KR20110070113A - Telecommunication connector and plating method for telecommunication connector - Google Patents

Abstract

PURPOSE: A communication connector and the surface treatment method thereof are provided to prevent the deterioration of IMD characteristics at low cost. CONSTITUTION: The surface of a communication connector is plated with the underlying layer of CuCN materials(S140). The top of the underlying layer is plated with an intermediate plating layer(S160). A plated result substance is plated into plating bath containing ternary alloy having copper, tin, and zinc. The surface of the intermediate plating layer is plated with a surface plating layer(S170).

Description

Telecommunication connector and plating method for telecommunication connector

The present invention relates to a surface treatment method of a communication connector, and more particularly, to a surface treatment method of a communication connector that can improve the corrosion resistance and IMD characteristics of the communication connector at low cost.

In general, as the demand for mobile communication increases rapidly, high-speed and large-capacity communication systems are accelerating, and the demand is rapidly increasing in various areas such as mobile phones, PCS, satellite communication, and IMT-2000.

As the communication in the high frequency range, which has not been used in the past, has been spreading, demand for mobile communication repeaters, antennas, and RF components required for microwave communication is expanding.

The communication connector, which is one of the RF components used in the repeater and the antenna, is directly used for connecting cables and systems between major devices. Problems such as reduced active power, interference and poor call quality, and interruption of communication can occur.

Non-linearity of the connector may be caused by the contact of dissimilar metals or by the high electric field plasma effect generated by corona discharge, magnetic nonlinearity by magnetic metal, high current density, loose contact between devices, and inadequate surface treatment. And by-products in the connector.

Thus, in order to develop a connector with a technology to solve the IMD that has a great effect on the call quality and capacity in high frequency communication, it is not used in the state of raw materials such as copper and copper alloy, but by surface treatment of plating rather than magnetic metal material. Some problems can be overcome.

In general, the RF connector is used as a means for connecting various components or devices of a mobile communication system, and various methods are applied according to its use and performance. Looking at the configuration of the RF connector is provided with a line provided inside, an outer conductor protruding from the other side of the connector body and the connector body on one side thereof in order to connect to the opposite connector, protrudes from the inside of the outer conductor to the outside And an inner conductor for connecting to a coaxial cable or a printed circuit board, and a dielectric filled between the outer conductor and the inner conductor.

RF connectors are complex in shape and structure. In particular, it features a large number of threads for the confidentiality of the product. If these products are electroplated, it is very difficult to obtain plating with excellent uniformity and smoothness. In particular, in the case of the inner plating surface, the plating thickness is not uniform due to the deterioration of uniform electrodeposition property when electroplating.

In this case, since it affects the IMD (InterModulation Distortion) characteristic of the RF connector, it is very important to form a uniform plating layer.

Until now, most of the surface treatment of connectors used in mobile communication systems has been formed by performing post-plating, electrolytic or electroless nickel plating, and post-discoloration prevention layer.

However, in the case of electroless nickel plating, there are disadvantages in that soldering characteristics are poor, discoloration and corrosion occur in gas test and salt spray test, and in the case of electrolytic nickel plating, uniform plating is not performed. It can be more than one communication.

That is, the surface where the RF connector is installed in the beach containing a large amount of salt in the air or industrial areas where various gases are discharged, the surface is black discoloration, there was a problem that the soldering characteristics may be degraded.

In order to solve such a problem of nickel plating, there is a case in which an impregnating coating layer is formed.

The problem to be solved by the present invention in view of the above problems is to provide a surface treatment method of a communication connector that can prevent corrosion and degradation of IMD characteristics at low cost.

The surface treatment method of the communication connector of the present invention for solving the above problems comprises the steps of: a) plating a base layer of a cyanide copper material on the surface of the communication connector; Plating the intermediate plating layer, and c) plating the surface plating layer on the surface of the intermediate plating layer by plating the resultant of the step b) in a copper, tin, and zinc ternary alloy plating bath.

In addition, the communication connector of the present invention, a copper plating base layer mainly on the surface of the tunghwa copper base layer, a nickel plated on the upper surface of the copper copper base layer, and copper, tin plated on the surface of the intermediate plating layer And a surface plating layer which is a ternary alloy of zinc.

The present invention has the effect of plating the surface of the intermediate layer having excellent corrosion resistance and the surface plating layer having excellent IMD properties on the upper surface thereof, thereby exhibiting high corrosion resistance and IMD characteristics.

When described in detail with reference to the accompanying drawings a preferred embodiment of the present invention as follows.

1 is a flowchart of a surface treatment process of a communication connector according to a preferred embodiment of the present invention.

Referring to Figure 1, the surface treatment method of the communication connector according to an embodiment of the present invention, the step of removing and cleaning the foreign matter and organic matter in the communication connector (S110), and the electrolytic degreasing of the communication connector from which the foreign matter and organic matter is removed And cleaning (S120), removing and cleaning the oxide film of the electrolytic degreasing communication connector, then activating and cleaning (S130), and not plating the surface of the activated communication connector. 140, neutralizing and washing the underplated communication connector (S150), and forming an intermediate plating layer by plating an upper portion of the underplated layer of the neutralized communication connector with a plating material containing nickel as a main component (S160). ), And to form a metal plating layer having excellent IMD properties on top of the intermediate plating layer to form and wash the upper plating layer (S170), and the surface of the surface plating layer It is configured to include a step of preventing color fading and washing (S180).

In the subsequent process, after washing in boiling water, it can be dried by air to complete the surface treatment.

Hereinafter, the configuration and operation of the preferred embodiment of the present invention configured as described above in more detail.

First, in step S110 to perform the immersion degreasing to remove foreign matter and organic matter for the surface treatment of the communication connector passed the import test.

The solution used for such immersion degreasing is treated by immersion in a silicate aqueous solution of 50 ~ 60g / l for 3 to 5 minutes. At this time, the temperature of the aqueous silicate solution is 60 to 70 ℃.

In step S110, the same immersion condition is repeated several times to remove foreign substances and organics from the surface of the communication connector.

Then, it is washed step by step in a multi-stage washing tank.

Then, as in step S120, the immersion degreasing electrolytic degreasing of the communication connector from which foreign substances and organic matters are removed.

At this time, the electrolytic degreasing is carried out through the negative electrode degreasing in the negative electrode degreasing tank, which is performed for 1 to 2 minutes in an aqueous sodium cyanide (NaCN) solution having a concentration of 50 to 60 g / l. The temperature at this time is room temperature.

It is then washed step by step in a multistage washing tank.

Next, in step S130, the electrolytic degreasing communication connector is put in an acid activation tank for 1 to 2 minutes to remove the oxide film. That is, the electrolytic degreasing communication connector is immersed in an acid mixed with 10 wt% hydrochloric acid and 90 wt% water to remove the oxide film formed on the surface thereof.

And sequentially washed in a multi-stage washing tank, to activate the communication connector is removed the oxide film. At this time, the activation is used by mixing 75wt%, 25wt% sodium sulfate of 100ml / l concentration and 40ml / l sulfuric acid aqueous solution, respectively. Immersion time is 10 to 30 seconds, the process temperature is carried out at room temperature.

It is then washed again step by step in a multi-stage flush tank.

Next, in step S140, the blue and blue copper is plated to form the underlayer. It is immersed in the copper plating bath to immerse the surface-activated communication connector in a mixture of 30 to 35 g / l copper cyanide (CuCN) solution and 40 to 45 g / l sodium cyanide (NaCN) solution, respectively, 43 wt% and 57 wt%. And plate through the cathode.

The plating time is 10 to 30 seconds, the process temperature is maintained at 45 to 50 ℃.

Then, it is washed sequentially in a multistage washing tank.

In step S150, the communication connector is neutralized. Anodization may occur during the plating and washing process, and the communication connector is immersed in a 5% sulfuric acid aqueous solution for 30 to 60 seconds to neutralize the alkaline solution on the surface. The process temperature at this time is room temperature.

Then, it is washed sequentially in a multistage washing tank.

Next, in step S160 to form an intermediate plating layer by plating nickel on the underlying plating layer of the neutralized communication connector. In this case, the nickel may be electrolytic nickel or electroless nickel. If the plated to the appropriate thickness while measuring the plating thickness of the intermediate plating layer is washed in a multi-stage washing tank.

In addition, the intermediate plating layer of step S160 may be formed by a treatment process using nickel sulfate as a main material.

The result of step S150 is a nickel sulfate of 250 to 350g / l concentration, nickel chloride of 35 to 45g / l concentration, boric acid of 35 to 45g / l concentration of 60 to 80wt%, 10 to 20wt%, 10 to 20wt% Add 50 ml / l acetic acid, 2 ml / l saccharin, and 1.3 ml / l formaldehyde as an additive, and the total amount of the additive is 100% by weight of the nickel sulfate, nickel chloride, and boric acid. When it was set, the solution was added to a solution added to 0.4 to 1wt% and plating was performed.

At this time, the process temperature is suitable 50 to 55 ℃, pH is to be in the range of 4 to 4.4.

Nickel sulphate makes it possible to work at high current density, nickel chloride dissolves the positive electrode, and boric acid adjusts the acidity of the negative electrode surface to maintain proper acidity.

The acetic acid serves to further improve the uniform plating electrodeposition, saccharin is an additive to improve the leveling of the plating surface, formaldehyde acts as a wetting agent and dispersant.

When the total weight of the additive is 100 wt%, the acetic acid is preferably 98 to 99wt%, saccharin and formaldehyde are 0.5 to 1wt%, respectively.

After plating in this way, the thickness is measured, and if there is no abnormality, it is washed stepwise in a multistage washing tank.

In the present invention, when the intermediate plating layer is formed by a plating process containing nickel sulfate as a main component, it is possible to obtain plating with more uniform and excellent soldering properties.

Then, in step S170, the surface plating layer is formed by performing three-way alloy plating of copper (Cu), tin (Sn), and zinc (Zn) on the intermediate plating layer prepared in step S160.

The surface plating layer is preferably plated in the ternary alloy plating bath in which the resultant of step S160 is mixed with 50 to 55 wt% of copper, 35 to 40 wt% of tin, and 5 to 12 wt% of zinc.

The surface plating layer is excellent in IMD characteristics, but the manufacturing cost is relatively high compared to other plating. Experimentally, when the surface plated layer was set to a thickness of 1 µm or more, appropriate IMD characteristics were expressed and manufacturing costs were relatively lowered.

After forming the surface plating layer in this way, the washing and washing can be carried out as necessary to prevent discoloration of step S180.

In the optional process step S180, the surface of the surface plated layer is treated with Taniban at a concentration of 5 to 10% for 30 to 60 seconds to prevent discoloration of the surface plated layer. At this time, the process temperature is 50 to 70 ℃.

When discoloration prevention treatment is performed step by step in a multi-stage washing tank.

In the subsequent process, the hot water treatment is performed in a hot water bath, dried with air, and the final inspection is performed to check whether the plating of the communication connector is defective.

2 is a partial cross-sectional view of a communication connector according to a preferred embodiment of the present invention.

Referring to FIG. 2, in the communication connector according to the preferred embodiment of the present invention, the base layer 20, the intermediate plating layer 30, and the surface plating layer 40 are sequentially disposed on the material layer 10, which is the surface of the communication connector. It is laminated to be configured.

As described in detail above, the base layer 20 is clarified copper, and the intermediate plating layer 30 positioned on the base layer 20 may be electrolyte nickel or non-electrolyte nickel.

In addition, the intermediate plating layer 30 may be made of a nickel compound, the nickel compound is made of nickel sulfate as a main raw material, nickel chloride, boric acid and additives are added.

As such, the intermediate plating layer 30 of the electrolyte nickel, the non-electrolyte nickel, and the nickel compound has excellent corrosion protection against salts, and even after 720 hours have elapsed as shown in the test result of FIG. It can be seen that neither the intermediate plating layer) nor the sample # 1-2 (non-electrolyte nickel intermediate plating layer) were corroded by salt.

The thickness of the intermediate plating layer 30 can be determined as necessary, but it is preferable to have a thickness of 2 to 3㎛ in consideration of the relationship between manufacturing cost and corrosion resistance.

As described above, in the communication connector according to the present invention, the base layer 20, the intermediate plating layer 30 having excellent corrosion resistance to salt, and the surface plating layer 40 having excellent IMD characteristics are sequentially plated to exhibit high corrosion resistance and high IMD characteristics. It becomes possible.

1 is a process flow diagram of a communication connector surface treatment method according to a preferred embodiment of the present invention.

2 is a partial cross-sectional view of the surface of a communication connector according to a preferred embodiment of the present invention.

3 is a test result table of the corrosion resistance of the salt of the present invention.

* Description of the symbols for the main parts of the drawings *

10: Material 20: Lower layer

30: intermediate plating layer 40: surface plating layer

Claims (8)

a) plating a base layer of a cyanide copper material on a surface of the communication connector; b) plating an intermediate plating layer containing nickel as a main component on the base layer; And c) plating a surface plating layer on the surface of the intermediate plating layer by plating the resultant of step b) in a copper, tin, and zinc three-way alloy plating bath. The method of claim 1, The intermediate plating layer of step b), And plating the electroless nickel, electrolytic nickel, or nickel compound. The method of claim 2, The intermediate plating layer of the nickel compound, 60 to 80 wt%, 10 to 20 wt%, 10 to 20 wt% of nickel sulfate at a concentration of 250 to 350 g / l, nickel chloride at a concentration of 35 to 45 g / l, and boric acid at a concentration of 35 to 45 g / l, respectively, Acetic acid, saccharin and formaldehyde are added, but the total amount of the additive is plated in a plating bath added at 0.4 to 1 wt% when the mixed weight of nickel sulfate, nickel chloride and boric acid is 100. Surface treatment method of communication connector. The method according to claim 1 or 3, The surface plating layer, The surface of the communication connector, characterized in that the result of the step b) is plated in a three-way alloy plating bath in which the copper is 50 to 55wt%, the tin is 35 to 40wt%, the zinc is 5 to 12wt% mixed Treatment method. A blue and white copper base layer plated on the surface of the communication connector; An intermediate plating layer composed mainly of nickel plated on the upper layer of the clarified copper base layer; And a surface plating layer of a three-alloy of copper, tin, and zinc plated on the surface of the intermediate plating layer. The method of claim 5, The intermediate plating layer, A communication connector characterized by being electroless nickel, electrolytic nickel or a nickel compound. The method of claim 6, The nickel compound, Nickel sulfate at a concentration of 250 to 350 g / l, nickel chloride at a concentration of 35 to 45 g / l, boric acid at a concentration of 35 to 45 g / l is mixed with 60 to 80 wt%, 10 to 20 wt%, and 10 to 20 wt%, respectively. Acetic acid, saccharin, and formaldehyde are added, but the total amount of the additive is plated in a plating bath added at 0.4 to 1 wt% when the mixed weight of nickel sulfate, nickel chloride and boric acid is 100. Communication connector. The method according to any one of claims 5 to 7, The surface plating layer, And 50 to 55 wt% of copper, 35 to 40 wt% of tin, and 5 to 12 wt% of zinc.

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