KR20060068592A - Apparatus for plating part in wireless communication product and method for plating part using the same - Google Patents

Abstract

The present invention is to provide a partial plating apparatus for a wireless communication product and a partial plating method using the same to allow plating only on the inside of a wireless communication product requiring a plating layer so as to prevent plating on unnecessary parts. The silver plating apparatus may include a wireless communication product including a housing and a cover, a tank which is in close contact with both ends of the wireless communication product so that the plating liquid contacts only the inside of the product, the plating liquid injection tube penetrating the side of the tank, and the plating liquid injection tube. A plating liquid discharge pipe penetrating the side of the tank at a periphery of the tank, and a positive plate disposed inside the tank through the upper portion of the tank, and the outer surface of the wireless communication product is grounded to serve as a negative plate. The present invention is in the interior (housing and cover) of the product for wireless communication Only John area there is an effect that can be selectively plated silver.

Wireless communication products, silver plating, immersion type, plating solution, tank, jig, close contact, O-ring

Description

Partial plating device for wireless communication products and partial plating method using the same {APPARATUS FOR PLATING PART IN WIRELESS COMMUNICATION PRODUCT AND METHOD FOR PLATING PART USING THE SAME}             

1 is a process flowchart showing a surface treatment method of a wireless communication product according to the prior art;

2 is a process flowchart showing a surface treatment method of a wireless communication product according to an embodiment of the present invention;

3 is a view showing a plating solution for the surface treatment of the product for wireless communication according to an embodiment of the present invention,

Figure 4 is a block diagram showing the structure of a silver plating processing apparatus for a product for wireless communication according to an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

21 housing 22 tank

23: plating liquid injection pipe 24: plating liquid discharge pipe

25: positive electrode plate 26: ground

27: silver plating layer 28: O-ring

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the surface treatment technology of indoor products used in the field of wireless communication, and more particularly, to an apparatus and a silver plating method for silvering the housing and cover of a product for wireless communication.

In general, in the field of wireless communication, various components perform functions of passing and processing radio waves. In particular, the band pass filter passes only signals in a frequency range of a predetermined band and removes signals in other frequency ranges and transmits and receives signals in both directions, and plays a role in determining the communication quality in the wireless communication field. The first consideration in wireless communications products such as bandpass filters is to increase the efficiency (eg, RF skin depth effect) of components that process signals.

Here, the surface frequency effect of radiation frequency is a phenomenon in which current flows only near the surface of the conductor as the frequency increases when the current flows through the conductor. If this property is used, it is possible to use gold or silver as a component. By plating the outside of the part without necessity, the high frequency conductivity can be increased and the AC loss can be prevented.

However, even when a signal flows along the surface of a plated component in a bandpass filter and is passed through and processed, some loss of signal due to various environmental conditions cannot be avoided, so efforts to minimize such losses are required. do.

In order to minimize signal loss in a wireless communication product such as a bandpass filter, a method of silver plating has been used.

1 is a view showing a state where silver plating is applied to a surface of a wireless communication product according to the prior art, and FIG. 2 is a process flow diagram illustrating a silver plating process for a wireless communication product.

As shown in FIG. 1, a silver plating layer 11 is formed on a surface of a housing 10 of a wireless communication product.

Referring to FIG. 2, the silver plating treatment method for a wireless communication product includes a sequence of processing (S1), pre-plating (S2), base plating (S3), silver plating (S4) and post-plating (S5) of a wireless communication product. It consists of.

The silver plating treatment method of the prior art as described above is mostly immersion type. Looking at the immersion type plating method, electrolytic reaction between the plating solution and the component by depositing a component (for example, a housing) of a wireless communication product in the plating solution (this is called 'electroplating method'). ) Or plating through electroless chemical reaction (called 'electroless plating method').

This immersion plating method is characterized in that the inner and outer surfaces having a complicated shape of the component is also silver plated.

Therefore, as shown in FIG. 1, when the electrolytic and non-electrolytic silver plating process of the housing 10 of a wireless communication product such as a band pass filter is performed, the silver plating layer is formed on both the inner and the unnecessary outer surfaces which are actually necessary parts to minimize the propagation loss. (11) is formed.

As such, since the silver plating layer is formed to the unnecessary outer surface in addition to the portion where the actual silver plating layer is required in order to minimize the propagation loss, the prior art requires the silver plating layer unnecessarily to reduce productivity, and the silver plating layer is formed to the unnecessary outer surface. Therefore, there is a problem that the plating speed is lowered.

The present invention has been proposed to solve the above-mentioned problems of the prior art, and the part plating apparatus and part using the part of the product for wireless communication to allow the silver plating only inside the product for wireless communication requiring a silver plating layer so as not to be silver plated in unnecessary parts The purpose is to provide a plating method.

Partial plating device for a wireless communication product of the present invention for achieving the above object is a wireless communication product comprising a housing and a cover, a tank in close contact with both ends of the product for wireless communication so that the plating liquid contacts only the inside of the product, the A plating liquid injection tube penetrating the side of the tank, a plating liquid discharge tube penetrating the side of the tank at the periphery of the plating liquid injection tube, and a positive electrode plate penetrating the upper portion of the tank and positioned inside the tank; The outer surface of the product is characterized in that it is grounded to serve as a negative electrode plate, characterized in that the O-ring is located in the contact portion of the tank and the product to prevent leakage of the plating solution to the outside, a large amount of the inside of the tank Pump is applied to the outside of the tank so that the plating liquid is continuously injected and exited again. PL, and is characterized in that the tank is box-shaped jig for sealing the inside of the radio communication products, characterized in that the non-conductive.

In addition, the method of partially plating the wireless communication product includes the step of closely contacting the tank with both ends of the product so that the plating liquid contacts only the inside of the product, and the pump so that the plating liquid is continuously injected into the tank and exits again. And injecting and discharging the plating solution to form a plating layer inside the product, wherein the forming of the plating layer comprises placing a positive electrode plate made of platinum inside the tank, and forming an outer surface of the product. The plating solution is injected while the surface is grounded.

Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the technical idea of the present invention. .

3 is a process flowchart showing a partial plating method of a wireless communication product according to an embodiment of the present invention.

As shown in Figure 3, the partial plating treatment method of the wireless communication product according to an embodiment of the present invention is largely pre-plating (S11), ground plating (S12), silver plating (S13) using a device in close contact with the tank, The plating proceeds in the order of post-plating treatment (S14). Hereinafter, the silver plating will be described for the housing (Housing) of the wireless communication product, the description of the cover will be omitted.

1) The plating pretreatment S11 will be described below.

The pre-plating process is performed on the housing of the wireless communication product.

In general, a housing and a cover of a wireless communication product including a bandpass filter are made of at least one metal selected from the group consisting of aluminum, magnesium, iron, and copper, or two or more alloys thereof. Since it is manufactured in the same manner as above, the plating pretreatment for this is appropriately selected according to the surface material to proceed. In other words, if the surface is made of aluminum, the plating pretreatment process including degreasing, alkali treatment, smut treatment, and alkali zinc treatment steps is carried out, and in the case of steel alloy material, alkali degreasing, pickling, electrolytic degreasing and activation steps are performed. The plating pretreatment process is performed.

2) A description of the base plating treatment S12 is as follows.

After the plating pretreatment is carried out, the base plating treatment can be additionally performed before the silver plating treatment. The underlying plating treatment improves the corrosion resistance, hardness and flexibility of the product, and enables plating with good adhesion. As the base plating treatment, in order to obtain a uniform and smooth surface layer, electroless nickel plating can be used. When the electrical conductivity of the electroless nickel plated layer is not suitable for a high frequency region other than the frequency band, it is possible to further perform electro copper plating on the electroless nickel plated layer or to perform only electro copper plating.

3) The silver plating (S13) will be described as follows.

Conventionally, the general method of silver plating treatment proceeds using an alkali type immersion electroplating method. At this time, since the deposition type, the parts are plated unnecessarily on the outside. Of course, plating is performed by applying an alkali-resistant tape or paint to prevent this, but this method has an adverse effect on the appearance quality because the process for removing it is complicated and not neat. In addition, when the portion unnecessary to plating is larger in area than the portion to be plated, the operation is not easy.

Accordingly, the present invention allows the plating solution (usually an alkaline electrolytic plating solution) to contact only a portion (for example, the inside of the product) to which silver plating is to be processed using a jig, thereby partially providing the silver plating layer 27. To form.

4 is a block diagram of a partial plating apparatus of a wireless communication product according to an embodiment of the present invention.

As shown in FIG. 4, the sides of the tank 22 and the tank 22 are in close contact with both ends of the housing 21 and the housing 21 of the wireless communication product so that the plating liquid contacts only the inside of the housing 21. A plating liquid injection tube 23 penetrating through the plate, a plating liquid discharge tube 24 penetrating the side surface of the tank 22 around the plating liquid injection tube 23, and an anode plate 25 penetrating the upper portion of the tank and positioned inside the tank. The outer surface of the housing 21 is connected to the ground (26). As described above, the portion of the housing 21 to be formed of the silver plating layer 27 is sealed by using the tank 22, so that the silver plating layer 27 is plated only inside the housing 21.

In FIG. 4, the tank 22 is a box type jig made of a non-conductor, and the silver plating layer 27 is not plated on the inner wall surface of the tank 22. For example, the tank 22 is made of the same box shape as the size of the area to be plated using plastic (ABS, etc.).

In addition, the plating liquid flowing into the tank 22 is leaked by the O-ring 28 to couple the tank 22 and the housing 21 to each other in close contact with the tank 22 and the housing 21. It gives a waterproof function to prevent it from coming out.

In addition, the silver plating apparatus of FIG. 4 has a positive electrode plate 25 and a negative electrode plate for electroplating. The positive electrode plate 25 is connected to the inside of the tank 22 with a positive electrode and used as an electrode using the positive electrode plate 25 at its end. Here, the positive electrode plate 25 is formed of platinum as a metal plate, and when the positive electrode plate 25 is formed of platinum, a fast reaction speed can be obtained during silver plating.

The negative electrode plate is not separately formed, and the housing 21 is connected with (−), and the outer surface of the housing 21 is connected with the ground 26 as shown.

The principle of forming the silver plating layer 27 in the interior of the housing 21 by using the partial plating apparatus as shown in FIG. 4 is based on the surface of the housing 21 in which silver ions (Ag +) dissolved in the plating solution are grounded (-). The silver plating layer 27 is formed by bonding (i.e., combining with electrons) to be metallized (Ag) and adsorbed to the surface of the grounded (-) housing.

 At this time, since the tank 22 is small in volume, the plating rate decreases as the silver ions Ag + of the plating solution are consumed due to the lack of the absolute content of silver ions Ag +. Therefore, a pump (pump, not shown) must be additionally installed so that a large amount of the plating liquid is continuously injected into the tank 22 and then exited again.

In this way, the concentration of silver ions (Ag +) in the plating solution can be kept constant, thereby improving the quality of the silver plating layer 27.

On the other hand, the plating speed of the silver plating layer 27 is proportional to the current density. If the concentration and flow rate of the plating liquid are increased and the current density is also increased, the silver plating layer 27 is formed in a short time.

4) The post-plating treatment (S14) will be described below.

Post-plating treatment consists of water washing, ultrasonic cleaning, discoloration prevention treatment and the like.

As described above, the present invention can proceed the silver plating only inside the product for wireless communication by using a tank for sealing the portion where the silver plating of the product is to proceed.

In the above-described embodiment, the silver plating method has been described. However, the present invention can be applied to plating a wireless communication product using an electrolytic plating solution such as nickel.

Although the technical idea of the present invention has been described in detail according to the above preferred embodiment, it should be noted that the above-described embodiment is for the purpose of description and not of limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical idea of the present invention.

 The present invention described above has the effect of selectively plating only the parts necessary for the interior (housing and cover) of the wireless communication product.

In addition, since the plating liquid flows at a high speed, the current density of the surface of the wireless communication product is increased to maintain the plating speed about 5 to 7 times faster, thereby increasing the plating efficiency.

Claims (9)

A wireless communication product comprising a housing and a cover; A tank in close contact with both ends of the wireless communication product such that the plating liquid contacts only the inside of the product; A plating liquid injection tube penetrating the side surface of the tank; A plating liquid discharge pipe penetrating the side surface of the tank around the plating liquid injection pipe; And A positive electrode plate penetrating the upper portion of the tank and positioned inside the tank; Partial plating device of a wireless communication product, characterized in that the outer surface of the wireless communication product is grounded to serve as a negative electrode plate. The method of claim 1, Partial plating apparatus for a product for wireless communication, characterized in that the O-ring is located in close contact with the tank and the product to prevent the plating liquid from leaking to the outside. The method of claim 1, Partial plating apparatus for a product for wireless communication, characterized in that the pump is installed outside the tank so that a large amount of plating liquid is continuously injected into the tank and exits again. The method of claim 1, The positive electrode plate is a platinum plate, characterized in that the partial plating device for a wireless communication product. The method according to any one of claims 1 to 4, The tank is a partial plating device for a product for wireless communication, characterized in that the box-shaped jig sealing the inside of the product. The method of claim 5, The tank is a partial plating device of a product for wireless communication, characterized in that the insulator. Adhering a tank close to both ends of the product to seal the plating liquid only in contact with the inside of the product; And Forming a plating layer in the interior of the product by injecting and discharging the plating solution using a pump so that the plating solution is continuously injected into the tank and exits again. Partial plating method of a wireless communication product comprising a. The method of claim 7, wherein The plating solution is a partial plating method of a wireless communication product, characterized in that using an alkaline electrolytic plating solution in which silver ions or nickel ions are dissolved. The method of claim 7, wherein Forming the plating layer, Placing a positive electrode plate made of platinum in the tank and injecting the plating liquid while the outer surface of the product is grounded, the partial plating method of the product for wireless communication.

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