JP3937943B2 - transceiver - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention mainly relates to a radio such as a cordless remote controller, a transceiver, and a cordless telephone, and more particularly to a structure of a circuit board of the radio.
[0002]
[Prior art]
A conventional wireless device will be described with reference to the drawings. FIG. 4 is a configuration diagram of a conventional wireless device.
[0003]
In FIG. 4, 1 is a multilayer substrate, 2 is a circuit component, 4 is a ground pattern of the multilayer substrate, and 7 is an antenna.
[0004]
A circuit component 2 is mounted on the surface of the multilayer substrate 1. Here, the circuit component 2 is a chip LCR component, a transistor, a filter, or the like. A radio circuit is constituted by the circuit components 2 and the wiring pattern formed on the multilayer substrate 1. The antenna 7 is connected to the antenna terminal on the multilayer substrate 1. On the multilayer substrate 1, a ground pattern 4 of the multilayer substrate is formed. The ground pattern 4 of the multilayer substrate has a role as the ground of the antenna 7 in addition to the role of the ground wiring of the wireless circuit 2.
[0005]
The multilayer substrate 1 is housed in a resin case or the like and completed as a wireless device.
[0006]
[Problems to be solved by the invention]
However, the conventional wireless device has a problem that the size of the multilayer substrate cannot be reduced to a certain extent. That is, the length or size of the antenna is determined by the frequency used. For example, a 1/4 λ antenna in a 400 MHz band has a length of about 17 cm. Here, the size of the ground pattern 4 of the multilayer substrate serving as the housing needs to be about 17 cm or more. If the multilayer substrate ground pattern 4 is small, the performance of the antenna is degraded. For example, there are problems such as a decrease in gain and unstable characteristics in which directivity is likely to change depending on the surrounding environment.
[0007]
If the circuit component 2 is downsized, the area occupied by the entire wireless circuit can be reduced. However, in order to ensure the characteristics of the antenna as described above, the size of the multilayer substrate 1 needs to be set to a certain level or more. In general, a multilayer substrate is more expensive than a single-sided substrate, which has been a limiting factor in reducing the cost of a wireless device.
[0008]
[Means for Solving the Problems]
In order to solve the above-described conventional problems, the wireless device of the present invention has a wireless circuit, a ground pattern, and an antenna terminal formed on a multilayer substrate, and a ground surface on one side of a single-sided substrate having a wider substrate surface than the multilayer substrate. A pattern and an antenna pattern are formed, and the surface of the single-sided substrate on which the ground pattern is not formed and the multilayer substrate are overlapped with each other, and the ground pattern formed on the multilayer substrate and the single-sided substrate are formed. The ground pattern, the antenna terminal, and the antenna pattern are electrically connected using rivets .
[0009]
And since the multilayer board can be made as small as the area occupied by the radio circuit and the size of the ground pattern for the antenna can be secured with an inexpensive single-sided board, it is possible to reduce the cost of the radio and ensure the antenna performance. It can be compatible.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, in order to solve the conventional problem, the wireless device of the present invention has a circuit component mounted on one side or both sides of a multilayer substrate, and an antenna component on a single side substrate having a larger area than the multilayer substrate. Or an antenna pattern is formed, and is placed so that a conductor layer surface of the single-sided substrate is opposite to the multilayer substrate, the antenna terminal of the multilayer substrate and the antenna component or antenna pattern of the single-sided substrate, and The ground pattern of the multilayer substrate and the ground pattern of the single-sided substrate are connected using rivets .
[0013]
【Example】
Embodiments of the present invention will be described below with reference to the drawings.
[0014]
Example 1
FIG. 1 is a configuration diagram of a wireless device according to a first embodiment of the present invention. A radio apparatus according to the present embodiment will be described with reference to FIG.
[0015]
In FIG. 1, 1 is a multilayer substrate, 2 is a circuit component, 3 is a single-sided substrate, 4 is a ground pattern of the multilayer substrate, 5 is a ground pattern of the single-sided substrate, 6 is a connection structure, and 7 is an antenna.
[0016]
A circuit component 2 is mounted on the surface of the multilayer substrate 1. Here, the multilayer substrate 1 uses a double-sided substrate in which a copper foil pattern is formed on both sides of the substrate, but a 4-layer substrate or a multilayered substrate having more layers can be used. Here, the term “multilayer” refers to a plurality of copper foil layers. Therefore, although the dielectric layer is a single layer in the double-sided substrate, this is also classified as a multilayer substrate.
[0017]
The circuit component 2 is a chip LCR component, a transistor, a filter, or the like. These circuit components 2 and the wiring pattern formed on the multilayer substrate 1 constitute a radio circuit. In addition, a ground pattern 4 of a multilayer substrate is formed on the multilayer substrate 1 as the ground of the wireless circuit.
[0018]
The ground pattern 5 of the single-sided substrate is formed by the copper foil on the surface of the single-sided substrate 3. The multilayer substrate 1 and the single-sided substrate 3 are arranged so as to overlap each other. Here, it arrange | positions so that the surface without the copper foil of the single-sided board | substrate 3 may come to the multilayer board | substrate 1 side. With such an arrangement, there is an advantage that unnecessary conduction can be prevented from occurring due to contact between the copper foil of the multilayer substrate 1 and the copper foil of the single-sided substrate 3. However, you may arrange | position the surface with the copper foil of the single-sided board | substrate 3 toward the multilayer board | substrate 1 side. In this case, since the copper foil pattern of the single-sided substrate 3 and the copper foil pattern of the multilayer substrate 1 overlap, there is an advantage that the mutual connection is easy.
[0019]
Next, the ground pattern 4 of the multilayer substrate and the ground pattern 5 of the single-sided substrate are electrically connected. A connection structure 6 is used for connection. In the connection structure 6, metal pins are inserted into holes formed in the multilayer substrate 1 and the single-sided substrate 3 and soldered to the ground pattern 4 of the multilayer substrate and the ground pattern 5 of the single-sided substrate. Although only one connection structure 6 is shown in FIG. 1, it may be configured to connect at a plurality of locations.
[0020]
An antenna 7 is connected to an antenna terminal provided on the multilayer substrate 1.
[0021]
With the configuration as described above, the size of the multilayer substrate 1 can be set to the minimum size necessary for configuring the wireless circuit. The ground pattern necessary for the antenna 7 is composed of a ground pattern 5 on a single-sided substrate.
[0022]
In this embodiment, the multilayer substrate 1 is a glass epoxy substrate. In general, a glass epoxy substrate has a relatively small dielectric loss and can form a pattern with high accuracy, so that it is widely used in a high-frequency circuit such as a radio device. The single-sided substrate 3 is a paper phenol substrate. In general, a paper phenol substrate is very inexpensive and easy to process. The total cost is about 1/7 that of the glass epoxy substrate.
[0023]
Since a portion requiring a large area as the ground of the antenna 7 is formed on an inexpensive paper phenol single-sided substrate, the product cost can be reduced. And since a radio | wireless circuit is comprised in the multilayer board | substrate 1 which consists of glass epoxy, the performance as a radio | wireless machine is ensured. That is, it is possible to achieve both cost reduction of the wireless device and securing of antenna performance.
[0024]
In this embodiment, the antenna 7 is directly connected to the antenna terminal of the multilayer substrate 1 and the antenna is also directly mounted on the multilayer substrate. However, the antenna 7 can be mounted on the single-sided substrate 3. In this case, a structure similar to the connection structure 6 is used to connect the antenna 7 mounted on the single-sided board 3 from the antenna terminal of the multilayer board 1.
[0025]
The multilayer substrate 1 is housed in a resin case or the like and completed as a wireless device.
[0026]
Moreover, although circuit components may be mounted only on one side of the multilayer substrate, circuit components can be mounted on both sides. However, in this case, it hits when it is overlapped with a single-sided substrate. In order to avoid this, it is possible to superimpose by deleting or cutting out a portion corresponding to the mounting position of the circuit component on the multilayer substrate of the single-sided substrate in advance.
[0027]
(Example 2)
FIG. 2 is a configuration diagram of a radio device according to the second embodiment of the present invention. In FIG. 2, 8 is a pattern antenna. Also, the same components as those in FIG.
[0028]
A feature of the present invention is that a pattern antenna 8 formed of a copper foil of a single-sided substrate 3 is used as an antenna.
[0029]
The antenna terminal of the multilayer substrate 1 is connected to the pattern antenna 8 of the single-sided substrate 3 through the connection structure 6. The antenna terminal inputs and outputs a radio signal of a radio circuit configured on the multilayer substrate 1 and is provided for connection to the antenna.
[0030]
In general, when a pattern antenna is formed on a substrate, it often occupies a larger area than the area occupied by a radio circuit. In this configuration, an inexpensive paper phenol substrate is used as the single-sided substrate 3, and an increase in cost can be suppressed even in a large area.
[0031]
Since the pattern antenna can be configured as an antenna built in the storage case of the wireless device, the pattern antenna can have a shape without protrusions.
[0032]
In this embodiment, the pattern antenna formed on the single-sided substrate 3 is used. However, the antenna function can be configured by mounting antenna components such as a chip antenna and a sheet metal antenna on the single-sided substrate 3.
[0033]
(Example 3)
FIG. 3 is a configuration diagram of a radio device according to the third embodiment of the present invention. In FIG. 3, 9 is a rivet. The same components as those in FIGS. 1 and 2 are denoted by the same reference numerals.
[0034]
A feature of the present invention is that a rivet is used as a connection structure. That is, the rivet 9 is used to connect the ground pattern 4 of the multilayer substrate and the ground pattern 5 of the single-sided substrate. A rivet 9 is also used to connect the antenna terminal of the multilayer substrate 1 and the pattern antenna 8 of the single-sided substrate 3.
[0035]
Rivets have a merit in terms of cost because they are relatively inexpensive, but also have an advantage that assembly costs can be reduced. That is, the circuit component is mounted on the multilayer substrate 1 by a reflow process or a flow process. On the other hand, since there are no components to be mounted on a single-sided board, the above process is unnecessary. Therefore, it is not necessary to form a resist or the like on the copper foil surface of the single-sided substrate. Next, the ground pattern 4 of the multi-layer substrate and the ground pattern 5 of the single-sided substrate are connected. However, if a process of soldering metal pins is employed, it is necessary to perform soldering individually or manually by a robot. Disadvantageous. You can also select the process of soldering the metal pins in the flow process, but in this case it is necessary to apply resist processing to prevent the solder from adhering to unnecessary parts on the copper foil surface of the single-sided board, It is disadvantageous in terms of cost.
[0036]
In this embodiment, the connection is completed by inserting rivets into holes formed in the multilayer substrate 1 and the single-sided substrate 3 and performing rivet caulking. Electrical and mechanical connections can be made easily. The assembly cost can be greatly reduced by the fact that the soldering equipment is unnecessary and the completion is completed in a short time.
[0037]
In addition, it is necessary to arrange | position the surface without the copper foil of the single-sided board | substrate 3 in the multilayer board | substrate 1 side.
[0038]
In addition, after the rivet caulking process, the substrate pattern and the rivet may be soldered.
[0039]
【The invention's effect】
As is apparent from the above description, according to the wireless device of the present invention, the area of a relatively expensive multilayer substrate is minimized, and the ground area necessary for the antenna is configured by an inexpensive single-sided substrate. There is an effect that it is possible to achieve both cost reduction and securing of antenna performance.
[Brief description of the drawings]
FIG. 1 is a block diagram of a radio device according to a first embodiment of the present invention. FIG. 2 is a block diagram of a radio device according to a second embodiment of the present invention. 4] Configuration of conventional radio equipment [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Multilayer substrate 2 Circuit component 3 Single side substrate 4 Multilayer substrate ground pattern 5 Single side substrate ground pattern 6 Connection structure 7 Antenna 8 Pattern antenna 9 Rivet

Claims (1)

A radio circuit, a ground pattern, and an antenna terminal are formed on a multilayer substrate, a ground pattern and an antenna pattern are formed on one side of a single-sided substrate having a substrate surface wider than the multilayer substrate, and the ground pattern of the single-sided substrate is formed. The non-coated surface and the multilayer substrate are relatively overlapped, and a ground pattern formed on the multilayer substrate, a ground pattern formed on the single-sided substrate, and the antenna terminal and the antenna pattern are riveted respectively. A radio that is configured to be electrically connected.

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