KR20060033074A - A pcb for mobile phone - Google Patents

A pcb for mobile phone Download PDF

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Publication number
KR20060033074A
KR20060033074A KR1020040082010A KR20040082010A KR20060033074A KR 20060033074 A KR20060033074 A KR 20060033074A KR 1020040082010 A KR1020040082010 A KR 1020040082010A KR 20040082010 A KR20040082010 A KR 20040082010A KR 20060033074 A KR20060033074 A KR 20060033074A
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KR
South Korea
Prior art keywords
shield
circuit board
printed circuit
contact
installation portion
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KR1020040082010A
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Korean (ko)
Inventor
이유란
Original Assignee
브이케이 주식회사
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Priority to KR1020040082010A priority Critical patent/KR20060033074A/en
Publication of KR20060033074A publication Critical patent/KR20060033074A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

본 발명은 이동통신 단말기에 사용되는 인쇄회로기판(1)에 관한 것으로, 인쇄회로기판 쉴드설치부(18)에 쉴드설치홈(18a)이 형성되어 쉴드(30)의 밑면(30a) 뿐 아니라 양 측면(30b)의 일부도 쉴드설치부(18)와 접촉(3면 접촉)이 가능하게 되어 쉴드(30)와 쉴드설치부(18)의 접촉 면적이 증가하고, 쉴드 밑면(30a)의 일부가 쉴드설치부(18)와 접촉하지 않게 되는 경우에도 양 측면(30b)의 접촉에 의하여 쉴드(30)와 쉴드설치부(18)가 확실하게 접촉하게 되어 확실한 차폐가 이루어지는 인쇄회로기판(1)을 제공하는 것이다.
The present invention relates to a printed circuit board (1) used in a mobile communication terminal, the shield mounting groove (18a) is formed in the printed circuit board shield installation portion 18, the amount of the bottom 30a of the shield 30, as well as both A part of the side surface 30b can also come into contact with the shield installation portion 18 (three-side contact), so that the contact area between the shield 30 and the shield installation portion 18 increases, and a part of the shield bottom surface 30a Even when the shield installation portion 18 is not in contact with the shield installation portion 18, the shield 30 and the shield installation portion 18 are firmly contacted by the contact of both side surfaces 30b, so that the shielded printed circuit board 1 is secured. To provide.

인쇄회로기판, 고주파처리부분, 기저대역처리부분, 쉴드, 차폐Printed Circuit Board, High Frequency Processing, Baseband Processing, Shield, Shielding

Description

이동통신 단말기용 인쇄회로기판{A PCB for mobile phone} Printed circuit board for mobile communication terminal {A PCB for mobile phone}             

도1 은 이동통신 단말기용 인쇄회로기판(PCB : Printed Circuit Board)을 개략적으로 도시한 평면도이다.1 is a plan view schematically illustrating a printed circuit board (PCB) for a mobile communication terminal.

도2 는 도1 의 "A"부(쉴드 설치부) 단면도이다.FIG. 2 is a cross-sectional view of the portion “A” (shield mounting portion) of FIG. 1.

도3 은 본 발명에 따른 바람직한 실시 예를 도시한 이동통신 단말기용 인쇄회로기판을 개략적으로 도시한 분해 평면도이다.Figure 3 is an exploded plan view schematically showing a printed circuit board for a mobile communication terminal showing a preferred embodiment according to the present invention.

도4 는 쉴드를 조립한 상태에서의 도3 "B"부 단면도이다.
Fig. 4 is a sectional view taken along the line “B” of Fig. 3 in a state where the shield is assembled.

** 도면 주요 부호에 대한 설명 **** Description of the main symbols **

1 : 이동통신 단말기용 인쇄회로기판 10 : 고주파처리부분           1: Printed circuit board for mobile communication terminal 10: High frequency processing part

12 : 부품 14 : 솔더막           12: part 14: solder film

16 : 그라운드패턴           16: ground pattern

18 : 쉴드설치부 18a : 쉴드설치홈           18: shield installation unit 18a: shield installation groove

20 : 기저대역처리부분 22 : 부품           20: baseband processing part 22: parts

30 : 쉴드
30: shield

본 발명은 인쇄회로기판에 관한 것으로, 보다 상세하게는 인쇄회로기판 쉴드설치부에 쉴드설치홈을 형성하여 차폐를 확실하게 하고 그라운드를 확실하게 하기 위한 이동통신 단말기용 인쇄회로기판에 관한 것이다.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly, to a printed circuit board for a mobile communication terminal for forming a shield mounting groove in a printed circuit board shield mounting portion to secure shielding and to secure ground.

도1 은 종래 기술에 의한 이동통신 단말기용 인쇄회로기판을 개략적으로 도시한 것이며, 도2 는 도1 "A"의 쉴드설치부와 쉴드설치부에 설치되는 쉴드를 개략적으로 도시한 단면도이다. FIG. 1 schematically shows a printed circuit board for a mobile communication terminal according to the prior art, and FIG. 2 is a cross-sectional view schematically showing a shield installed in the shield installation unit and the shield installation unit of FIG.

이동통신 단말기는 고주파처리부분(Radio Frequency Part)과 기저대역처리부분(Base Band Part)으로 나눌 수 있으며, 도1 에 도시된 바와 같이 종래 기술에 의한 이동통신 단말기용 인쇄회로기판(100)은 고주파처리부분(110)과 기저대역처리부분(120)을 포함하는 하나의 인쇄회로기판으로 사용하는 것이 일반적이다.The mobile communication terminal may be divided into a radio frequency part and a base band part, and as shown in FIG. 1, the printed circuit board 100 for a mobile communication terminal according to the prior art has a high frequency. It is common to use one printed circuit board including the processing portion 110 and the baseband processing portion 120.

고주파처리부분(110)에는 송수신 전파를 주파수 대역으로 분리하는 듀플렉서 및 고주파 대역을 저주파 대역으로 낮추기 위한 IF(INTERMEDIATE FREQUENCY)와 같은 부품(112)들이 실장된다. 그리고 고주파처리부분(110)에 실장되는 부품(112)들은 아날로그 신호를 제어하기 때문에 다른 칩에 의해 발생하는 전자기파(EMI)에 영향을 많이 받기 때문에 부품(112)들의 원활한 아날로그 출력과 특성을 보장하기 위해서는 다른 전자기파로부터 보호해야 할 필요가 있다. The high frequency processing part 110 includes components such as a duplexer for separating transmission and reception radio waves into a frequency band and an IF (INTERMEDIATE FREQUENCY) for lowering the high frequency band to the low frequency band. In addition, since the components 112 mounted on the high frequency processing part 110 are controlled by the analog signal, they are affected by the electromagnetic wave (EMI) generated by other chips, thereby ensuring smooth analog output and characteristics of the components 112. In order to protect it from other electromagnetic waves.                         

따라서 인쇄회로기판(100)에는 고주파처리부분(110)과 기저대역처리부분(120)을 분리하고 고주파처리부분(110)에 실장된 각 부품(112)들 사이에 발생하는 전자기파 간섭을 차단하기 위한 수단이 설치된다. 전자기파 간섭을 차단하기 위한 수단으로는 쉴드(130, Shield)가 대표적인 예이다.Accordingly, the printed circuit board 100 separates the high frequency processing portion 110 and the baseband processing portion 120 and blocks electromagnetic interference generated between the components 112 mounted on the high frequency processing portion 110. Means are installed. Shield is a representative example as a means for blocking the electromagnetic interference.

도2 에 도시된 바와 같이 인쇄회로기판(100)에는 고주파처리부분(110)에 존재하는 그라운드패턴(116) 일부분의 솔더막(114)를 오픈시켜서 도금한 쉴드설치부(118)에 전자기파 간섭 차단 수단인 쉴드(130)를 접촉, 고정시키고 있다. As shown in FIG. 2, in the printed circuit board 100, electromagnetic wave interference is blocked in the shield installation part 118 which is plated by opening a solder film 114 of a part of the ground pattern 116 present in the high frequency processing part 110. The shield 130 which is a means is contacted and fixed.

상기 쉴드설치부(118)에 설치된 쉴드(130)는 그라운드를 강화시켜주는 기능을 하며 고주파처리부분(110)에 설치되는 부품(112) 들 간의 전자기파 간섭을 차폐하는 기능을 하게 된다.The shield 130 installed in the shield installation unit 118 serves to strengthen the ground and shields electromagnetic interference between the components 112 installed in the high frequency processing unit 110.

도1 에서 미설명 부호 122는 기저대역처리부분(120)에 설치되는 부품을 개략적으로 도시한 것이다.
Reference numeral 122 in FIG. 1 schematically shows a component installed in the baseband processing portion 120.

그러나 종래 기술에 의한 인쇄회로기판(100)의 쉴드설치부(118)와 쉴드(130)는 쉴드 밑면(130a)에서 쉴드설치부(118)와 단순 평면 접촉을 하게 되어 그라운드 효과가 확실하지 않게 되며, 쉴드 밑면(130a)의 가공 상태에 따라 쉴드 밑면(130a)의 일부가 쉴드설치부(118)와 접촉하지 않게 될 수 있기 때문에 완벽한 차폐 효과를 기대할 수 없는 문제점이 있었다.
However, the shield installation portion 118 and the shield 130 of the prior art printed circuit board 100 is in simple flat contact with the shield installation portion 118 at the bottom surface (130a) of the ground effect is not sure. According to the processing state of the shield bottom surface 130a, a part of the shield bottom surface 130a may not come into contact with the shield installation portion 118, so there was a problem in that a perfect shielding effect could not be expected.

본 발명은 상기와 같은 문제점을 해결하기 위한 것으로 쉴드설치부와 쉴드가 확실하게 접촉을 유지하게 함으로써 그라운드를 확실하게 하며, 완벽한 차폐가 이루어지는 이동통신 단말기용 인쇄회로기판을 제공하려는데 목적이 있는 것이다.
An object of the present invention is to provide a printed circuit board for a mobile communication terminal, which ensures the ground by ensuring that the shield installation unit and the shield are securely in contact with each other.

본 발명은 상기와 같은 목적을 달성하기 위하여 고안된 것으로서, 쉴드가 설치되는 쉴드설치부에 쉴드설치홈이 형성된 이동통신 단말기용 인쇄회로기판을 제공한다. 이동통신 단말기에 있어서 본 발명에 따르는 쉴드설치부에 쉴드설치홈이 가공된 인쇄회로기판을 사용하는 경우에는 쉴드와 쉴드설치부 사이에 접촉이 확실하게 이루어져 그라운드 및 각 부품 간의 차폐를 확실하게 할 수 있다.
The present invention has been devised to achieve the above object, and provides a printed circuit board for a mobile communication terminal in which a shield installation groove is formed in a shield installation portion in which a shield is installed. In the case of using a printed circuit board in which a shield mounting groove is machined in the shield mounting portion according to the present invention, the mobile communication terminal can securely contact the shield and the shield mounting portion to ensure shielding between the ground and each component. have.

상기 기술적 과제를 달성하기 위한 본 발명의 구체적인 수단으로는 As a specific means of the present invention for achieving the above technical problem

쉴드설치부를 구비하는 고주파처리부분, 상기 쉴드설치부에 설치되는 쉴드, 기저대역처리부분을 포함하여 구성되는 인쇄회로기판에 있어서, In the printed circuit board comprising a high frequency processing portion having a shield installation portion, a shield provided in the shield installation portion, a baseband processing portion,

상기 고주파처리부분의 쉴드설치부에는 상기 쉴드와 접촉 면적을 증가시키기 위하여 쉴드설치홈이 형성되며, The shield installation portion of the high frequency treatment portion is provided with a shield installation groove to increase the contact area with the shield,

상기 쉴드는 밑면 및 양 측면의 일부가 상기 고주파처리부분의 쉴드설치부와 접촉하게 된다.The shield is in contact with the shield installation portion of the high frequency treatment portion of the bottom surface and both sides.

그리고 상기 쉴드와 고주파처리부분 쉴드설치부의 접촉을 더욱 더 확실하게 하기 위하여 고주파처리부분에 형성되는 쉴드설치홈의 폭은 상기 쉴드의 두께와 같거나 좁게 형성하는 것도 가능하다.
In order to further ensure contact between the shield and the high frequency shield portion, the width of the shield mounting groove formed in the high frequency wave treatment portion may be equal to or smaller than the thickness of the shield.

이하, 도면을 참조하여 본 발명에 따르는 바람직한 실시 예를 상세하게 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

종래 기술과 동일한 작용을 하는 구성 및 기술 내용에 대하여는 상세한 설명을 생략한다.Detailed descriptions of components and technical contents which perform the same functions as the prior art will be omitted.

도3 은 본 발명의 실시 예에 따르는 이동통신 단말기용 인쇄회로기판(1)을 개략적을 도시한 분해 평면도이며, 도4 는 인쇄회로기판(1) 쉴드설치부(18)에 쉴드(30)를 설치한 개략적인 일부 단면도이다.FIG. 3 is an exploded plan view schematically illustrating a printed circuit board 1 for a mobile communication terminal according to an embodiment of the present invention, and FIG. 4 shows a shield 30 in the shield installation unit 18 of the printed circuit board 1. Some schematic cross-sections installed.

도3 및 도4 에 도시된 바와 같이 인쇄회로기판(1)의 고주파처리부분(10)에는 상기 쉴드(30)를 설치하기 위한 쉴드설치부(18)가 마련되는데, 본 발명에서는 상기와 같이 접촉을 증가시키기 위햐여 쉴드설치부(18)에 쉴드설치홈(18a)를 형성한다. 이러한 쉴드설치홈(18a)을 형성하기 위해 고주파처리부분(10)의 그라운드 설계 시 쉴드(30)의 일단과 접촉되는 부위, 즉 그라운드패턴(16) 일부분을 설정한 두께(삽입될 쉴드의 일단 두께)만큼 드릴링하여 쉴드설치홈을 형성하게 된다. 3 and 4, the high frequency processing portion 10 of the printed circuit board 1 is provided with a shield installation portion 18 for installing the shield 30. In the present invention, the contact as described above is provided. In order to increase the number of shield installation grooves (18a) is formed in the shield installation portion (18). In order to form such a shield installation groove 18a, a portion of the high frequency processing portion 10 that is in contact with one end of the shield 30, that is, a part of the ground pattern 16 that is set (the thickness of the shield to be inserted) Drill by) to form the shield installation groove.

도4 를 참조하면, 쉴드설치부(18)에 접촉되는 쉴드(30)는 쉴드설치부(18)에 마련된 쉴드설치홈(18a)에 그 일부가 삽입되는 형태로 접촉(솔더링 등)하게 된다. 이때에는 쉴드(30)의 밑면(30a)과 양 측면(30b)의 일부가 쉴드설치홈(18a)의 내면과 접촉됨에 따라 쉴드설치부(18)와 쉴드(30) 간에는 그만큼 넓은 접촉면이 형성된 다. Referring to FIG. 4, the shield 30 in contact with the shield installation unit 18 is in contact with the shield installation groove 18a provided in the shield installation unit 18 in such a manner that a part thereof is inserted (soldering, etc.). At this time, as a part of the bottom 30a and both sides 30b of the shield 30 is in contact with the inner surface of the shield installation groove 18a, a wide contact surface is formed between the shield installation unit 18 and the shield 30. .

도4 에서 미설명 부호 14 는 그라운드패턴(16) 일부분인 솔더막을 나타내며, 도4 에서는 단면 형상이 사각형인 쉴드설치홈(18a)를 도시하고 있으나 이에 한정되는 것이 아니며 쉴드(30)의 밑면(30a)의 형상에 따라 다양한 형태의 쉴드설치홈(18a)을 형성하는 것이 가능하다.
In FIG. 4, reference numeral 14 denotes a solder film which is a part of the ground pattern 16. In FIG. 4, a shield installation groove 18a having a rectangular cross-sectional shape is illustrated in FIG. 4, but the present invention is not limited thereto, and the bottom surface 30a of the shield 30 is shown. It is possible to form various types of shield installation groove (18a) according to the shape of).

이상에서는 본 발명의 일 실싱 예에 한정하여 설명하였지만, 본 발명의 권리는 이에 한정되지 않으며 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있는 정도까지 확대 해석하여야 할 것이다.
In the above description, the present invention is limited to one example of silencing, but the rights of the present invention are not limited thereto, and the present invention should be broadly interpreted to the extent that a person skilled in the art can easily carry out the present invention.

상기 기재한 본 발명에 따른 이동통신 단말기용 인쇄회로기판은 고주파처리부분의 쉴드설치부에 쉴드설치홈이 형성되어 있으므로 쉴드의 밑면 뿐 아니라 양 측면의 일부도 쉴드설치부와 접촉하게 되어 쉴드의 접촉 면적이 증가하고, 쉴드 밑면의 일부가 쉴드설치부가 접촉하지 않게 되는 경우에도 양 측면의 접촉에 의하여 쉴드와 쉴드설치부가 확실하게 접촉하게 되어 확실한 차폐가 이루어지며 그라운드 효과를 강화할 수 있는 효과가 있다.
In the printed circuit board for a mobile communication terminal according to the present invention described above, since the shield installation groove is formed in the shield installation portion of the high frequency processing portion, not only the bottom surface of the shield but also a part of both sides thereof is in contact with the shield installation portion. Even if the area is increased and a part of the bottom of the shield does not come into contact with the shield installation part, the shield and the shield installation part are firmly contacted by the contact of both sides, so that the shielding is secured and the ground effect is enhanced.

Claims (3)

쉴드설치부를 구비하는 고주파처리부분, 상기 쉴드설치부에 설치되는 쉴드, 기저대역처리부분을 포함하여 구성되는 인쇄회로기판에 있어서, In the printed circuit board comprising a high frequency processing portion having a shield installation portion, a shield provided in the shield installation portion, a baseband processing portion, 상기 고주파처리부분의 쉴드설치부에는 상기 쉴드와 접촉 면적을 증가시키기 위하여 쉴드설치홈이 형성되는 것을 특징으로 하는 이동통신 단말기용 인쇄회로기판.The shield installation portion of the high frequency processing portion is a printed circuit board for a mobile communication terminal, characterized in that the shield installation groove is formed to increase the contact area with the shield. 제1 항에 있어서, According to claim 1, 상기 쉴드는 밑면 및 양측면의 일부가 상기 고주파처리부분 쉴드설치부와 접촉하는 것을 특징으로 하는 이동통신 단말기용 인쇄회로기판.The shield is a printed circuit board for a mobile communication terminal, characterized in that a portion of the bottom and both sides in contact with the high frequency shield portion installation portion. 제1 항 또는 제2 항 중 어느 한 항에 있어서,The method according to claim 1 or 2, 상기 고주파처리부분에 형성되는 쉴드설치홈의 폭은 상기 쉴드의 두께와 같거나 좁게 형성되는 것을 특징으로 하는 이동통신 단말기용 인쇄회로기판.The width of the shield installation groove formed in the high frequency processing portion is a printed circuit board for mobile communication terminal, characterized in that formed in the same or narrower than the thickness of the shield.
KR1020040082010A 2004-10-14 2004-10-14 A pcb for mobile phone KR20060033074A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170071834A (en) * 2015-12-16 2017-06-26 엘지이노텍 주식회사 Camera module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170071834A (en) * 2015-12-16 2017-06-26 엘지이노텍 주식회사 Camera module

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