KR100488417B1 - Printed circuit board shield design patten in the mobile communication phone - Google Patents
Printed circuit board shield design patten in the mobile communication phone Download PDFInfo
- Publication number
- KR100488417B1 KR100488417B1 KR10-2003-0044609A KR20030044609A KR100488417B1 KR 100488417 B1 KR100488417 B1 KR 100488417B1 KR 20030044609 A KR20030044609 A KR 20030044609A KR 100488417 B1 KR100488417 B1 KR 100488417B1
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- South Korea
- Prior art keywords
- board
- shield
- mobile communication
- printed circuit
- keypad
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- 238000010295 mobile communication Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
본 발명은 인쇄회로기판의 메인보드에 별도의 쉴드캔을 장착하지 않고, 메인보드상에 부착되는 키패드 보드의 저면에 쉴드패턴을 형성하여 쉴드캔을 대용함으로써, 이동통신 단말기의 두께를 최소화하면서, 각종 회로부품간의 간섭 및 전자파장애을 신뢰적으로 방지하며, 제품단가를 감소시킬 수 있는 이동통신 단말기에 있어서의 인쇄회로기판 쉴드패턴구조에 관한 것이다.The present invention forms a shield pattern on the bottom surface of the keypad board attached to the main board without replacing the shield can on the main board of the printed circuit board, and replaces the shield can, thereby minimizing the thickness of the mobile communication terminal. The present invention relates to a printed circuit board shield pattern structure in a mobile communication terminal that can reliably prevent interference and electromagnetic interference between various circuit components and reduce product cost.
본 발명은, 각종 회로부품이 실장된 메인보드; 상기 메인보드의 상면에 안착되며, 주요 기능신호를 보내기 위한 기능버튼이 구비된 키패드 보드; 및 상기 키패드 보드의 저면에 형성되며, 회로부품간의 간섭 및 전자파장애를 접지로 흐르도록 하기 위한 쉴드동판을 포함하는 이동통신 단말기에 있어서의 인쇄회로기판 쉴드패턴구조를 제공한다. The present invention is a main board mounted with various circuit components; A keypad board seated on an upper surface of the main board and provided with a function button for sending a main function signal; And a shield copper plate formed on a bottom surface of the keypad board, the shield copper plate for flowing interference and electromagnetic interference between circuit components to the ground.
Description
본 발명은 이동통신 단말기에 있어서 RF단의 RX와 TX간의 간섭을 막고 전자파장애(electromagnetic interference:EMI)를 방지하는 쉴드구조에 관한 것으로, 더욱 상세하게는 기존의 인쇄회로기판의 메인보드에 부착된 쉴드캔을 패턴구조로 형성하여 메인보드 및 키패드보드 부착두께를 감소시키고, 단가를 절감할 수 있는 이동통신 단말기의 인쇄회로기판 쉴드패턴구조에 관한 것이다. The present invention relates to a shield structure that prevents interference between RX and TX of an RF terminal and prevents electromagnetic interference (EMI) in a mobile communication terminal. More particularly, the present invention relates to a main board of a conventional printed circuit board. The present invention relates to a shield pattern structure of a printed circuit board of a mobile communication terminal capable of reducing the thickness of the main board and keypad board and reducing the unit cost by forming the shield can in a pattern structure.
현대의 통신기술 발달에서 가장 주목할 만한 것 중의 하나가 무선통신기기 예컨대 개인휴대 통신의 등장이며, 이러한 개인휴대 통신으로 가장 대표적인 것이 이동통신 단말기 및 호출기 그리고 가정용 무선 전화기를 예를 들 수 있다. One of the most remarkable things in the development of modern communication technology is the emergence of wireless communication devices such as personal mobile communication, and the most representative examples of such personal mobile communication are mobile communication terminals, pagers, and home wireless telephones.
이러한 무선 통신기기에 있어서, 내부에 내장된 회로기판상에는 많은 회로부품이 설치되고 있는 바, 이 회로부품을 보호하고 특히 작동과정에서 발생되는 전자파를 차폐하기 위한 구조를 필요로 하고 있다. 이를 위하여 통상적으로 도1에 도시된 바와 같이 메인보드(10)상에 쉴드캔(shield can)(20)를 안착시켜 이를 통해 RF단에서의 RX와 TX간의 간섭을 막고, 전자파 장애(EMI)에 관한 사항을 해결하고 있다. In such a wireless communication device, many circuit components are provided on a circuit board embedded therein, and therefore, a structure for protecting the circuit components and particularly shielding electromagnetic waves generated during operation is required. To this end, as shown in FIG. 1, a shield can 20 is mounted on the main board 10 to prevent interference between RX and TX at an RF terminal and to prevent electromagnetic interference (EMI). I am solving the matter.
이를 좀더 상세히 설명하면, 도1에서와 같이 메인보드(10)상면에는 가장자리면을 따라 소정 패턴 형상으로 납 패턴(11)이 형성되며, 이 납 패턴(11)상에는 즉, 네 모서리부와 인접된 부위에는 관통구멍(미도시)이 형성되어 쉴드캔(20)을 끼워 고정한다.In more detail, as shown in FIG. 1, the lead pattern 11 is formed on the upper surface of the main board 10 in a predetermined pattern shape along the edge surface, that is, the four corners are adjacent to the lead pattern 11. A through hole (not shown) is formed in the portion to fix the shield can 20.
이 메인보드(10)상에는 쉴드캔(20)가 안착되어지는 바, 이 쉴드캔(20)은 메인보드(10)상면에 형성된 납 패턴(11)에 의해 메인보드(10)와 연결되는 구조를 취하고 있다. The shield can 20 is seated on the main board 10. The shield can 20 has a structure in which the shield can 20 is connected to the main board 10 by a lead pattern 11 formed on an upper surface of the main board 10. Getting drunk.
또한 쉴드캔(20)상에는 도2에서와 같이 키패드 보드(30)가 안착되어 도3 및 도4에 도시된 바와 같이 인쇄회로기판 완성물이 된다.In addition, a keypad board 30 is seated on the shield can 20 as shown in FIG. 2 to form a printed circuit board completed as shown in FIGS. 3 and 4.
그러나 이와같은 종래 쉴드 구조에 있어서는, 메인보드(10)상에 쉴드캔(20)이 놓여지고 또 그 위에 키패드보드(30)가 놓여지기 때문에 자연히 이동통신 단말기의 두께를 두껍게 만드는 요소로 작용하여 근래에 추구하고 있는 이동통신 단말기의 소형화 및 초슬림화 추세에 역행하는 문제점이 있으며, 이동통신 단말기의 제조단가를 상승시키는 요인으로 작용하는 문제점이 있다. However, in such a conventional shield structure, since the shield can 20 is placed on the main board 10 and the keypad board 30 is placed thereon, it acts as an element that naturally thickens the thickness of the mobile communication terminal. There is a problem contrary to the trend toward miniaturization and ultra-slimization of the mobile communication terminal, which has been pursued, and there is a problem that acts as a factor to increase the manufacturing cost of the mobile communication terminal.
또한, 도1에서와 같이 메인보드(10)상에 쉴드캔(20)의 레그를 끼워 삽입되도록 마련된 관통구멍 부분에 납 패턴(11)이 형성되어 있지 않기 때문에 부분적으로 쉴드 효과가 떨어지는 문제점이 야기된다. In addition, since the lead pattern 11 is not formed in the through hole provided to insert the leg of the shield can 20 on the main board 10 as shown in FIG. do.
따라서, 본 발명은 상기한 바와 같은 제반 문제점을 해결하기 위하여 제안된 것으로, 인쇄회로기판의 메인보드에 별도의 쉴드캔을 장착하지 않고, 메인보드상에 부착되는 키패드 보드의 저면에 쉴드패턴을 형성하여 쉴드캔을 대용함으로써, 이동통신 단말기의 두께를 최소화하면서, 각종 회로부품간의 간섭 및 전자파장애을 신뢰적으로 방지하며, 제품단가를 감소시킬 수 있는 이동통신 단말기에 있어서의 인쇄회로기판 쉴드패턴구조를 제공함에 그 목적이 있다. Accordingly, the present invention has been proposed to solve the above problems, and forms a shield pattern on the bottom surface of the keypad board attached on the main board without mounting a separate shield can on the main board of the printed circuit board. By substituting the shield can, the printed circuit board shield pattern structure of the mobile communication terminal can be minimized while minimizing the thickness of the mobile communication terminal, reliably preventing interference between various circuit components and electromagnetic interference, and reducing product cost. The purpose is to provide.
상기 목적을 달성하기 위한 본 발명은, 각종 회로부품이 실장된 메인보드; 상기 메인보드의 상면에 안착되며, 주요 기능신호를 보내기 위한 기능버튼이 구비된 키패드 보드; 및 상기 키패드 보드의 저면에 형성되며, 회로부품간의 간섭 및 전자파장애를 접지로 흐르도록 하기 위한 쉴드동판을 포함하는 이동통신 단말기에 의 인쇄회로기판 쉴드패턴구조를 제공한다. The present invention for achieving the above object is a main board mounted with various circuit components; A keypad board seated on an upper surface of the main board and provided with a function button for sending a main function signal; And a shield copper plate formed on a bottom surface of the keypad board, the shield copper plate for flowing interference and electromagnetic interference between circuit components to the ground.
이하, 본 발명의 바람직한 실시예를 도5 내지 도8에 예시된 도면를 참조하여 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings illustrated in FIGS. 5 to 8.
본 발명은 인쇄회로기판의 메인보드상에 부착되는 키패드 보드저면에 쉴드패턴을 형성하여 이동통신 단말기의 두께를 최소화하고 제품단가를 감소시킬 수 있도록 구현한 것으로, 본 발명의 실시예에서는 도5 및 도6에 도시된 바와 같이 각종 회로부품이 실장된 메인보드(1)와; 상기 메인보드(1)의 상면에 안착되며, 주요 기능신호를 보내기 위한 기능버튼이 구비된 키패드 보드(2); 및 상기 키패드 보드(2)의 저면에 형성되며, 회로부품간의 간섭 및 전자파장애를 접지로 흐르도록 하기 위한 쉴드동판(3)을 포함한다.The present invention is implemented to minimize the thickness of the mobile communication terminal and reduce the product cost by forming a shield pattern on the bottom of the keypad board attached to the main board of the printed circuit board, Figure 5 and in the embodiment of the present invention A main board 1 on which various circuit components are mounted as shown in FIG. 6; A keypad board 2 seated on an upper surface of the main board 1 and having a function button for sending a main function signal; And a shield copper plate 3 formed on the bottom surface of the keypad board 2 so as to flow interference and electromagnetic interference between circuit components to the ground.
여기서, 상기 메인보드(1)는 그의 상면에 기존에 쉴드캔이 위치하는 자리를 없앤 구조로 되어 있으며, 또한 상기 메인보드(1)상에 놓여지는 키패드 보드(2)의 저면에 구비된 쉴드동판(3)은 먼저 쉴드될 부분을 패턴으로 디자인설계하고, 상기 패턴을 에칭한 후 상기 에칭부에 동박을 입혀 도전체로 형성한 것이다.Here, the main board (1) has a structure in which the shield can is removed from the existing position on the upper surface, and the shield copper plate provided on the bottom surface of the keypad board (2) placed on the main board (1) In (3), the part to be shielded is first designed and designed in a pattern, and the pattern is etched, and then the copper is coated with the etching part to form a conductor.
상기와 같이 구성함으로써, 도7 및 도8에 도시된 바와 같이 메인보드(1)상에 키패드 보드(2)가 연결되어 작동할 때, 각 회로부품간의 간섭, 예를들면 RF단에서 RX와 TX간의 간섭이나 전자파 장애가 발생했을 때, 상기 쉴드동판(3)을 통해 접지로 흐르도록 함으로써 전자파로 인한 부품의 손상을 방지할 수 있는 것이다.By configuring as described above, when the keypad board 2 is connected and operated on the main board 1 as shown in Figs. 7 and 8, interference between each circuit component, for example, RX and TX at the RF terminal When the interference or electromagnetic interference between the two occurs, it is possible to prevent damage to the components due to electromagnetic waves by flowing to the ground through the shield copper plate (3).
이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의해 한정되는 것이 아니고, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능하다는 것이 본 발명이 속하는 분야에서 통상의 지식을 가진 자에게 있어서 명백할 것이다.The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and it is common in the field of the present invention that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.
전술한 바와 같이 본 발명에 따르면, 키패드 보드의 저면에 쉴드패턴을 에칭한 후, 이 에칭부에 동막을 입혀 전도되도록함으로써 기존의 쉴드캔을 채용함에 따라 발생되는 이동통신 단말기의 두께가 두꺼워지는 것을 감소시킬 수 있으며, 쉴드캔이 사용되지 않으므로 제품단가를 감소시킬 수 있는 효과가 있다.As described above, according to the present invention, after the shield pattern is etched on the bottom surface of the keypad board, the thickness of the mobile communication terminal generated by adopting the existing shield can is increased by applying a copper film to the etching portion so as to be conducted. It can be reduced, and since the shield can is not used, there is an effect of reducing the unit cost.
또한, 두께문제로 쉴드캔을 씌울 수 없는 이동통신 단말기의 경우에도 본 발명을 적용할 경우 RF단의 무선감도 및 파워 손실을 감소시킬 수 있는 다른 효과가 있다. In addition, even in the case of the mobile communication terminal that can not cover the shield can due to the thickness problem there is another effect that can reduce the radio sensitivity and power loss of the RF stage.
도1은 종래기술에 따른 이동통신 단말기에서의 인쇄회로기판 메인보드를 나타낸 구조도.1 is a structural diagram showing a printed circuit board main board in a mobile communication terminal according to the prior art;
도2는 일반적인 키패드보드의 저면구조도.Figure 2 is a bottom structure of a typical keypad board.
도3 및 도4는 종래기술에 따른 이동통신 단말기에서의 인쇄회로기판 메인보드상에 키패드 보드가 부착된 상태를 나타낸 평면도 및 측면도.3 and 4 are a plan view and a side view showing a state where a keypad board is attached to a printed circuit board main board in a mobile communication terminal according to the prior art.
도5는 본 발명에 의한 쉴드캔이 부착되지 않은 인쇄회로기판의 구조도.5 is a structural diagram of a printed circuit board without a shield can according to the present invention;
도6은 본 고안의 키패드 보드에 쉴드패턴구조를 에칭한 상태도.Figure 6 is a state etched shield pattern structure on the keypad board of the present invention.
도7 및 도8은 쉴드캔이 없는 상태에서 메인보드에 키패드보드가 부착된 상태를 나탄내 평면도 및 측면도. 7 and 8 are a plan view and a side view of the inner portion of the keypad board attached to the main board state without the shield can.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1: 메인보드 2: 키패드 보드1: main board 2: keypad board
3: 쉴드동판3: shield copper
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| Application Number | Priority Date | Filing Date | Title |
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| KR10-2003-0044609A KR100488417B1 (en) | 2003-07-02 | 2003-07-02 | Printed circuit board shield design patten in the mobile communication phone |
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| KR10-2003-0044609A KR100488417B1 (en) | 2003-07-02 | 2003-07-02 | Printed circuit board shield design patten in the mobile communication phone |
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| KR20050004435A KR20050004435A (en) | 2005-01-12 |
| KR100488417B1 true KR100488417B1 (en) | 2005-05-11 |
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| KR100782512B1 (en) | 2006-12-28 | 2007-12-05 | 삼성전자주식회사 | Mobile terminal for improving specification absorption rate |
| KR101232035B1 (en) * | 2011-04-05 | 2013-02-12 | 한국과학기술원 | Apparatus for Partially Shielding Magnetic Field from Antenna |
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2003
- 2003-07-02 KR KR10-2003-0044609A patent/KR100488417B1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR20050004435A (en) | 2005-01-12 |
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