KR20060066401A - Shielding film transmit electricity and process for preparing the same - Google Patents

Abstract

The present invention relates to a conductive protective film and a method of manufacturing the same.

In the present invention, the conductive protective film is formed by applying a conductive polymer coating composition to both surfaces of the base film to form an antistatic layer, and secondly applying an adhesive to the inner skin, and adding an ion complex resin antistatic agent to the adhesive to improve conductivity. By providing it, it provides a conductive protective film which minimizes the generation of peeling static electricity.

Conductive Protective Film, Antistatic Agent

Description

Conductive protective film and manufacturing method thereof {Shielding film transmit electricity and process for preparing the same}             

1 is a cross-sectional view of a conductive protective film according to an embodiment of the present invention.

Figure 2 is a cross-sectional view of the conductive protective film according to another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10, 20: protective film 11, 21: base film

12, 22: antistatic polymer coating layer 13, 23: antistatic adhesive layer

The present invention relates to a conductive protective film and a method of manufacturing the same. More specifically, the present invention relates to a conductive protective film and a method of manufacturing the same, which may maximize the antistatic function by providing a conductive function to the outer skin, the inner skin of the film, as well as to the adhesive part.

The protective film for sealing electronic precision substrates used in polarizers, monitors, semiconductor wafers, printed wiring boards (PCBs) and the like prevents the generation of static electricity on the surface of electronic components and prevents adhesion of dust and fine particles.

The conductive protective film for antistatic is mainly polyester, polyimide, polyethylene, polypropylene, polystyrene, etc., which is used as a base film, and one side is coated with adhesive for attachment to electronic components, and the other side is Antistatic treatment with conductive polymer coating composition to prevent static electricity. As a conductive polymer coating composition used in a conventional antistatic protective film, a coating composition made by adding a polymer binder, a thickener and a dispersant, an adhesive and a lubricant, a solvent, and the like to a conductive polymer such as polythiophene is disclosed. Published in However, in the conventional antistatic protective film method, since the antistatic treatment is performed only on the opposite side of the adhesive surface, the antistatic treatment is not performed at all on the adhesive surface, so that a large amount of peeling static electricity is generated upon removal from the substrate. The generated peeling electrification voltage may be a fatal factor for damage to electronic components at about 20 Kvolt.

Accordingly, the inventors of the present invention prepare an antistatic conductive protective film which first coats the conductive polymer on both surfaces of the film and secondarily coats the existing silicone-based, acrylic-based, epoxy-based, or urethane-based adhesive (or adhesive) only on the first coated inner skin. The method was developed and filed in patent application No. 10-2003-0084804.

The prior application discloses a method of manufacturing a conductive antistatic protective film for preventing static electricity by applying a conductive polymer composition on both sides of the base film to form a conductive layer, and then applying an adhesive on the inner surface again. The surface resistance of the adhesive surface of the conductive antistatic protective film thus prepared is in the range of 10E6 ~ 10E9 (= 1x10 ⁶ ~ 1x10 ⁹ ) Ω / cm, which is 10,000 times higher than the surface resistance of 10E10 ~ 10E13 Ω / cm of the conventional antistatic protective film. It has a degree of antistatic function.

However, in order to expect the conductive effect according to the above-described invention, the thickness of the pressure-sensitive adhesive layer should be applied with an ultra-thin film of 5 μm or less, and industrially, a stable protective effect can be expected when the thickness of the pressure-sensitive adhesive layer becomes 20 μm or more. At this time, the surface resistance of the adhesive surface may have only an antistatic function of about 10E10 ~ 10E12 Ω / cm. Therefore, the antistatic function alone does not apply to electronic components requiring more improved conductivity performance (10E8 Ω / cm or less) according to the advancement of the industry. As a method for solving the problem of the thickness of the adhesive surface, a method of adding a conductive material such as a surfactant type antistatic agent or polythiophene, polyaniline or polypyrrole to the pressure sensitive adhesive layer may be considered. However, the surfactant type antistatic agent is sensitive to moisture and its effect is doubtful in winter, and antistatic performance is shown by surface transition, and metal cations contained in the surfactant are also detected at the same time, causing contamination. In the case of a conductive polymer such as polythiophene, polyaniline, or polypyrrole, there is a problem in transparency, and there is a possibility of changing the structure of the conductive polymer due to its incompatibility with the pressure-sensitive adhesive.

 Thus, the present inventors can exhibit the desired conductivity even if the thickness of the pressure-sensitive adhesive layer is industrially necessary, that is, the present invention by developing a next-generation conductive protective film manufacturing technology that can have a more enhanced conductive function as well as an antistatic function. To complete.

SUMMARY OF THE INVENTION An object of the present invention is to manufacture a conductive protective film that can safely protect electrostatic sensitive electronic products, in particular, electromagnetic plate parts by greatly reducing the peeling static electricity of the protective film.

Another object of the present invention is to produce a conductive protective film that can have a more improved conductive function beyond the antistatic function of the adhesive surface.

Another object of the present invention is to reduce the conductive effect of the adhesive surface by 10 times to 1000 times or more (surface resistance by 10E1 ~ 10E3 Ω / ㎝) by reducing the electromagnetic plate protective film to improve the antistatic function to the conductive function To manufacture.

In the present invention, the conductive polymer coating composition is first applied to both surfaces of the base film to form an antistatic layer, and the second endothelial is coated with an adhesive, but the ion complex polymer (ion-complex polymer, ICP) antistatic agent is applied to the adhesive. By adding the additional conductivity to provide a conductive protective film that minimizes the occurrence of peeling static electricity when separating from electronic components and the like.

1 is a view showing the structure of the conductive protective film 10 according to an embodiment of the present invention, the antistatic polymer coating layer 12 is first applied to both sides of the base film 11, only the second endothelial layer only The structure in which the antistatic adhesive layer 13 is applied is shown. 2 is a view showing the structure of the conductive protective film 20 according to another embodiment of the present invention, the first antistatic polymer coating layer 22 is applied to only one surface (endothelium) of the base film 21, 2 It shows the structure in which the antistatic pressure-sensitive adhesive layer 23 is applied only to the inner skin layer.

In the present invention, as the base film 11, a polymer film such as polyester, polyimide, polyethylene, polypropylene, polystyrene, etc. is mainly used. Among them, polyester and polyethylene are most commonly used. The conductive polymer composition which can be used as the primary coating on the base film of the present invention is based on a water-dispersible conductive polymer formed of polyaniline, polythiophene, polypyrrole and derivatives thereof. The polyaniline is green, the polypyrrole is brown, and the poly tea Offen has a nearly colorless background color. As the conductive polymer which imparts conductivity, which is the most important component in the conductive coating solution, any conductive polymer having a structure of polyaniline, polypyrrole, polythiophene, and the like may be used. This includes polythiophene, polyaniline, polypyrrole and the like substituted with an alkyl group having 5 to 15 carbon atoms or an alkoxy group and an aromatic group. Examples of specific aromatic functional acids include camphorsulfonic acid, benzenesulfonic acid, dodecylbenzenesulfonic acid, naphthalene sulfonic acid, paratoluene sulfonic acid and the like. In particular, poly (3,4-alkylenedioxythiophene) substituted with an ethylenedioxy group is commercially available under the trade names Bitetron (Baytron, HC Starck, Germany) and Organacon (AGFA, Germany). When used, a colorless transparent conductive polymer coating can be obtained. In addition, the conductive polymer composition of the present invention includes an adhesive binder, a functional additive, and a solvent. Silicone, acrylic, epoxy or urethane adhesives are used as the adhesive binder, dispersants are used as functional additives, and alcohols, water or organic solvents are used as solvents. The primary antistatic conductive coating composition is 0.1 to 20 parts by weight of one selected from the conductive polymer, 5 to 55 parts by weight of an adhesive binder, 0.01 to 5 parts by weight of a dispersant to help disperse the composition components, and isopropyl alcohol as a solvent, It is prepared by mixing 50 to 140 parts by weight of at least one solvent selected from ethanol, methanol, water, toluene, ethyl acetate, and 1-methyl-2-pyrrolidinone. The conductive coating solution prepared as described above was coated with a thickness of 0.1 to 10 microns using a gravure, offset, kissbar, knife, mayer bar or coma method and left at 50 to 250 ° C for 30 seconds to 1 hour to dry. While volatilizing, the transparent conductive polymer coating layer 12 is obtained with a conductive base film coated on the surface of the substrate. In another method, a conductive polymer monomer, an oxidizing agent, and a dopant are mixed on the surface of the primary conductive base film, and then heated, that is, the conductive polymer is directly synthesized on the surface of the film to form a conductive polymer coating layer 12, The same effect can be obtained by drying and forming a conductive film.

Secondly, adhesives or adhesives, such as silicone, acrylic, epoxy, or urethane, may be selectively used on one side (endothelium) of the primary coated conductive base film (adhesive for temporary adhesion and adhesive for permanent adhesion, if necessary. It can be applied to the coating method as described above to produce a protective film (or tape) to ensure the antistatic conductivity on the outer skin and the inner skin, and the conductive function on the adhesive surface of the inner skin.

As the adhesive used in the present invention, an acrylic adhesive [Cosmotech Co., Ltd., CMT Grade], a urethane adhesive [Nano Camptech Co., Ltd., POSTIC Grade] and a rubber adhesive [Samwon Co., Ltd., AT Grade] were used.

Antistatic pressure-sensitive adhesive coating liquid composition is 30 to 100 parts by weight of one selected from the acrylic, urethane or rubber pressure-sensitive adhesive, 0.1 to 10 parts by weight of the ion complex polymer antistatic agent, 0.1 to 5 parts by weight of the curing agent and methyl alcohol, ethyl alcohol, iso One kind selected from propyl alcohol, normal butanol, water, toluene, xylene, 1-methyl-2-pyrrolidinone, chloroform, ethyl acetate, 2-methoxyethanol, dimethylformamide, 2-butanone, or the solvent Two kinds are prepared by mixing 50-140 weight part with each other in the ratio of 5:95. The ion-complex polymer (ICP) antistatic agent, which is an antistatic agent for endothelial pressure sensitive adhesive, is used by adding 0.1 to 10% by weight to the endothelial pressure sensitive adhesive. When added at 0.1 wt% or less, the conductivity is too weak, and when added at 10 wt% or more, there is a problem that the surface transition phenomenon and the adhesion with the base film are lowered.

Specifically, the ion complex polymer antistatic agent used in the present invention is disclosed in Patent Application No. 10-2003-0002201 filed by the present inventors, such as alkali metal salts LiPF ₆ , LiBF ₄ , LiSbF ₆ , LiClO ₄ , LiCF ₃ SO ₃ , LiAsF ₆ , LiC (CF ₃ SO ₃ ) ₃ , LiN (CF ₃ SO ₃ ) ₂ , LiI, LiBr, LiCl, LiF, NaPF ₆ , NaClO ₄ , NaI, NaSCN, KSCN, KPF ₆ or KClO ₄ Mixing 1 or 2 or more, cationic conducting organic compounds (e.g. propylene carbonate, ethylene glycol, dimethyl formamide, etc.) and anionic conducting organic compounds (e.g. trilauryl phosphite, tris chloromethyl ester, dimethyl sulfoxide, etc.) To react) in turn. It is marketed under the brand name of Elecon (Nano Camptech Co., Ltd.).

The acrylic, epoxy, rubber, silicone, and urethane adhesives used for the endothelial secondary coating decrease the antistatic effect in the order of urethane, acrylic, rubber, and epoxy, and the silicone has the effect, but the silicone has an effect on electronic components. Should be refrained from use. Preferably, urethane-based and acrylic pressure-sensitive adhesives show the most excellent conductive effect, and rubber-based is useful when high adhesion is required. More specifically, among the urethanes, polyester, polyether, polycaprolactam, polytetramethylene ether glycol, etc., acrylics, acrylic esters, vinyl acetate, vinylidene chloride, styrene, acrylonitrile A pressure-sensitive adhesive and the like show more excellent conductive effects.

In the present invention, the thickness of the secondary coating antistatic adhesive layer 13 is generally 2 to 50 µm, but preferably 20 to 35 µm. When the thickness is less than 2 μm, the peeling phenomenon of the peeling is too severe, and there is a problem. In the case of 50 μm or more, there is a difficulty in electric transmission, so the expected effect is greatly reduced.

Using the pressure-sensitive adhesive to which the ion complex type polymer antistatic agent is added, the conductive effect of the adhesive surface is reduced from 10 times to 1000 times by surface resistance (10E1 ~ 10E3 Ω / cm by surface resistance), thereby reducing the performance of the existing antistatic function ( Electromagnetic sheet protection film can be manufactured with improved conductivity (surface resistance of 10E8 Ω / cm or less) at surface resistance of 10E10 Ω / cm or more).

Until now, a method of manufacturing a conductive protective film was first described by applying a conductive polymer coating composition to both sides of a base film to form an antistatic layer and secondly applying an adhesive containing an antistatic agent only to the endothelium. The conductive polymer coating composition may be applied to only one side (endothelium) of the base film to form an antistatic layer, and a method of manufacturing a conductive protective film by applying an adhesive containing an antistatic agent thereon may be selected. Particularly, when polyethylene is used as the base film, it is preferable to prepare a conductive protective film by coating the outer skin and applying the primary conductive coating only to the inner skin, and then applying the antistatic adhesive coating on the primary coating surface.

Hereinafter, the present invention will be described in detail with reference to Examples. The surface resistance of the protective film prepared in this Example was measured under the conditions of 55% RH, 23 ° C. and an applied voltage of 500 V according to ASTM-D257 measuring method, and the adhesive strength was 65% RH, based on KS A1107 or JIS-Z0237, Based on the 180 ° peeling method at 23 ° C., the peeling speed was measured at 300 mm / min and the sample size at 25 mm × 250 mm.

This embodiment is for illustrative purposes only and not intended to limit the scope of the present invention.

<Example 1-4>

4 g of 3,4-polyethylene dioxythiophene aqueous solution (Baytron PH from HC Starck), 9.6 g of a water-soluble acrylic binder (Neoresin from Neocryl A Grade), 0.01 g of a dispersant (BYK Disperbyk110) from 5 g of distilled water and 20 g of isopropyl It was dissolved in an alcohol mixed solution and first coated on the inner and outer surfaces of the polyester film, followed by drying at 100-110 ° C. for 2 minutes. The surface resistance of the dried film was 9 × 10 E4 Ω / cm, the adhesion (adhesion between the base film and the coating film) was 5g / 25mm. An acrylic pressure-sensitive adhesive containing 0.5 wt%, 2 wt%, 5 wt%, and 10 wt% of Li-amide ion complex polymer antistatic agent [NanoCamtech Co., Ltd., Elecon-100EH] in the endothelial conductive layer of the dry film, respectively. [Cosmotech Co., Ltd., CMT-1101] 100g was mixed with 0.2g of a curing agent (MA-4, melamine type) and 50g of ethyl acetate, coated with 20 μm (coating after drying), dried at 100 ° C. for 2 minutes, and then 60 The conductive protective film was prepared by aging at 3 ° C. for 3 days. The surface resistance and adhesive force of the protective film endothelial adhesive surface were measured, and the results are shown in Table 1.

Comparative Example 1

A conductive protective film was prepared in the same manner as in Example 1, except that an acrylic adhesive (Cosmotech Co., Ltd., CMT-1101) containing no antistatic agent was used as the endothelial adhesive of the conductive protective film. And the adhesion was measured and the results are shown in Table 1.

TABLE 1

division Example 1 Example 2 Example 3 Example 4 Comparative Example 1 ICP Antistatic Paper (% by weight) 0.5 2 5 10 0 Surface Resistance (Ω / cm) 4x10E8 8x10E7 9x10E6 7x10E6 1x10E10 Adhesive force (g / 25㎜) 5 6 11 20 5

<Example 5-8>

To 4 g of polyaniline aqueous dispersion solution (NanoCamtech Co., Ltd., Pacon-GW), 9.6 g of a water-soluble acrylic binder (Neoresin Corporation Neocryl A Grade) and 0.01 g of a dispersant (BYK Disperbyk 110) were added, 5 g of distilled water and 20 g of iso It was dissolved in a mixed propyl alcohol solution and coated on the inner and outer surfaces of the polyester film, and then dried at 110 ° C. for 2 minutes. The surface resistance of the dried film was 4 × 10 E5 Ω / cm, and the adhesive force was 5 g / 25 mm. Low adhesion for Li-amide ion complex polymer antistatic agent [NanoCamtech Co., Ltd., Elecon-100EH] 0.5 wt%, 2 wt%, 5 wt%, 10 wt%, respectively, in the endothelial conductive layer of the dry film 100 g of a urethane-based [Nano Camptech Co., Ltd., Postic-PT10] adhesive is mixed with 2 g of a curing agent (CL-70T, isocyanate) and 50 g of ethyl acetate, and then coated with a thickness of 25 μm (coating after drying) and dried at 110 ° C. for 2 minutes. After that, aged for 3 days at 60 ℃ to prepare a protective film. The surface resistance and adhesive force of the prepared protective film endothelial adhesive surface were measured and described in Table 2.

Comparative Example 2

A conductive protective film was prepared in the same manner as in Example 5 except that a low-adhesion urethane-based [nanocamptech Co., Ltd., Postic-PT10] pressure-sensitive adhesive containing no antistatic agent was used as the inner skin pressure-sensitive adhesive of the conductive protective film, and the adhesive surface The surface resistance and adhesive force of the was measured, and the results are shown in Table 2.

TABLE 2

division Example 5 Example 6 Example 7 Example 8 Comparative Example 2 ICP Antistatic Paper (% by weight) 0.5 2 5 10 0 Surface Resistance (Ω / cm) 4x10E8 5x10E7 9x10E6 6x10E6 1x10E10 Adhesive force (g / 25㎜) 6 8 12 16 6

<Example 9-12>

To 4 g of polypyrrole aqueous dispersion solution (NanoCamtech Co., Ltd., Pacon-BW), 9.6 g of a water-soluble acrylic binder (Neoresin, Neocryl A Grade) and 0.01 g of a dispersant (BYK, Disperbyk 110) were added, and 5 g of distilled water and 20 g of It was dissolved in an isopropyl alcohol mixed solution and coated on the inner and outer surfaces of the polyester film, and then dried at 105 ° C. for 2 minutes. The surface resistance of the dried film was 2 x 10 E5 Ω / cm, and the adhesive force was 5 g / 25 mm. Rubber-based pressure-sensitive adhesive comprising 0.5% by weight, 2% by weight, 5% by weight, and 10% by weight of Li-amide ion complex polymer antistatic agent [NanoCamtech Co., Ltd., Elecon-100EH], respectively, on the endothelial conductive layer of the dry film. Samwon Co., Ltd., AT-5910] 100g was mixed with 3g of a curing agent (CL-70T, isocyanate) and 50g of ethyl acetate, coated with 20㎛ (after drying film) and dried at 110 ℃ for 2 minutes, and then dried at 60 ℃. It was aged for 3 days to prepare a protective film. Surface resistance and adhesive force of the endothelial adhesive surface of the prepared protective film are shown in Table 3.

Comparative Example 3

A conductive protective film was prepared in the same manner as in Example 9 except that a rubber-based adhesive (Samwon Co., Ltd., AT-5910), which did not contain an antistatic agent, was used as an endothelial adhesive of the conductive protective film. Adhesion was measured and the results are shown in Table 3.

TABLE 3

division Example 9 Example 10 Example 11 Example 12 Comparative Example 3 ICP Antistatic Paper (% by weight) 0.5 2 5 10 0 Surface Resistance (Ω / cm) 6x10E8 3x10E8 5x10E7 1x10E7 5x10E10 Adhesive force (g / 25㎜) 22 24 30 35 22

<Example 13-16>

To 4 g of 3,4-polyethylene dioxythiophene aqueous solution (HC Starck, Baytron PH), 8.9 g of a water-soluble urethane binder (Neoresin, Neocryl A Grade) and 0.01 g of a dispersant (BYK, Disperbyk 110) were added, and 5 g of It was dissolved in distilled water and 20 g of isopropyl alcohol mixed solution, coated on the inner and outer surfaces of the polyethylene film, and then dried at 70 ° C. for 2 minutes. The surface resistance of the dried film was 2 x 10 E5 Ω / cm, and the adhesive force was 5 g / 25 mm. Urethane-containing Li-amide ion complex polymer antistatic agent [NanoCamtech Co., Ltd., Elecon-100EH] 0.5 wt%, 2 wt%, 5 wt%, 10 wt%, respectively, in the endothelial conductive layer of the dry film [Nanocamptech Co., Ltd., Postic-LDP] 100g of pressure-sensitive adhesive is mixed with 1g of curing agent (CL-70T, isocyanate) and 50g of ethyl acetate. It was aged for 2 days at ℃ to prepare a protective film. Surface resistance and adhesive force of the prepared protective film adhesive surface is shown in Table 4.

<Comparative Example 4>

A conductive protective film was prepared in the same manner as in Example 13 except that a urethane-based [Nanocamptech Co., Ltd., Postic-LDP] pressure-sensitive adhesive containing no antistatic agent was used as the endothelial adhesive of the conductive protective film, and the surface resistance of the adhesive surface was And the adhesion was measured and the results are shown in Table 4.

TABLE 4

division Example 13 Example 14 Example 15 Example 16 Comparative Example 4 ICP Antistatic Paper (% by weight) 0.5 2 5 10 0 Surface Resistance (Ω / cm) 1x10E8 6x10E7 2x10E7 5x10E6 1x10E10 Adhesive force (g / 25㎜) 6 8 12 16 6

<Example 17-20>

To 3 g of polyaniline (NanoCamtec, Pacon-GS) doped with camphorsulfonic acid, 5 g of an oil type acrylic binder solution (Neoresin, NeoRez R Grade), 0.01 g of a dispersant (BYK, Disperbyk 110), 10 g of toluene and methyl isobutyl It was dissolved in a mixed solvent of 10 g of ketone and coated only on the polyethylene film endothelium, followed by drying at 70 ° C. for 5 minutes. The surface resistance of the said dry film conductive layer was 6 * 10E5 (ohm) / cm, and the adhesive force was 5g / 25mm. Low adhesive acrylic type containing 0.5 wt%, 2 wt%, 5 wt%, 10 wt% of Li-amide ion complex polymer antistatic agent [NanoCamtech Co., Ltd., Elecon-100EH] on the conductive layer of the dry film, respectively [Cosmotech Co., Ltd., CMT-1107] 100 g of the pressure-sensitive adhesive was mixed with 1 g of a curing agent (NA-20, isocyanate) and 100 g of ethyl acetate, coated with ultra-thin film with 3 μm (after drying), and dried at 80 ° C. for 2 minutes. A protective film was prepared by aging at 60 ° C. for 2 days. Surface resistance and adhesive force of the prepared protective film adhesive surface is shown in Table 5.

Comparative Example 5

A conductive protective film was prepared in the same manner as in Example 17 except for using a low-adhesive acrylic adhesive (Cosmotech Co., Ltd., CMT-1107) that did not contain an antistatic agent as an endothelial adhesive of the conductive protective film. The surface resistance and adhesive force of the was measured and the results are shown in Table 5.

TABLE 5

division Example 17 Example 18 Example 19 Example 20 Comparative Example 5 ICP Antistatic Paper (% by weight) 0.5 2 5 10 0 Surface Resistance (Ω / cm) 5x10E8 9x10E7 3x10E7 8x10E6 2x10E10 Adhesive force (g / 25 mm) 100 108 118 130 100

<Example 21-24>

To 3 g of polypyrrole solution (NanoCamtech, Pacon-BS) doped with paratoluene sulfonic acid, 5 g of an oil type urethane binder (Neoresin, NeoRez R Grade) and 0.01 g of a dispersant (BYK, Disperbyk 110) were added to Methyl isobutyl ketone was dissolved in 10 g of a mixed solvent and coated only on the polyethylene film endothelium, followed by drying at 70 ° C. for 5 minutes. The surface resistance of the dried film was 2 × 10 E5 Ω / cm, and the adhesive strength was 5 g / 25 mm. Rubber-based pressure-sensitive adhesive containing 0.5% by weight, 2% by weight, 5% by weight, 10% by weight of Li-amide ion complex polymer antistatic agent [NanoCamtech Co., Ltd., Elecon-100EH] on the endothelial conductive layer of the dried film, respectively. [Samwon Co., Ltd., AT-530S] 100g is mixed with 2g of a curing agent (CL-70T, isocyanate) and 100g of ethyl acetate and coated with ultra-thin film with 3㎛ (after drying) and dried at 70 ℃ for 2 minutes, and then 60 ℃ After aging for 2-3 days to prepare a protective film. Surface resistance and adhesion of the prepared protective film adhesive surface are shown in Table 6.

Comparative Example 6

A conductive protective film was prepared in the same manner as in Example 21, except that a rubber-based adhesive (Samwon Co., Ltd., AT-530S) containing no antistatic agent was used as the endothelial adhesive of the conductive protective film, and the surface resistance of the adhesive surface and Adhesion was measured and the results are shown in Table 6.

TABLE 6

division Example 21 Example 22 Example 23 Example 24 Comparative Example 6 ICP Antistatic Paper (% by weight) 0.5 2 5 10 0 Surface Resistance (Ω / cm) 7x10E8 2x10E8 3x10E7 9x10E6 4x10E10 Adhesive force (g / 25㎜) 50 54 64 85 50

In preparing a protective film by applying a conventional general pressure sensitive adhesive on a primary film coated with a conductive polymer first, a surface transition is obtained by adding 0.1 to 10% by weight of an ion complex polymer antistatic agent to the pressure sensitive adhesive according to the present invention. It is possible to achieve an antistatic effect of about 10 to 1000 times as compared with a conventional conductive protective film without the problem of deterioration in development and adhesion to the base film and the thickness of the adhesive surface, thereby generating peeling static electricity. There is an effect that can significantly reduce the.

Claims (10)

An antistatic conductive polymer coating is applied to a base film, and a method of manufacturing an antistatic conductive protective film by coating an adhesive again on the conductive polymer coating, wherein the adhesive is charged with an ion complex polymer (ion-complex polymer, ICP) Method for producing a conductive protective film, characterized in that the coating is added by 0.1 to 10% by weight based on the pressure-sensitive adhesive. The method of claim 1, wherein the antistatic conductive polymer coating is made of polyaniline, polythiophene, polypyrrole, and a conductive polymer selected from derivatives thereof as a main component, and is prepared by mixing an adhesive binder, a dispersant, water or an organic solvent therein. Method for producing a conductive protective film, characterized in that carried out with a conductive polymer coating composition. The conductive protective film of claim 2, wherein the conductive polymer is one selected from camphorsulfonic acid, benzenesulfonic acid, dodecylbenzenesulfonic acid, naphthalene sulfonic acid, paratoluene sulfonic acid, and poly (3,4-alkylenedioxythiophene). Manufacturing method. The method of claim 1, wherein the pressure-sensitive adhesive is one selected from acrylic, epoxy, rubber, silicone, or urethane pressure-sensitive adhesives. The method of claim 1, wherein the ion complex polymer antistatic agent is LiPF6, LiBF4, LiSbF6, LiClO4, LiCF3SO3, LiAsF6, LiC (CF3SO3) 3, LiN (CF3SO3) 2, LiI, LiBr, LiCl, LiF, NaPF6, NaClO4, A method of manufacturing a conductive protective film, characterized in that it is prepared by reacting a cationic conducting organic compound and an anionic conducting organic compound in turn with a cationic metal salt prepared by mixing one or two or more selected from NaI, NaSCN, KSCN, KPF6, or KClO4. In the antistatic protective film formed by coating an antistatic conductive polymer coating layer on the base film and an adhesive layer for attaching an electronic product, the pressure sensitive adhesive layer is an ion complex polymer (ICP) antistatic agent 0.1 to about the adhesive Conductive protective film, characterized in that consisting of a pressure-sensitive adhesive layer containing 10% by weight. The conductive protective film of claim 6, wherein the antistatic conductive polymer is one selected from polyaniline, polythiophene, polypyrrole, and derivatives thereof. The method of claim 6, wherein the ion complex polymer antistatic agent is LiPF6, LiBF4, LiSbF6, LiClO4, LiCF3SO3, LiAsF6, LiC (CF3SO3) 3, LiN (CF3SO3) 2, LiI, LiBr, LiCl, LiF, NaPF6, NaClO4, A conductive protective film prepared by reacting a cationic conductive organic compound and an anionic conductive organic compound in turn with a cationic metal salt prepared by mixing at least one selected from NaI, NaSCN, KSCN, KPF6 or KClO4. According to any one of claims 6 to 8, wherein the conductive protective film is coated with an antistatic conductive polymer on the outer skin and the inner surface of the primary coating, the endothelial pressure-sensitive adhesive containing the ion complex antistatic agent again Conductive protective film, characterized in that the coating. The method according to any one of claims 6 to 8, wherein the conductive protective film is coated on the outer surface, the inner surface is a pressure-sensitive adhesive containing an ion complex antistatic agent is coated on the first surface of the antistatic conductive polymer first Conductive protective film, characterized in that the second coating.

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