(24)는 도가니(22)에 비하여 상대적으로 많은 열량을 보유하고 있으므로, 가열체(20a, 20b)에 인가되는 동력을 차단하는 경우에 도가니(22)가 분사노즐부(24)에 비해서 빨리 냉각된다. Hot wires are installed relatively large as the injection nozzle unit 24, which as described above is in the case of blocking the power applied to it, and relatively stocks many calories, the heating body (20a, 20b) than the crucible 22 the crucible 22 is quickly cooled than the injection nozzle unit 24. the 이는 증착원(20)의 내부에 유기기상물질이 존재하는 것을 방지하여 유기기상물질의 응축에 의한 노즐막힘현상 및 스플래시 현상을 방지한다. This is to prevent the organic material vapor present in the interior of the evaporation source 20 to prevent the nozzle clogging and splash caused by condensation of the gaseous organic substances.

상기 내용은 본 발명의 바람직한 실시예를 단지 예시한 것으로 본 발명이 속하는 분야의 당업자는 첨부된 청구범위에 기재된 본 발명의 사상 및 요지로부터 벗어나지 않고 본 발명에 대한 수정 및 변경을 가할 수 있다는 것을 인식하여야 한다. The information is recognized that those skilled in the art to which the present invention pertains to the way of example only a preferred embodiment of the present invention can be applied to changes and modifications to the invention without departing from the spirit and substance of the invention as set forth in the appended claims shall.

본 발명에 따르면, 유기물질이 저장되어 있는 도가니와 유기기상물질이 분사되는 분사노즐부를 각각 가열하는 가열체의 열용량을 다르게 설정하고 특히 분사노즐부를 가열하는 가열체를 도가니를 가열하는 가열체에 비해 고온으로 유지함으로써 분사노즐부에서 유기기상물질이 응축되는 것을 방지하여 노즐막힘현상 및 스플래시 현상을 방지하고 또한 기판에 유기물질을 균일하게 증착하여 대면적 디스플레이를 효율적으로 제작할 수 있다. In accordance with the present invention, setting the heat capacity of the heating body of each heating unit injection nozzle which is an organic substance is a crucible and an organic vapor phase substance which is stored injection differently and compared to the heating body to the heated portion in particular spraying nozzles in the heating body to heat the crucible. prevent the organic material vapor condensation in the injection nozzle portion by maintaining a high temperature to prevent the nozzle clogging phenomenon and splash phenomenon, and also to uniformly deposit the organic material on the substrate it can be manufactured to large-area display efficiently.

Claims (8)

  1. 유기물질이 저장되어 있는 도가니와; A crucible in the organic material is stored and;
    상기 도가니를 가열하는 제1가열체와; And a first heater for heating the crucible;
    상기 제1가열체의 가열작용에 의해서 상기 유기물질이 증발하여 형성되는 유기기상물질이 분사되는 분사노즐부와; Wherein said ejection nozzle portion is the organic material vapor formed by the evaporation of the organic material injected by the heating action of the heating body 1 and;
    상기 분사노즐부를 가열하는 제2가열체로 이루어지고, Body comprises a second heating portion for heating the injection nozzle,
    상기 제2가열체는 상기 제1가열체에 비하여 고온으로 유지되어 있는 것을 특징으로 하는 물질증착용 증착원. It said second heating body is worn evaporation source material increases, characterized in that it is maintained at a high temperature than in the first heating body.
  2. 제1항에 있어서, According to claim 1,
    상기 제1가열체와 제2가열체는 열선으로 구성되는 것을 특징으로 하는 물질증착용 증착원. It said first heater and the second heater is a material evaporation source for deposition, characterized in that consisting of the heating wire.
  3. 제2항에 있어서, 3. The method of claim 2,
    상기 제2가열체의 열선의 권취수는 상기 제1가열체의 권취수보다 높게 하여 상기 분사노즐부에 더 많은 발열이 이루어지도록 하는 것을 특징으로 하는 물질증착용 증착원. The second winding of the heating coil of the heating body may have the first material deposition by evaporation source to be higher than the take-up characterized in that so that more heat carried to the injection nozzle part of the heating body.
  4. 진공챔버; A vacuum chamber;
    상기 진공챔버의 일측에 설치되는 기판과 마스크를 정렬된 상태로 지지하는 척을 갖는 스테이지; Stage having a chuck for supporting a substrate in an ordered and mask, which is installed at one side of the vacuum chamber state;
    상기 진공챔버의 타측에 설치되는 구동축; A drive shaft installed in the other side of the vacuum chamber; And
    상기 구동축을 따라서 이동가능하도록 설치되는 증착원으로 구성되고, Therefore, the drive shaft is composed of an evaporation source, which is installed to be movable,
    상기 증착원은 유기물질이 저장되어 있는 도가니와, 상기 도가니를 가열하는 제1가열체와, 상기 제1가열체의 가열작용에 의해서 상기 유기물질이 증발하여 형성되는 유기기상물질이 분사되는 분사노즐부와, 상기 분사노즐부를 가열하고 상기 제1가열체에 비하여 고온으로 유지되어 있는 제2가열체로 이루어진 것을 특징으로 하는 증착시스템. The evaporation source is a spray nozzle that organic vapor phase substance formed by said organic material evaporation injection by the heating action of the first heater and the first heating member for heating the crucible which the organic material is stored, the furnace unit, and a heating unit wherein the injection nozzle and the vapor deposition system, characterized in that the body consisting of the second heating furnace which is held at a high temperature than the first heating member.
  5. 제4항에 있어서, 5. The method of claim 4,
    상기 제1가열체와 제2가열체는 열선으로 구성되는 것을 특징으로 하는 증착시스템. It said first heater and the second heater is a vapor deposition system according to claim consisting of the heating wire.
  6. 제5항에 있어서, 6. The method of claim 5,
    상기 제2가열체의 열선의 권취수는 상기 제1가열체의 권취수보다 높게 하여 상기 분사노즐부에 더 많은 발열이 이루어지도록 하는 것을 특징으로 하는 증착시스템. Said second number of windings of the heating coil of the heating body is a vapor deposition system which is characterized in that so that more heat to the injection nozzle unit to be greater than the take-up of the first heating body made.
  7. 제4항에 있어서, 5. The method of claim 4,
    상기 제1가열체와 제2가열체에 대한 가열제어를 개별적으로 수행할 수 있는 제어부를 더 포함하는 것을 특징으로 하는 증착시스템. It said first heater and the vapor deposition system according to claim 1, further comprising a controller capable of performing the heating control individually for the second heating body.
  8. 제7항에 있어서, The method of claim 7,
    상기 제1가열체와 제2가열체에는 동일 파워가 인가되는 것을 특징으로 하는 증착시스템. It said first heater and the second heater is a vapor deposition system, characterized in that to which the same power.
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US8945979B2 (en) 2012-11-09 2015-02-03 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus by using the same, and organic light-emitting display apparatus manufactured by the method
US8945974B2 (en) 2012-09-20 2015-02-03 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display device using an organic layer deposition apparatus
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US8951610B2 (en) 2011-07-04 2015-02-10 Samsung Display Co., Ltd. Organic layer deposition apparatus
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US9018647B2 (en) 2010-09-16 2015-04-28 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9040330B2 (en) 2013-04-18 2015-05-26 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus
US9051636B2 (en) 2011-12-16 2015-06-09 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus
US9076982B2 (en) 2011-05-25 2015-07-07 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US9121095B2 (en) 2009-05-22 2015-09-01 Samsung Display Co., Ltd. Thin film deposition apparatus
US9136476B2 (en) 2013-03-20 2015-09-15 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured by the method
US9150952B2 (en) 2011-07-19 2015-10-06 Samsung Display Co., Ltd. Deposition source and deposition apparatus including the same
US9174250B2 (en) 2009-06-09 2015-11-03 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US9206501B2 (en) 2011-08-02 2015-12-08 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus by using an organic layer deposition apparatus having stacked deposition sources
US9234270B2 (en) 2011-05-11 2016-01-12 Samsung Display Co., Ltd. Electrostatic chuck, thin film deposition apparatus including the electrostatic chuck, and method of manufacturing organic light emitting display apparatus by using the thin film deposition apparatus
US9249493B2 (en) 2011-05-25 2016-02-02 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus by using the same
US9257649B2 (en) 2012-07-10 2016-02-09 Samsung Display Co., Ltd. Method of manufacturing organic layer on a substrate while fixed to electrostatic chuck and charging carrier using contactless power supply module
US9260778B2 (en) 2012-06-22 2016-02-16 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9279177B2 (en) 2010-07-07 2016-03-08 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9306191B2 (en) 2012-10-22 2016-04-05 Samsung Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
US9347886B2 (en) 2013-06-24 2016-05-24 Samsung Display Co., Ltd. Apparatus for monitoring deposition rate, apparatus provided with the same for depositing organic layer, method of monitoring deposition rate, and method of manufacturing organic light emitting display apparatus using the same
US9388488B2 (en) 2010-10-22 2016-07-12 Samsung Display Co., Ltd. Organic film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9450140B2 (en) 2009-08-27 2016-09-20 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
US9461277B2 (en) 2012-07-10 2016-10-04 Samsung Display Co., Ltd. Organic light emitting display apparatus
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US9534288B2 (en) 2013-04-18 2017-01-03 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light-emitting display apparatus by using same, and organic light-emitting display apparatus manufactured by using deposition apparatus
US9593408B2 (en) 2009-08-10 2017-03-14 Samsung Display Co., Ltd. Thin film deposition apparatus including deposition blade
US9624580B2 (en) 2009-09-01 2017-04-18 Samsung Display Co., Ltd. Thin film deposition apparatus
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US10246769B2 (en) 2010-01-11 2019-04-02 Samsung Display Co., Ltd. Thin film deposition apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100889759B1 (en) * 2002-09-03 2009-03-24 삼성모바일디스플레이주식회사 Forming apparatus of organic thin film and heating crucible thereof

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* Cited by examiner, † Cited by third party
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US9873937B2 (en) 2009-05-22 2018-01-23 Samsung Display Co., Ltd. Thin film deposition apparatus
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US8882921B2 (en) 2009-06-08 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US9174250B2 (en) 2009-06-09 2015-11-03 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US8802200B2 (en) 2009-06-09 2014-08-12 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US8907326B2 (en) 2009-06-24 2014-12-09 Samsung Display Co., Ltd. Organic light-emitting display device and thin film deposition apparatus for manufacturing the same
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US9593408B2 (en) 2009-08-10 2017-03-14 Samsung Display Co., Ltd. Thin film deposition apparatus including deposition blade
US8193011B2 (en) 2009-08-24 2012-06-05 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8921831B2 (en) 2009-08-24 2014-12-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8137466B2 (en) 2009-08-24 2012-03-20 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
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US9450140B2 (en) 2009-08-27 2016-09-20 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
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US9224591B2 (en) 2009-10-19 2015-12-29 Samsung Display Co., Ltd. Method of depositing a thin film
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US8951349B2 (en) 2009-11-20 2015-02-10 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
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US10287671B2 (en) 2010-01-11 2019-05-14 Samsung Display Co., Ltd. Thin film deposition apparatus
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US8882556B2 (en) 2010-02-01 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9453282B2 (en) 2010-03-11 2016-09-27 Samsung Display Co., Ltd. Thin film deposition apparatus
US8973525B2 (en) 2010-03-11 2015-03-10 Samsung Display Co., Ltd. Thin film deposition apparatus
US8865252B2 (en) 2010-04-06 2014-10-21 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9136310B2 (en) 2010-04-28 2015-09-15 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9279177B2 (en) 2010-07-07 2016-03-08 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8833294B2 (en) 2010-07-30 2014-09-16 Samsung Display Co., Ltd. Thin film deposition apparatus including patterning slit sheet and method of manufacturing organic light-emitting display device with the same
US8846547B2 (en) 2010-09-16 2014-09-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the thin film deposition apparatus, and organic light-emitting display device manufactured by using the method
US9018647B2 (en) 2010-09-16 2015-04-28 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8871542B2 (en) 2010-10-22 2014-10-28 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus manufactured by using the method
US9388488B2 (en) 2010-10-22 2016-07-12 Samsung Display Co., Ltd. Organic film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8882922B2 (en) 2010-11-01 2014-11-11 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8852687B2 (en) 2010-12-13 2014-10-07 Samsung Display Co., Ltd. Organic layer deposition apparatus
US9748483B2 (en) 2011-01-12 2017-08-29 Samsung Display Co., Ltd. Deposition source and organic layer deposition apparatus including the same
US9234270B2 (en) 2011-05-11 2016-01-12 Samsung Display Co., Ltd. Electrostatic chuck, thin film deposition apparatus including the electrostatic chuck, and method of manufacturing organic light emitting display apparatus by using the thin film deposition apparatus
US9076982B2 (en) 2011-05-25 2015-07-07 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US8859043B2 (en) 2011-05-25 2014-10-14 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9249493B2 (en) 2011-05-25 2016-02-02 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus by using the same
US8906731B2 (en) 2011-05-27 2014-12-09 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US9512515B2 (en) 2011-07-04 2016-12-06 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8951610B2 (en) 2011-07-04 2015-02-10 Samsung Display Co., Ltd. Organic layer deposition apparatus
US9777364B2 (en) 2011-07-04 2017-10-03 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9150952B2 (en) 2011-07-19 2015-10-06 Samsung Display Co., Ltd. Deposition source and deposition apparatus including the same
US9206501B2 (en) 2011-08-02 2015-12-08 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus by using an organic layer deposition apparatus having stacked deposition sources
US9051636B2 (en) 2011-12-16 2015-06-09 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus
US9260778B2 (en) 2012-06-22 2016-02-16 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9257649B2 (en) 2012-07-10 2016-02-09 Samsung Display Co., Ltd. Method of manufacturing organic layer on a substrate while fixed to electrostatic chuck and charging carrier using contactless power supply module
US8956697B2 (en) 2012-07-10 2015-02-17 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus and organic light-emitting display apparatus manufactured by using the method
US9461277B2 (en) 2012-07-10 2016-10-04 Samsung Display Co., Ltd. Organic light emitting display apparatus
US9496524B2 (en) 2012-07-10 2016-11-15 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9466647B2 (en) 2012-07-16 2016-10-11 Samsung Display Co., Ltd. Flat panel display device and method of manufacturing the same
US8945974B2 (en) 2012-09-20 2015-02-03 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display device using an organic layer deposition apparatus
US9012258B2 (en) 2012-09-24 2015-04-21 Samsung Display Co., Ltd. Method of manufacturing an organic light-emitting display apparatus using at least two deposition units
US9306191B2 (en) 2012-10-22 2016-04-05 Samsung Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
US8945979B2 (en) 2012-11-09 2015-02-03 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus by using the same, and organic light-emitting display apparatus manufactured by the method
KR101393065B1 (en) * 2012-11-23 2014-05-12 주식회사 선익시스템 Heating device of evaporation source
US9136476B2 (en) 2013-03-20 2015-09-15 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured by the method
US8993360B2 (en) 2013-03-29 2015-03-31 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus
US9534288B2 (en) 2013-04-18 2017-01-03 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light-emitting display apparatus by using same, and organic light-emitting display apparatus manufactured by using deposition apparatus
US9040330B2 (en) 2013-04-18 2015-05-26 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus
US8962360B2 (en) 2013-06-17 2015-02-24 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the organic layer deposition apparatus
US9347886B2 (en) 2013-06-24 2016-05-24 Samsung Display Co., Ltd. Apparatus for monitoring deposition rate, apparatus provided with the same for depositing organic layer, method of monitoring deposition rate, and method of manufacturing organic light emitting display apparatus using the same
US9496317B2 (en) 2013-12-23 2016-11-15 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus

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