KR20060073770A - Cast for plasma display panel electrode - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold substrate for forming a plasma display panel electrode, and more particularly, to a mold substrate for forming a plasma display panel electrode, which can reduce manufacturing costs and facilitate selection of defective products.

The present invention is a glass substrate; A metal thin film formed on the glass substrate; And it provides a mold substrate for forming a plasma display panel electrode comprising a glass ceramic structure patterned on the metal thin film.

Description

Molded substrate for plasma display panel electrode formation {Cast for plasma display panel electrode}

1 is a partial perspective view illustrating electrodes disposed on a front substrate of a plasma display panel.

2 shows a cross-sectional view of a mold substrate according to the present invention.

3 shows a cross-sectional view of another template substrate according to the invention.

4 shows an electrode detached by a tape.

* Brief description of symbols used in drawings

11: front substrate 12: sustain electrode 31: transparent electrode

32: bus electrode 41: glass ceramic structure

42: metal thin film 43: glass substrate 44: detached metal electrode

45: adhesive layer 46: tape

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold substrate for forming a plasma display panel electrode, and more particularly, to a mold substrate for forming a plasma display panel electrode for reducing manufacturing costs and facilitating selection of defective products.

Recently, a plasma display panel, which is drawing attention as a replacement of a conventional cathode ray tube display device, is discharged after a discharge gas is filled between two substrates on which a plurality of electrodes are formed. The phosphor formed in a predetermined pattern by the ultraviolet rays is excited to represent an apparatus for obtaining a desired image.

1 shows sustain electrodes 12 formed on the front substrate 11. The sustain electrodes 12 each include a transparent electrode 31 and a bus electrode 32. The bus electrode 32 is formed of a material having excellent electrical conductivity, and generally has a two-layer structure. In detail, the transparent electrode 31 is disposed on the front substrate 11, and the bus electrode 32 is disposed on the transparent electrode 31, and the bus electrode 32 is continuously disposed from the transparent electrode 31. The first black layer 32a and the second white layer 32b are provided. In particular, the black first layer 32a is disposed to absorb visible light incident from the front and to improve bright room contrast.

Such electrodes are formed by patterning a conductive thin film deposited on a substrate, or by a method using a photosensitive Ag paste. However, this method has a disadvantage in that the manufacturing process is complicated and expensive. In particular, in the case of using the photosensitive Ag paste, it is particularly expensive, and there is a problem that an electrode cannot be formed using a metal other than Ag.

Therefore, there is a need for a new method capable of reducing costs, shortening manufacturing processes and reducing defective components.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a template substrate for forming a plasma display panel electrode which is easy to reduce cost and can be repeatedly used.

Another object of the present invention is to provide a method of forming an electrode for a plasma display panel using the template substrate.

The present invention to achieve the above technical problem,

Glass substrates;

A metal thin film formed on the glass substrate; And

The present invention provides a mold substrate for forming a plasma display panel electrode including a glass ceramic structure patterned on the metal thin film.

According to one embodiment of the invention, the metal thin film is Ti / Ag / Ti / Cr, Ti / Ag / Ti / Cr / CrO _x , Ti / Ag / Ti / TiO _x , Ti / Me / Ti / Pt / TiO _x , Ti / Me / Ti / Pt / Cr / CrO _x , Cr / Me / Ti / Cr / CrO _x , or Cr / Me / ti / TiO _x , where x is 0, 1, Or 2, Me is copper, nickel or aluminum).

According to one embodiment of the invention, the surface resistance of the metal thin film is preferably 0.1 to 1 Ω / □.

According to one embodiment of the invention, the thickness of the metal thin film is 0.1 to 3 microns.

According to an embodiment of the present invention, the glass ceramic structure includes PbO or SiO ₂ .

The present invention to achieve the above other technical problem,

Plating an metal on the mold substrate to form an electrode structure;

Detaching the electrode structure using an adhesive tape;

Manufacturing a transfer electrode film by spraying glass frit on the electrode structure and then coating a baking adhesive; And

It provides a method for forming an electrode of the plasma display panel comprising the step of transferring the transfer electrode film to the upper plate or the lower plate of the plasma panel.

Hereinafter, the present invention will be described in more detail.

The present invention provides a mold substrate for forming an electrode of a plasma display panel capable of greatly reducing the cost and an electrode forming method using the same. According to this, since the semi-permanent repetitive use of the mold substrate is possible, the cause of the loss of Ag can be eliminated as compared with the conventional electrode forming method using the photosensitive Ag paste, and only the electrode component of the required portion is plated and used as an electrode. This allows for cost savings in the manufacturing process. In addition, it is possible to use Ni or Cu in addition to Ag, thereby further reducing the cost. In addition, the electrode can be manufactured in advance to determine whether the defective product is in advance, thereby reducing the index and reducing the defective element in the actual plasma display panel manufacturing process.

An electrode forming template substrate of a plasma display panel according to the present invention includes a glass substrate 43, as shown in FIG. A metal thin film 42 formed on the glass substrate 43; And a glass ceramic structure 41 patterned on the metal thin film.

The mold substrate thus formed can be repeatedly used by a transfer method, and used in place of the printed electrode of the plasma display panel. When the transfer method is roughly described, a metal electrode is formed on the mold substrate on which the pattern is formed in advance through a deposition process such as sputtering or vapor deposition, or electroplating is performed using a plating solution containing a desired metal. After the electrode is formed, it is detached through an adhesive tape and then transferred to a desired position on the upper or lower plate of the desired plasma display panel to manufacture the electrode of the plasma display panel.

Such a metal thin film used for the electrode forming template substrate of the plasma display panel according to the present invention is formed on a glass substrate, a thin film having a variety of structures can be used, but is not particularly limited, a metal thin film having the following structure This can be used.

(One)

Glass / Ti / Ag / Ti / Cr                     

Glass / Ti / Ag / Ti / Cr / CrO _x

Glass / Ti / Ag / Ti / TiO _x

(2)

Glass / Ti / Me / Ti / Pt / TiO _x

Ti / Me / Ti / Pt / Cr / CrO _x

(3)

Cr / Me / Ti / Cr / CrO _x

Cr / Me / ti / TiO _x

(Wherein, x represents 0, 1, or 2, Me is copper, nickel or aluminum.)

The metal thin film used in the template substrate according to the present invention is preferably used as an electrode when electroplating for the manufacture of a metal electrode of a desired plasma display panel, and thus has excellent electrical conductivity. It serves to form a metal electrode. Therefore, for excellent electrical conductivity, it is preferable that the sheet resistance on the surface is small, and the surface resistance thereof is more preferably 0.1 to 1 Ω / □. If the surface resistance of the metal thin film is out of the above range, there is a problem in that sufficient electrical conductivity cannot be obtained during the electroplating process, making it difficult to form the metal electrode by plating.                     

Such metal thin films are different depending on the type of metal to be formed, but generally have a thickness of 0.1 to 3 microns. If the thickness of the metal thin film is less than 0.1 micron, the thickness of the metal thin film may be damaged when the subsequent desorption of the metal electrode, if the thickness exceeds 3 microns is not economically desirable because the effect due to the excess content is small.

In particular, a basic selection criterion in such a metal thin film is that the metal of the final part of the metal thin film is less diffused toward the glass paste during high temperature firing.

The glass ceramic structure formed on the metal thin film has a predetermined pattern by a patterning process, and the pattern varies depending on an electrode formed on a desired plasma display panel. The patterning process may be performed according to a general photoresist process, proceeds in the order of coating / exposure / development process, and is completed by performing an etching process to produce a dielectric film pattern shape to be used.

As a material for forming such a glass ceramic structure, PbO, SiO _2, or the like may be used, but is not limited thereto.

The mold substrate formed as described above can be used to form the electrodes of the plasma display panel, and has the advantage that it can be used repeatedly because of the features of the mold substrate. This possibility of repeated use is possible to reduce the cost, it is possible to reduce the defective elements because it is possible to sort the defective parts with the naked eye during the electrode manufacturing process.

As a method of forming an electrode using the mold substrate according to the present invention, for example, a predetermined metal is plated on the mold substrate to form an electrode structure, and the electrode structure is detached using an adhesive tape. After spraying a glass frit onto the electrode structure, a baking adhesive is coated to produce a transfer electrode film, and then the transfer electrode film is transferred to a top plate or a bottom plate of a plasma panel and then obtained by baking.

3 shows a mold substrate according to the present invention, which comprises a glass substrate 43, a metal thin film 42 and a glass ceramic structure 41. The glass ceramic structure has a pattern formed according to a predetermined shape, and a metal electrode is formed on the exposed portion of the metal thin film in which the pattern is not formed.

As a method for forming the metal electrode according to the pattern, a general deposition method such as sputtering or an electroplating method may be used. In the case of the deposition method, the metal is coated on the mold substrate as a whole. In this case, it is necessary to remove the remaining coating film except the coating film existing on the metal thin film, that is, the metal coating film formed on the glass ceramic structure. have. In this case, the metal coating film is formed with a layer so that it can be easily removed using a general adhesive tape.

In contrast, in the case of forming the metal electrode using the electroplating method, the electroplating is performed using the electrolyte containing the metal to be plated using the template substrate as an electrode. Since a metal thin film on a mold substrate is used as an electrode, a pattern may not be formed by the glass ceramic structure, and thus a metal electrode may be formed by electroplating on a surface where the metal thin film is exposed. In the case of electroplating, the thickness of the plating film can be easily adjusted, and the type of metal to be plated can be easily used in the electrolyte and the electrode, which is more preferable.

After the metal electrode is plated as described above, it must be detached from the mold substrate. In this case, an adhesive tape is used. The adhesive tape is formed with an adhesive material on one surface thereof, and when the adhesive tape is in contact with the mold substrate on which the metal electrode is formed, only the formed metal electrode is detached. The detached metal electrode is shown in FIG. In FIG. 4, the metal electrode 44, the adhesive layer 45, and the tape 46 are shown. As described above, after the metal electrode is detached from the mold substrate, glass frit is sprayed onto the metal electrode 44 in order to attach the metal electrode to a desired position on the upper or lower plate of the plasma display panel. An electrode film is prepared.

The reason why the glass frit is used in the transfer electrode film is that the metal adhesive cannot be adhered onto the plasma display panel because the pressure-sensitive adhesive for firing is evaporated and disappeared during the firing process. In other words, even if the pressure-sensitive adhesive for firing disappears during the firing process, the glass frit remains and exhibits an adhesive force, so that the metal electrode is maintained on the panel.

 The present invention provides a mold substrate for forming an electrode of a plasma display panel capable of greatly reducing the cost and an electrode forming method using the same. According to this, since the semi-permanent repetitive use of the mold substrate is possible, the cause of the loss of Ag can be eliminated as compared with the conventional electrode forming method using the photosensitive Ag paste. This allows for cost savings in the manufacturing process. In addition, it is possible to use Ni or Cu in addition to Ag, thereby further reducing the cost. In addition, the electrode can be manufactured in advance to determine whether the defective product is in advance, thereby reducing the index and reducing the defective element in the actual plasma display panel manufacturing process.

Claims (5)

Glass substrates; A metal thin film formed on the glass substrate; And And a glass ceramic structure patterned on the metal thin film. The method of claim 1, wherein the metal thin film is Ti / Ag / Ti / Cr, Ti / Ag / Ti / Cr / CrO _x , Ti / Ag / Ti / TiO _x , Ti / Me / Ti / Pt / TiO _x , Ti / Me / Ti / Pt / Cr / CrO _x , Cr / Me / Ti / Cr / CrO _x , or Cr / Me / ti / TiO _x (where x is 0, 1, or 2, and Me is copper, nickel Or aluminum). A template substrate for forming a plasma display panel electrode, which is a laminate structure. 2. The template substrate for forming a plasma display panel electrode according to claim 1, wherein the metal thin film has a surface resistance of 0.1 to 1 Ω / square. 2. The template substrate for forming a plasma display panel electrode according to claim 1, wherein the metal thin film has a thickness of 0.1 to 3 microns. Plating an metal on the mold substrate to form an electrode structure; Detaching the electrode structure using an adhesive tape; Manufacturing a transfer electrode film by spraying glass frit on the electrode structure and then coating a baking adhesive; And And transferring the transfer electrode film to an upper plate or a lower plate of the plasma panel and then firing the transfer electrode film.

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