JP2007525820A - Applicable processing member for processing system and method of manufacturing the same - Google Patents

Abstract

  The present invention provides adaptable processing members (50, 150-156) having various configurations for use in a processing system. The processing member includes a main member (182, 200, 202, 230) and at least one removable member (184, 208, 232). The removable member can be held attached in some configurations, and can be removed in other configurations. The removable member can have a punchout (210, 214, 216) located on the right side or located on the left side. Thereby, it is possible to adapt whether the gas supply line of the processing chamber is arranged on the right side or the left side. In addition, the removable member can be held or removed to accommodate various size processing chambers. A method of manufacturing such a processing member is also provided.

Description

  This application is a continuation of U.S. Patent Application No. 10 / 454,381 and U.S. Patent Application No. 10 / 454,747, both filed June 4, 2003. The contents of these documents are incorporated herein for reference.

  This application is related to currently pending US patent application Ser. No. 10 / 454,798, entitled “Method of Fabricating a Shield”.

  The present invention relates to a processing member for a vacuum processing apparatus such as, for example, a semiconductor wafer processing apparatus, and in particular, a protective chamber shield that protects the inner surface of the processing chamber of such apparatus from film deposits during processing. It is related with such a processing member. More particularly, the present invention relates to the surface treatment of such treated members so that film adhesion during processing can be improved.

  Plasma is typically used in the manufacture of integrated circuits (ICs) in the semiconductor industry. The use of plasma can create or assist in the surface chemistry necessary to deposit or remove material on the substrate in the plasma reactor. For example, by using plasma, physical vapor deposition (PVD) can be performed, that is, the material from the target can be sputtered and the sputtered atoms can be deposited on the substrate, or chemically. Chemical vapor deposition (CVD) can be performed, that is, chemical components suitable for film formation on a substrate can be formed, or dry plasma etching can be performed, that is, a specific material is removed from the surface of the substrate. It is possible to form chemical components suitable for the purpose.

  In general, during plasma processing, such as the process described above, excessive sputter atoms in the PVD system, excessive deposition material in the CVD system, excessive etching chemicals and / or etching residues in the etching system are A film-forming body can be formed on the surface, and it accumulates every time a process is performed. Accordingly, such systems generally include a protective member or liner. The protective member or liner protects the immediate surface of the more expensive processing member and can be periodically replaced with a clean, refurbished new protective member without deposits. Typically, the replacement frequency of the protective member is governed by the type of process and the nature of the material or film accumulated on the exposed surface of the protective member. Therefore, it is important to make the protective member a low-cost member. It is also important to provide a surface that is in contact with the processing environment that promotes excessive material deposition, and in some cases, reduces contamination in subsequent processes such as particle stripping from the surface. It is also important to provide a surface. Thereby, the replacement interval of a protection member can be lengthened.

In addition, it is not uncommon to encounter the evolution of processing system configurations (ie, changes in processing chamber size, pumping systems, etc.) over the life of the processing system. Typically, the continuous evolution of processing systems as manufacturing devices necessitates the holding of various protective members according to specific configurations as inventory. Accordingly, it is also important to provide a low cost replaceable protective member that is flexible enough for use in processing systems that can take a variety of configurations.
US patent application Ser. No. 10 / 454,381 US patent application Ser. No. 10 / 454,747 US patent application Ser. No. 10 / 454,798

  An object of the present invention is to provide a low-cost member that can be used to protect the inner surface of a vacuum processing chamber used in semiconductor wafer processing, and to provide a method for manufacturing such a member. It is to be. A particular object of the present invention is to protect the surface and components from being deposited on the surface of the processing chamber during processing and from depositing on various components of the apparatus. It is to provide such a chamber shield and to provide a method for manufacturing such a chamber shield.

  A more specific object of the present invention is to provide such a member with a treatment or treatment to be performed in the chamber by a technique such as preventing the film-deposited body accumulated on such a member from being peeled off. It is to impart surface properties that are resistant to the generation of particles that can contaminate the substrate.

  Another object of the present invention is to provide a member that can be adapted to various device configurations and applications, thereby allowing members of various sizes and shapes for each device configuration and application. As well as the need for inventory can be eliminated.

  The present invention provides an adaptable processing member for use in a processing system and provides a method for its manufacture.

  In particular, in certain embodiments of the present invention, a process, particularly embodied as a chamber shield or chamber shield assembly, for use in a processing system having two or more different arrangements or configurations. Providing a member. Such a processing member comprises a main member; and a detachable member coupled to the main member; the processing member holding the removable member against the main member, Used in the first configuration of the processing system, and used in the second configuration of the processing system with the removable member removed. The illustrated embodiment includes a detachable component, thereby providing flexibility for variously configured devices.

  In addition, in certain embodiments of the present invention, a process kit is provided for use in a processing system. The process kit is effective for a processing system and is connected to a processing chamber having an upper chamber portion and a lower chamber portion, a target assembly connected to the processing chamber, and a processing chamber. And a substrate holder for supporting the substrate, a pumping system, and a pumping duct for connecting the pumping system to the processing chamber. In the illustrated embodiment, the process kit is a door shield connected to the upper portion of the processing chamber, and the door shield includes a detachable ring. The removable ring remains held in the first configuration of the target assembly and is removed in the second configuration of the target assembly. Similarly, a pod shield is provided. The pod shield can be coupled to the lower chamber portion of the processing chamber, and includes a first removable gas injection punchout coupled to the right side of the pod shield and a first coupled to the left side of the pod shield. 2 detachable gas injection punch-out. In the case of a processing system that introduces gas from the right side, the first removable gas injection punch-out is removed, and in the case of a processing system that introduces gas from the left side, the second removable gas injection punch-out. Is removed. Alternatively, if there is no gas inlet ring in the device, none of the punchouts are removed. Similarly, a pumping duct shield is connected to the pumping duct and includes a removable shield extension. The removable shield extension is left attached when the pumping duct is of the first size, and is removed when the pumping duct is of the second size.

  In addition, a method for manufacturing a processing member for use in a processing system is provided. In this method, a sheet-like metal shield is formed as having a notch formed by stamping, having a notch formed by laser cutting, or having another type of weakening member. Thus, the processing member described above is formed. Here, such a notch and the weakening member act so as to facilitate the removal of the detachable member from the main member.

  In addition, a method of using a processing member in a processing system having two or more configurations as described above is provided. In this method, the processing member is manufactured as described above, with the removable member being retained in some configurations of the processing system, and the removable member being removed in other configurations of the processing system. In this method, it is determined whether the processing member is used in the first configuration of the processing system or the processing member is used in the second configuration of the processing system; when the processing system is in the first configuration The processing member is used while holding the removable member; when the processing system is in the second configuration, the processing member is used with the removable member removed.

  Additionally, a method for manufacturing a processing member for use in a processing system and having one or more exposed surfaces that are exposed to processing in the processing system during processing, the processing method comprising: A method is provided such that the exposed surface is belt sanded so that material adhesion on the exposed surface at times can be increased.

  In addition, a method for processing a substrate in a processing system, wherein one or more processing members are provided in the processing system to protect the processing system from processing in the processing system, thereby A method is provided that can protect the process and the substrate from contamination. In a preferred embodiment, the one or more processing members are provided with at least one exposed surface that is exposed to the process, and a belt sanding process is applied to the exposed surface. In this method, a substrate is placed in a processing system in which a processing member that has undergone belt sanding processing is mounted, and the substrate is processed.

  A processing member used in the processing system is provided with one or more exposed surfaces that are exposed to processing during processing in the processing system, the exposed surfaces having undergone a belt sanding process. It is said. In the embodiment described here, the processing member is a shield, and particularly protects the inner surface of a wafer processing apparatus such as a film forming apparatus or an etching apparatus related to semiconductor processing.

  In particular, embodiments are provided that relate to a method for manufacturing a chamber shield member. In such a method, the shield is preferably formed from a sheet metal, such as a stretched metal. In the present invention, the shield formed of sheet metal can be roughened. The shield can be ring-shaped by stretching a single sheet of material and can have a lip region and a flange region.

  The above and other objects and advantages of the present invention will become apparent upon reading the following detailed description with reference to the accompanying drawings.

  FIG. 1 is a diagram schematically illustrating a processing system according to an embodiment of the present invention.

  FIG. 2A is a side view schematically illustrating a processing system according to another embodiment of the present invention.

  FIG. 2B is a plan view schematically showing the processing system of FIG. 2A.

  FIG. 3A is an exploded perspective view showing a process kit coupled to the chamber top in the processing system of FIGS. 2A and 2B.

  FIG. 3B is an exploded perspective view showing the process kit connected to the bottom of the chamber in the processing system of FIGS. 2A and 2B.

  FIG. 4A is a plan view illustrating a door shield according to an embodiment of the present invention.

  FIG. 4B is a side view illustrating a door shield according to an embodiment of the present invention.

  FIG. 4C is an enlarged plan view showing a part of the door shield of FIG. 4A.

  FIG. 4D is an enlarged plan view showing another part of the door shield of FIG. 4A.

  FIG. 4E is an enlarged plan view showing another part of the door shield of FIG. 4A.

  FIG. 5A is a plan view illustrating a pod shield according to an embodiment of the present invention.

  FIG. 5B is a side view of a pod shield according to one embodiment of the present invention.

  FIG. 5C is an enlarged plan view showing a part of the pod shield of FIG. 5A.

  5D is an enlarged plan view showing another portion of the pod shield of FIG. 5A.

  FIG. 5E is an enlarged plan view showing another portion of the pod shield of FIG. 5A.

  FIG. 6A is a plan view illustrating a left gas injection ring according to an embodiment of the present invention.

  FIG. 6B is a side view illustrating a left gas injection ring according to an embodiment of the present invention.

  FIG. 6C is a side view illustrating a right gas injection ring according to an embodiment of the present invention.

  FIG. 6D is a side view illustrating a right gas injection ring according to an embodiment of the present invention.

  FIG. 7A is a side view of a pumping duct shield according to one embodiment of the present invention.

  FIG. 7B is a plan view illustrating a pumping duct shield according to an embodiment of the present invention.

  FIG. 7C is a plan view illustrating a pumping duct shield according to another embodiment of the present invention.

  FIG. 8 is a diagram showing a surface treatment pattern on a treatment member according to an embodiment of the present invention.

  FIG. 9 is a diagram illustrating a method for manufacturing a processing member according to an embodiment of the present invention.

  FIG. 10A is a diagram illustrating a method of manufacturing a processing member according to another embodiment of the present invention.

  FIG. 10B is a diagram illustrating a method of manufacturing a processing member according to another embodiment of the present invention.

  FIG. 11 is a diagram illustrating a method for installing a processing member in a processing system according to another embodiment of the present invention.

  FIG. 12A is a plan view illustrating a dark space shield according to an embodiment of the present invention.

  12B is a cross-sectional view of the dark space shield of FIG. 12A.

  FIG. 12C is an enlarged cross-sectional view of a part of the dark space shield of FIG. 12B.

  FIG. 13A is a plan view illustrating a dark space shield according to another embodiment of the present invention.

  13B is a cross-sectional view illustrating the dark space shield of FIG. 13A.

  FIG. 13C is an enlarged cross-sectional view of a part of the dark space shield of FIG. 13B.

  FIG. 14A is a plan view showing a ring shield according to an embodiment of the present invention.

  14B is a cross-sectional view showing the ring shield of FIG. 14A.

  In one embodiment of the present invention, the processing system 15 includes a processing chamber 16, a substrate holder 20 for supporting the substrate 25, and a pumping duct 40, as shown in FIG. The pumping duct 40 is connected to the pumping system 45 and can change the pressure of the processing region 30 in the processing chamber 16. For example, the processing chamber 16 can maintain the substrate 25 to be processed in a high pressure state, an atmospheric pressure state, or a reduced pressure (vacuum) state. Further, for example, the processing chamber 16 can form processing plasma in the processing region 30 adjacent to the substrate 25. The processing system 15 can be configured to process a variety of substrates (ie, 100 mm substrates, 200 mm substrates, 300 mm substrates, or larger substrates).

  Desirably, the processing system 15 is a deposition system, such as a physical vapor deposition (PVD) system. In other embodiments, the processing system 15 is a chemical vapor deposition (CVD) system. In yet another embodiment, the processing system 15 is a plasma enhanced chemical vapor deposition (PECVD) system. Alternatively, the processing system 15 can be an etching system.

  Referring again to FIG. 1, the processing system 15 further includes one or more processing members 50. The processing member 50 is coupled to the processing chamber 16 and is capable of protecting one or more valuable surfaces 60 of the processing chamber 16. In addition, the one or more processing members 50 have one or more exposed surfaces 70. The exposed surface 70 is exposed to or in contact with the processing environment within the processing region 30. The one or more processing members 50 can constitute, for example, a process kit that can be replaced periodically, in whole or in parts. The one or more processing members 50 may be formed from a variety of materials such as metals such as aluminum or stainless steel, or non-metals such as ceramics (eg, alumina, quartz, silicon carbide, etc.). Can do. Thereafter, the one or more exposed surfaces 70 on the one or more processing members 50 are subjected to a treatment to increase surface roughness so that material adhesion during processing may be improved. In one embodiment, the one or more exposed surfaces 70 are roughened using a belt sander to have an average surface roughness such as, for example, Ra = 6.3 microns (or 250 mils). It becomes. Belt sanding can be performed prior to stretching the sheet material. Thereby, for example, a shield can be formed by forming a plurality of grooves with intersecting patterns in at least two directions.

  The use of belt sanding for surface roughening to improve adhesion significantly reduces manufacturing costs (over 50%) compared to previously used techniques such as grit blasting etc. Brought about. For example, prior to assembly, the sheet metal can be pulled through the belt sander as a first pass, and then rotated through 90 ° and pulled through the belt sander as a second pass. By doing so, a cross hatch pattern can be formed. The belt sander can have, for example, a 36 grit (made of silicon carbide) abrasive surface. Alternatively, the belt sander can have, for example, a 40 grit, 50-60 grit, or 80-100 grit abrasive surface. Forming the processing member 50 from sheet metal allows the use of belt sanding. Therefore, the belt sanding process can be applied when the sheet metal is flattened before the sheet metal is formed into a shape required as a shield. In the case of machined shields according to the prior art, a more expensive roughening process had to be used.

  In another embodiment of the present invention, a physical vapor deposition (PVD) processing system 101 is provided for supporting a processing chamber 110 and a substrate 125, as shown by the side view of FIG. 2A and the plan view of FIG. 2B. A substrate holder 120, a sputtering target assembly 135, and a pumping duct 140 are provided. The pumping duct 140 is connected to the pumping system 145 and can change the pressure of the processing region 130 in the processing chamber 110. For example, the processing chamber 110 can maintain the substrate 125 to be processed in a reduced pressure (vacuum) state. Further, the processing chamber 110 can form a processing plasma in the processing region 130 adjacent to the substrate 125 and the sputtering target assembly 135. The processing plasma can be formed from a chemically inert species such as a noble gas (eg, argon). Such a gas is supposed to be able to interact with the sputtering target, and sputtering particles for forming a film on the substrate 125 are formed in the processing region 130 by physical ion bombardment against the sputtering target. be able to. For example, the sputtering target assembly can be a copper target and an electrical bias (direct current (DC), alternating current (AC), or RF) can be applied. The sputtering target assembly 135 may further include a magnet or may not.

  Still referring to FIGS. 2A and 2B, the processing system 101 further includes one or more processing members 150. The processing member 150 is coupled to the processing chamber 110 and is capable of protecting one or more valuable surfaces 160 of the processing chamber 110. In addition, the one or more processing members 150 have one or more exposed surfaces 170. The exposed surface 170 is exposed to or in contact with the processing environment within the processing region 130. The one or more processing members 150 can constitute, for example, a process kit that can be replaced periodically, in whole or in portions.

  For example, the processing chamber 110 can include a chamber lower portion 112 (or pod) and a chamber upper portion 114 (or pod door). The upper chamber portion 114 can be coupled to the lower chamber portion 112, for example, by using a hinge (not shown). Thus, the chamber top 114 can function as a chamber door, which allows the processing chamber 110 to open and access its interior. 3A and 3B illustrate a processing member such as in the form of a chamber shield assembly of the type configured for a processing apparatus of the type disclosed in US Pat. No. 4,915,564. . Prior art and other shields for this device are described in detail in US patent application Ser. No. 10 / 349,661, filed Jan. 23, 2003. The contents of this document are incorporated herein in their entirety for reference. As shown in FIG. 3A, the process kit 151 may include a processing member connected to the chamber upper portion 114. In this case, the process kit 151 includes a door shield 152, an adapter shield 152A, and a dark space shield 152B. The dark space shield 152A and adapter shield 152B are configured to fit a sputtering cathode adapter that supports the cathode assembly within the pod door. Such adapter and shield configurations are described in detail in US patent application Ser. No. 10 / 438,304. The contents of this document are incorporated herein in their entirety for reference. Further, as shown in FIG. 3B, the process kit 151 may include a processing member connected to the chamber lower portion 112. In this case, the process kit 151 includes a pod shield 154, an additional gas injection ring 155, a gas ring shield 155A, a ring shield 155B, a substrate holder shield 155C, a plenum shield 155D, and an (additional) heater. A shield 155E and a pumping duct shield 156 are provided. Each of the processing members described above is replaceable and functions to protect the valuable surface 160 of the processing chamber 110.

  4A and 4B show a top view and a side view, respectively, for the door shield 152 that is coupled to the chamber top 114. The door shield 152 can comprise one or more access features. This allows access to a measuring instrument, such as a pressure sensing device, into the processing region 130 of the processing chamber 110. For example, each access feature can have a group of three through holes. In that case, the measuring device can be placed in a central position behind the group of through holes, thus preventing excessive deposition of process material on the measuring device.

  Further, the door shield 152 can be configured to receive various sizes of targets housed within the target assembly 135. As shown in FIG. 4A, the door shield 152 includes a main member 182 suitable for the size of the first target and a detachable member 184 suitable for the size of the second target. The main member 182 is formed from the same metal sheet as the detachable member 184. The main member 182 has a plurality of individual members 182a, 182b, and 182c when the removable member 184 is removed. However, the individual members 182a, 182b, and 182c maintain their spatial positional relationship when installed in the chamber. This is because each individual member is individually secured to the chamber structure. With the removable member 184 removed, the main member 182 (here, the three members 182a, 182b, and 182c are collectively referred to) can be coupled to the chamber upper portion 114. This allows a 304.8 mm (12 inch) diameter target to be received. In addition, with the detachable member 184 attached, the main member 182 provided with the detachable member 184 can be connected to the upper portion of the chamber. This allows a 254 mm (10 inch) diameter target to be received. The door shield 152 further includes a first set of mounting features 186 that are used for the first target size in connecting the door shield 152 to the chamber upper portion 114, and the door shield 152 to the chamber upper portion 114. A second set of mounting features 188 used for the second target size when connecting, and a third set commonly used for all target sizes when connecting the door shield 152 to the chamber top 114. And an attachment feature 190 formed. Each attachment feature 186, 188, 190 allows for the attachment of a fixing member such as, for example, a bolt. This allows the door shield 152 to be secured to the processing chamber 110 by receiving the securing member into the threaded feature.

  FIG. 4C is an enlarged view showing a part of the door shield 152 with the detachable member 184 attached, and FIGS. 4D and 4E are views between the detachable member 184 and the main member 182. It is a figure which expands and shows a part of connection part. As shown in FIGS. 4D and 4E, a narrow notch 195 can be formed in the door shield 152 while leaving one or more attachment features 194. Thereby, the main member 182 and the detachable member 184 having the detachable ring can be separated. Narrow notch 195 can be formed using, for example, a laser cutting system. Moreover, the width | variety of a notch can be about 0.254 mm-2.03 mm (10-80 mil) (for example, 0.762 mm (30 mil)), for example. In addition, the length of the one or more attachment features can be, for example, 0.254 mm to 4.06 mm (10 to 160 mil) (eg, 1.52 mm (60 mil)). The small size of the one or more attachment features 194 that are formed allows removal of the removable member 184 from the main member 182 in a simple manner (eg, manually bending the two members). It can be done by snapping it). Therefore, even if a single processing member is formed, it is possible to provide the flexibility that it can be used according to various sizes of targets.

  5A and 5B are a side view and a plan view showing the pod shield 154 connected to the lower chamber portion 112. The pod shield 154 can be formed from the floor portion 200 and the wall portion 202, for example. In this case, the floor portion 200 is connected to the wall portion 202 using a plurality of attachment members 204. For example, the attachment member 204 can be a tab for welding the floor portion 200 to the wall portion 202. Further, the pod shield 154 has a plurality of attachment features 206 for connecting the pod shield 154 to the chamber lower portion 112 of the processing chamber 110. Each attachment feature 206 allows for the attachment of a fixing member such as a bolt, for example. This allows the pod shield 154 to be secured to the processing chamber 110 by receiving the securing member into the threaded feature.

  Still referring to FIGS. 5A and 5B, the pod shield 154 further includes one or more removable members 208. The detachable member 208 is connected to a main member having the floor portion 200 and the wall portion 202. For example, the one or more removable members 208 can have removable gas injection punchouts 210 disposed on both sides of the pod shield 154. The removable gas injection punch-out introduces process gas from the left side into the processing region 130 of the processing chamber 110 and also into the processing region 130 of the processing chamber 110 from the left side. The pod shield 154 can also be used in the left system. As shown in FIG. 5C, a narrow notch 213 can be formed in the wall portion 202 of the second processing member 154 while leaving one or more attachment features 212. Thereby, the main member which has the floor part 200 and the wall part 202, and the removable gas injection | pouring punchout 210 can be isolate | separated. Narrow notch 213 can be formed using, for example, a laser cutting system. Moreover, the width | variety of a notch can be about 0.254 mm-2.03 mm (10-80 mil) (for example, 0.762 mm (30 mil)), for example. In addition, the length of the one or more attachment features can be, for example, 0.254 mm to 4.06 mm (10 to 160 mil) (eg, 1.52 mm (60 mil)). Due to the small size of the one or more attachment features 212 formed, the removable gas injection punchout 210 can be detached from the main member in a simple manner. Therefore, even if a single processing member is formed, it is possible to provide the flexibility that it can be used according to the direction of various processing chambers, that is, various directions of gas introduction, if necessary.

In addition, for example, the one or more removable members 208 can have a removable clearance punchout 214 and a removable gas injection line clearance punchout 216. 6A and 6B (gas injection ring from the left side, plan view and side view, respectively) and as shown in FIGS. 6C and 6D (gas injection ring from the right side, plan view and side view, respectively). As shown, additional gas injection rings 240 can be accommodated. For example, the additional gas injection ring 240 (240 ′) includes a supply ring 241 (241 ′), a gas introduction port 242 (242 ′), and a plurality of mounting structures 244 (244 ′). . As shown in FIG. 5D, a narrow notch 219 can be formed in the floor portion 200 of the pod shield 154 while leaving one or more attachment features 218. Thereby, the main member which has the floor part 200 and the wall part 202 and the detachable clearance punchout 214 can be separated. The removable clearance punchout 214 provides clearance for the plurality of mounting structures 244 after being removed. By using a plurality of mounting structures 244, the gas injection rings 240, 240 ′ can be fixed to the substrate holder shield 155C. Further, as shown in FIG. 5E, a narrow notch 221 can be formed in the floor portion 200 of the pod shield 154 while leaving one or more attachment features 220. Thereby, the main member having the floor portion 200 and the wall portion 202 can be separated from the removable gas injection line clearance punch-out 216. The removable gas injection clearance punchout 216 can provide clearance for a flexible gas line (not shown) after being removed. Thereby, a gas supply source and the gas introduction ports 242 and 242 ′ of the gas injection rings 240 and 240 ′ can be connected. Narrow notches 219, 221 can be formed using, for example, a laser cutting system. Moreover, the width | variety of a notch can be about 0.254 mm-2.03 mm (10-80 mil) (for example, 0.762 mm (30 mil)), for example. In addition, the length of the one or more attachment features can be, for example, 0.254 mm to 4.06 mm (10 to 10 mm).
160 mil) (for example, 1.52 mm (60 mil)). Due to the small size of the one or more attachment features 218, 220 that are formed, removal of the removable clearance punchout 214 and removal of the removable gas injection line clearance punchout 216 from the main member 182 is possible. Removal can be done in a simple manner. Therefore, even if a single processing member is formed, it is possible to provide flexibility that can be used according to various directions of the gas injection ring.

  FIG. 7A shows a side view of a pumping duct shield 156 that is coupled to the pumping duct 140 of the processing system 110. The pumping duct shield 156 includes a main member 230 and a detachable member 232 connected to the main member 230. For example, the pumping duct shield 156 can accommodate two differently sized pumping ducts (ie, two pumping ducts having different diameters) as shown in FIG. 7A. FIG. 7B shows the configuration for the first size pumping duct. In this case, the detachable member 232 is not removed. FIG. 7C shows a configuration for a second size pumping duct. In this case, the detachable member 232 has been removed. In addition, the pumping duct shield 156 can additionally comprise one or more tabs 236. After the pumping duct shield 156 is installed in the pumping duct 140, each tab can be easily folded radially outward so that the pumping duct shield 156 can be held in the pumping duct 140. it can. As shown in FIG. 7A, a narrow notch can be formed in the pumping duct shield 156 while leaving one or more attachment features 234. Thereby, the main member 230 and the detachable member 232 having the detachable shield extension can be separated. Narrow notches 219, 221 can be formed using, for example, a laser cutting system. Moreover, the width | variety of a notch can be about 0.254 mm-2.03 mm (10-80 mil) (for example, 0.762 mm (30 mil)), for example. In addition, the length of the one or more attachment features can be, for example, 0.254 mm to 4.06 mm (10 to 160 mil) (eg, 1.52 mm (60 mil)). The small size of the one or more attachment features 234 that are formed allows the removal of the removable member from the main member in a simple manner. Therefore, even if a single processing member is formed, it is possible to provide flexibility that can be used according to pumping ducts of various sizes.

  The one or more processing members 152, 154, 156 can be formed from a variety of materials, including metals such as aluminum. As described above, one or more exposed surfaces 170 on one or more processing members 150, such as processing members 152, 154, 156, for example, are processed to increase surface roughness. Thereby, the adhesion of the material can be improved. In one embodiment, the one or more exposed surfaces 170 are roughened using a belt sander, such as having an average surface roughness such as Ra = 6.3 microns (or 250 mils). It becomes. In addition, for example, roughening of one or more exposed surfaces can be performed by forming a cross hatch pattern 250 as shown in FIG. For example, prior to assembly, the sheet metal can be pulled through the belt sander as a first pass, and then rotated through 90 ° and pulled through the belt sander as a second pass. By doing so, a cross hatch pattern can be formed. The belt sander can have, for example, a 36 grit (made of silicon carbide) abrasive surface. Alternatively, the belt sander can have, for example, a 40 grit, 50-60 grit, or 80-100 grit abrasive surface.

  FIG. 9 illustrates a method of manufacturing a processing member for use in a processing system such as that described with reference to FIGS. 1, 2A and 2B. The flowchart 300 begins at step 310, where a processing member is formed. The processing member can include, for example, a chamber liner, a film formation shield, an apparatus shield, a baffle plate, a duct liner, and the like. In addition, for example, the processing member may be a door shield as shown in FIGS. 4A-4E, a pod shield as shown in FIGS. 5A-5E, or as shown in FIGS. 7A-7C. A pumping duct shield as described above. The treatment member is formed from a sheet metal or a stretched metal. For example, in manufacturing the processing member, at least one of machining, casting, polishing, forging, and grinding can be further performed. Each processing member mentioned above can be formed according to the specification prescribed | regulated by the apparatus drawing.

  In step 320, one or more surfaces (exposed surfaces) of the processing member that will be exposed to the processing environment during processing are exposed to 6.3 microns (or 250 mils) using belt sanding techniques. ) Exceeding the average surface roughness Ra. In the belt sanding technique, for example, the roughening can be performed such that one or more exposed surfaces of the processing member have a cross hatch pattern.

In manufacturing each processing member, at least one of an anodizing process for one or more surfaces, a spray coating process for one or more surfaces, and a plasma electrolytic oxidation process for one or more surfaces is further performed. It can be carried out. For example, in spray coating, in Al ₂ O ₃ , yttria (Y ₂ O ₃ ), Sc ₂ O ₃ , Sc ₂ F ₃ , YF ₃ , La ₂ O ₃ , CeO ₂ , Eu ₂ O ₃ , DyO ₃ At least one of which can be coated. Methods for performing anodizing and spray coating of aluminum members are well known to those skilled in the art of surface material processing.

  FIG. 10A illustrates a method of manufacturing a processing member for use in a processing system such as that described with reference to FIGS. 1, 2A and 2B. Flowchart 400 begins at step 410, where a processing member comprising a main member is formed. In step 420, at least one removable member is formed in the main member. The processing member can include, for example, a chamber liner, a film formation shield, an apparatus shield, a baffle plate, a duct liner, and the like. In addition, for example, the processing member may be a door shield as shown in FIGS. 4A-4E, a pod shield as shown in FIGS. 5A-5E, or as shown in FIGS. 7A-7C. A pumping duct shield as described above. The treatment member is formed from a sheet metal or a stretched metal. For example, in manufacturing the processing member, at least one of machining, casting, polishing, forging, and grinding can be further performed. Each processing member mentioned above can be formed according to the specification prescribed | regulated by the apparatus drawing.

  The removable member can be coupled to the main member via one or more attachment features. For example, the attachment feature can be formed by forming a narrow notch, such as one formed using a laser cutting system. The main member and the detachable member can be separated along such a narrow notch. The width of each mounting feature can be, for example, approximately 0.254 mm to 2.03 mm (10 to 80 mils) (eg, 0.762 mm (30 mils)). In addition, the length of the attachment feature can be, for example, 0.254 mm to 4.06 mm (10 to 160 mil) (eg, 1.52 mm (60 mil)). The detachable member can be connected to a processing member such as a door shield, for example. This allows the door shield to be used in a manner that accommodates various sized target assemblies. In addition, for example, the removable member can comprise a punchout (or knockout) and can be coupled to a processing member such as a pod shield. This makes it possible to adapt to gas injection systems having various orientations (ie, to adapt to a system that introduces gas from the right side or a system that introduces gas from the left side), and the pod shield. Can be used. In addition, for example, the removable member can be coupled to the pumping duct shield. This allows the pumping duct shield to be used in a manner that can accommodate various sizes of pumping ducts.

FIG. 10B illustrates another method of manufacturing a processing member for use in a processing system such as that described with reference to FIGS. 1, 2A and 2B. Flowchart 430 begins at step 410, where a processing member comprising a main member is formed. In step 420, at least one removable member is formed in the main member. In step 440, during the manufacture of each processing member, an anodizing treatment on one or more surfaces, a spray coating treatment on one or more surfaces, a plasma electrolytic oxidation treatment on one or more of the following: At least one process can be performed. For example, in the spray coating process, Al ₂ O ₃ , yttria (Y ₂ O ₃ ), Sc ₂ O ₃ , Sc ₂ F ₃ , YF ₃ , La ₂ O ₃ , CeO ₂ , Eu ₂ O ₃ , DyO ₃ are used. At least one of them can be coated. Methods for performing anodizing and spray coating of aluminum members are well known to those skilled in the art of surface material processing.

  FIG. 11 illustrates the use of a processing member in a processing system such as that described with reference to FIGS. 1, 2A and 2B. Flowchart 500 begins at step 510, where a processing member comprising a main member and at least one removable member is formed. The processing member can include, for example, a chamber liner, a film formation shield, an apparatus shield, a baffle plate, a duct liner, and the like. In addition, for example, the processing member may be a door shield as shown in FIGS. 4A-4E, a pod shield as shown in FIGS. 5A-5E, or as shown in FIGS. 7A-7C. A pumping duct shield as described above.

  In step 520, it is determined whether one or more of the at least one removable member should be removed. If the removable member is to be removed, the removable member is removed and discarded at step 530 and the processing member is loaded into the processing chamber at step 540. If it should not be removed, the process member is mounted in the process chamber without removing the removable member.

  In one example, the processing member is a door shield (FIG. 4A). If the processing system includes a 254 mm (10 inch) diameter sputtering target, the removable member shown in FIGS. 4A-4E need not be removed prior to installation. However, if the processing system includes a 304.8 mm (12 inch) diameter sputtering target, the removable members shown in FIGS. 4A-4E are removed prior to installation. In another example, the processing member is a pod shield (FIG. 5A). If the processing system includes a gas injection system arranged to be introduced from the right side, the removable gas injection punchout (FIG. 5C) located on the right side of the pod shield is removed prior to installation. Rather, if the processing system includes a gas injection system arranged to be introduced from the left side, the removable gas injection punchout located on the left side of the pod shield is removed prior to installation. In addition, if an additional gas injection ring is used, the removable clearance punchout (FIG. 5D) is removed prior to installation. Further, if the processing system includes a gas injection system arranged to be introduced from the right side, the removable gas injection line clearance punch-out (FIG. 5E) is removed prior to installation. Rather, if the processing system includes a gas injection system arranged to be introduced from the left side, the removable gas injection clearance punchout is removed prior to installation. In yet another example, the processing member is a pumping duct shield. If the pumping duct shield is attached to a smaller diameter pumping duct, the removable member is removed prior to installation. However, if the pumping duct shield is attached to a larger diameter pumping duct, the removable member need not be removed prior to installation.

  12A and 12B show a plan view and a cross-sectional view of the dark space shield 152B. The dark space shield 152B can be a member that forms a shield assembly coupled to the target assembly and can be configured to surround and protect the peripheral edge of the sputtering target mounted within the target assembly. As shown in FIG. 3A, the shield assembly may further comprise an adapter shield 152A, for example. The dark space shield 152B has a flange region 600 and a lip region 610 connected to the flange region. As shown in FIG. 3A, the dark space shield 152B is coupled to the target assembly by using a securing member as shown that extends through the securing hole 620 of the dark space shield 152B, and the sputtering target (FIG. (Not shown). By surrounding the peripheral edge of the sputtering target coupled to the target assembly 135, a clearance space is formed between the inner surface 625 of the lip region 610 of the dark space shield 152B and the outer edge of the target. . This space is, for example, less than 1 mm. Thereby, it can prevent that a plasma penetrate | invades in this space, and can prevent the corrosion of the peripheral edge of a sputtering target. FIG. 12C shows the lip region 610 and the inner surface 625 on an enlarged scale.

  For an alternative embodiment, FIGS. 13A and 13B show plan and cross-sectional views of dark space shield 700. FIG. The dark space shield 700 can be a member that forms a shield assembly coupled to the target assembly and can be configured to surround and protect the peripheral edge of a sputtering target mounted within the target assembly. Thereby, both the dark space shield and the adapter shield in the meaning in the prior art can be combined. The dark space shield 700 has a flange region 710, a lip region 720, and an adapter region 730 connected to the flange region 710. Adapter region 730 serves as an individual adapter shield. The dark space shield 700 may be coupled to the target assembly by using a securing member as shown extending through the securing hole 740 of the dark space shield 700 to enclose the sputtering target (not shown). Configured. By surrounding the peripheral edge of the sputtering target connected to the target assembly 135, a clearance space is formed between the inner surface 745 of the lip region 720 of the dark space shield 700 and the outer edge of the target. . This space is, for example, less than 1 mm. Thereby, it can prevent that a plasma penetrate | invades in this space, and can prevent the corrosion of the peripheral edge of a sputtering target. FIG. 13C shows enlarged lip region 720 and inner surface 745.

  14A and 14B are a plan view and a cross-sectional view showing the ring shield 155B. The ring shield 155B can be a member that forms a shield assembly for protecting the substrate holder. Ring shield 155B has a flange region 630 and a lip region 640 connected to the flange region. As shown in FIG. 3B, the ring shield 155B is connected to the substrate holder shield 155C by using a fixing member as shown that extends through the fixing hole 650, and the pod shield 154 and the substrate holder shield 155C. And can be protected. In addition, the ring shield 155B can further have a clearance notch. Thereby, the connection to the additional gas injection ring 155 can be performed.

As shown in FIGS. 12A-12C, 13A-13C, and 14A and 14B, dark space shield 152B and ring shield 155B are formed from stretched metal. The metal can be, for example, aluminum. This manufacturing process can result in cost savings of over 50%. The dark space shields and ring shields described above can be formed for 200 mm, 300 mm, or larger diameter systems. In addition, the manufacture of the dark space shield 152B and the ring shield 155B further includes anodizing treatment on one or more surfaces, spray coating treatment on one or more surfaces, plasma electrolytic oxidation treatment on one or more, At least one of the processes can be performed. For example, in the spray coating process, Al ₂ O ₃ , yttria (Y ₂ O ₃ ), Sc ₂ O ₃ , Sc ₂ F ₃ , YF ₃ , La ₂ O ₃ , CeO ₂ , Eu ₂ O ₃ , DyO ₃ are used. At least one of them can be coated. Methods for performing anodizing and spray coating of aluminum members are well known to those skilled in the art of surface material processing.

  Although described in detail with respect to several exemplary embodiments of the present invention, it will be appreciated by those skilled in the art that various modifications can be made to the above embodiments without departing from the scope and advantages of the invention. Will be understood. All such variations are intended to be included within the scope of the present invention.

1 schematically illustrates a processing system according to an embodiment of the present invention. It is a side view which shows roughly the processing system by other embodiment of this invention. It is a top view which shows roughly the processing system of FIG. 2A. FIG. 3 is an exploded perspective view showing a process kit coupled to a chamber top in the processing system of FIGS. 2A and 2B. FIG. 3 is an exploded perspective view showing a process kit coupled to a chamber bottom in the processing system of FIGS. 2A and 2B. It is a top view which shows the door shield by one Embodiment of this invention. It is a side view which shows the door shield by one Embodiment of this invention. It is a top view which expands and shows a part of door shield of Drawing 4A. It is a top view which expands and shows the other part of the door shield of FIG. 4A. It is a top view which expands and shows the other part of the door shield of FIG. 4A. It is a top view which shows the pod shield by one Embodiment of this invention. It is a side view which shows the pod shield by one Embodiment of this invention. It is a top view which expands and shows a part of pod shield of FIG. 5A. It is a top view which expands and shows the other part of the pod shield of FIG. 5A. It is a top view which expands and shows the other part of the pod shield of FIG. 5A. It is a top view which shows the left side gas injection ring by one Embodiment of this invention. It is a side view which shows the left side gas injection ring by one Embodiment of this invention. It is a side view which shows the right side gas injection ring by one Embodiment of this invention. It is a side view which shows the right side gas injection ring by one Embodiment of this invention. 1 is a side view of a pumping duct shield according to an embodiment of the present invention. It is a top view which shows the pumping duct shield by one Embodiment of this invention. FIG. 6 is a plan view showing a pumping duct shield according to another embodiment of the present invention. It is a figure which shows the surface treatment pattern on the process member by one Embodiment of this invention. It is a figure which shows the manufacturing method of the processing member by one Embodiment of this invention. It is a figure which shows the manufacturing method of the processing member by other embodiment of this invention. It is a figure which shows the manufacturing method of the processing member by other embodiment of this invention. It is a figure which shows the installation method of the processing member in the processing system by other embodiment of this invention. It is a top view which shows the dark space shield by one Embodiment of this invention. It is sectional drawing which shows the dark space shield of FIG. 12A. It is sectional drawing which expands and shows a part of dark space shield of FIG. 12B. It is a top view which shows the dark space shield by other embodiment of this invention. It is sectional drawing which shows the dark space shield of FIG. 13A. It is sectional drawing which expands and shows a part of dark space shield of FIG. 13B. It is a top view which shows the ring shield by one Embodiment of this invention. It is sectional drawing which shows the ring shield of FIG. 14A.

Explanation of symbols

DESCRIPTION OF SYMBOLS 15 Processing system 16 Processing chamber 20 Substrate holder 25 Substrate 40 Pumping duct 45 Pumping system 50 Processing member 70 Exposed surface 101 Physical vapor deposition (PVD) processing system 110 Processing chamber 112 Lower chamber 114 Upper chamber 120 Substrate holder 125 Substrate 135 Sputtering target Assembly 140 Pumping duct 145 Pumping system 150 Processing member 151 Process kit 152 Door shield 152A Adapter shield 152B Dark space shield 154 Pod shield 155 Additional gas injection ring 155A Gas ring shield 155B Ring shield 155C Substrate holder shield 155D Plenum shield 155E Heater shield 156 Pumping duct shield 170 Surface 182 Main member 184 Removable member 186 Mounting feature 188 Mounting feature 190 Mounting feature 194 Mounting feature 200 Floor portion 202 Wall portion 206 Mounting feature 208 Removable member 210 Removable gas injection punch-out 212 Mounting feature 214 Removable Clearance Punch Out 216 Removable Gas Injection Line Clearance Punch Out 218 Mounting Feature 220 Mounting Feature 230 Main Member 232 Removable Member 234 Mounting Feature 240 Additional Gas Injection Ring 600 Flange Region 610 Lip Region 630 Flange area 640 Lip area 700 Dark space shield 710 Flange area 720 Lip area

Claims (65)

A processing member for use in a processing system having two or more configurations,
Main components;
A detachable member connected to the main member;
Comprising
In a state where the detachable member is held against the main member, the processing member can be used in the first configuration of the processing system,
In the state where the detachable member is removed, the processing member can be used in the second configuration of the processing system. The processing member according to claim 1,
The removable member is coupled to the main member via one or more attachment features;
The attachment feature is formed by cutting the processing member along a curve, except for the position of the one or more attachment features, thereby separating the removable member from the main member. A processing member characterized in that it is obtained. The processing member according to claim 2,
The processing member, wherein the cutting is performed using a laser cutting system. The processing member according to claim 2,
The width of the one or more attachment features is 0.254 mm to 2.03 mm (10 to 80 mils);
A processing member wherein the length of the one or more attachment features is 0.254 mm to 4.06 mm (10 to 160 mil). The processing member according to claim 1,
A processing member, wherein the processing system is at least one of a physical vapor deposition system, a chemical vapor deposition system, and an etching system. The processing member according to claim 5,
The processing system is a physical vapor deposition system;
The processing system is
A processing chamber having an upper chamber portion and a lower chamber portion;
A target assembly coupled to the processing chamber;
A substrate holder coupled to the processing chamber and for supporting the substrate;
A pumping system;
A pumping duct for connecting the pumping system to the processing chamber;
A processing member comprising: The processing member according to claim 6,
A door shield connected to the chamber upper portion of the processing chamber; a pod shield connected to the chamber lower portion of the processing chamber; and a pumping duct connected to the pumping duct. A processing member comprising at least one of a shield. The processing member according to claim 7,
The removable member comprises a removable ring connected to the door shield;
When using the door shield for the first size of the target assembly, the removable ring is left held;
When the door shield is used for the second size target assembly, the detachable ring is removed. The processing member according to claim 8,
The target assembly of the first size corresponds to a substrate diameter of less than 290 mm;
The processing member, wherein the target assembly of the second size corresponds to a substrate diameter larger than 290 mm. The processing member according to claim 7,
The at least one removable member has a first removable gas injection punchout and a second removable gas injection punchout;
The at least one removable member is removably coupled to the pod shield using at least one attachment feature;
The first removable gas injection punch-out is connected to the right side of the pod shield;
The processing member, wherein the second removable gas injection punch-out is connected to the left side of the pod shield. The processing member according to claim 7,
Furthermore, an additional gas injection ring is provided,
The at least one removable member comprises:
At least one removable clearance punchout for providing clearance for attaching the additional gas injection ring to the processing system;
A first removable gas injection line clearance punchout to provide clearance for introducing gas from the right side of the processing system;
A second removable gas injection line clearance punchout to provide clearance for introducing gas from the left side of the processing system;
A processing member comprising: The processing member according to claim 7,
The at least one removable member comprises a removable shield extension coupled to the pumping duct shield;
When the pumping duct shield is used in the pumping duct of the first configuration, the removable shield extension is kept held,
The processing member, wherein the removable shield extension is removed when the pumping duct shield is used in the pumping duct having the second configuration. The processing member according to claim 1,
The processing member further comprising a coating applied to at least one surface on the processing member. The processing member according to claim 13,
The processing member, wherein the coating is at least one of surface anodization, spray coating, and plasma electrolytic oxidation coating. A process kit for use in a processing system comprising:
The processing system is
A processing chamber with an upper chamber portion and a lower chamber portion;
A target assembly coupled to the processing chamber;
A substrate holder coupled to the processing chamber and for supporting the substrate;
A pumping system;
A pumping duct for connecting the pumping system to the processing chamber;
Comprising
The process kit is
When the door shield is connected to the upper portion of the processing chamber and includes a detachable ring and the door shield is used for the target assembly having the first configuration, A door shield in which the removable ring remains held and the removable ring is to be removed when the door shield is used for the target assembly in the second configuration;
A first removable gas injection punch-out connected to the chamber lower portion of the processing chamber and connected to the right side of the pod shield via an attachment feature; and the pod via an attachment feature. A pod shield having a second removable gas injection punch-out connected to the left side of the shield, and when the processing system is of a type that introduces gas from the right side, the first A pod shield in which the second removable gas injection punchout is to be removed if the removable gas injection punchout is removed and the processing system is of the type that introduces gas from the left side;
A pumping duct shield configured to be connectable to the pumping duct and having a removable shield extension connected to the pumping duct shield via an attachment feature and a first configuration When the pumping duct shield is used in the pumping duct, the detachable shield extension is held, and the pumping duct shield is used in the pumping duct having the second configuration. A pumping duct shield, wherein the removable shield extension is to be removed;
A process kit characterized by comprising: The process kit according to claim 15, wherein
The process kit further comprises an additional gas injection ring connected to the processing chamber. The process kit according to claim 16,
The pod shield is
One or more removable clearance punchouts connected to the pod shield via at least one attachment means;
A first removable gas injection line clearance punchout connected to the pod shield via at least one attachment means;
A second removable gas injection line clearance punchout connected to the pod shield via at least one attachment means;
With
When attaching the additional gas injection ring to the processing chamber, the one or more removable clearance punchouts are removed,
When introducing additional gas from the right side with respect to the additional gas injection ring, the first removable gas injection line clearance punch-out is removed,
The process kit according to claim 1, wherein the second removable gas injection line clearance punch-out is removed when additional gas is introduced from the left side of the additional gas injection ring. The process kit according to claim 15, wherein
The process kit, wherein at least one of the door shield, the pod shield, and the pumping duct shield further includes a coating. The process kit according to claim 18,
A process kit, wherein the coating is at least one of surface anodic oxidation, spray coating, and plasma electrolytic oxidation coating. A method for manufacturing a processing member for use in a processing system comprising:
Producing the processing member comprising a main member and at least one detachable member connected to the main member;
At this time, when the processing system has the first configuration, the processing member is used while holding the at least one detachable member, and the processing system has the second configuration. If so, the process member is used with the at least one removable member removed. The method of claim 20, wherein
The method further comprises applying a coating to at least one surface on the processing member. The method of claim 21, wherein
The method is characterized in that the coating is at least one of surface anodic oxidation, spray coating, and plasma electrolytic oxidation coating. A method for using a processing member in a processing system having two or more configurations, comprising:
Manufacturing the processing member comprising a main member and at least one detachable member coupled to the main member using an attachment feature;
Determining whether to use the processing member in the processing system having the first configuration or in the processing system having the second configuration;
When using the processing member in the processing system having the first configuration, the processing member is used while holding the detachable member;
When the processing member is used in the processing system having the second configuration, the processing member is used with the removable member removed;
A method characterized by that. 24. The method of claim 23.
The method further comprises applying a coating to at least one surface on the processing member. 25. The method of claim 24, wherein
The method is characterized in that the coating is at least one of surface anodic oxidation, spray coating, and plasma electrolytic oxidation coating. A door shield for use in a physical vapor deposition system,
The physical vapor deposition system comprises:
A processing chamber with an upper chamber portion and a lower chamber portion;
A target assembly coupled to the processing chamber;
A substrate holder coupled to the processing chamber and for supporting the substrate;
A pumping system;
A pumping duct for connecting the pumping system to the processing chamber;
Comprising
The door shield is
A primary member coupled to the chamber upper portion of the processing chamber and having a substantially rectangular, rounded first end and a rounded second end; A main member such that the rounded second end is capable of enclosing the target assembly;
A detachable member connected to the main member and substantially circular and connected to the main member at a peripheral edge of the detachable member via at least one attachment feature. A detachable member assumed to be,
With
For the target assembly of the first size, the door shield is used as comprising the main member and the removable member,
For the second size target assembly, the door shield is used as having only the main member. The door shield according to claim 26.
The door shield further comprises a coating applied to at least one surface on the door shield. 28. The door shield according to claim 27.
The door shield is characterized in that the coating is at least one of surface anodization, spray coating, and plasma electrolytic oxidation coating. The door shield according to claim 26.
The door shield according to claim 1, wherein the target assembly of the first size corresponds to a substrate diameter of less than 290 mm. The door shield according to claim 26.
The door shield, wherein the target assembly of the second size corresponds to a substrate diameter larger than 290 mm. A pod shield for use in a physical vapor deposition system,
The physical vapor deposition system comprises:
A processing chamber with an upper chamber portion and a lower chamber portion;
A target assembly coupled to the processing chamber;
A substrate holder coupled to the processing chamber and for supporting the substrate;
A pumping system;
A pumping duct for connecting the pumping system to the processing chamber;
Comprising
The pod shield is
It is a main member connected to the lower portion of the processing chamber, and includes a floor portion, a wall portion connected to the floor portion, a first end, and a second end. The first end has a first opening configured to be connectable to the pumping duct, and the second end is configured to be connectable to the substrate holder. A main member, such as having an opening;
A first detachable member connected to the wall portion of the main member via at least one attachment feature, and when the first detachable member remains attached, The first gas injection structure provided on the first side of the pod shield is not accessible, and is provided on the first side of the pod shield when the first removable member is removed. A first removable member that is accessible to the first gas injection configuration;
A second detachable member coupled to the wall portion of the main member on the opposite side of the first detachable member via at least one attachment feature and attaching the second detachable member When left untouched, the second gas injection configuration provided on the second side of the pod shield is inaccessible, and when the second removable member is removed, A second removable member that is accessible to a second gas injection configuration provided on a second side of the pod shield;
A pod shield characterized by comprising. The pod shield according to claim 31,
The pod shield further comprising a coating applied to at least one surface on the pod shield. The pod shield of claim 32.
The pod shield is characterized in that the coating is at least one of surface anodic oxidation, spray coating, and plasma electrolytic oxidation coating. A pumping duct shield for use in a physical vapor deposition system comprising:
The physical vapor deposition system comprises:
A processing chamber with an upper chamber portion and a lower chamber portion;
A target assembly coupled to the processing chamber;
A substrate holder coupled to the processing chamber and for supporting the substrate;
A pumping system;
A pumping duct for connecting the pumping system to the processing chamber;
Comprising
The pumping duct shield is
A main member that is substantially rectangular;
A detachable member that is substantially rectangular and further connected to an end of the main member via at least one attachment feature;
A pumping duct shield characterized by comprising: The pumping duct shield of claim 34.
A pumping duct shield further comprising a coating applied to at least one surface on the pumping duct shield. The pumping duct shield of claim 35.
A pumping duct shield, wherein the coating is at least one of surface anodization, spray coating, and plasma electrolytic oxidation coating. A method for manufacturing a processing member for use in a processing system and having one or more exposed surfaces that are exposed to processing in the processing system during processing, comprising:
Molding the material into the shape of the processing member with one or more exposed surfaces;
Belt sanding one or more of the exposed surfaces to increase material adhesion on the one or more of the exposed surfaces during the processing;
A method characterized by that. 38. The method of claim 37, wherein
A method wherein the belt sanding treatment on one or more of the exposed surfaces is performed prior to the molding operation of the material. 38. The method of claim 37, wherein
The material is a sheet metal material,
A method of performing the belt sanding process on one or more of the exposed surfaces before forming the sheet metal material into the shape of the processing member. 38. The method of claim 37, wherein
The method comprising performing the belt sanding process on one or more of the exposed surfaces by drawing a cross hatch pattern on the exposed surfaces. 38. The method of claim 37, wherein
The method wherein the processing member is a detachable shield for protecting the inner surface of the processing system so that film formation does not occur during the processing. 38. The method of claim 37, wherein
The method is characterized in that the processing system is at least one of a physical vapor deposition system, a chemical vapor deposition system, and an etching system. 43. The method of claim 42, wherein
The processing system is a physical vapor deposition system,
The processing system;
A processing chamber having an upper chamber portion and a lower chamber portion;
A target assembly coupled to the processing chamber;
A substrate holder coupled to the processing chamber and for supporting the substrate;
A pumping system;
A pumping duct for connecting the pumping system to the processing chamber;
A method characterized by comprising: 44. The method of claim 43, wherein
The method wherein the processing member is a detachable shield for protecting the inner surface of the processing system so that film formation does not occur during the processing. 45. The method of claim 44, wherein
A door shield coupled to the chamber upper portion of the processing chamber; a pod shield coupled to the chamber lower portion of the processing chamber; and a pumping duct coupled to the pumping duct. A method, characterized in that it is at least one of the shields. 38. The method of claim 37, wherein
The method further comprises applying a coating to at least one surface on the processing member. The method of claim 46.
The method is characterized in that the coating is at least one of surface anodic oxidation, spray coating, and plasma electrolytic oxidation coating. 38. The method of claim 37, wherein
A method comprising applying a 36 grit abrasive surface during the belt sanding process. 38. The method of claim 37, wherein
During the molding, the sheet metal material is stretched,
Thereby, the processing member having a ring shape which is a planar shape as a whole is formed,
The processing member includes an annular flange region, and a generally cylindrical lip region formed by bending from the sheet-like metal material while being adjacent to an inner diameter portion of the flange region. A method characterized by. A method for processing a substrate in a processing system comprising:
One or more processing members are provided in the processing system so that the processing system can be protected from processing in the processing system, wherein the one or more processing members are protected against the processing. Having at least one exposed surface to be exposed, and further applying a belt sanding treatment to the at least one exposed surface;
Placing the substrate in the processing system;
Applying the treatment to the substrate;
A method characterized by that. 50. The method of claim 49, wherein
The belt sanding process is performed by forming a cross hatch pattern. 50. The method of claim 49, wherein
The method is characterized in that the processing system is at least one of a physical vapor deposition system, a chemical vapor deposition system, and an etching system. 52. The method of claim 51, wherein
The processing system is a physical vapor deposition system,
The processing system;
A processing chamber having an upper chamber portion and a lower chamber portion;
A target assembly coupled to the processing chamber;
A substrate holder coupled to the processing chamber and for supporting the substrate;
A pumping system;
A pumping duct for connecting the pumping system to the processing chamber;
A method characterized by comprising: 53. The method of claim 52, wherein
A door shield coupled to the chamber upper portion of the processing chamber; a pod shield coupled to the chamber lower portion of the processing chamber; and a pumping duct coupled to the pumping duct. A method, characterized in that it is at least one of the shields. 50. The method of claim 49, wherein
The method further comprises applying a coating to at least one surface on the processing member. 55. The method of claim 54, wherein
The method is characterized in that the coating is at least one of surface anodic oxidation, spray coating, and plasma electrolytic oxidation coating. 50. The method of claim 49, wherein
A method comprising applying a 36 grit abrasive surface during the belt sanding process. An improved processing member for use in a processing system comprising:
The processing system is
A processing chamber having an upper chamber portion and a lower chamber portion;
A target assembly coupled to the processing chamber;
A substrate holder coupled to the processing chamber and for supporting the substrate;
A pumping system;
A pumping duct for connecting the pumping system to the processing chamber;
If you have
The processing member comprises one or more exposed surfaces exposed to processing during processing in the processing system;
The processing member, wherein the at least one exposed surface is subjected to a belt sanding process. The processing member according to claim 57,
The processing member, wherein the belt sanding process is performed so as to form a cross hatch pattern. The processing member according to claim 57,
A processing member, wherein the processing system is at least one of a physical vapor deposition system, a chemical vapor deposition system, and an etching system. The processing member according to claim 57,
A door shield connected to the chamber upper portion of the processing chamber; a pod shield connected to the chamber lower portion of the processing chamber; and a pumping duct connected to the pumping duct. A processing member comprising at least one of a shield. The processing member according to claim 57,
The processing member further comprising a coating applied to at least one surface on the processing member. The processing member of claim 61,
The processing member, wherein the coating is at least one of surface anodization, spray coating, and plasma electrolytic oxidation coating. The processing member according to claim 57,
The processing member, wherein the belt sanding process is performed by applying a surface of 36 grit abrasive. The processing member according to claim 57,
Formed as a ring shape,
A lip region and a flange region connected to the lip region;
A treatment member formed of a stretched metal.

Images