KR20060039862A - Adaptable processing element for a processing system and a method of making the same - Google Patents

Abstract

An adaptable processing element (50,150- 156) having multiple configurations is provided for use in a processing system. The processing element comprises a primary component (182, 200, 202, 230) and at least one detachable component (184, 208, 232). The detachable component can be retained for one configuration and removed for another configuration. The detachable component may include a punch- out or knock-out (210, 214, 216) located, for example on its right-hand side or its left-hand side in order to permit access of a gas supply line to a processing chamber for either a right-hand orientation or a left- hand orientation, respectively. Additionally, for example, the detachable component can be retained or removed to permit flexible use with different size processing chambers. A method of making the processing element having these components is also provided. The method may provide a roughening of one or more exposed surfaces on the processing element to improve the adhesion of materials on these surfaces during processing. The roughening procedure may comprise belt sanding the one or more exposed surfaces to produce surface roughness. The roughness may, for example, be about or in excess of Ra=250 mil.

Description

ADAPTABLE PROCESSING ELEMENT FOR A PROCESSING SYSTEM AND A METHOD OF MAKING THE SAME

The present invention relates to processing elements for vacuum processing machines such as semiconductor wafer processing machines, in particular processing elements such as protective chamber shields which protect the inner surface of the processing chamber of such machines from deposits during processing. More specifically, the present invention relates to the surface treatment of such treatment elements for improved film adhesion during treatment.

In the semiconductor industry, the manufacture of integrated circuits (ICs) typically employs plasma to create and assist surface compounds in the plasma reactors needed to remove material from and deposit material on the substrate. For example, a plasma may be a physical vapor deposition method (PVD) that sputters material from a target and deposits sputtered adsorption atoms onto a substrate, a chemical vapor deposition method (CVD) or a substrate that produces a chemical component suitable for depositing on the substrate. It can be used in a dry plasma etching method to produce a chemical component suitable for removing a specific material from the surface of the.

In general, during plasma processing, such as in the processes described above, excessive adsorption atoms sputtered in PVD systems, excessive deposition compounds or excessive etching compounds in CVD systems and / or residues in etching systems are deposited on the process system surface. Can accumulate between processes. Thus, such systems generally have a protective element or liner that protects the underside of more expensive processing components and that can be periodically replaced with a new protective element that has been cleaned or regenerated without deposits. Typically, the frequency of replacement of the protective element is determined by the process type and the physical properties of the material or film that accumulate on the exposed surfaces of the protective element. Therefore, it is absolutely further necessary to provide a protection element at low cost. In addition, it is absolutely necessary to provide a surface that easily contacts the processing environment with excessive material adhesion, and to timely reduce contaminants of a later process such as, for example, particle detachment of the surface, to prolong the replacement cycle of the protective element. .

In addition, it is not uncommon to encounter gradual changes in the processing system configuration (ie, changes in size of processing chambers, pumping systems, etc.) over the lifetime of the processing system. In general, the continuous gradual change of the processing system as an article of manufacture required a list of protective elements, each element or set of elements specific to a particular configuration. Thus, it is also absolutely necessary to provide a low cost replaceable protection element with sufficient flexibility for use in a multi-form processing system.

It is an object of the present invention to provide a low cost element used to protect the inner surface of a vacuum processing chamber used in a semiconductor wafer processing process and a low cost method of manufacturing the element. It is a particular object to provide a chamber shield that protects the surface of the processing chamber and the mechanical components in the chamber from deposits during processing, and a method of manufacturing the chamber shield.

A more particular object of the present invention is to provide such elements with surface properties that inhibit the process carried out in the chamber and the generation of particles that contaminate the substrate being treated, for example by preventing the deposition of deposits accumulating on these elements. .

Another object of the present invention is to provide elements of a type suitable for different types and applications of different machines, so that elements of different sizes or shapes do not need to be manufactured and there is no need to make a list for each such machine type or application. .

The present invention provides a convertible treatment element for use in a treatment system and a method of making the same.

In particular, certain embodiments of the present invention provide processing elements, in particular implemented as chamber shields and chamber shield assemblies, for use in processing systems having two or more different forms or applications. Such a processing element may comprise a primary component and a detachable component coupled to the primary component, wherein the processing element is of the first type of processing system when the detachable component is retained within the primary component. And the processing element is configured for use in a second type of processing system when the detachable component is removed. In the illustrated embodiment, a chamber shield is provided having components that can be removed from the components to make the chamber shield suitable for different types of machines.

In addition, according to certain embodiments of the present invention, a treatment kit for use in a treatment system is provided. The processing kit includes a processing chamber having an upper chamber portion and a lower chamber portion, a target assembly coupled to the processing system, a substrate holder supporting a substrate coupled to the processing chamber, a pumping system, and a pumping system to the processing chamber. It is useful for treatment systems that include pumping ducts. In the illustrated embodiment, the processing kit includes a door shield coupled to the upper chamber portion of the processing chamber and is configured to have a detachable ring. The detachable ring is retained to facilitate the use of the door shield in the form of the first target assembly and is removed to facilitate the use of the door shield in the form of the second target assembly. Similarly, it may be coupled to the lower chamber portion of the processing chamber and configured to have a removable first gas injection aperture coupled to the right side of the pod shield and a removable second gas injection aperture coupled to the left side of the pod shield. Ford shields are provided. The detachable first gas jet perforation and the detachable second gas jet perforation are removed to facilitate the use of the pod shield in the left orientation of the processing system. Alternatively, no perforations are removed if there is no gas inlet ring in the machine. Similarly, a pumping duct shield is provided that is coupled to the pumping duct and configured to have a detachable shield extension. The detachable shield extension is maintained to facilitate the use of the pumping duct shield in the pumping duct of the first size and is removed to facilitate the use of the pumping duct shield in the pumping duct of the second size.

Also provided is a method of making a processing element for use in a processing system. The method includes manufacturing the aforementioned processing element by constructing a stamped or laser cut aperture, or other type of weakened member, in the sheet metal shield to facilitate removal of the removable component from the primary component.

Also provided is a method for using a processing element in a processing system having two or more forms described above. The method includes providing a processing element as described above and using the processing element by maintaining the removable element for use in some form of processing system and removing the removable element for use in another form of processing system. The method includes determining whether a processing element is for use with a first type of processing system and whether the processing element is for use with a second type of processing system and using the processing element with a first type of processing system. Retaining the detachable component to facilitate and removing the detachable component to facilitate the use of the processing element in a second type of processing system.

In addition, a method of manufacturing a processing element for use in a processing system having one or more surfaces exposed to a process in the processing system during processing, by belt polishing one or more surfaces of the processing element to promote adhesion of the material during processing. Is provided.

Also provided is a method of treating a substrate in the processing system by providing one or more processing elements to the processing system to protect the processing system during the process and to protect the process and the substrate from contaminants. In a preferred embodiment, one or more processing elements are provided in which one or more surfaces exposed to the process are modified by belt polishing. The process includes placing a substrate in a processing system having a belt polished processing element and exposing the substrate to the process.

A processing element for use in a processing system is disclosed that has one or more surfaces exposed to the process in the processing system and modified by belt polishing during the process. In the embodiment disclosed herein, the processing element is a shield that protects the inner surface of a wafer processing machine, in particular a deposition and etching machine for semiconductor processing.

In particular an embodiment of a method of manufacturing a chamber shield element is provided. Such particular method preferably comprises the manufacture of a shield from a sheet metal, such as a spun metal, and is made of a ring having a lip region and a flange region which are roughened according to the invention and formed by spinning an integral material sheet from a metal sheet. It may include a shield to be.

These and other objects and advantages of the present invention will be more readily apparent from the detailed description of the drawings.

1 is a schematic diagram of a processing system according to an embodiment of the present invention;

2A is a schematic side view of a processing system according to another embodiment of the present invention.

FIG. 2B is a schematic plan view of the processing system shown in FIG. 2A;

3A is an assembly view of a processing kit coupled to the upper chamber portion of the processing system shown in FIGS. 2A and 2B.

FIG. 3B is a further assembly view of the processing kit coupled to the lower chamber portion of the processing system shown in FIGS. 2A and 2B.

4A is a plan view of a door shield according to an embodiment of the present invention.

4B is a side view of a door shield in accordance with an embodiment of the present invention.

4C is an exploded top view of the door shield shown in FIG. 4A.

4D is another inflated plan view of the door shield shown in FIG. 4A.

4E is another expanded plan view of the door shield shown in FIG. 4A.

5A is a top view of a pod shield in accordance with an embodiment of the present invention.

5B is a side view of a pod shield in accordance with an embodiment of the present invention.

5C is an exploded top view of the pod shield shown in FIG. 5A.

FIG. 5D is another inflated plan view of the pod shield shown in FIG. 5A. FIG.

5E is another expanded plan view of the pod shield shown in FIG. 5A.

6A is a plan view of a left gas injection ring in accordance with an embodiment of the present invention.

6B is a side view of the right gas injection ring in accordance with an embodiment of the present invention.

6C is a plan view of a right gas injection ring in accordance with an embodiment of the present invention.

6D is a side view of the right gas injection ring in accordance with an embodiment of the present invention.

7A is a side view of a pumped duct shield in accordance with an embodiment of the present invention.

7B is a plan view of a pumping duct shield in accordance with an embodiment of the present invention.

7C is a plan view of a pumping duct shield according to another embodiment of the present invention.

8 illustrates a surface treatment pattern of a treatment element according to an embodiment of the invention.

9 shows a method of manufacturing a processing element according to an embodiment of the invention.

10A illustrates a method of making a processing element in accordance with an embodiment of the present invention.

10B illustrates a method of making a processing element according to another embodiment of the present invention.

11 illustrates a method of mounting a processing element in a processing system in accordance with another embodiment of the present invention.

12A is a top view of a dark space shield in accordance with an embodiment of the present invention.

12B is a cross-sectional view of the dark space shield shown in FIG. 12A.

FIG. 12C is an enlarged cross-sectional view of the dark space shield shown in FIG. 12B. FIG.

13A is a top view of a dark space shield in accordance with another embodiment of the present invention.

FIG. 13B is a cross-sectional view of the dark space shield shown in FIG. 13A.

FIG. 13C is an enlarged cross-sectional view of the dark space shield shown in FIG. 13B.

14A is a plan view of a ring shield in accordance with an embodiment of the present invention.

14B is a cross-sectional view of the ring shield shown in FIG. 13A.

According to an embodiment of the invention, the processing system 15 shown in FIG. 1 is coupled to the processing chamber 16, the substrate holder 20 supporting the substrate 25, and the pumping system 45. The pumping duct 40 which changes the pressure of the process area | region 30 in 16 is provided. For example, the processing chamber 16 may facilitate processing of the substrate 25 at elevated pressure, atmospheric pressure, or reduced (vacuum) pressure. Also, for example, the processing chamber 16 may facilitate the formation of a processing plasma in the processing region 30 adjacent to the substrate 25. Processing system 15 may be configured to process a variety of substrates (ie, 100 mm, 200 mm, 300 mm or more substrates).

Preferably, treatment system 15 includes a deposition system, such as a physical vapor deposition (PVD) system. In another embodiment, processing system 15 includes a chemical vapor deposition (CVD) system. In yet another embodiment, the processing system 15 includes a plasma chemical vapor deposition (PECVD) system. Alternatively, the processing system 15 includes an etching system.

Referring to FIG. 1, the processing system 15 further includes one or more processing elements 50 coupled to the processing chamber 16 and configured to protect one or more precious surfaces of the processing chamber 16. In addition, the one or more processing elements 50 have one or more exposed surfaces 70 that are exposed to or in contact with the processing environment of the processing region 30. The one or more treatment elements 50 constitute a treatment kit, for example, which may be replaced in whole or in part periodically. One or more processing elements 50 may be made of various materials, including metals such as aluminum, stainless steel, and nonmetals such as ceramics (eg, alumina, quartz, silicon carbide, etc.). Thereafter, one or more exposed surfaces 70 of one or more processing elements 50 are treated to increase surface roughness to improve adhesion of the material during processing. In one embodiment, the one or more exposed surfaces 70 are roughened using a belt polishing apparatus, for example, with an average roughness exceeding Ra = 250 mil (ie 6.3 microns). The belt polishing method can be carried out before the spinning processing of the sheet metal forming the shield, for example, by forming grooves in at least two directions so that the grooves form cross patterns.

The use of belt polishing to roughen the surface to improve adhesion results in a significant reduction in manufacturing costs (more than 50%) compared to conventional techniques such as grit blasting. For example, prior to assembly, the sheet metal may be drawn through the belt polishing apparatus for the first pass and then rotated 90 degrees through the belt polishing device for the second pass. In doing so, a mesh pattern can be formed. The belt polishing apparatus may have, for example, a polishing surface of 40 grit, 50-60 grit or 80-100 grit. The manufacture of the processing element 50 from the sheet metal allows the belt polishing method to be used, so that the belt polishing process can be applied when the sheet metal is flat before it is formed into the shape required for the shield. In the case of conventional machined shields, a more expensive roughness process had to be used.

According to another embodiment of the present invention, FIGS. 2A and 2B show a processing chamber 110, a substrate holder 120 supporting a substrate 125, a sputter target assembly 135, and a pumping system 145, respectively. Is a side view and a plan view of a physical vapor deposition (PVD) processing system 101 having a pumping duct 140 coupled to and changing the pressure of the processing region 130 in the processing chamber 110. For example, processing chamber 110 may facilitate processing of substrate 125 at reduced (vacuum) pressure. Furthermore, the processing chamber 110 may facilitate the formation of a processing plasma in the processing region 130 adjacent to the substrate 125 and the sputter target assembly 135. The treatment plasma is configured to interact with the sputter target and chemicals such as rare gases (eg, argon), such as argon, which introduce the sputtered adsorbed atoms onto the substrate 125 through the physical ion bombardment of the sputter target to deposit onto the substrate 125. It may be formed of inert species. For example, the sputter target assembly may have a copper target to which an electrical bias (direct current, DC; alternating current, AC or RF) is applied. The sputter target assembly 135 may or may not have further magnet systems.

2A and 2B, the processing system 101 further includes one or more processing elements 150 coupled to the processing chamber 110 and configured to protect one or more precious surfaces of the processing chamber 110. In addition, the one or more processing elements 150 have one or more exposed surfaces 170 that are exposed to or in contact with the processing environment of the processing region 130. One or more processing elements 150 may constitute, for example, a treatment kit, which may be replaced in whole or in part periodically.

For example, the processing chamber 110 may include a lower chamber portion 112 (or pod) and an upper chamber portion 114 (or pod door). The upper chamber portion 114 may be coupled to the lower chamber portion 112 using, for example, a hinge (not shown), and may serve as a chamber door to open the processing chamber 110 and access therein. have. 3A and 3B disclose a processing element in the form of a chamber shield assembly of the type configured for a processing device of the type disclosed in US Pat. No. 4,915,564. Prior art shields and other shields for this processing device are described in detail in US patent application Ser. No. 10 / 349,661, filed Jan. 23, 2003, which is expressly incorporated herein by reference. As shown in FIG. 3A, the treatment kit 151 may have a treatment element coupled to the upper chamber portion 114, which may include a door shield 152, an adapter shield 152A, and And a dark space shield 152B. The dark space shield 152B and the adapter shield 152A are configured to fit a sputtering cathode adapter that supports the cathode assembly at the pod door. The construction of such adapters and shields is discussed in detail in US patent application Ser. No. 10 / 438,304, which is expressly incorporated herein by reference. Also, referring to FIG. 3B, the treatment kit 151 may further include a treatment element coupled to the lower chamber portion 112, wherein the treatment kit 151 includes a pod shield 154, an optional gas injection ring. 155, gas ring shield 155A, ring shield 155B, substrate holder shield 155C, plenum shield 155D, (optional) heater shield 155E and pumping duct shield 156. . Each processing element listed above is replaceable and functions to protect the valuable surface 160 of the processing chamber 110.

4A and 4B show top and side views, respectively, of the door shield 152 coupled to the upper chamber portion 114. The door shield 152 may have one or more access mains 180 to allow access to a measurement tool, such as a pressure sensing device, to the processing region 130 in the processing chamber 110. For example, each access main part may have a cluster of three through holes, and the measuring device may be located behind the center of the cluster to prevent excessive deposition of processing material onto the measuring device.

In addition, door shield 152 may be manufactured to accommodate different sizes for targets received within target assembly 135. As shown in FIG. 4A, the door shield 152 has a primary component 182 suitable for the first target size and a detachable component 184 suitable for the second size. Primary component 182 is part of the same metal sheet on which detachable component 184 is part. Primary component 182 includes separation pieces 182a, 182b, 182c when detachable component 184 is removed. However, the separation pieces 182a, 182b, and 182c maintain their spatial relationship when mounted in the chamber because each separation piece is separably fixed to the structure of the chamber. Once the detachable component 184 is removed, the primary component 182 (hereinafter collectively referred to as three separate pieces 182a, 182b, 182c) is defined by an upper chamber portion (10) to accommodate a 12 inch diameter target. Upper component 114 to accommodate a 10 inch diameter target with detachable component 184, unless the detachable component 184 is removed. Can be coupled to. The door shield 152 includes a first set of mounting main parts 186 used for the first target size to couple the door shield 152 to the upper chamber portion 114, and the door shield 152 to the upper chamber portion ( A second set of mounting mains 188 used for the second target size to couple to 114 and a third set of common to all target sizes to couple the door shield 152 to the upper chamber portion 114. It further includes a mounting main portion 190. Each mounting main portion 186, 188, 190 passes through a fastener such as a bolt, for example, to secure the door shield 152 to the processing chamber 110 when receiving the fastener in the tapped main portion.

4C is an enlarged view of door shield 152 having a detachable component, and FIGS. 4D and 4E are enlarged views of coupling between detachable component 184 and primary component 182. As shown in FIGS. 4D and 4E, a narrow cutout 195 may be made in the door shield 152 leaving one or more attachment major portions 194, so that the component is separable from the primary component 182. Contoured 184, the detachable component 184 has a detachable ring. The narrow cutout 195 can be achieved using a laser cutting system, for example, and the width of the cutout can be, for example, about 10 to 80 mils (eg, 30 mils). In addition, the length of one or more attachment principals may be, for example, about 10 to 160 mils (eg, 60 mils). The microscopic amount holding one or more attachment major portions 194 can simplify the separation of the detachable component 184 from the primary component 182 (eg, stiffening and breaking after bending two members by hand). . Thus, a single processing element can be manufactured while providing flexibility for use with targets of different sizes.

5A and 5B show side and top views, respectively, of the pod shield 154 coupled to the lower chamber portion 112. Pod shield 154 may be manufactured, for example, from bottom 200 and wall 112, which bottom 200 is coupled to wall 202 using a plurality of attachment elements 204. For example, the attachment element 204 may have a tab for welding the bottom 200 to the wall 202. The pod shield 154 also includes a plurality of mounting mains 206 for coupling the pod shield 154 to the lower chamber portion 112 of the processing chamber 110. Each mounting main portion 206 may secure the pod shield 154 to the processing chamber 110 upon receipt of the fastener in the tapped main portion, for example, through a fastener such as a bolt.

Referring again to FIGS. 5A and 5B, the pod shield 154 further includes one or more separable components 208 coupled to the primary component having the bottom 200 and the wall 202. For example, the one or more separable components 208 may have a detachable gas injection aperture 210 disposed opposite the pod shield 154. The detachable gas injection perforation is either a right side system into which the processing gas enters the processing region 130 on the right side of the processing chamber 110 or a left side system into which the processing gas enters the processing region 130 on the left side of the processing chamber 110. The use of pod shield 154 may be facilitated. As shown in FIG. 5C, a narrow cutout 213 can be made in the wall 202 of the processing element 154, leaving one or more attachment major portions 212, such that the wall 202 and the bottom 200 can be formed. And a primary component having a cross-section, and a detachable gas injection perforation 210. The narrow cutout 213 may be achieved using a laser cutting system, for example, and the width of the cutout may be, for example, about 10 to 80 mils (eg, 30 mils). In addition, the length of one or more attachment principals may be, for example, about 10 to 160 mils (eg, 60 mils). The minute amount holding one or more attachment major portions 212 may simplify the separation of the gas injection apertures 210 that are separable from the primary component. Thus, if desired, a single processing element can be manufactured while providing flexibility for use in different processing chamber orientations, such as gas injection orientations.

Also, for example, the one or more separable components 208 may include optional gas shown in FIGS. 6A and 6B (top and side views of the left gas injection ring, respectively) and FIGS. 6C and 6D (side and top views of the right gas injection ring, respectively). A detachable gap aperture 214 and a removable gas injection line gap aperture 216 may be provided to receive the injection ring 240. For example, optional gas injection rings 240, 240 ′ have distribution rings 241, 241 ′, gas inlets 242, 242 ′ and a plurality of mounting structures 244, 244 ′. As shown in FIG. 5D, a narrow cutout 219 may be made within the bottom 200 of the pod shield 154 leaving one or more attachment major portions 218, such that the wall 202 and the bottom portion ( A primary component having 200 and a removable gap aperture 214 are contoured. Once removed, the detachable gap perforations can provide gaps for the plurality of mounting structures 244 that are used to secure the gas injection rings 240, 240 'to the substrate holder shield 155c. Furthermore, as shown in FIG. 5E, a narrow cutout 221 may be made in the bottom 200 of the pod shield 154 leaving one or more attachment major portions 220, such that the wall 202 and the bottom are formed. The primary component with section 200 and the removable gas injection line gap aperture 216 are contoured. The detachable gas injection line gap aperture 216, once removed, is a flexible gas line (not shown) for coupling a gas supply (not shown) to the gas inlets 242, 242 'of the gas injection rings 240, 240'. Gap may be provided). The narrow cutouts 219, 221 can be achieved, for example, using a laser cutting system, and the width of the cutout can be, for example, about 10 to 80 mils (eg, 30 mils). In addition, the length of one or more attachment principals may be, for example, about 10 to 160 mils (eg, 60 mils). The minute amount holding one or more attachment major portions 212 can simplify separation of the detachable gap aperture 214 and the detachable gas injection line gap aperture 216 from the primary component. Thus, a single treatment element can be manufactured while providing flexibility for use in different optional gas injection ring orientations.

7A is a side view of pumping duct shield 156 coupled to pumping duct 140 of processing system 110. Pumping duct shield 156 has a primary component 230 and a detachable component 232 coupled to the primary component. For example, as shown in FIG. 7A, the pumping duct shield 156 may be fitted into two different pumping ducts of different sizes (ie, pumps of different diameters). FIG. 7B shows a form for the pumping duct of the first size, with the detachable component 232 not removed. FIG. 7C shows a form for a pumping duct of a second size, with detachable component 232 removed. In addition, the pumping duct shield 156 may be curved radially outward so that each tab retains the pumping duct shield 156 in the pumping duct 140 when the pumping duct shield 156 is fitted in the pumping duct 140. One or more tabs 236 may optionally be provided. As shown in FIG. 7A, a narrow cutout may be made in the pumping duct shield 156 leaving one or more attachment major portions 234, thereby delineating the primary component 230 from the detachable component 232. And the detachable component 232 has a detachable shield extension. Narrow cuts can be achieved, for example, using a laser cutting system, and the width of the cuts can be, for example, about 10 to 80 mils (eg, 30 mils). In addition, the length of one or more attachment principals may be, for example, about 10 to 160 mils (eg, 60 mils). The minute amount holding one or more attachment major portions 234 can simplify the separation of separable components from the primary components. Thus, a single treatment element can be manufactured while providing flexibility for use in pumping ducts of different sizes.

One or more processing elements 152, 154, 156 can be made from a variety of materials, including metals such as aluminum. As noted above, one or more exposed surfaces on one or more processing elements 150 (eg, 152, 154, 156) are treated to increase surface roughness to improve adhesion of the material. In one embodiment, the one or more exposed surfaces 170 are roughened using a belt polishing apparatus, for example, with roughness in excess of Ra = 250 mil (ie, 6.3 microns). Also, for example, the roughening of one or more exposed surfaces can be applied to form the intersecting pattern 250 shown in FIG. 8. For example, prior to assembly, the sheet metal may be drawn through the belt polishing apparatus for the first pass and then rotated 90 degrees through the belt polishing device for the second pass. In doing so, an intersecting pattern can be formed. The belt polishing apparatus may include, for example, 36 grits (silicon carbide) polishing surfaces. Alternatively, the belt polishing apparatus may have a polishing surface of 40 grit, 50-60 grit or 80-100 grit, for example.

9 shows a method of making a processing element for use in a processing system such as that shown in FIGS. 1, 2A and 2B. Flowchart 300 begins at 310 manufacturing a processing element. Processing elements may include, for example, chamber liners, deposition shields, instrument shields, baffle plates, and the like. Also, for example, the processing element may include a door shield shown in FIGS. 4A-4E, a pod shield shown in FIGS. 5A-5E, and a pumping duct shield shown in FIGS. 7A-7C. The processing element is formed from sheet metal or spun metal. For example, the manufacture of the processing element may further comprise at least one of machining, casting, grinding, forging and polishing. Each of the aforementioned processing elements can be manufactured according to the specifications defined in the machine drawing.

At 320, one or more surfaces of the processing elements to be exposed to the processing environment during processing are subjected to an average roughness Ra exceeding 250 mils (ie, 6.3 microns) using belt polishing. Belt polishing may further comprise, for example, roughening one or more exposed surfaces of the processing element having a cross-sectional pattern.

The manufacture of each processing element may further comprise one or more of providing surface anodization on one or more surfaces, providing a spray coating on one or more surfaces, or subjecting one or more surfaces to plasma electrolyte oxidation. have. For example, the spray coating may be Al ₂ O ₃ , Yttria (Y ₂ O ₃ ), Sc ₂ O ₃ , Sc ₂ F ₃ , YF ₃ , La ₂ O ₃ , CeO ₂ , Eu ₂ O ₃ and DyO ₃ It may include at least one of. Methods of anodizing aluminum components and coating spray coatings are well known to those skilled in the surface material treatment arts.

10A shows a method of making a processing element for use in a processing system such as that shown in FIGS. 1, 2A, and 2B. Flowchart 400 begins at 410 where a processing element is manufactured, the processing element having a primary component. At 420, at least one separable component is formed in the primary component. Processing elements may include, for example, chamber liners, deposition shields, instrument shields, baffle plates, duct liners, and the like. Also, for example, the processing element may include a door shield shown in FIGS. 4A-4E, a pod shield shown in FIGS. 5A-5E, and a pumping duct shield shown in FIGS. 7A-7C. The processing element is formed from sheet metal or spun metal. For example, the manufacture of the processing element may further comprise at least one of machining, casting, grinding, forging and polishing. Each of the aforementioned processing elements can be manufactured according to the specifications defined in the machine drawing.

The detachable component can be coupled to the primary component via one or more attachment principals. For example, the attachment major portion can be formed by providing a narrow cut obtained from the laser cutting system along a line or curve that outlines the separable component with the primary component. Each attachment major portion may be, for example, 10 to 80 mils (ie 30 mils) wide and 10 to 160 mils (ie 60 mils) long. Detachable components can be coupled to processing elements, such as door shields, for example, allowing the flexible use of door shields in target assemblies of various sizes. Also, for example, the detachable component may have perforations (knockouts) and may be coupled to processing elements, such as pod shields, such that pod shields with gas injection systems of different orientations (ie right to left systems). Can be used flexibly. Also, for example, the detachable component can be coupled to the pumping duct shield, allowing for flexible use of the pumping duct shield in pumping ducts of various sizes.

FIG. 10B shows another method of making a processing element for use in a processing system such as that shown in FIGS. 1, 2A, and 2B. Flowchart 430 begins at 410 for manufacturing a processing element, the processing element having a primary component, and forming at least one separable component in the primary component at 420. At 440, the manufacture of each processing element further comprises one or more of providing surface anodization on one or more surfaces, providing a spray coating on one or more surfaces, or subjecting one or more surfaces to plasma electrolyte oxidation. It may include. For example, the spray coating may be Al ₂ O ₃ , Yttria (Y ₂ O ₃ ), Sc ₂ O ₃ , Sc ₂ F ₃ , YF ₃ , La ₂ O ₃ , CeO ₂ , Eu ₂ O ₃ and DyO It may include at least one of _three . Methods of anodizing aluminum components and coating spray coatings are well known to those skilled in the surface material treatment arts.

11 shows a method of making a processing element for use in a processing system such as that shown in FIGS. 1, 2A and 2B. Flowchart 500 begins at 510 of manufacturing a processing element, wherein the processing element has a primary component and at least one separable component. Processing elements may include, for example, chamber liners, deposition shields, instrument shields, baffle plates, duct liners, and the like. Also, for example, the processing element may include a door shield shown in FIGS. 4A-4E, a pod shield shown in FIGS. 5A-5E, and a pumping duct shield shown in FIGS. 7A-7C.

At 520, it is determined to remove one or more of the at least one removable component. In the case of removing one or more of the at least one removable component, these components are removed and discarded at 530, and the processing element is installed in the processing chamber at 540. Otherwise, these components are installed in the processing chamber without removing one or more of the at least one removable component.

By way of example, the processing element is a door shield (see FIG. 4). If the processing system includes a sputter target of 10 inches in diameter, the removable components shown in FIGS. 4A-4E are not removed prior to installation. However, if the processing system includes a sputter target 12 inches in diameter, the removable components shown in FIGS. 4A-4E are removed prior to installation. As another example, the processing element is a pod shield (see FIG. 5A). If the processing system includes a gas injection system with a right orientation, the removable gas injection punching portion (see FIG. 5C) located on the right side of the pod shield is removed prior to installation. On the other hand, when the processing system comprises a gas injection system with a left orientation, the removable gas injection punching portion located on the left side of the pod shield is removed before installation. In addition, when employing an optional gas injection ring, the removable gap punching portion (see FIG. 5D) is removed prior to installation. In addition, in the case where the processing system includes a gas injection system having a right orientation, the gap perforations (see FIG. 5E) of the removable gas injection line are removed before installation. On the other hand, in the case where the treatment system includes a gas injection system with a left orientation, the gap perforation of the removable gas injection line (see FIG. 5E) is removed before installation. In another example, the processing element is a pumping duct shield. If the pumping duct shield is equipped with a smaller diameter pumping duct, the removable component is removed prior to installation. However, if the pumping duct shield is equipped with a larger diameter pumping duct, the removable component is not removed prior to installation.

Referring now to FIGS. 12A and 12B, a plan view and a cross-sectional view of dark space shield 152B is shown. Dark space shield 152B may be a member of a shield assembly coupled to the target assembly, the shield assembly configured to surround and protect a circumferential edge of a sputter target mounted within the target assembly. As shown in FIG. 3A, the shield assembly may further include, for example, an adapter shield 152A. Dark space shield 152B has a flange region 600 and a lip region 610 coupled to the region. As shown in FIG. 3A, the dark space shield 152B is coupled to the target assembly using a fastener as shown extending through the fastening hole 620 of the dark space shield 152B, and the sputter target (not shown). Is omitted). By enclosing the circumferential edge of the sputter target in a coupled state with the target assembly 135, a gap space is formed between the inner surface 625 of the lip region 610 of the dark space shield 152B and the outer edge of the target. . This space can be, for example, less than 1 mm to prevent the plasma from passing through the space and to corrode the peripheral edge of the sputter target. 12C shows an enlarged view of the lip region 610 and the inner surface 625.

In a variant, referring now to FIGS. 13A and 13B, a plan view and a cross-sectional view of the dark space shield 700 are shown. Dark space shield 700 may be a member of a shield assembly coupled to a target assembly, the shield assembly configured to surround and protect a circumferential edge of a sputter target mounted within the target assembly, thereby providing a conventional dark space shield and adapter. Incorporate all shields. Dark space shield 700 has a flange region 710, a lip region 720, and an adapter region 730 coupled thereto. Adapter area 730 performs the function of a separate adapter shield. The dark space shield 700 is coupled to the target assembly using a fastener as shown extending through the fastening hole 740 of the dark space shield 700, and is configured to surround the sputter target (not shown). have. By enclosing the circumferential edge of the sputter target in a coupled state with the target assembly 135, a gap space is formed between the inner surface 745 of the lip region 720 of the dark space shield 700 and the outer edge of the target. . This space can be, for example, less than 1 mm to prevent the plasma from passing through the space and to corrode the peripheral edge of the sputter target. 13C shows an enlarged view of the lip region 720 and the inner surface 745.

Referring now to FIGS. 14A and 14B, top and cross-sectional views of ring shield 155B are shown. The ring shield 155B may be a member of the shield assembly to protect the substrate holder. Ring shield 155B includes a flange region 630 and a lip region 640 coupled to the region. As shown in FIG. 3B, the ring shield 155B is coupled to the substrate holder shield 155C using a fastener as shown extending through the fastening hole 650, and the pod shield 154 and the substrate holder. It is configured to protect the shield 155C. In addition, the ring shield 155B may further include a gap notch 655 to engage the optional gas injection ring 155.

As shown in FIGS. 12A-12C, 13A-13C, 14A, and 14B, the dark space shield 152B and the ring shield 155B are made of spun metal. The spun metal may comprise aluminum for example. This manufacturing process can lead to cost reductions of 50% or more. Any of the dark space shields or ring shields described above can be manufactured for systems with a diameter of 200 mm, 300 mm or more. In addition, the method of manufacturing the dark space shield 152B and the ring shield 155B may include surface anodizing one or more surfaces, spray coating one or more surfaces, and plasma electrolyte oxidation of one or more surfaces. It may further include at least one of the. For example, the spray coating may be Al ₂ O ₃ , Yttria (Y ₂ O ₃ ), Sc ₂ O ₃ , Sc ₂ F ₃ , YF ₃ , La ₂ O ₃ , CeO ₂ , Eu ₂ O ₃ and DyO ₃ It may include at least one of. Methods of anodizing aluminum components and applying spray coatings are well known to those skilled in the art of surface material treatment.

Although only certain exemplary embodiments of the invention have been described in detail above, those skilled in the art will readily appreciate that many modifications to the exemplary embodiments are possible without materially departing from the novel teachings and advantages of the invention. All these modifications are intended to be included within the spirit of the invention.

Claims (65)

A processing element for use in any one of two or more forms of processing systems, The primary component, Detachable component coupled to the primary component Wherein the processing element is configured for use in a first type of processing system when the separable component is held by the primary component, wherein the processing element is configured to be removed when the detachable component is removed. A processing element configured for use with two types of processing systems. The detachable component of claim 1, wherein the detachable component is coupled to the primary component by one or more attachment principals, wherein the attachment principal defines the contour of the detachable component from the primary component except for the point of the attachment principal. Wherein the processing element is formed by cutting the processing element along a predetermined curve to form. The processing element of claim 2, wherein the cutting is performed using a laser cutting system. The processing element of claim 2, wherein the at least one attachment major portion has a predetermined width and length, the width is from 10 to 80 mils, and the length is from 10 to 160 mils. The processing element of claim 1, wherein the processing system comprises one or more of a physical vapor deposition system, a chemical vapor deposition system, and an etching system. 6. The processing system of claim 5, wherein the processing system comprises a physical vapor deposition system, the processing system having a top chamber portion and a bottom chamber portion, a target assembly coupled to the processing chamber, and coupled to the processing chamber. A substrate holder for supporting a substrate, a pumping system, and a pumping duct to couple the pumping system to a processing chamber. The method of claim 6, wherein the processing element comprises at least one of a door shield coupled to an upper chamber portion of the treatment chamber, a pod shield coupled to a lower chamber portion of the treatment chamber, and a pumping duct shield coupled to the pumping duct. And a processing element. 8. The detachable ring of claim 7 wherein the detachable component includes a detachable ring coupled to the door shield, the detachable ring being retained when using a door shield having a target assembly of a first size, the detachable ring Is removed when using a door shield having a target assembly of a second size. The processing element of claim 8, wherein the first size is a target assembly for a substrate diameter of less than 290 mm and the second size is a target assembly for a substrate diameter of at least 290 mm. 8. The method of claim 7, wherein the one or more separable components includes a detachable first gas jet perforation and a detachable second gas jet perforation detachably coupled to the pod shield using one or more attachment principals, Wherein the first gas injection perforation is coupled to the right side of the pod shield and the second gas injection perforator is coupled to the left side of the pod shield. 8. The system of claim 7, further comprising an optional gas injection ring, wherein the one or more separable components comprise one or more separable gap apertures providing a gap for mounting the optional gas injection ring in the processing system; A first detachable gas injection line gap perforator that provides a gap for the gas injection line in the right orientation of the processing system and a second detachable gas injection that provides a gap for the gas injection line in the left orientation of the processing system And a line gap aperture. 8. The method of claim 7, wherein the at least one separable component has a separable shield extension coupled to the pumping duct shield, wherein the detachable shield extension is adapted to use a pumping duct shield in the pump duct of the first type. And the detachable shield extension is removed to use a pumping duct shield for the pumping duct of the second type. The processing element of claim 1, further comprising a coating coated on at least one surface on the processing element. The processing element of claim 13, wherein the coating comprises at least one of surface anodization, spray coating, and plasma electrolyte oxidation coating. A processing kit for use in a processing system, the processing system comprising: a processing chamber having an upper chamber portion and a lower chamber portion, a target assembly coupled to the processing chamber, and a substrate holder supporting a substrate coupled to the processing chamber; A process kit comprising a pumping system and a pumping duct coupling the pumping system to a processing chamber, A door shield configured to be coupled to an upper chamber portion of the processing chamber, the door shield having a detachable ring, wherein the maintenance of the detachable ring facilitates use of the door shield in the form of a first target assembly and wherein the detachable ring The removal of the door shield facilitates use of the door shield in the form of a second target assembly; A pod shield configured to be coupled to a lower chamber portion of the processing chamber, using a detachable first gas injection punched portion coupled to the right side of the pod shield using an attachment major portion, and an attachment major portion to the left side of the pod shield; Configured to have a second detachable gas injection aperture, wherein the removal of the first detachable gas injection aperture facilitates use of the pod shield in the right orientation of the processing system, and the second detachable gas injection The removal of the perforations is to facilitate the use of the pod shield in the left orientation of the processing system; A pumping duct shield configured to be coupled to said pumping duct, said pumping duct shield having a detachable shield extension coupled to said pumping duct shield using a major portion, said retaining of said detachable shield extension being pumped to a pumping duct of a first size Pumping duct shield, which facilitates the use of the shield and the removal of the detachable shield extension facilitates the use of the pumping duct shield in a pumping duct of a second size. Treatment kit comprising a. The process kit of claim 15, further comprising an optional gas injection ring coupled to the process chamber. 17. The method of claim 16, wherein the pod shield has one or more separable gap apertures coupled to the pod shield using one or more attachment means, and the first detachable gas coupled to the pod shield using one or more attachment means. Further comprising a spray line gap aperture and a separable second gas injection line gap aperture coupled to the pod shield using the one or more attachment means, wherein the removal of the one or more detachable gap apertures Facilitate mounting of an optional gas injection ring to the processing chamber, and removal of the detachable first gas injection line gap aperture facilitates use in the right orientation of the optional gas injection ring, and the separation Possible removal of the second gas injection line gap perforation is to the left orientation of the optional gas injection ring Treatment kits to facilitate the use of the document. 16. The treatment kit of claim 15, wherein at least one of the door seal, pod shield and pumping duct shield further comprises a coating. 19. The treatment kit of claim 18, wherein the coating comprises at least one of surface anodization, spray coating, and plasma electrolyte oxidation coating. A method of making a processing element for use in a processing system, Manufacturing the processing element having a primary component and one or more separable components coupled to the primary component Wherein the one or more separable components are maintained to facilitate the use of the processing elements in the first type of processing system, wherein the one or more separable components permit the use of the processing elements in the second type of processing system. A method of making a processing element that can be removed to facilitate. 21. The method of claim 20, further comprising coating at least one surface of the treatment element. The method of claim 21, wherein the coating comprises applying at least one of surface anodization, spray coating, and plasma electrolyte oxidation coating. A method for using a processing element in a processing system having two or more forms, Manufacturing a processing element having a primary component and at least one separable component coupled to the primary component using attachment principals; Determining whether the processing element is used in a first type of processing system and whether the processing element is used in a second type of processing system; Maintaining the detachable component to facilitate use of the processing element in a first type of processing system; Removing the separable component to facilitate use of the processing element in a second type of processing system. Method of using a processing element comprising a. The method of claim 23, further comprising coating at least one surface of the treatment element. The method of claim 24, wherein the coating comprises applying at least one of surface anodization, spray coating, and plasma electrolyte oxidation coating. A door shield for use in a physical vapor deposition system, the physical vapor deposition system supporting a processing chamber having an upper chamber portion and a lower chamber portion, a target assembly coupled to the processing chamber, and a substrate coupled to the processing chamber. A door shield comprising a substrate holder, a pumping system, and a pumping duct for coupling the pumping system to a processing chamber. A primary component configured to couple to the upper chamber portion, wherein the primary component is substantially rectangular and includes a first curved end and a second curved end, the second curved end configured to surround the target assembly. Wow, A detachable component coupled to the primary component, wherein the detachable component is substantially circular and configured to couple to the primary component at the peripheral edge of the detachable component using one or more attachment principals. Wherein the door shield is configured for use in a target assembly of a first size when the door shield has the primary component and the separable component, the door shield being configured as a primary configuration. The door shield, when provided with an element, configured for use in a target assembly of a second size. 27. The door shield of claim 26, further comprising a coating applied to one or more surfaces of the door shield. The door shield of claim 27, wherein the coating comprises at least one of surface anodization, spray coating, and plasma electrolyte oxidation coating. 27. The door shield of claim 26, wherein the first size is a target assembly for a substrate diameter of less than 290 mm. 27. The door shield of claim 26, wherein the second size is a target assembly for a substrate diameter of at least 290 mm. A pod shield for use in a physical vapor deposition system, the physical vapor deposition system supporting a processing chamber having an upper chamber portion and a lower chamber portion, a target assembly coupled to the processing chamber, and a substrate coupled to the processing chamber. A pod shield having a substrate holder, a pumping system, and a pumping duct for coupling the pumping system to a processing chamber, A primary component configured to couple to the lower chamber portion, the primary component having a bottom portion and a wall portion coupled to the bottom portion, the first end of the primary component including a first opening configured to engage the pumping duct And the second end includes a second opening configured to engage the substrate holder; A first separable component coupled to the wall portion of the primary component using one or more attachment principals; A second separable component located opposite the first separable component and coupled to the wall of the primary component using one or more attachment principals; Wherein the pod shield is configured for use without a first gas injection configuration accessible to the first side of the pod shield, when the first detachable component is retained. When the first detachable component is removed, it is configured for use with a first gas injection configuration accessible to the first side of the pod shield, wherein the pod shield is retained when the second detachable component is retained. And without a second gas injection configuration accessible to the second side of the pod shield, wherein the pod shield has access to the second side of the pod shield when the second detachable component is removed. A pod shield that is configured for use with a second gas injection configuration. 32. The pod shield of claim 31 further comprising a coating applied to one or more surfaces of the pod shield. 33. The pod shield of claim 32, wherein the coating comprises at least one of surface anodization, spray coating, and plasma electrolyte oxidation coating. A pumping duct shield for use in a physical vapor deposition system, the physical vapor deposition system comprising a processing chamber having an upper chamber portion and a lower chamber portion, a target assembly coupled to the processing chamber, and a substrate coupled to the processing chamber. A pumping duct shield having a substrate holder for supporting, a pumping system, and a pumping duct for coupling the pumping system to a processing chamber, comprising: A nearly rectangular primary component, Nearly rectangular detachable component Wherein the detachable component is coupled to an end of the primary component using one or more attachment principals. 35. The pumped duct shield of claim 34, further comprising a coating applied to at least one surface of the pumped duct shield. 36. The pumped duct shield of claim 35, wherein the coating comprises at least one of surface anodization, spray coating, and plasma electrolyte oxidation coating. A method of making a treatment element having at least one surface used in a treatment system and exposed to a process in the treatment system during treatment, Processing the desired material to form it into the form of a processing element having at least one surface thereon; Belt polishing one or more surfaces to promote adhesion of material onto the one or more materials in the process Method of producing a processing element comprising a. The method of claim 37, wherein the belt polishing of the one or more surfaces is performed prior to processing the material in the form of one or more surfaces. 38. The method of claim 37, wherein the material is a sheet metal material and belt polishing of the one or more surfaces is performed prior to processing the sheet metal material in the form of a processing element. 38. The method of claim 37, wherein the belt polishing of one or more surfaces applied to the material comprises polishing a pattern comprising an intersecting shape. 38. The method of claim 37, wherein the processing element is a removable shield to protect the inner surface of the processing system from deposits in the process. 38. The method of claim 37, wherein the processing system comprises at least one of a physical vapor deposition system, a chemical vapor deposition system, and an etching system. 43. The processing system of claim 42, wherein the processing system comprises a physical vapor deposition system, the processing system coupled to the processing chamber, a target assembly coupled to the processing chamber, a processing chamber having an upper chamber portion and a lower chamber portion. A substrate holder for supporting a substrate, a pumping system, and a pumping duct for coupling the pumping system to a processing chamber. The method of claim 43, wherein the processing element is a removable shield that protects the inner surface of the processing system from deposits in the process. 45. The method of claim 44, wherein the processing element comprises at least one of a door shield coupled to an upper chamber portion of the treatment chamber, a pod shield coupled to a lower chamber portion of the treatment chamber, and a pumping duct shield coupled to the pumping duct. Method of producing a processing element comprising a. 38. The method of claim 37, further comprising coating at least one surface of the treatment element. 47. The method of claim 46, wherein the coating comprises coating at least one of surface anodization, spray coating, and plasma electrolyte oxidation coating. 38. The method of claim 37 wherein the belt polishing comprises applying a 36 grit polishing surface. 38. The sheet metal material of claim 37, wherein the processing comprises forming the sheet metal material to form the processing element in the form of a ring having an approximately flat annular flange area and a substantially cylindrical lip area inverted from the sheet metal material adjacent the inner diameter of the flange area. A method of making a processing element comprising spinning. A substrate processing method for processing a substrate in a processing system, Providing at least one processing element in the processing system to protect the processing system from a process in the processing system; Placing the substrate in a processing system; Exposing the substrate to the process Wherein the one or more processing elements comprise one or more surfaces exposed to the process, wherein at least one of the one or more surfaces is modified by belt polishing application. 50. The method of claim 49, wherein the belt polishing application comprises a predetermined pattern and the pattern comprises an intersecting shape. The method of claim 49, wherein the processing system comprises one or more of a physical vapor deposition system, a chemical vapor deposition system, and an etching system. The processing system of claim 51, wherein the processing system comprises a physical vapor deposition system, the processing system having a top chamber portion and a bottom chamber portion, a target assembly coupled to the processing chamber, and coupled to the processing chamber. A substrate holder for supporting a substrate, a pumping system, and a pumping duct for coupling the pumping system to a processing chamber. 53. The system of claim 52, wherein the processing element comprises at least one of a door shield coupled to an upper chamber portion of the treatment chamber, a pod shield coupled to a lower chamber portion of the treatment chamber, and a pumping duct shield coupled to the pumping duct. Substrate processing method comprising a. 50. The method of claim 49, further comprising coating at least one of the one or more surfaces of the processing element. 55. The method of claim 54, wherein the coating comprises coating at least one of surface anodization, spray coating, and plasma electrolyte oxidation coating. 50. The method of claim 49, wherein the belt polishing application comprises applying a 36 grit polishing surface. A processing chamber having an upper chamber portion and a lower chamber portion, a target assembly coupled to the processing chamber, a substrate holder supporting a substrate coupled to the processing chamber, a pumping system, and a pumping coupling the pumping system to the processing chamber. An improved treatment element for use in a treatment system having a duct, And at least one surface exposed to the process in the treatment system during the process, wherein at least one of the one or more surfaces is modified by belt polishing application. 58. The processing element of claim 57 wherein the belt polishing application comprises a predetermined pattern and the pattern comprises an intersecting shape. 59. The processing element of claim 57, wherein the processing system further comprises one or more of a physical vapor deposition system, a chemical vapor deposition system, and an etching system. 58. The system of claim 57, wherein the processing element comprises at least one of a door shield coupled to an upper chamber portion of the treatment chamber, a pod shield coupled to a lower chamber portion of the treatment chamber, and a pumping duct shield coupled to the pumping duct. And a processing element. 58. The processing element of claim 57 further comprising a coating on at least one of the one or more surfaces of the processing element. 62. The processing element of claim 61 wherein the coating comprises coating at least one of surface anodization, spray coating and plasma electrolyte oxidation coating. 58. The processing element of claim 57 wherein said belt polishing application comprises applying a 36 grit polishing surface. 58. The processing element of claim 57 wherein the processing element has a lip region and a ring having a flange region coupled to the lip region, wherein the processing element is made from spun metal.

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