KR20060035074A - Socket for testing semiconductor chip package making easy multi-test - Google Patents

Abstract

Disclosed is a socket for inspecting a semiconductor chip package that can be easily multi-tested. A socket for inspecting a semiconductor chip package according to the present invention includes a base housing having a plurality of loading parts on which a semiconductor chip package is to be placed, and having a contact pin under the loading part and electrically contact pins electrically connected to the semiconductor chip package; A plurality of lead backers installed to correspond to the loading part inside the cover housing to press the cover housing and the semiconductor chip package placed on the loading part to contact the contact pins; And a plurality of adapters detachably mounted to at least one of the loading parts and having a receiving portion of a semiconductor chip package appearance size.

Description

Socket for testing semiconductor chip package making easy multi-test}

1 is a perspective view illustrating an example of a socket for inspecting a semiconductor chip package according to the related art.

2 is a longitudinal cross-sectional view illustrating a case in which a BGA type semiconductor chip package is mounted on a socket for inspecting a semiconductor chip package according to the related art.

Figure 3 is a schematic diagram showing a conventional method for manufacturing a multiparameter board.

4 is a perspective view illustrating a socket for inspecting a semiconductor chip package according to the present invention.

5 is a perspective view of a single adapter used in a socket for inspecting a semiconductor chip package according to the present invention.

6 is a perspective view of a single adapter combination used in the socket for inspecting the semiconductor chip package according to the present invention.

7 is a perspective view of another single adapter combination used in the socket for inspecting the semiconductor chip package according to the present invention.

8 is a schematic view showing a method for manufacturing a multi-parameter board using a socket for inspecting a semiconductor chip package according to the present invention.

<Description of the symbols for the main parts of the drawings>

200 ... socket for semiconductor chip package inspection 210 ... base housing

218 ... contact pin 220 ... loading section

230 ... Cover housing 240 ... Lead backer

260, 261, 262, 263, 264 ... Single adapter 265 Dual adapter

266 ... Receptor 280 ... Screw

282 position pins 284 holes

290 PCB board 292 Motherboard

294 ... cable

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for testing reliability of semiconductor chip packages, and more particularly, to a socket for inspecting semiconductor chip packages capable of inspecting electrical characteristics of a semiconductor chip package of a ball grid array (BGA) type.

The semiconductor device is manufactured through a preliminary process, that is, a fabrication process and a postprocess, that is, an assembly process. The preprocessed semiconductor device integrated circuit is subjected to electrical die sorting (EDS) using probe equipment, and semiconductor devices that are judged to be good at this stage are subjected to a series of packaging processes in a later process. It is reprocessed into a semiconductor chip package. The semiconductor chip package is subjected to an electrical property inspection process before being provided to the user. In the electrical property inspection process, the electrical characteristics of the semiconductor chip package are inspected using sockets. The socket for inspecting a semiconductor chip package is a device that transmits an electrical signal by electrically connecting a semiconductor device integrated circuit to a tester, and its configuration and shape vary according to the type and type of the semiconductor chip package.

In recent years, with the trend of miniaturization and large-capacity electronic devices, semiconductor chip packages have been developed in the direction of using solder balls or solder bumps instead of leads. Therefore, a socket for inspecting a semiconductor chip package is also developed to have a structure suitable for use in a BGA type package which is a kind of chip scale package.

1 is a perspective view showing an example of a semiconductor chip package inspection socket 100 according to the prior art.

Referring to FIG. 1, a socket for inspecting a semiconductor chip package according to the related art includes a socket housing 110 and a cover 130 which is hinged to the socket housing 110 so as to be opened and closed. The socket housing 110 includes an alignment plate on which a semiconductor chip package (not shown) is placed, and a contact plate on which a plurality of contact pins 118 are electrically connected to the semiconductor chip package. The semiconductor chip package is connected to the contact pins 118 of the contact plate through a loading part 120 formed at an approximately center portion of the alignment plate. The contact pins 118 are configured to have different electrical wiring positions depending on the type of semiconductor chip package.

A lead backer 140 is coupled to the inner side surface 132 of the cover 130. An elastic body such as a spring is interposed between the lead backer 140 and the cover 130. The elastic body is disposed at appropriate intervals to apply a constant pressure to the entire surface of the lead backer 140.

The lead backer 140 has a support plate 144 in the form of a plate having a through hole 142 formed at a center thereof, and the support plate 144 at a position corresponding to the loading part 120 in which the semiconductor chip package is placed. A protrusion 146 protruding upward. The through hole 142 formed in the support plate 144 is formed at a position corresponding to the through hole (not shown) formed in the center of the cover 130. Therefore, in the state where the cover 130 and the lead backer 140 are coupled to each other, the through holes communicate with each other.

FIG. 2 is a longitudinal cross-sectional view for explaining that the BGA type semiconductor chip package 170 is mounted on the semiconductor chip package inspection socket 100 having the configuration shown in FIG. 1. In FIG. 2, the cover 130 and the lead backer 140 are coupled to each other by a joint bolt 160 including a female screw 162 and a male screw 164. The cover 130 and It is shown that the through holes 138 and 142 communicate with each other in a state in which the lead backers 140 are coupled to each other. Reference numeral 150 is a spring as an elastic body interposed between the lead backer 140 and the cover 130.

As shown in FIG. 2, when the BGA type semiconductor chip package 170 is mounted on a portion of the contact pin 118 inside the socket housing 110, the contact pin 118 inside the socket housing 110 is shown. The protrusion 146 of the lead backer 140, which acts to press the semiconductor chip package 170 mounted on the semiconductor chip package 170, contacts a proper position of the semiconductor chip package 170, and thus, the semiconductor chip within the socket 100. The package 170 can be mounted well.

As can be seen from Figures 1 and 2, the prior art is to test the test by matching the semiconductor chip package 170 and the socket 100 to 1: 1. In this case, when the semiconductor chip package size is changed, there is a problem that all sockets must be newly manufactured, and there is a high possibility that the product analysis will be interrupted due to the long time required for the new manufacturing.

In addition, as shown in FIG. 3, the socket 100 and the PCB board 190 may be manufactured and connected to the motherboard 192 using a cable 194 according to the number of parameters when the multiparameter board is manufactured. Therefore, when the number of parameters in the multi test increases, there is a problem in that the number and the manufacturing cost of the socket 100 and the PCB board 190 increase.

An object of the present invention is to solve the problems in the prior art as described above, and to provide a socket for semiconductor chip package inspection that is easy to cope with a new semiconductor chip package and a simple multi test configuration.

In order to achieve the above object, the semiconductor chip package inspection socket according to the present invention includes a base housing having a plurality of loading portions on which the semiconductor chip package is to be placed and having contact pins electrically connected to the semiconductor chip package under the loading portions; A cover housing coupled to the base housing so as to be openable and close, and the loading part corresponding to the loading part inside the cover housing to press the semiconductor chip package so that the semiconductor chip package placed on the loading part contacts the contact pin. A plurality of lead backers, and a plurality of adapters detachably mounted to one or more of the loading portions and having an accommodating portion of a semiconductor chip package appearance size.

The semiconductor chip package is a BGA type package. The adapter may be a single adapter mounted on one loading unit or a dual adapter mounted on two loading units. This adapter is mounted or detached by screwing or dismounting the base housing. In particular, the adapter is provided with a position pin, and the base housing is provided with a hole for receiving the position pin, so that the adapter is aligned with the loading unit by the combination of the position pin and the hole. Preferably, the adapter may be equipped with a semiconductor chip package of the same size or different.

In a preferred embodiment, the loading section has a 2 × 2 arrangement. In this case, the adapter may be four single adapters mounted on one loading unit one by one, or two single adapters mounted on one loading unit one by one and one dual adapter combination mounted on two loading units, or two Two dual adapters mounted across the loading section.

Next, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.

4 is a perspective view illustrating a socket for inspecting a semiconductor chip package according to the present invention.

The semiconductor chip package inspection socket 200 according to the present invention includes a base housing 210 and a cover housing 230 coupled to the base housing 210 so as to be openable and closeable. The cover housing 230 may be hinged to the base housing 210.

The base housing 210 has a plurality of loading parts 220 on which a BGA type semiconductor chip package (not shown) is to be placed, and a contact pin 218 electrically connected to the semiconductor chip package is provided below the loading part 220. do. In the present exemplary embodiment, the loading unit 220 may have a 2 × 2 arrangement to mount and test up to four semiconductor chip packages.

The lead backer 240 is coupled to the inner side surface 232 of the cover housing 230. The lead backer 240 pressurizes the semiconductor chip package so that the semiconductor chip package placed on the loading unit 220 may come into contact with the contact pin 218, and 2 × 2 to correspond to the loading unit 220. Installed to have an array. An elastic body such as a spring may be interposed between the lead backer 240 and the cover housing 230. The elastic body may be disposed at appropriate intervals to apply a constant pressure to the entire surface of the lead backer 240. The lead backer 240 of the cover housing 230 may apply independent pressure to the semiconductor chip package for each position, and thus may freely cope with a height change of the semiconductor chip package. The lead backer 240 may have a support plate 244 in the form of a flat plate having a through hole 242 formed at a center thereof, and the support plate 244 at a position corresponding to the loading unit 220 in which the semiconductor chip package is placed. It may include a protrusion 246 protruding upward.

Adapters 260 and 265 are mounted to the loading unit 220. In this embodiment, two types of adapters 260 and 265 are used. The adapter 260 is a single adapter mounted on one loading unit 220 one by one, and the adapter 265 is a dual adapter mounted on two loading units 220. The adapters 260 and 265 are detachably mounted to the loading part 220 and have an accommodating part 266 having a semiconductor chip package appearance size.

The adapters 260 and 265 are mounted or detached by fixing or dismounting the screws 280 to the base housing 210. In particular, the adapter 260, 265 is provided with a position pin 282, and the base housing 210 is provided with a hole 284 for receiving the position pin 282, the position pin 282 And the adapters 260 and 265 are aligned with the loading unit 220 by the combination of the holes 284.

The configuration of the single adapter 260 is shown in more detail in the perspective view of FIG. 5. According to the present invention, according to the type and size change of the semiconductor chip package, when the screw 280 is fixed to the single adapter 260 in FIGS. 4 and 5, the base housing 210 can be detached / attached and moved. This is easy. At the time of fixing, the position of the position pin 282 may be checked and inserted into the base housing 210, and then the screw 280 may be tightened.

As shown in FIG. 4, the socket for inspecting a semiconductor chip package 200 may test a 2 × 2 array, that is, four semiconductor chip packages at a time by using two single adapters 260 and one dual adapter 265. have. As another example for mounting four semiconductor chip packages, it may be configured to include four single adapters as shown in FIGS. 6 and 7. In this case, if four identical single adapters 260 having accommodating portions 266 having the same size are configured as shown in FIG. 6, four semiconductor chip packages 270 having the same size may be mounted and multi-tested. Alternatively, as shown in FIG. 7, four single adapters 261, 262, 263, and 264 each having different sized accommodation portions to mount the semiconductor chip packages 271, 272, 273, and 274 of different sizes are also configured. can do. For example, the semiconductor chip package 271 is 10 × 11, the semiconductor chip package 272 is 11 × 13, the semiconductor chip package 273 is 11 × 18, and the semiconductor chip package 274 is 10 × 11.5 (unit is mm In this way, semiconductor chip packages of different sizes can be mounted in one semiconductor chip package inspection socket 200 to be tested at a time.

Meanwhile, in order to mount four semiconductor chip packages, two dual adapters 265 may be implemented. Two semiconductor adapters may be provided in a vertical direction or two in a horizontal direction, depending on the type of semiconductor chip package. Can be configured. As in the example using the single adapter 260, it is a matter of course that the semiconductor chip package having a different size can be mounted by changing the size of the receiving portion (266).

In this way, a single or dual adapter can be used, and various sizes and types of semiconductor chip packages can be mounted by varying the size of the accommodating part. Do. Therefore, it is easy to replace the new semiconductor chip package to improve the test environment and efficiency.

As shown in FIG. 8, the semiconductor chip package 270 is mounted in the socket 200 for inspecting the semiconductor chip package when the multi-parameter board is manufactured. Conduct the connection and electrical characteristics check. Since a plurality of semiconductor chip packages can be mounted and tested at one time in one semiconductor chip package inspection socket 200, the advantage of using a narrow space and multi-testing are possible.

Compared with the related art, since the number of sockets 200 and PCB boards 290 required when constructing a multi-parameter board can be reduced, manufacturing costs can be reduced. In addition, when a new semiconductor chip package inspection process is required, an immediate response can be made by simply replacing a part, and new product analysis can be efficiently performed. In addition, as described above, the lead backer 240 of the cover housing 230 may apply independent pressure for each position, so that the height of the semiconductor chip package may be freely changed.

The present invention has been described in detail with reference to preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications may be made by those skilled in the art within the scope of the technical idea of the present invention. It is possible.

The socket for inspecting a semiconductor chip package of the present invention may be multi-tested by simultaneously mounting a plurality of semiconductor chip packages in one socket. In addition, even if the semiconductor chip package type and size is changed at each location, it is easy to install in a single or dual adapter type, so it is easy to replace the new semiconductor chip package to improve the test environment and efficiency.

The number of sockets and PCB boards required to configure a multiparameter board can be reduced, thereby reducing manufacturing costs. In addition, when a new semiconductor chip package inspection process is required, an immediate response can be made by simply replacing a part, and new product analysis can be efficiently performed.

Claims (14)

A base housing having a plurality of loading parts on which a semiconductor chip package is to be placed, and having contact pins electrically connected to the semiconductor chip package under the loading parts; A cover housing coupled to the base housing to be openable and closeable; A plurality of lead backers installed in correspondence with the loading part inside the cover housing to press the semiconductor chip package so that the semiconductor chip package placed in the loading part contacts the contact pin; And And a plurality of adapters detachably mounted to at least one of the loading parts and having an accommodating portion having a semiconductor chip package appearance size. The method of claim 1, The semiconductor chip package is a socket for semiconductor chip package, characterized in that the BGA type package. The method of claim 1, The adapter is a socket for semiconductor chip package, characterized in that the single adapter mounted to one loading unit one by one. The method of claim 1, The adapter is a socket for semiconductor chip package, characterized in that the dual adapter mounted over the two loading. The method of claim 1, The adapter is a socket for semiconductor chip package, characterized in that the mounting or detachment by screwing or detaching the base housing. The method of claim 5, The adapter is provided with a position pin and the base housing is provided with a hole for receiving the position pin, the semiconductor chip package, characterized in that the adapter is aligned with the loading portion by the combination of the position pin and the hole. Inspection socket. The method of claim 1, The adapter socket socket for semiconductor chip package, characterized in that the same size or different semiconductor chip package can be mounted. The method of claim 1, The loading unit has a 2 × 2 arrangement, and the adapter is a socket for semiconductor chip package inspection, characterized in that four single adapters mounted one by one in the loading unit. The method of claim 1, The loading unit has a 2 × 2 array, and the adapter is a combination of two single adapters mounted one by one on one loading unit and one dual adapter mounted on two loading units. . The method of claim 1, The loading unit has a 2 × 2 arrangement, wherein the adapter is a socket for semiconductor chip package, characterized in that the two dual adapters mounted over the two loading units. The method of claim 10, And the two dual adapters are arranged horizontally or vertically of the base housing according to the semiconductor chip package type. The method according to any one of claims 8 to 10, The adapter is a socket for semiconductor chip package, characterized in that the mounting or detachment by screwing or detaching the base housing. The method of claim 12, The adapter is provided with a position pin and the base housing is provided with a hole for receiving the position pin, the semiconductor chip package, characterized in that the adapter is aligned with the loading portion by the combination of the position pin and the hole. Inspection socket. The method of claim 12, The adapter socket socket for semiconductor chip package, characterized in that the same size or different semiconductor chip package can be mounted.

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