KR20060034408A - Manufacturing method of key pad for metal key insert type cellular phone - Google Patents

Manufacturing method of key pad for metal key insert type cellular phone Download PDF

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Publication number
KR20060034408A
KR20060034408A KR1020040083418A KR20040083418A KR20060034408A KR 20060034408 A KR20060034408 A KR 20060034408A KR 1020040083418 A KR1020040083418 A KR 1020040083418A KR 20040083418 A KR20040083418 A KR 20040083418A KR 20060034408 A KR20060034408 A KR 20060034408A
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KR
South Korea
Prior art keywords
key
film
metal
plate
keypad
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KR1020040083418A
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Korean (ko)
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KR100678817B1 (en
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장병월
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주식회사 소림
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Priority to KR1020040083418A priority Critical patent/KR100678817B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
    • H01H13/704—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by the layers, e.g. by their material or structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/88—Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Switches (AREA)
  • Push-Button Switches (AREA)

Abstract

본 발명은 금속키 내장형 휴대폰용 키패드 제조방법에 관한 것이다.The present invention relates to a method for manufacturing a keypad for a metal key embedded mobile phone.

본 발명은 폴리우레탄 필름(1)에 도안된 키패드 모양을 인쇄하는 필름인쇄단계와, 상기 인쇄된 필름(1)의 도안부에 지그를 이용하여 숫자나 문자등이 형성된 박판형태의 금속키(2)를 안착하여 이를 부착하는 금속키 설치단계와, 상기 금속키(2)가 부착된 필름(1)을 포밍기의 가이드홀에 안착하여 상판을 약 80~120℃, 하판을 60~110℃로 유지한 상태에서 약 5~10초동안 포밍하여 키돌출부를 형성하는 키탑성형단계와, 상기 포밍완료된 상기금속키가 부착된 필름 저면에 액상 실리콘을 약 10~20g을 주입하는 토출단계와, 상기 액상 실리콘이 토출된 패드를 성형금형틀에 안착하여 상판을 약 110~130℃, 하판을 100~120℃로 유지한 상태에서 약 80~150초동안 성형하는 성형단계와, 상기 성형완료된 패드를 제품 형상에 따라 외곽 테두리를 타발하는 커팅단계로 이루어지는 것을 특징으로 한다.The present invention provides a film printing step of printing a keypad shape designed on a polyurethane film (1), and a metal plate (2) in the form of a plate in which numbers or letters are formed using a jig in a pattern portion of the printed film (2). The metal key installation step of seating and attaching it), and the film (1) with the metal key (2) is seated in the guide hole of the forming machine, the upper plate is about 80 ~ 120 ℃, the lower plate to 60 ~ 110 ℃ A key top molding step of forming a key protrusion by forming in a maintained state for about 5 to 10 seconds, a discharging step of injecting about 10 to 20 g of liquid silicon into the bottom surface of the formed metal key-attached film, and the liquid phase A molding step of molding the pad discharged with silicon on the mold to mold for about 80 to 150 seconds while maintaining the upper plate at about 110 to 130 ° C and the lower plate at 100 to 120 ° C; According to the cutting step of punching the outer border The features.

본 발명은 키부의 상면, 저면에 숫자나 문자 등을 직접 가공, 인쇄하지 아니하고 키부의 안쪽에 금속키를 내장하여 이를 일체로 성형함으로서 메탈릭한 고급스러움을 갖도록 함은 물론 키패드의 손상없이 이를 지속적으로 사용할 수 있도록 한 매우 유용한 발명이다. The present invention does not directly process and print numbers or letters on the upper and lower surfaces of the key portion, but by embedding a metal key inside the key portion to form it integrally to have a metallic luxury as well as continuously without damaging the keypad. One very useful invention that can be used.

Description

금속키 내장형 휴대폰용 키패드 제조방법{Manufacturing method of key pad for metal key insert type cellular phone} Manufacturing method of key pad for metal key embedded mobile phone {Manufacturing method of key pad for metal key insert type cellular phone}

도 1은 본 발명의 정면도1 is a front view of the present invention

도 2는 본 발명의 공정도2 is a process diagram of the present invention

도 3은 본 발명의 블록도3 is a block diagram of the present invention

<도면의 주요부분에 대한 부호의 설명><Description of Symbols for Main Parts of Drawings>

1 : 필름 2 : 금속키1 film 2 metal key

3 : 실리콘3: silicone

본 발명은 금속키 내장형 휴대폰용 키패드 제조방법에 관한 것이다.The present invention relates to a method for manufacturing a keypad for a metal key embedded mobile phone.

본 발명은 휴대폰의 키패드를 제조함에 있어서, 키의 상면에 숫자나 문자 등을 직접 인쇄하지 아니하고 키의 안쪽에 금속키를 내장하여 이를 일체로 성형함으로서 메탈릭한 고급스러움을 갖도록 함은 물론 키패드의 손상없이 이를 지속적으로 사용할 수 있도록 한 것이다. The present invention in the manufacture of the keypad of the mobile phone, without having to print numbers or letters directly on the upper surface of the key by embedding a metal key inside the key to have a metallic luxury as well as damage to the keypad as well as damage to the keypad It can be used continuously without.

종래 제공되고 있는 휴대폰의 키패드는 주로 키부를 플라스틱사출 성형 후 도장 후 레이져 가공 또는 플라스틱 사출키, 우레탄, PC FILM, PET FILM 저면에 인쇄하여 키부를 부착하거나 포밍 또는 성형 작업으로 키부를 형성하는 것이 일반적이며 보편적이다. The keypad of the conventionally provided mobile phone is generally formed by molding the key portion after plastic injection molding and then printing it on the bottom of the laser processing or plastic injection key, urethane, PC FILM, PET FILM and attaching the key portion or forming the key portion by forming or forming operations. And universal.

그러나 이러한 종래의 키패드 제조방법은 키의 표면에 숫자나 문자 등이 직접적으로 노출되기 때문에 키를 반복 조작하게 되면 키 표면에 인쇄된 숫자나 문자 등이 쉽게 벗겨지게 되어 외관상 바람직하지 못하며 숫자나 문자의 인식이 어려워 키 조작을 원활하게 하는 것이 매우 불편하다. However, in the conventional keypad manufacturing method, numbers or letters are directly exposed on the surface of the key, so if the key is repeatedly operated, the numbers or letters printed on the surface of the key are easily peeled off, which is undesirable in appearance. It is very inconvenient to make the key operation smooth because it is difficult to recognize.

본 발명은 휴대폰의 키패드를 제조함에 있어서, 키의 상면에 숫자나 문자 등을 직접 인쇄하지 아니하고 키의 안쪽에 금속키를 내장하여 이를 일체로 성형함으로서 메탈릭한 고급스러움을 갖도록 함은 물론 키패드의 손상없이 지속적으로 사용할 수 있도록 함을 목적으로 한다.The present invention in the manufacture of the keypad of the mobile phone, without having to print numbers or letters directly on the upper surface of the key by embedding a metal key inside the key to have a metallic luxury as well as damage to the keypad as well as damage to the keypad It is intended to be able to use continuously without.

이를 위해 본 발명은 폴리우레탄 필름에 도안된 키패드 모양을 인쇄하는 필름인쇄단계와, 상기 인쇄된 필름의 도안부에 지그를 이용하여 숫자나 문자등이 형성된 박판형태의 금속키를 안착하여 이를 부착하는 금속키 설치단계와, 상기 금속키가 부착된 필름을 포밍기의 가이드홀에 안착하여 상판을 약 80~120℃, 하판을 60~110℃로 유지한 상태에서 약 5~10초동안 포밍하여 키돌출부를 형성하는 키탑성형단계와, 상기 포밍완료된 상기금속키가 부착된 필름 저면에 액상 실리콘을 약 10~20g을 주입하는 토출단계와, 상기 액상 실리콘이 토출된 패드를 성형금형틀에 안착하여 상판을 약 110~130℃, 하판을 100~120℃로 유지한 상태에서 약 80~150초 동안 성형하는 성형단계와, 상기 성형완료된 패드를 제품 형상에 따라 외곽 테두리를 타발하는 커팅단계로 이루어지는 것을 특징으로 하는 일련의 금속키 내장형 휴대폰용 키패드 제조방법을 제공함으로서 상기 목적을 달성하고자 한다.To this end, the present invention is a film printing step for printing a keypad shape designed on the polyurethane film, and using a jig to the plate portion of the printed film to form a metal key of the plate-shaped formed by numbers or letters, etc. Installing the metal key, and seating the film with the metal key in the guide hole of the forming machine to form the key for about 5 to 10 seconds while maintaining the upper plate at about 80 ~ 120 ℃, the lower plate at 60 ~ 110 ℃ A key top molding step of forming a protrusion, a discharging step of injecting about 10 to 20 g of liquid silicon into the bottom surface of the formed metal key-attached film, and a pad on which the liquid silicon is discharged are seated on a mold to form a top plate. It consists of a molding step for about 80 ~ 150 seconds in a state of maintaining about 110 ~ 130 ℃, the bottom plate at 100 ~ 120 ℃, and a cutting step of punching the outer rim according to the shape of the molded pad By providing a set of metal of the integrated cell phone keypad production method according to claim and to achieve the object.

본 발명은 폴리우레탄 필름(1)에 도안된 키패드 모양을 인쇄하는 필름인쇄단계와, 상기 인쇄된 필름(1)의 도안부에 지그를 이용하여 숫자나 문자등이 형성된 박판형태의 금속키(2)를 안착하여 이를 부착하는 금속키 설치단계와, 상기 금속키(2)가 부착된 필름(1)을 포밍기의 가이드홀에 안착하여 상판을 약 80~120℃, 하판을 60~110℃로 유지한 상태에서 약 5~10초동안 포밍하여 키돌출부를 형성하는 키탑성형단계와, 상기 포밍완료된 상기금속키가 부착된 필름 저면에 액상 실리콘을 약 10~20g을 주입하는 토출단계와, 상기 액상 실리콘이 토출된 패드를 성형금형틀에 안착하여 상판을 약 110~130℃, 하판을 100~120℃로 유지한 상태에서 약 80~150초동안 성형하는 성형단계와, 상기 성형완료된 패드를 제품 형상에 따라 외곽 테두리를 타발하는 커팅단계로 이루어지는 것을 특징으로 한다.The present invention provides a film printing step of printing a keypad shape designed on a polyurethane film (1), and a metal plate (2) in the form of a plate in which numbers or letters are formed using a jig in a pattern portion of the printed film (2). The metal key installation step of seating and attaching it), and the film (1) with the metal key (2) is seated in the guide hole of the forming machine, the upper plate is about 80 ~ 120 ℃, the lower plate to 60 ~ 110 ℃ A key top molding step of forming a key protrusion by forming in a maintained state for about 5 to 10 seconds, a discharging step of injecting about 10 to 20 g of liquid silicon into the bottom surface of the formed metal key-attached film, and the liquid phase A molding step of molding the pad discharged with silicon on the mold to mold for about 80 to 150 seconds while maintaining the upper plate at about 110 to 130 ° C and the lower plate at 100 to 120 ° C; According to the cutting step of punching the outer border The features.

이하 본 발명 금속키 내장형 휴대폰용 키패드 제조방법에 대하여 상세히 설명하면 다음과 같다.Hereinafter, a method for manufacturing a keypad for a metal key embedded mobile phone according to the present invention will be described in detail.

본 발명은 크게 필름인쇄단계와, 금속키 설치단계와, 키탑형성단계와, 토출단계와, 성형단계와, 커팅단계로 이루어지는 것을 특징으로 한다.The present invention is characterized by consisting of a film printing step, a metal key installation step, a key top forming step, a discharging step, a molding step, and a cutting step.

본 발명에 적용되는 금속키(2)의 제조는 스테인레스판(STS)을 회전기에 안착하여 회전과 동시에 스테인레스판 표면에 감광액 약 150~250g을 도포시키는 감광액 도포공정과, 상기 감광액이 도포된 스테인레스판을 건조기에서 약 10~20초동안 약 100~140℃의 온도로 건조시키는 건조공정과, 흑백필름에 라이팅부분 및 키패드 형상 외곽부가 투명부가 되고 그 나머지 부분이 부분이 블랙부가 되도록 키패드 형상을 도안된 상기 흑백 인쇄필름을 건조된 스테인레스판을 접착한 상태에서 조사기기를 통해 약 3분~10분 정도 자외선 또는 할로겐램프를 조사하는 조사공정과, 상기 조사공정에 의해 감광 완료 후 인쇄필름을 분리하여 남아 있는 도안부분이 접착력을 갖을 수 있도록 이를 무수크롬산에 딥핑(Deeping)시키는 담금공정과, 상기 담금고정이 완료된 스페인레스판을 약 30초에서 3분동안 물분사하여 이를 에어 건조시키고 감광액 부분이 잘 벗겨지지 않도록 건조기에서 110~130℃의 온도로 약 5~20분 정도 열처리하는 열처리 공정과, 치약 또는 에스크린 화공약품을 이용하여 스테인레스판 표면의 각종 먼저 및 무수크롬산 그리고 공정상 발생되는 이물질을 제거하기 위해 수행하는 이물질 제거공정과, 도금되는 도안형상이 표면에서 용이하게 이탈되지 않으면서 강하게 부착될 수 있도록 물 85-95중량%, 염화니켈 4~15중량%, 염산 0.05~0.15중량%를 혼합한 용액에 약 10~20초 딥핑한 후 스테인레스판을 음극에 그리고 니켈판을 양극에 약 1~12시간동안 니켈도금하고 상기 니켈도금 완료 후 스테인레스 표면에 무광 및 유광을 나타내기 위해 약 5~10초동안 크롬도금을 실시하는 도금공정과, 상기 도금된 스테인레스판에 보호테이프 접착하여 상기 보호테이프와 도금된 부분을 스테인레스판에서 분리하는 도금금속키 분리공정을 통해 완성된다. In the manufacture of the metal key 2 applied to the present invention, the photoresist coating process of applying about 150 to 250 g of the photoresist on the surface of the stainless plate at the same time as the stainless plate (STS) is mounted on the rotating machine, and the stainless plate coated with the photoresist Drying process to dry at a temperature of about 100 ~ 140 ℃ for about 10 to 20 seconds in a dryer, and the keypad shape so that the writing portion and the keypad shape outer portion in the black and white film and the remaining portion is a black portion An irradiation step of irradiating ultraviolet or halogen lamps for about 3 to 10 minutes through an irradiation apparatus in a state where the black and white printing film is adhered to the dried stainless plate, and after the completion of the photosensitive by the irradiation process, the print film is separated. Soaking process of dipping (Deeping) in chromic anhydride so that the design part can have an adhesive force, and Spanishless completed the immersion fixing Water spray for about 30 seconds to 3 minutes to air dry it and heat-treat it at 110 ~ 130 ℃ for about 5 ~ 20 minutes in order to prevent the photoresist part from peeling off well. The foreign material removal process is performed to remove various first and chromic anhydrides and other foreign matters generated on the surface of the stainless steel plate, and the water to be strongly attached without being easily detached from the surface. After dipping for about 10 to 20 seconds in a solution containing a weight%, nickel chloride 4 ~ 15% by weight, hydrochloric acid 0.05 ~ 0.15% by weight, nickel plated to the negative electrode and nickel plate to the positive electrode for about 1 to 12 hours After the nickel plating is completed, a plating process of performing chromium plating for about 5 to 10 seconds in order to show matt and gloss on the stainless surface, and a protective tape on the plated stainless plate. Adhesion to the plated parts and the protective tape is accomplished through metal plating key separation step of separating from the stainless steel plate.

본 발명은 먼저 폴리우레탄 필름(1)에 미리 도안된 키패드 모양을 인쇄하는 인쇄하게 되며 상기 인쇄된 필름(1)에 도안부에 지그를 이용하여 숫자나 문자등이 형성된 박판형태의 금속키(2)를 안착하여 이를 움직이지 않도록 부착하게 된다. The present invention first prints the keypad pattern previously designed on the polyurethane film (1) to print, and the printed metal film (2) in the form of a plate or a thin metal plate (2) formed by using a jig in the pattern portion (2) ) Will be attached so that it does not move.

한편, 상기 금속키(2)가 부착된 필름(1)을 포밍기의 가이드홀에 안착하여 상판을 약 80~120℃, 하판을 60~110℃로 유지한 상태에서 약 5~10초동안 포밍하여 키돌출부를 형성하게 되며 상기 포밍완료된 상기금속키가 부착된 필름 저면에 액상 실리콘을 약 10~20g을 토출하게 되며 상기 액상 실리콘이 토출된 패드를 성형금형틀에 안착하여 상판을 약 110~130℃, 하판을 100~120℃로 유지한 상태에서 약 80~150초동안 성형하여(2)를 고정시킴으로서 금속키(2)가 키돌출부 안쪽에 영구적으로 위치하게 되며 이때 키돌출부의 외측으로는 상기 금속키(2)가 노출되지 않는 상태로 필름(1)에 의해 안전하게 보존되고 또한 금속키(2)에 형성된 숫자나 문자가 용이하게 식별가능하기 때문에 키를 반복적으로 조작하더라도 키패드부의 숫자나 문자의 상태를 최초의 상태와 같은 상태로 양호히 유지할 수 있게 되는 것이다. Meanwhile, the film 1 with the metal key 2 attached thereto is seated in the guide hole of the forming machine to form the upper plate at about 80 to 120 ° C. and the lower plate at 60 to 110 ° C. for about 5 to 10 seconds. To form a key protrusion, and discharge about 10 to 20 g of liquid silicon onto the bottom surface of the formed metal key attached film. By holding the bottom plate at 100-120 ° C. for about 80-150 seconds, the metal key 2 is permanently positioned inside the key projection by fixing the 2 to the inside of the key projection. Even if the keys are repeatedly operated, the numbers or letters of the keypad part can be easily stored because the metal key 2 is safely stored by the film 1 without being exposed and the numbers or letters formed on the metal keys 2 can be easily identified. State same as original state It will be able to maintain well.

그리고 또 다른 방법으로는 PC,PET FILM에 미리 도안된 키패드 모양을 인쇄하는 인쇄하게 되며 상기 인쇄된 필름(1)에 도안부에 지그를 이용하여 숫자나 문자등이 형성된 박판형태의 금속키(2)를 안착하여 이를 움직이지 않도록 부착하게 된다. And another method is to print the keypad pattern previously designed on the PC, PET FILM and to print a thin metal key (2) in which a number or letters are formed using a jig in the pattern on the printed film (2) ) Will be attached so that it does not move.

한편, 상기 금속키(2)가 부착된 필름(1)을 포밍기의 가이드홀에 안착하여 상판을 약 80~120℃, 하판을 60~110℃로 유지한 상태에서 약 5~10초동안 포밍하여 키돌출부를 형성하게 되며 상기 포밍완료된 상기금속키가 부착된 필름 패드를 사출성형금형틀에 안착하여 상판을 약 110~130℃, 하판을 100~120℃로 유지한 상태에서 약 80~150초동안 성형하게 되는데 이때의 사출조건은 노즐부 265℃, heat 1265℃, h2 260℃, h3 250℃ 금형온도 고정측 60℃, 가동측 20℃(pc,pet film고정부) 1차사출조건 : 압력90㎏/㎤, 속도100㎜/sec, 위치20㎜, 시간5sec, 2차 50, 60, 5, 1.2가 적당하며 냉각시간은 15sec, 계랑조건 압력 50, 속도 60, 위치 5, 시간 30을 유지하는 것이 바람직하다.Meanwhile, the film 1 with the metal key 2 attached thereto is seated in the guide hole of the forming machine to form the upper plate at about 80 to 120 ° C. and the lower plate at 60 to 110 ° C. for about 5 to 10 seconds. To form a key protrusion and seat the film pad with the metal key formed thereon in an injection mold, and hold the upper plate at about 110 to 130 ° C. and the lower plate at 100 to 120 ° C. for about 80 to 150 seconds. The injection conditions at this time are nozzle part 265 ℃, heat 1265 ℃, h2 260 ℃, h3 250 ℃ mold temperature fixed side 60 ℃, movable side 20 ℃ (pc, pet film fixing) 90kg / cm3, speed 100mm / sec, position 20mm, time 5sec, secondary 50, 60, 5, 1.2 are suitable, cooling time is 15sec, maintenance condition pressure 50, speed 60, position 5, time 30 It is desirable to.

이와 같은 사출조건을 통해 성형된 패드는 제품 형상에 따라 외곽 테두리를 타발하는 커팅단계를 통해 최종적으로 완성되며 이러한 구조로 완성되는 키패드는 키돌출부 안쪽에 매립된 금속키(2)에 의해 메탈릭한 고급스러움도 갖추게 될 뿐만 아니라 키를 반복적으로 조작하더라고 키의 숫자나 문자가 절대 손상될 염려없이 키패드부의 숫자나 문자의 상태를 최초의 상태와 같은 상태로 양호히 유지할 수 있게 되는 것이다. The pad formed through the injection condition is finally completed through the cutting step of punching the outer edge according to the shape of the product. The keypad completed with this structure is metallic high quality by the metal key (2) embedded inside the key protrusion. Not only will it be possible to operate the keys repeatedly, but the numbers and letters on the keypad can be maintained in the same state as the original state without fear of damage to the keys.

이상에서는 본 발명의 바람직한 실시예에 대하여 도시하고 설명하였으나 본 발명은 상기한 실시예에 한정되지 아니하며 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 실시가 가능한 것은 물론이고 그와 같은 변경은 기재된 청구범위 내에 있게 된다.Although the above has been illustrated and described with respect to the preferred embodiment of the present invention, the present invention is not limited to the above-described embodiment without departing from the gist of the present invention claimed in the claims, having ordinary skill in the art to which the present invention pertains. Anyone can make various modifications as well as such changes are within the scope of the appended claims.

본 발명은 키의 상면에 숫자나 문자 등을 직접 인쇄하지 아니하고 키의 안쪽에 금속키를 내장하여 이를 일체로 성형함으로서 메탈릭한 고급스러움을 갖도록 함은 물론 키패드의 손상없이 이를 지속적으로 사용할 수 있도록 한 매우 유용한 발 명이다.


















The present invention is to provide a metallic luxury as well as to continuously use it without damaging the keypad by embedding a metal key inside the key without integrally printing numbers or letters on the upper surface of the key. Very useful invention.


















Claims (1)

폴리우레탄 필름(1)에 도안된 키패드 모양을 인쇄하는 필름인쇄단계와, 상기 인쇄된 필름(1)의 도안부에 지그를 이용하여 숫자나 문자등이 형성된 박판형태의 금속키(2)를 안착하여 이를 부착하는 금속키 설치단계와, 상기 금속키(2)가 부착된 필름(1)을 포밍기의 가이드홀에 안착하여 상판을 약 80~120℃, 하판을 60~110℃로 유지한 상태에서 약 5~10초동안 포밍하여 키돌출부를 형성하는 키탑성형단계와, 상기 포밍완료된 상기금속키가 부착된 필름 저면에 액상 실리콘을 약 10~20g을 주입하는 토출단계와, 상기 액상 실리콘이 토출된 패드를 성형금형틀에 안착하여 상판을 약 110~130℃, 하판을 100~120℃로 유지한 상태에서 약 80~150초동안 성형하는 성형단계와, 상기 성형완료된 패드를 제품 형상에 따라 외곽 테두리를 타발하는 커팅단계로 이루어지는 것을 특징으로 하는 금속키 내장형 휴대폰용 키패드 제조방법.A film printing step of printing a keypad shape designed on the polyurethane film 1, and a thin plate-shaped metal key 2 having numbers or letters formed thereon by using a jig in a pattern portion of the printed film 1 Metal key installation step for attaching the same, and the film 1 attached with the metal key 2 is seated in the guide hole of the forming machine to maintain the upper plate at about 80 to 120 ° C. and the lower plate at 60 to 110 ° C. A key top forming step of forming a key protrusion by forming for about 5 to 10 seconds in a step, a discharging step of injecting about 10 to 20 g of liquid silicon into the bottom surface of the formed metal key-attached film, and discharging the liquid silicon Forming the pads on the mold and molding the upper plate for about 80 to 150 seconds while maintaining the upper plate at about 110 to 130 ° C and the lower plate at 100 to 120 ° C; Characterized by a cutting step to punch the rim Manufacturing method for a metal keypad keys embedded mobile phones.
KR1020040083418A 2004-10-19 2004-10-19 Manufacturing method of key pad for metal key insert type cellular phone KR100678817B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100787382B1 (en) * 2006-03-21 2007-12-24 주식회사 쎈스테크 A sheet-type key-pad assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100787382B1 (en) * 2006-03-21 2007-12-24 주식회사 쎈스테크 A sheet-type key-pad assembly

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