KR20170135512A - Optical Film - Google Patents

Abstract

The present invention relates to an optical film, a method of manufacturing the optical film, a method of protecting a surface of a barrier film, and a method of manufacturing an organic light emitting electronic device. According to the present invention, the optical film protects a surface of a barrier film and has excellent anti-static function to prevent foreign substances from being attached by static electricity generated when the optical film is separated during a process.

Description

Optical Film {Optical Film}

The present invention relates to an optical film, a method for producing the optical film, a method for protecting a surface of a barrier film, and a method for manufacturing an organic light emitting electronic device.

An organic light emitting diode (OLED) is a self-emitting type display device, unlike a liquid crystal display (LCD), a separate light source is not necessary and can be manufactured in a light and thin shape. Further, the organic light emitting diode is advantageous not only in terms of power consumption in accordance with low voltage driving but also in response speed, viewing angle, and contrast ratio, and is being studied as a next generation display.

The organic light emitting diode is very vulnerable to impurities, oxygen, and moisture, so that the organic light emitting diode is easily degraded in characteristics due to external exposure, moisture, and oxygen penetration, and the lifetime is shortened. In order to solve such a problem, an encapsulation layer is required to prevent oxygen, moisture and the like from flowing into the organic light emitting electronic device.

The encapsulant layer includes a protective film for protecting the encapsulant layer after a manufacturing process or a manufacturing process. The typical protective film has a high surface electrical resistance due to the nature of the material. When the protective film is peeled off from the encapsulant layer due to static electricity, A residual image is left on the encapsulation material layer and foreign substances such as dust or dust are adhered to the organic light emitting device and the organic light emitting device is damaged. In order to solve such a problem, there is a problem in that productivity is deteriorated due to an increase in production time and cost due to the need for a worker to remove static electricity through a static eliminator. A method for solving these problems is required.

Korean Patent Registration No. 10-0294521

The present invention relates to an optical film that protects the surface of a barrier film and has excellent antistatic function, a method of manufacturing the optical film, a method of protecting a surface of a barrier film, and a method of manufacturing an organic light emitting electronic device.

This application relates to an optical film. The optical film may be, for example, an optical film that protects the surface of the barrier film and has an excellent antistatic function and prevents adhesion of foreign matter due to static electricity generated during peeling in the process.

Exemplary optical films may include a substrate layer, a protective layer, and an adhesive member. The base layer may include a base film and a first antistatic layer on one side of the base film. The protective layer may include a protective film and a second and a third antistatic layer on both sides of the protective film. The adhesive member may include a silicone-based pressure-sensitive adhesive layer or may include a non-silicone-based pressure-sensitive adhesive layer and a release layer, and the pressure-sensitive adhesive member may be included between the base layer and the protection layer. The first to third antistatic layers may have a surface resistance of 10 ⁹ Ω / □ or less, for example, 9 × 10 ⁸ Ω / □ or less, 8 × 10 ⁸ Ω / □ or less and 7 × 10 ⁸ Ω / 10 ⁸ Ω / □ or less, or less than 10 ⁷ Ω / □, and may be 10 ⁵ Ω / □ or more. By having the surface resistances of the first to third antistatic layers within the above-mentioned range, the optical film can have an excellent antistatic function.

The optical film of the present application contains a first antistatic layer on one surface of a base film and a second and a third antistatic layer on both surfaces of the protective film to protect the surface of the barrier film and to provide an antistatic function, It is possible to prevent the adhesion of the foreign matter by the generated static electricity.

FIGS. 1 and 2 are diagrams illustrating a method of manufacturing a light emitting device according to an embodiment of the present invention, which includes a base layer 110 including a first antistatic layer 11 A on one surface of a base film 111; A protective layer 130 including second and third antistatic layers 11 B and 11 C on both sides of the protective film 131 and the protective film 131; And an adhesion member 120 between the base layer 110 and the protection layer 130. The adhesion member 120 may include a silicone based pressure sensitive adhesive layer 121 or a non silicone based pressure sensitive adhesive layer 122 and a release layer 123 (1) and (2). Fig. 1 exemplarily shows an optical film 1 including a silicone-based pressure-sensitive adhesive layer 121 as an adhesive member 120, and Fig. 2 shows an optical film 1 as a pressure-sensitive adhesive member 120, The optical film 2 including the release layer 123 is exemplarily shown.

As used herein, the term " antistatic layer " may mean a layer intended to suppress the generation of static electricity or to reduce the discharge energy. In the present invention, in the first to third antistatic layers, the term " to " may mean to include any one of three, to include any two of the three, or to include all three.

The first to third antistatic layers may be formed by a known method to achieve a desired effect. For example, the first to third antistatic layers may be formed by an in-line coating method on one side of the base film and both sides of the protective film, as described above. The in-line coating method is a method of coating a coating layer after uniaxially stretching an extruded film to complete the film by biaxial stretching. The coating is imparted during the production process of the film to increase the adhesion, And thus it is advantageous in that the film can be used as easily as possible with a shortening of the process and the film can be made as thin as possible.

The first to third antistatic layers may have a transmittance of 85% or more. The transmittance may mean a transmittance measured at a wavelength of 380 nm to 780 nm. By having the first to third antistatic layers have transmittance within the above-mentioned range, the processability can be improved. For example, an additional process for peeling off an optical film during an inspection involving optical evaluation such as display ability, color, contrast, foreign matter incorporation, etc. of the liquid crystal display panel may not occur.

The first to third antistatic layers may include a carbon nanotube and a thermosetting binder resin. The carbon nanotubes may have a tubular shape formed by rounding a graphite plate formed by connecting six hexagonal rings of carbon. The carbon nanotubes are excellent in rigidity and electrical conductivity, and when used as an antistatic layer of an optical film, the hardness is increased and the antistatic function can be improved. In addition, since the carbon nanotubes are not decomposed when exposed to ultraviolet rays or heat, the weatherability of the optical film is increased as compared with the case of using a conductive polymer or the like.

The method for producing the carbon nanotubes is not particularly limited and may be manufactured by a method known in the art such as a chemical vapor deposition method, an arc discharge method, a plasma torch method, and an ion impact method. In one example, the carbon nanotubes can be produced by an arc discharge method.

The specific structure of the carbon nanotube is not particularly limited. For example, the carbon nanotube may be any one of a single-walled carbon nanotube (SWCNT) or a multi-walled carbon nanotube (MWCNT) .

In one example, the first to third antistatic layers may comprise single wall carbon nanotubes. When single-walled carbon nanotubes are used for the first to third antistatic layers, the above-mentioned range of surface resistance and transmittance can be realized.

In one example, single-walled carbon nanotubes can be used as the first to third antistatic layers. The diameter of the single-walled carbon nanotube may range from 0.1 nm to 20.0 nm, and the upper limit may be 10.0 nm or less, or 5.0 nm or less, and the lower limit may be 0.5 nm or more and 1.0 nm or more. The length of the single-walled carbon nanotube may be in the range of 1.0 μm to 50.0 μm, the upper limit thereof may be 40.0 μm or less, or 30.0 μm or less, and the lower limit may be 2.0 μm or more or 4.0 μm or more. When the diameter of the carbon nanotubes is less than 0.1 nm or more than 20.0 nm and the length is less than 1.0 탆 or more than 50 탆, the surface resistance of the first to third antistatic layers increases and the peeling electrification voltage may be high.

The first to third antistatic layers of the optical film may include 0.5 to 50 parts by weight of single-walled carbon nanotubes per 100 parts by weight of the thermosetting binder resin. When the single-walled carbon nanotube is contained in an amount of less than 0.5 parts by weight, the surface resistance of the first to third antistatic layers increases to reduce the antistatic effect. When the amount exceeds 50 parts by weight, The physical properties such as the transmittance of the third antistatic layer may be lowered.

The thicknesses of the first to third antistatic layers may be suitably selected in consideration of the object of the present application. For example, the thickness of the first to third antistatic layers may be less than 400 nm, less than 300 nm, or less than 200 nm, and may be more than 20 nm. By having the thicknesses of the first to third antistatic layers within the above-mentioned range, it is possible to have excellent coating properties on one surface of the base film or both surfaces of the protective film.

As used herein, the term " thermosetting binder resin " means a binder resin that can be cured through the application of an appropriate heat or an aging process. For example, as the thermosetting binder resin, one or a mixture selected from the group consisting of an acrylic resin, a urethane resin, a urethane-acrylic copolymer, an ester resin, an ether resin, an amide resin, an epoxy resin and a melamine resin But is not limited thereto.

The first to third antistatic layers may further include a crosslinking agent. The crosslinking agent may be a crosslinking agent having at least one, more preferably from 1 to 10, from 1 to 8, from 1 to 6, or from 1 to 4 functional groups capable of reacting with a crosslinkable functional group contained in the thermosetting binder resin Crosslinking agents may be used. Such a crosslinking agent can be selected by appropriately considering the kinds of the crosslinkable functional groups of the thermosetting binder resin among conventional crosslinking agents such as aziridine, melamine, oxazoline, epoxy and metal chelate crosslinking agents.

Examples of the aziridine crosslinking agent include N, N'-toluene-2,4-bis (1-aziridine carboxamide), N, N'-diphenylmethane-4,4'- (2-methyl aziridine), or tri-1-aziridinyl phosphine oxide. Examples of the melamine crosslinking agent include, for example, Hexamethylol melamine, and the like, but are not limited thereto.

Examples of the oxazoline crosslinking agent include ortho, meta- or para-substituted phenylene bisoxazoline, 2,6-bis (2-oxazoline-2-yl) pyridine, 2,6- (4,4-dimethyl-2-oxazolin-2-yl) ethane or 2,2-isopropylidene bis-2 -Oxazoline, and the like. Examples of the epoxy crosslinking agent include ethylene glycol diglycidyl ether, triglycidyl ether, trimethylol propane triglycidyl ether, N, N, N ', N'-tetraglyme Methyl ethylenediamine, diethylethylenediamine or glycerine diglycidyl ether, and the like, but are not limited thereto. Examples of the metal chelate crosslinking agent include compounds in which a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium and / or vanadium is coordinated to acetylacetone or ethyl acetate, It is not.

The type of the base film is not particularly limited. For example, the base film may be a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, But are not limited to, a film, a polyurethane film, an ethylene-vinyl acetate film, an ethylene-propylene copolymer film, an ethylene-ethyl acrylate copolymer film, an ethylene-methyl acrylate copolymer film or a polyimide film.

The thickness of the base film may be suitably selected in consideration of the object of the present application. For example, the thickness of the base film may be 25 탆 to 150 탆, 50 탆 to 125 탆, or 75 탆 to 100 탆.

The base film may be subjected to appropriate bonding treatment such as, for example, corona discharge treatment, ultraviolet ray irradiation treatment, plasma treatment or sputter etching treatment, but is not limited thereto.

The base film may be directly attached to the silicone-based pressure-sensitive adhesive layer or the non-silicone-based pressure-sensitive adhesive layer. That is, the optical film of the present application may have a structure in which a silicone-based pressure-sensitive adhesive layer or a non-silicone-based pressure-sensitive adhesive layer is adhered on the base film.

The adhesive member may be formed between the base layer and the protective layer. The adhesive member may include a silicone-based pressure-sensitive adhesive layer or a non-silicone-based pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer may include a silicone-based pressure-sensitive adhesive composition or a non-silicone-based pressure-sensitive adhesive composition in a cured state. The method for curing the pressure-sensitive adhesive composition is not particularly limited, and for example, it is possible to employ a curing method by suitable heating, drying and / or aging process, or curing by electromagnetic wave irradiation such as ultraviolet (UV) have.

In one example, the adhesive member may include a silicone-based pressure-sensitive adhesive layer. The silicone pressure sensitive adhesive layer may include, but is not limited to, polydimethylsiloxane or polyphenylsiloxane.

When the adhesive member includes a silicone-based adhesive layer, the adhesive member may not include a release layer. When a silicone-based pressure-sensitive adhesive layer is used as the pressure-sensitive adhesive member, a residual image can be peeled off on the pressure-sensitive adhesive layer at a low peeling force when the silicone-based pressure-sensitive adhesive layer is peeled from the protective layer.

In one example, the silicone-based pressure-sensitive adhesive layer may have a peel force of 30 gf / in or less, 20 gf / in or less or 5 gf / in or less measured at a peeling angle of 180 ° and a peeling speed of 0.3 m / gf / in. < / RTI > The peeling force may be a peeling force measured on glass, polyethylene naphthalate (PEN) or silicon nitride. According to one embodiment of the present application, the peeling force may be a peeling force measured on glass.

The silicone-based pressure-sensitive adhesive layer may have a wetting time of 1 sec to 10 sec, 2 sec to 8 sec, 3 sec to 6 sec, or 4 sec to 5 sec for glass, but is not limited thereto. The silicone-based pressure-sensitive adhesive layer has a wettling time within the above-mentioned range, whereby the after-image can be peeled off without peeling off the pressure-sensitive adhesive layer and the protective layer.

As used herein, wetting refers to the time taken for the adhesive or adhesive to be wetted against both the surface of the adherend, and the method for measuring the wettability can use a method commonly used in the art. For example, it can be measured by the wettability evaluation method of Experimental Example 2 described later.

In another example, the adhesive member may include a non-silicone-based pressure-sensitive adhesive layer and a release layer. The non-silicone-based pressure-sensitive adhesive layer may be a rubber-based pressure-sensitive adhesive layer, a urethane pressure-sensitive adhesive layer, or an acrylic pressure-sensitive adhesive layer.

For example, as the rubber-based pressure-sensitive adhesive layer, a pressure-sensitive adhesive layer containing a natural rubber, polyisoprene rubber, polyisobutylene rubber, polybutadiene rubber or styrene-butadiene-styrene block copolymer or the like can be used. As the urethane pressure sensitive adhesive layer, a pressure sensitive adhesive layer containing a polyurethane resin may be used. The polyurethane resin can be obtained from a cured product of a composition containing at least one selected from, for example, a functional group consisting of a hydroxyl group, an amine group and a carboxyl group. The acrylic pressure sensitive adhesive layer may include a (meth) acrylic acid ester monomer. The monomers may be included in the polymer as polymerized units. In the present specification, the monomer is included in the polymer as a polymerization unit may mean a state in which the monomer forms a skeleton of the polymer, for example, a main chain or a side chain through a polymerization reaction or the like. As the (meth) acrylic acid ester monomer, for example, alkyl (meth) acrylate may be used. For example, an alkyl (meth) acrylate having an alkyl group having 1 to 14 carbon atoms can be used in consideration of cohesive force of a pressure-sensitive adhesive, glass transition temperature, and the like. Examples of such monomers include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, (Meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, sec-butyl (Meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate and tetradecyl (meth) acrylate, and a mixture of one or more of the aforementioned monomers is included in the polymer .

The acrylic pressure sensitive adhesive layer may further comprise an elastomer. Examples of the elastomer include at least one selected from the group consisting of natural isoprene, synthetic polyisoprene, polybutadiene, chloroprene rubber, butyl rubber, halogenated butyl rubber, styrene-butadiene rubber, nitrile rubber and hydrogenated nitrile rubber have.

In the case where a non-silicone-based pressure-sensitive adhesive layer is used as the pressure-sensitive adhesive member, the pressure-sensitive adhesive layer of the second antistatic layer is further provided with a release layer on the surface on which the protective film is not formed, A residual image is not generated on the pressure-sensitive adhesive layer by the force, and can be peeled off.

For example, the non-silicone-based pressure-sensitive adhesive layer may have a peel force of 30 gf / in or less, 20 gf / in or 10 gf / in or less measured at a peel angle of 180 ° and a peel rate of 0.3 m / / in. < / RTI > The peeling force may be a peeling force measured on glass, polyethylene naphthalate (PEN) or silicon nitride. According to one embodiment of the present application, the peeling force may be a peeling force measured on glass.

The non-silicone pressure-sensitive adhesive layer may have a wetting time of 1 to 10 sec, 2 to 8 sec, 3 to 6 sec, or 4 to 5 sec for glass, but is not limited thereto. The non-silicone-based pressure-sensitive adhesive layer has a wetting time in the above-mentioned range, so that the after-image can be peeled off without peeling off the pressure-sensitive adhesive layer and the protective layer.

The release layer may comprise silicon or fluorine. The non-silicone-based pressure-sensitive adhesive layer can be peeled off even when a large physical force is not applied to the release layer, and it is possible to prevent the after-image on the pressure-sensitive adhesive layer from being peeled off from the non-silicone pressure-

The thickness of the release layer can be appropriately selected in consideration of the object of the present application. For example, the thickness of the release layer may be 500 nm or less, 300 nm or less, or 100 nm or less, and 10 nm or more.

The protective film may be formed between the second and third antistatic layers. The type of the protective film is not particularly limited, and for example, polyethylene terephthalate; Polytetrafluoroethylene; Polyethylene; Polypropylene; Polybutene; Polybutadiene; Vinyl chloride copolymer; Polyurethane; Ethylene-vinyl acetate; Ethylene-propylene copolymer; Ethylene-ethyl acrylate copolymer; Ethylene-methyl acrylate copolymer; Polyimide; nylon; Styrene resin or elastomer; Polyolefin resins or elastomers; Other elastomers; Polyoxyalkylene resins or elastomers; Polyester-based resins or elastomers; Polyvinyl chloride resins or elastomers; Polycarbonate resin or elastomer; Polyphenylene sulfide type resin or elastomer; Mixtures of hydrocarbons; Polyamide based resins or elastomers; Acrylate resins or elastomers; Epoxy resin or elastomer; Silicone resin or elastomer; And a liquid crystal polymer, but is not limited thereto.

The thickness of the protective film may be suitably selected in consideration of the object of the present application. For example, from 25 탆 to 150 탆, from 25 탆 to 100 탆, or from 25 탆 to 50 탆.

The silicone-based or non-silicone-based pressure-sensitive adhesive layer may have a peeling electromotive force of 1 kV or less, 0.8 kV or 0.6 kV or less measured at an applied pressure of 10 kV, a temperature of 23 캜 and a relative humidity of 50% . By having the silicone-based or non-silicone-based pressure-sensitive adhesive layer have a peeling electrification voltage within the above-mentioned range, it is possible to prevent the adhesion of foreign matter due to static electricity generated during peeling in the process. The peeling electrification voltage of the silicone-based or non-silicone-based pressure-sensitive adhesive layer can be measured by a known method in order to achieve the object of the present application. For example, it can be measured by the peeling electrification evaluation method of Experimental Example 2 described later.

The present application also relates to a method for producing an optical film. The above-mentioned production method relates to, for example, the above-mentioned method for producing an optical film. Therefore, the details of the optical film production method described later can be similarly applied to the optical film described above.

The method for producing an optical film according to the present invention comprises a base film and a base layer comprising a first antistatic layer on one side of the base film, a protective film, and a protective layer comprising second and third antistatic layers on both sides of the protective film, A pressure-sensitive adhesive layer, or a pressure-sensitive adhesive member including a non-silicone-based pressure-sensitive adhesive layer and a release layer.

In one example, a silicone-based pressure-sensitive adhesive layer may be formed on a surface of the substrate layer on which the first antistatic layer is not present, and the base layer and the protective layer may be adhered via the silicone-based pressure-sensitive adhesive layer.

In another example, a non-silicone-based pressure-sensitive adhesive layer is formed on a surface of the substrate layer where the first antistatic layer is absent, and a release layer is formed on the surface of the protective layer where the protective film of the second antistatic layer is absent Based pressure-sensitive adhesive layer and the release layer, the base layer and the protective layer can be adhered to each other.

The present application also relates to a method of protecting the surface of a barrier film. The surface protection method relates to a method for protecting the surface of a barrier film with, for example, a base layer and a silicone-based or non-silicone-based pressure-sensitive adhesive layer which are peeled from the optical film described above. Therefore, the details of the base layer and the silicone-based or non-silicone-based pressure-sensitive adhesive layer which are peeled off from the optical film to be described later can be applied equally to those described in the optical film.

3 and 4 illustrate examples of the structure including the substrate layer 110 and the silicon-based or non-silicon-based pressure-sensitive adhesive layer 121, 122 peeled off from the optical film on the surface of the barrier film 310 Fig. Fig. 3 exemplarily shows a structure including the silicone-based pressure-sensitive adhesive layer 121 as a pressure-sensitive adhesive layer on the surface of the barrier film 310. Fig. 4 shows a structure in which a pressure- A structure including the pressure-sensitive adhesive layer 122 is exemplarily shown.

In one example, the method of protecting the surface of the barrier film may include a step of adhering the base film layer and the silicone-based or non-silicone-based pressure-sensitive adhesive layer to the barrier film in the optical film described above. And a silicone-based or non-silicone-based pressure-sensitive adhesive layer is adhered to the above-mentioned optical film and the antistatic function for preventing adhesion of foreign substances generated by static electricity during the manufacturing process of the barrier film A barrier film can be formed.

As used herein, the barrier film may mean a functional film that prevents substances that promote device deterioration such as moisture and oxygen from entering the device. The barrier film may include at least one inorganic layer and may be formed by directly adhering a silicone-based or non-silicone-based pressure-sensitive adhesive layer to the inorganic layer.

The barrier film may be formed of a metal such as In, Sn, Pb, Au, Cu, Ag, Al, Ti, and Ni; MgO, a metal oxide such as _{SiO, SiO 2, Al 2 O} 3, GeO, NiO, CaO, BaO, Fe 2 O 3, Y 2 O 3 and TiO _2; Metal nitrides such as SiN; Metal oxynitrides such as SiON; Or metal fluorides such as MgF ₂ , LiF, AlF _3, and CaF ₂ .

The present application also relates to a method of manufacturing an organic light emitting electronic device.

In one example, the method of fabricating an organic light emitting electronic device includes the steps of: peeling off the above-mentioned optical film on the encapsulant layer of an organic light emitting device sequentially including a back plate, a plastic substrate, an organic light emitting diode, a thin film transistor, Based adhesive layer and a silicone-based or non-silicone-based pressure-sensitive adhesive layer.

In the optical film described above, the peeled base layer and the silicone-based or non-silicone-based pressure-sensitive adhesive layer may be formed directly on the sealant layer. For example, the silicone-based or non-silicone-based pressure-sensitive adhesive layer may be formed directly on the sealing material layer. By attaching a silicone-based or non-silicone-based pressure-sensitive adhesive layer directly on the sealing material layer, an encapsulating material layer having an antistatic function for preventing adhesion of foreign substances generated by static electricity during the manufacturing process of the organic light- .

Figs. 5 and 6 are views showing the attachment state of the silicone-based or non-silicone-based pressure-sensitive adhesive layer on the sealing material layer in the manufacturing process of the organic light-emitting electronic device. 5 and 6, an organic light emitting diode 510 (hereinafter, referred to as an organic light emitting diode) 510 including a back plate 511, a plastic substrate 512, an organic light emitting diode 513, a thin film transistor 514 and an encapsulant layer 515 ); And a base layer 110 and a silicone-based or non-silicone-based pressure-sensitive adhesive layer 121 or 122 peeled from the optical film on the encapsulant layer 515 of the organic light-emitting device 510.

5 shows an example of the attachment state of the silicone-based pressure-sensitive adhesive layer 121 on the sealing material layer 515 in the manufacturing process of the organic light-emitting electronic device 5. FIG. The adhesion state of the non-silicone-based pressure-sensitive adhesive layer 122 on the encapsulant layer 515 is exemplarily shown in the manufacturing process.

The encapsulant layer may exhibit excellent moisture barrier properties and optical properties in organic light emitting electronic devices. In addition, the sealing material layer may be formed of a sealing material layer which is stable regardless of the form of the organic light emitting electronic device such as top emission or bottom emission.

The encapsulant layer may include a first inorganic material layer, a polymer layer, and a second inorganic material layer sequentially. As a method of forming the encapsulant layer, a method of forming a conventional encapsulant layer known in the art can be applied. In one example, a silicone-based or non-silicone-based pressure-sensitive adhesive layer may be directly attached to the surface of the second inorganic material layer on which the polymer layer is not formed.

The first and second inorganic layers may include a material of the inorganic layer described in the item of the barrier film, and may include, for example, AlO _x , SiN _x , SiO _x , SiON, and the like. The polymer layer is introduced between the first and second inorganic layers to perform the function of relieving the stress of the inorganic layer while flattening the irregular surface by the inorganic particles or the like. The polymer layer may include, for example, an acrylate resin or an epoxy resin.

The manufacturing method of the organic light-emitting electronic device of the present application may further comprise a step of peeling the substrate layer and the silicon-based or non-silicon-based pressure-sensitive adhesive layer from the sealing material layer and forming a polarizing plate on the sealing material layer. After peeling the base layer and the silicone-based or non-silicone-based pressure-sensitive adhesive layer from the sealing material layer, the sealing material layer exhibits an excellent antistatic function, and the polarizing plate can be formed on the sealing material layer without generating static electricity.

The method of manufacturing an organic light emitting electronic device according to the present application may further include forming a touch screen panel and a cover window on a surface of the polarizing plate on which an encapsulant layer is not formed.

The present application can provide an optical film that protects the surface of a barrier film and has an excellent antistatic function and prevents adhesion of foreign matter due to static electricity generated during peeling in the process.

1 and 2 are views showing an exemplary optical film.
Figs. 3 and 4 are diagrams for illustrating the method for protecting the surface of the barrier film. Fig.
Figs. 5 and 6 are views showing the adhesion state of the silicone-based or non-silicone-based pressure-sensitive adhesive layer on the sealing material layer in the manufacturing process of the organic light-emitting electronic device.

Hereinafter, the present application will be described in more detail by way of examples according to the present application and comparative examples not complying with the present application, but the scope of the present application is not limited by the following examples.

Manufacturing example  One

1st  To Third  Preparation of Antistatic Layer Composition

72 parts by weight of methyl methacrylate (MMA), 23 parts by weight of n-butyl methacrylate (NBMA), 5 parts by weight of acrylic acid (AA) and AIBN as a polymerization initiator were added to a methyl ethyl ketone (MEK) And the mixture was mixed and dropped at about 80 ° C to 85 ° C to complete the polymerization at a conversion of about 95% to 100% to prepare a binder.

10 g of a solution (A) prepared by diluting 100 parts by weight of methyl ethyl ketone (MEK) and 5 parts by weight of the binder, 100 parts by weight of propanol and 0.1 part by weight of single-walled carbon nanotubes (SWCNT, 90 g of the solution (B), and 5 g of a solution (C) prepared by diluting 100 parts by weight of methyl ethyl ketone with 5 parts by weight of an epoxy curing agent (BXX-5420) were mixed to prepare first to third charge- .

Manufacturing example  2

1st  To Third  Preparation of Antistatic Layer Composition

The first to third antistatic layer compositions were prepared in the same manner as in Preparation Example 1 except that 0.1 part by weight of multi-walled carbon nanotubes (MWCNT, Wonil Corp.) was used in place of single-walled carbon nanotubes.

Manufacturing example  3

1st  To Third  Preparation of Antistatic Layer Composition

The first to third antistatic layer compositions were prepared in the same manner as in Preparation Example 1 except that 0.3 part by weight of multi-wall carbon nanotubes (MWCNT, Wonil Corp.) was used instead of single wall carbon nanotubes.

Experimental Example  One. Manufacturing example 1st  To Third  Evaluation of physical properties for antistatic layer

The properties in the following examples were evaluated in the following manner.

* Surface resistance evaluation

The first to third antistatic layer compositions prepared in Preparative Examples 1 to 3 were prepared in the form of a sheet and were made into specimens having a width of 5 cm and a length of 7 cm. A surface resistance meter (MCP-HT450, manufactured by MITSUBISHI CHEMICAL) At 10 V and 1000 V, the average values of the five points of the coating specimen measured for 10 seconds were evaluated. The results are shown in Table 1 below.

* Evaluation of transmittance

The first to third antistatic layer compositions prepared in Preparative Examples 1 to 3 were prepared in the form of a sheet and were made into specimens having a width of 5 cm and a length of 7 cm. The first to third antistatic layers The transmittance of the composition was measured and evaluated using a haze meter (NDH-5000SP), and the results are shown in Table 1 below.

division Production Example 1 Production Example 2 Production Example 3 Surface resistance
(Ω / □) 6.91 × 10 ⁶ 6.78 x 10 ¹⁴ 1.00 x 10 ⁷ Transmittance
(%) 88.49 85.60 80.29

As shown in Table 1, in the case of the first to third antistatic layers of Production Example 1, the surface resistance was low and the transmittance was excellent, whereas in the case of the first to third antistatic layers of Production Examples 2 and 3, 1 to the third antistatic layer can not be satisfied.

Experimental Example  2. Evaluation of physical properties for optical film

Optical films were prepared in the same manner as in Examples 1 to 3 and Comparative Examples 1 to 5, and physical properties of the produced optical films were evaluated in the following manner.

* Peel force  evaluation

A substrate layer on which a silicone-based or non-silicone-based pressure-sensitive adhesive layer was formed was peeled off from the optical films prepared in Examples 1 to 3 and Comparative Examples 1 to 5, and the substrate layer on which the pressure-sensitive adhesive layer was formed had a width of 25 mm and a length of 150 mm To prepare a specimen. Subsequently, the substrate layer on which the pressure-sensitive adhesive layer is formed is attached to the glass using a 2 kg roller in accordance with JIS Z 0237, and is stored in a constant temperature and humidity chamber (23 DEG C, 50% relative humidity) for about 24 hours. Subsequently, using the equipment (Texture Analyzer, manufactured by Stable Microsystems, UK), the peel strength was evaluated while peeling the substrate layer formed with the pressure-sensitive adhesive layer from the glass at a peeling speed of 0.3 m / min and a peeling angle of 180 °.

* Wetting wetting evaluation

The optical films prepared in the following Examples 1 to 3 and Comparative Examples 1 to 5 were cut into a size of 50 mm x 150 mm and the substrate layer on which the silicone or non-silicone pressure sensitive adhesive layer was formed was peeled off from the optical film, After the substrate layer was attached to the glass, the time when all the pressure sensitive adhesive layer was wetted on the glass was measured and evaluated.

* The pressure-  Evaluation of antistatic layer transfer

In the optical films prepared in Examples 1 to 3 and Comparative Examples 1 to 5, after peeling off the pressure-sensitive adhesive layer, the transfer of the antistatic layer on the pressure-sensitive adhesive layer was evaluated.

O: Front Warrior

?: Partial transfer

X: No warrior

* Peeling Voltage Rating

In the optical films prepared in Examples 1 to 3 and Comparative Examples 1 to 5, silicon-based or non-silicone-based pressure-sensitive adhesive layers were bonded to the second antistatic layer or release layer, and then cut into 250 mm width and 250 nm length , And allowed to stand for 1 day under an environment of 23 ° C × 50% RH. When the silicone-based or non-silicone-based pressure-sensitive adhesive layer was peeled from the second antistatic layer or the release layer, the peeling electrification voltage was measured with a static honestmeter Manufactured by Seish Electric Co., Ltd.) under the environment of 23 占 폚 占 50% RH by applying a voltage of 10 kV.

Example  One

Manufacture of optical film

The first antistatic layer composition prepared in Production Example 1 was coated on a 75 m thick PET film (H33P, manufactured by KOLON CORPORATION) as a base film to a thickness of 50 nm and coated.

On both sides of a 38 탆 thick PET film (XD510P, manufactured by TAK Co.) as the protective film, the second and third antistatic layer compositions prepared in Preparation Example 1 were coated at a thickness of 50 nm and coated.

A first antistatic layer of the base film was formed on the silicon pressure-sensitive adhesive layer by coating a 75 탆 thick first silicone-based pressure-sensitive adhesive (7654, Dow Corning) on the surface of the second antistatic layer on which the protective film was not formed Was laminated to prepare an optical film. The evaluation results of physical properties of the prepared optical film are shown in Table 3 below.

Example  2

Manufacture of optical film

(SH101, manufactured by Toyochem Co.) as a non-silicone pressure-sensitive adhesive layer and a silicone release film (RF02N, SK HASS Co., Ltd.) as a release layer on the surface of the base film on which the first antistatic layer was not formed, ) Was formed in the same manner as in Example 1, The evaluation results of physical properties of the prepared optical film are shown in Table 3 below.

Example  3

Manufacture of optical film

An optical film was produced in the same manner as in Example 1, except that a silicone pressure-sensitive adhesive (SG-6405A, KCC) was used as the silicone pressure-sensitive adhesive layer. The evaluation results of physical properties of the prepared optical film are shown in Table 3 below.

Comparative Example  1 to 3

Manufacture of optical film

Comparative Example 1 to Comparative Example 3 were obtained in the same manner as in Example 1 except that at least one of the antistatic layers of the first to third antistatic layers prepared in Preparation Example 1 was removed as shown in Table 2 below. The evaluation results of physical properties of the prepared optical film are shown in Table 3 below.

division Comparative Example 1 Comparative Example 2 Comparative Example 3 The first antistatic layer x O O The second antistatic layer O X X The third antistatic layer O X O O: antistatic layer oil
X: antistatic layer

Comparative Example  4

Manufacture of optical film

An optical film was produced in the same manner as in Example 1, except that the first to third antistatic layers used in Production Example 2 were used as the first to third antistatic layers. The evaluation results of physical properties of the prepared optical film are shown in Table 3 below.

Comparative Example  5

Manufacture of optical film

An optical film was produced in the same manner as in Example 1, except that the first to third antistatic layers used in Production Example 3 were used as the first to third antistatic layers. The evaluation results of physical properties of the prepared optical film are shown in Table 3 below.

division Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Peel force
(gf / in)
(For glass) One 1.4 10 1.5 1.5 1.5 One One Wetting time (sec) 4 5 5 4 4 4 4 4 The transfer of the antistatic layer on the pressure-sensitive adhesive layer X X X X X X X X Peeling Voltage (kV) 0.75 0.44 0.72 1.57 1.01 1.28 3.15 0.78

As shown in Table 3, it can be confirmed that the peeling electrification voltage of the optical films of Examples 1 to 3 is lower than that of the optical films of Comparative Examples 1 to 4. The low peeling electrification voltage means that the generation of static electricity is suppressed. When the optical films of Examples 1 to 3 are used, the effect of preventing the adhesion of foreign matter due to the generation of static electricity is excellent.

On the other hand, the optical film of Comparative Example 5 showed a peeling electrification voltage similar to that of the optical films of Examples 1 to 3, but the optical film of Comparative Example 5 had a lower transmittance than the optical films of Examples 1 to 3 Sufficient transparency can not be ensured because the antistatic layer of Example 3 is used and accordingly an additional process for peeling off the optical film during inspection accompanied by optical evaluation such as display ability, color, contrast and foreign matter incorporation of the liquid crystal display panel occurs There is a problem that the fairness is lowered.

1, 2: Optical film
11A: First antistatic layer
11 B: Second antistatic layer
11 C: Third antistatic layer
110: substrate layer
111: substrate film
120: Adhesive member
121: Silicone-based pressure-sensitive adhesive layer
122: non-silicone-based pressure-sensitive adhesive layer
123:
130: Protective layer
131: Protective film
310: barrier film
5, 6: Organic light-emitting electronic devices
510: Organic light emitting device
511: back plate
512: plastic substrate
513: organic light emitting diode
514: Thin film transistor
515: encapsulating material layer

Claims (29)

A base film comprising a base film and a first antistatic layer on one side of the base film;
A protective film and a second and a third antistatic layer on both sides of the protective film; And
Wherein the adhesive member comprises a silicone-based pressure-sensitive adhesive layer or a non-silicone-based pressure-sensitive adhesive layer and a release layer, wherein the first to third antistatic layers have a surface resistance of 10 ⁹ Ω / □ or less. The method according to claim 1,
Wherein the first to third antistatic layers have a transmittance of 85% or more. The method according to claim 1,
Wherein the first to third antistatic layers comprise a single-walled carbon nanotube and a thermosetting binder resin. The method of claim 3,
A single-walled carbon nanotube has a diameter of 0.1 nm to 20.0 nm and a length of 1.0 to 50 탆. The method of claim 3,
Wherein the first to third antistatic layers comprise single-walled carbon nanotubes in an amount of 0.5 to 50 parts by weight based on 100 parts by weight of the thermosetting binder resin. The method according to claim 1,
Wherein the first to third antistatic layers have a thickness of 20 nm or more and less than 400 nm. The method according to claim 1,
Wherein the thickness of the base film is 25 占 퐉 to 150 占 퐉. The method according to claim 1,
Wherein the base film is directly attached to the silicone-based pressure-sensitive adhesive layer or the non-silicone-based pressure-sensitive adhesive layer. The method according to claim 1,
Wherein the silicone-based pressure-sensitive adhesive layer comprises polydimethylsiloxane or polyphenylsiloxane. The method according to claim 1,
The silicone-based pressure-sensitive adhesive layer has a peel force of 0.1 gf / in to 30 gf / in measured at a peel angle of 180 deg. And a peel rate of 0.3 m / min. The method according to claim 1,
Wherein the silicone-based pressure-sensitive adhesive layer has a wetting time of 1 sec to 10 sec with respect to the glass. The method according to claim 1,
Based pressure-sensitive adhesive layer is a rubber-based pressure-sensitive adhesive layer, a urethane-based pressure-sensitive adhesive layer, or an acrylic pressure-sensitive adhesive layer. The method according to claim 1,
Wherein the non-silicone-based pressure-sensitive adhesive layer has a peel force of 0.1 gf / in to 30 gf / in or less measured at a peel angle of 180 deg. And a peel rate of 0.3 m / min. The method according to claim 1,
Wherein the non-silicone-based pressure-sensitive adhesive layer has a wetting time of 1 sec to 10 sec. The method according to claim 1,
Wherein the release layer comprises silicon or fluorine. The method according to claim 1,
Wherein the release layer has a thickness of 10 nm to 500 nm. The method according to claim 1,
The protective film may be polyethylene terephthalate; Polytetrafluoroethylene; Polyethylene; Polypropylene; Polybutene; Polybutadiene; Vinyl chloride copolymer; Polyurethane; Ethylene-vinyl acetate; Ethylene-propylene copolymer; Ethylene-ethyl acrylate copolymer; Ethylene-methyl acrylate copolymer; Polyimide; nylon; Styrene resin or elastomer; Polyolefin resins or elastomers; Other elastomers; Polyoxyalkylene resins or elastomers; Polyester-based resins or elastomers; Polyvinyl chloride resins or elastomers; Polycarbonate resin or elastomer; Polyphenylene sulfide type resin or elastomer; Mixtures of hydrocarbons; Polyamide based resins or elastomers; Acrylate resins or elastomers; Epoxy resin or elastomer; Silicone resin or elastomer; And a liquid crystal polymer. The method according to claim 1,
Wherein the thickness of the protective film is 25 占 퐉 to 150 占 퐉. The method according to claim 1,
Wherein the silicone based or non-silicone based pressure sensitive adhesive layer has a peeling electrification voltage of 1 kV or less measured at an applied pressure of 10 kV, a temperature of 23 DEG C and a relative humidity of 50%. Based pressure sensitive adhesive layer or a protective layer comprising a first antistatic layer on one surface of the base film and a protective film comprising a first antistatic layer and a second and a third antistatic layer on both surfaces of the protective film, And a releasing layer interposed between the adhesive layer and the adhesive layer. 21. The method of claim 20,
Based pressure-sensitive adhesive layer on a surface of the substrate layer where the first antistatic layer is absent, and attaching the base layer and the protective layer via the silicone-based pressure-sensitive adhesive layer. 21. The method of claim 20,
Based pressure-sensitive adhesive layer on the surface of the substrate layer where the first antistatic layer does not exist, and after forming a release layer on the surface of the protective layer where the protective film of the second antistatic layer does not exist, And attaching the substrate layer and the protective layer via the pressure-sensitive adhesive layer and the release layer. A method for protecting a surface of a barrier film comprising the step of adhering a release layer and a silicone-based or non-silicone-based pressure-sensitive adhesive layer to a barrier film in the optical film of claim 1. 24. The method of claim 23,
Wherein the barrier film comprises at least one inorganic layer, and the silicon-based or non-silicon-based pressure-sensitive adhesive layer is directly attached to the inorganic layer. A step of attaching a base layer and a silicone-based or non-silicone-based pressure-sensitive adhesive layer peeled off from the optical film of claim 1 onto the encapsulant layer of an organic light-emitting device including a back plate, a plastic substrate, an organic light emitting diode, Wherein the organic electroluminescent device is a light emitting device. 26. The method of claim 25,
A silicone-based or non-silicone-based pressure-sensitive adhesive layer is directly attached on an encapsulating material layer to protect the surface of the encapsulating material layer. 26. The method of claim 25,
Wherein the sealing material layer comprises a first inorganic material layer, a polymer layer, and a second inorganic material layer in this order. 28. The method of claim 27,
Further comprising the step of peeling the substrate layer and the silicon-based or non-silicon-based pressure-sensitive adhesive layer from the sealing material layer, and forming a polarizing plate on the sealing material layer. 29. The method of claim 28,
And forming a touch screen panel and a cover window on the polarizing plate.

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