JP2008041585A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable to realize protection of an electronic component against static electricity in an electronic equipment with a simple structure, and provide an electronic equipment capable of manufacturing at low cost. <P>SOLUTION: The electronic equipment 1 is provided with a substrate 3 mounting an electronic component 2 and a chassis 4 housing the substrate 3. A conductive member 6 grounded with lower impedance than that of the electronic component 2 is provided on the substrate 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic device, and more particularly to an electronic device in which a substrate is surrounded by an insulating casing.

  Conventionally, in an electronic device, when a non-insulated portion or a gap (hereinafter referred to as “non-insulated portion”) formed in an insulating casing is exposed to the outside, static electricity is applied to the non-insulated portion or the like. Then, the static electricity may be applied to the electronic components inside the electronic device from the non-insulating portion of the housing, and the electronic components may be broken or malfunctioned. As countermeasures, a structure in which an insulator is additionally mounted to block a static electricity application path and a structure in which an electronic component is moved to a position where static electricity is not applied are used.

  Moreover, as a structure for discharging static electricity applied to an electronic component, a structure as shown in Patent Document 1 is used. Specifically, an adjustment switch (“electronic component” in the present invention) is attached on a printed circuit board, and the adjustment switch is surrounded by a metal casing. Further, an antistatic pattern (“conductive member” in the present invention) on which solder is piled is formed in a peripheral region where the adjustment switch is attached. And in this structure, it forms so that the distance of the metal housing | casing of an adjustment switch and an antistatic pattern may approach most. Thereby, the static electricity applied to the metal casing of the adjustment switch is discharged to the antistatic pattern.

  Furthermore, when the outer surface of the electronic device is a metal-decorated copper plate (“non-insulating part etc.” in the present invention), as a structure for discharging static electricity applied to the metal-decorated copper plate, a lead wire is connected to the metal-decorated copper plate. A structure for discharging static electricity has been used. And the structure as shown in patent document 2 is used as a structure of the electronic device which discharges static electricity without using this lead wire. This structure has a metal decorative plate on the outermost side and a resin-molded base on the inner side. In addition, a through hole (“non-insulating part or the like” in the present invention) is provided in the resin molding base, and a discharge conductive part (“conductive member” in the present invention) is provided in the vicinity of the through hole. . Thereby, the static electricity applied to the metal decorative plate is discharged to the discharging conductive portion via the through hole provided in the resin molding base.

Japanese Utility Model Publication No. 4-133398 JP 2005-19217 A

  However, as described above, in the case of a structure in which an insulator is additionally mounted and the static electricity application path is cut off, there are problems that the number of parts is increased, the production cost is increased, and the assemblability is deteriorated. It was. Further, when the above-described electronic component is moved to a position where static electricity is not applied, there is a problem that the degree of freedom of component mounting is hindered.

  Moreover, since the structure shown in Patent Document 1 is a structure that discharges static electricity applied to a metal casing of an electronic component, it can be used for an electronic component that does not have a metal casing or an electronic component that is sensitive to static electricity. Can not.

  In the structure of the electronic device shown in Patent Document 2, when the impedance of the electrical component is lower than that of the discharging conductive portion, the distance from the electrical component to the through hole is larger than the distance from the discharging conductive portion to the through hole. If the length is short, static electricity is still applied to the electrical component.

  For this reason, in the present invention, the disadvantages of the above-described conventional example can be improved, and in particular, the protection of the electronic components against static electricity in the electronic device can be realized with a simple structure, which can be manufactured at low cost. The object is to provide an electronic device that can be used.

  Therefore, an electronic device according to an embodiment of the present invention is an electronic device including a substrate on which an electronic component is mounted and a housing that accommodates the substrate, and the substrate is grounded with a lower impedance than the electronic component. It is characterized in that a conductive member is provided. According to such a configuration, even if there is a non-insulating portion or a gap in the casing and static electricity enters the electronic device, the impedance of the conductive member is lower than that of the electronic component, so static electricity is applied to the conductive member. It becomes easy to do. And since the electroconductive member is earth | grounded, the applied static electricity can be discharged.

  In addition, a conductive member is disposed at a position where the distance from the non-insulating portion or the gap formed in the housing is shorter than the electronic component. Thereby, even if static electricity is discharged to the non-insulating part or the gap, the electronic component has higher impedance than the conductive member and is separated from the distance, so that it is possible to suppress the application of static electricity by the electronic component. . That is, static electricity can be applied to a non-insulating part or a conductive member having a shorter distance than the gap from the electronic component to be discharged.

  Furthermore, the shape of the conductive member is characterized in that the distance between the conductive member and the non-insulating portion or the gap is shortened. Thereby, when static electricity is applied to the non-insulating part or the gap, the static electricity is easily discharged by the conductive member. Further, since the distance between the electronic component and the non-insulating portion or the gap can be shortened, the electronic device can be downsized.

  In addition, another conductive member having a lower impedance than the electronic component is provided on the conductive member. Accordingly, the distance between the conductive member and the non-insulating part or the gap can be further shortened by the amount of the other conductive member provided on the conductive member. Therefore, the static electricity applied to the non-insulating part or the gap can be discharged to the conductive member. Furthermore, since the distance between the electronic component and the non-insulating part or the gap can be made shorter than that of the electronic device, the electronic device can be further downsized.

  Here, the other conductive member is a solder. Thereby, static electricity can be applied to the solder and discharged. Soldering can be performed by a simple method, and solder is often used in the manufacture of electronic devices. Accordingly, such a configuration can be easily realized, and static electricity can be discharged by a method with reduced production costs.

  Further, the conductive member is an electrode formed on the substrate. Thereby, static electricity can be applied to the electrode and discharged. The electrode can be mounted on the substrate by a simple method, and is also used in the production of a circuit board. Accordingly, such a configuration can be easily realized, and static electricity can be discharged by a method with reduced production costs.

  Since this invention is comprised and functions as mentioned above, according to this, it can discharge by applying static electricity to the electroconductive member whose impedance is lower than an electronic component. Therefore, it is difficult to apply static electricity to the electronic component, the electronic component can be prevented from being destroyed by the static electricity, and the reliability of the electronic device can be improved.

  The present invention is characterized in that static electricity that has entered the inside of an electronic device from a non-insulating portion or gap is prevented from being applied to an electronic component, and this static electricity is applied to a conductive member to be discharged. Hereinafter, specific configurations and operations will be described with reference to examples.

  A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an enlarged cross-sectional view of the periphery of an electronic component and a conductive member of an electronic device according to the present embodiment. FIG. 2 is an explanatory diagram for explaining a distance relationship between the electronic component, the non-insulating portion, and the conductive member in the electronic apparatus.

[Constitution]
As shown in FIG. 1, the electronic device 1 according to the present invention is accommodated so that the substrate 3 is surrounded by a housing 4 including an upper housing 41 and a lower housing 42, and the substrate 3 is accommodated in the lower housing 42. Equipped on top. An electronic component 2 is mounted on the upper surface of the substrate 3, and a grounded conductive member 6 is provided around the electronic component 2. Furthermore, the non-insulating part 5 is formed in the upper housing 41. Hereinafter, each configuration will be described in detail with reference to FIG.

  The housing 4 is, for example, a rectangular parallelepiped case, and is formed of an insulating resin. The resin case is divided into an upper housing 41 and a lower housing 42. Thereby, the assembly property of an electronic device can be improved, and further, weight reduction and cost reduction can be achieved. At this time, the non-insulating portion 5 described later is provided in the upper housing 41, and the substrate 3 is equipped in the lower housing 42. In addition, although the present Example demonstrated the case of the rectangular parallelepiped resin case which can be divided into upper and lower parts, this is an example, Comprising: It is not restricted to upper and lower parts, The case may be integrated. Further, the shape of the case is not limited to a rectangular parallelepiped, and the material may be formed of other synthetic resins such as insulating plastic.

  The board | substrate 3 is a single-sided board | substrate, Comprising: It is a printed circuit board formed in plate shape. Here, one surface is fixed to the lower housing 42, and electrodes and wirings are provided on the other surface to constitute a circuit. Thereby, various functions according to the configuration of the substrate 3 can be given to the electronic device 1. The upper part of the substrate 3 is covered with an upper housing 41. Further, the electronic component 2 is soldered to the upper surface of the substrate 3, and a conductive member 6 is provided around the electronic component 2. In this embodiment, a single-sided board, which is a printed board formed in a plate shape, has been described. However, this is not limited to a single-sided board, and may be a double-sided board or a multilayer board. Moreover, the shape may be a film shape.

  The electronic component 2 is an electronic component having a higher impedance than the conductive member 6 described later. The electronic component 2 is mounted on the surface of the substrate 3 accommodated in the housing 4 by soldering. The electronic device 1 can have a function according to the characteristics of the electronic component 2 by mounting the electronic component 2. Further, an insulating upper casing 41 and a non-insulating portion 5 formed on the upper casing 41 are located above the electronic component 2. A grounded conductive member 6 is provided on the upper surface of the substrate 3 and around the electronic component 2. As will be described later, the distance relationship between the non-insulating portion 5, the electronic component 2, and the conductive member 6 is a place where the distance from the non-insulating portion 5 to the electronic component 2 is shorter (from the conductive member 6 to the non-insulating portion 5. The conductive member 6 is provided at a distance D1 <a distance D2 from the electronic component 2 to the non-insulating part 5 (see FIG. 2). The electronic component 2 in the present embodiment is, for example, a semiconductor chip, but may be any component as long as it has a higher impedance than the conductive member 6.

  The conductive member 6 is an electrode having a lower impedance than the electronic component 2 and is provided on the upper surface of the substrate 3 and grounded. In addition, the conductive member 6 is provided at a location where the distance from the electronic component 2 is shorter than that of the non-insulating portion 5 as described later. Thereby, the static electricity applied to the electroconductive member 6 can be discharged using the same material used for the circuit wiring of the substrate 3 as will be described later. In addition, although the present Example demonstrated the case where the electroconductive member 6 was an electrode, it is not restricted to this, A copper wiring etc. may be sufficient. Further, the material of the conductive member 6 may be any material whose impedance is lower than that of the electronic component 2.

  The non-insulating part 5 is, for example, a conductor such as metal plating applied to a part of the upper casing 41 that is an insulator. Here, the metal plating is, for example, a decorative process. A conductive member 6 provided on the upper surface of the substrate 3 is located below the non-insulating portion 5. The electronic component 2 is mounted around the conductive member 6. At this time, as will be described later, the conductive member 6 is located at a location where the distance from the non-insulating portion 5 is shorter than the electronic component 2. In the present embodiment, metal plating is given as an example of the conductor provided in the upper casing 41 that is an insulator, but a component made of another conductor may be used.

  Here, the distance relationship among the electronic component 2, the non-insulating part 5, and the conductive member 6 in the electronic apparatus 1 will be described with reference to FIG. First, the distance from the non-insulating part 5 to the conductive member 6 is D1. When the distance from the non-insulating part 5 to the electronic component 2 is D2, the distance relationship between the electronic component 2, the non-insulating part 5 and the conductive member 6 is D1 <D2. That is, the conductive member 6 is provided at a location where the distance from the non-insulating portion 5 is shorter than the electronic component 2. Thereby, the static electricity discharged to the non-insulating part 5 can be applied to the conductive member 6. In the present embodiment, the distance relationship between the electronic component 2, the non-insulating portion 5, and the conductive member 6 is D1 <D2, but the impedance of the conductive member 6 is lower than that of the electronic component 2. If so, the present invention is not limited to the case of D1 <D2.

[Operation]
Next, the operation of the electronic apparatus 1 having the above configuration will be described. First, static electricity 7 is generated outside the electronic device 1. At this time, since the housing 4 has insulating properties, static electricity 7 is discharged to the non-insulating portion 5 formed in the housing 4. The static electricity 7 enters the electronic device 1 through the non-insulating part 5. Here, the static electricity 7 is located at a short distance from the non-insulating portion 5 and has an electrical conductivity and has a low impedance (easy to flow electricity). Therefore, the conductive electronic component 2 and the conductive member 6 that are inside the electronic device 1 have a lower impedance than the electronic component 2 and are located at a short distance from the non-insulating part 5 (D1 <D2). Static electricity is applied to the conductive member 6. The static electricity 7 is discharged from the grounded conductive member 6. For this reason, the electronic component 2 in the electronic device 1 can be protected from static electricity, and the reliability of the electronic device can be improved.

  Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is an enlarged cross-sectional view of the periphery of the electronic component and the conductive member of the electronic device according to the present embodiment. In the present embodiment, a configuration almost the same as that of the electronic apparatus in the first embodiment described above is employed, but the configuration of the conductive member 60 is different.

  As shown in FIG. 3, the electronic device 21 according to the present invention is accommodated so that the substrate 3 is surrounded by a housing 4 including an upper housing 41 and a lower housing 42, and the substrate 3 is a lower housing. Equipped on 42. An electronic component 2 is mounted on the upper surface of the substrate 3, and a conductive member 60 that is grounded is provided around the electronic component 2. Furthermore, the non-insulating part 5 is formed in the upper housing 41. Hereinafter, the configuration different from that of the first embodiment will be described in detail with reference to FIG.

  The conductive member 60 is an electrode having a lower impedance than the electronic component 2 and is provided on the upper surface of the substrate 3 and grounded. Further, as will be described later, the conductive member 60 is provided at a location where the distance from the electronic component 2 is shorter than the non-insulating portion 5. In the present embodiment, the conductive member 60 is formed of a thicker member than in the first embodiment. That is, the height of the conductive member 60 along the direction from the substrate 3 toward the upper housing 41 is higher than that in the first embodiment. Thereby, since the distance between the non-insulating part 5 and the conductive member 60 can be further shortened, static electricity can be applied from the non-insulating part 5 to the conductive member 60. Moreover, the static electricity applied to the electroconductive member 60 can be discharged using the same material used for the circuit wiring of the substrate 3 as will be described later. In addition, although the present Example demonstrated the case where the electroconductive member 60 was an electrode, it is not restricted to this, A copper wiring etc. may be sufficient. The material of the conductive member 60 may be any material whose impedance is lower than that of the electronic component 2.

  Here, the distance relationship among the electronic component 2, the non-insulating part 5, and the conductive member 60 in the electronic device 21 will be described. As in the first embodiment, the distance from the non-insulating part 5 to the conductive member 60 is D3. If the distance from the non-insulating part 5 to the electronic component 2 is D2, the distance relationship between the electronic component 2, the non-insulating part 5 and the conductive member 60 is D3 <D2. That is, the conductive member 60 is provided at a location where the distance from the non-insulating portion 5 is shorter than the electronic component 2. Here, in this embodiment, since the conductive member 60 is made thicker than in the first embodiment, D3 is shorter than that in the first embodiment (D3 <D1). Thereby, the static electricity discharged to the non-insulating part 5 can be applied to the conductive member 60. In the present embodiment, the distance relationship between the electronic component 2, the non-insulating portion 5, and the conductive member 60 is D3 <D2, but the impedance of the conductive member 60 is lower than that of the electronic component 2. If so, the present invention is not limited to the case of D3 <D2.

  Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 4 is an enlarged cross-sectional view of the periphery of the electronic component and the conductive member of the electronic apparatus according to the present embodiment. In the present embodiment, the configuration is almost the same as that of the electronic apparatus in the first embodiment described above, but the configuration of the conductive member 6 is different.

  As shown in FIG. 4, the electronic device 31 according to the present invention is accommodated so that the substrate 3 is surrounded by a housing 4 including an upper housing 41 and a lower housing 42. Equipped on 42. An electronic component 2 is mounted on the upper surface of the substrate 3, and a grounded conductive member 6 is provided around the electronic component 2. Further, the non-insulating part 5 is formed in the upper housing 41. Here, another conductive member 8 is provided on the conductive member 6. The non-insulating portion 5 is located above the other conductive member 8. Hereinafter, the configuration different from that of the first embodiment will be described in detail with reference to FIG.

  The conductive member 6 is an electrode having a lower impedance than the electronic component 2 and is provided on the upper surface of the substrate 3 and grounded. Thereby, the static electricity applied to the electroconductive member 6 can be discharged using the same material used for the circuit wiring of the substrate 3 as will be described later. Further, another conductive member 8 is provided on the conductive member 6. In this embodiment, the case where the conductive member 6 is an electrode has been described. However, the present invention is not limited to this, and may be a copper wiring or the like. As long as it has a low impedance.

  The other conductive member 8 is a conductive member having a lower impedance than the electronic component 2, and is provided on the conductive member 6. Thereby, since the distance with the non-insulating part 5 can be further shortened, static electricity can be discharged to the other conductive member 8. Furthermore, since the distance between the electronic component 2 and the non-insulating part 5 can be further shortened, the electronic device can be further downsized.

  Here, the distance relationship among the electronic component 2, the non-insulating part 5, and the other conductive member 8 inside the electronic device 31 will be described with reference to FIG. If the distance from the non-insulating part 5 to the other conductive member 8 is D4, the distance relationship with the distance D2 from the non-insulating part 5 to the electronic component 2 is D4 <D2. That is, another conductive member 8 is provided at a location where the distance from the non-insulating portion 5 is shorter than the electronic component 2. Here, since the other conductive member 8 is provided on the conductive member 6, the distance from the non-insulating part 5 to the other conductive member 8 is longer than the distance from the non-insulating part 5 to the conductive member 6. Becomes shorter (D4 <D1). Thereby, the static electricity discharged to the non-insulating part 5 can be applied to the other conductive member 8. In addition, although the present Example demonstrated the case where the distance relationship of the electronic component 2, the non-insulating part 5, and the other electroconductive member 8 was D4 <D2, the impedance of the other electroconductive member 8 is the electronic component 2. If it is lower than that, it is not limited to the case of D4 <D2.

  Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 5 is an enlarged cross-sectional view of the periphery of the electronic component and the conductive member of the electronic device according to the present embodiment. The present embodiment employs substantially the same configuration as the electronic apparatus in the third embodiment described above, but differs in that solder 9 is used for the other conductive member 8.

  As shown in FIG. 5, the electronic device 51 according to the present invention is accommodated so that the substrate 3 is surrounded by a housing 4 including an upper housing 41 and a lower housing 42. Equipped on 42. An electronic component 2 is mounted on the upper surface of the substrate 3, and a grounded conductive member 6 is provided around the electronic component 2. Furthermore, the non-insulating part 5 is formed in the upper housing 41. A solder 9 is provided on the conductive member 6. The non-insulating part 5 is located above the solder 9. Hereinafter, the configuration different from that of the third embodiment will be described in detail with reference to FIG.

  The conductive member 6 is an electrode having a lower impedance than the electronic component 2 and is provided on the upper surface of the substrate 3 and grounded. Thereby, the static electricity applied to the electroconductive member 6 can be discharged using the same material used for the circuit wiring of the substrate 3 as will be described later. A solder 9 is provided on the conductive member 6. In this embodiment, the case where the conductive member 6 is an electrode has been described. However, the present invention is not limited to this, and may be a copper wiring or the like. As long as it has a low impedance.

  The solder 9 has a lower impedance than the electronic component 2, and the solder 9 is soldered on the conductive member 6. Thereby, static electricity can be discharged by a simple method of soldering.

  Here, the distance relationship among the electronic component 2, the non-insulating part 5, and the other conductive member 8 inside the electronic device 51 will be described with reference to FIG. 4. When the distance from the non-insulating part 5 to the solder 9 is D5, the distance relationship with the distance D2 from the non-insulating part 5 to the electronic component 2 is D5 <D2. That is, the solder 9 is provided at a location where the distance from the non-insulating portion 5 is shorter than the electronic component 2. Here, since the solder 9 is soldered onto the conductive member 6, D5 <D1 in the distance relationship with D1. Thereby, it becomes easy to apply the static electricity discharged to the non-insulating part 5 to the solder 9. In the present embodiment, the distance relationship between the electronic component 2, the non-insulating portion 5, and the solder 9 is described as D5 <D2, but if the impedance of the solder 9 is lower than that of the electronic component 2, It is not limited to the case of D5 <D2.

  Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 6 is an enlarged cross-sectional view of the periphery of the electronic component and the conductive member of the electronic device according to the present embodiment. In this embodiment, the configuration is almost the same as that of the electronic device in the first embodiment described above, but the configuration of the housing 140 is different.

  As shown in FIG. 6, the electronic device 61 according to the present invention is accommodated so that the substrate 3 is surrounded by a case 140 including an upper case 141 and a lower case 142, and the substrate 3 is included in the lower case 142. Equipped on top. An electronic component 2 is mounted on the upper surface of the substrate 3, and a grounded conductive member 6 is provided around the electronic component 2. Further, a gap 10 is formed in the upper housing 141. Hereinafter, the configuration different from that of the first embodiment will be described in detail with reference to FIG.

  The housing 140 is, for example, a rectangular parallelepiped case, and is formed of an insulating resin. This resin case is formed by being divided into an upper housing 141 and a lower housing 142. At this time, the upper case 141 is provided with a gap 10 to be described later, and the lower case 142 is equipped with the substrate 3.

  The gap 10 is, for example, a fitting gap formed in the housing 140. Below this gap 10, the conductive member 6 provided on the upper surface of the substrate 3 is located. An electronic component 2 is mounted on the upper surface of the substrate 3 and around the conductive member 6. At this time, as for the distance relationship between the gap 10, the electronic component 2, and the conductive member 6, the conductive member 6 is provided at a location where the distance from the gap 10 is shorter than the electronic component 2, as will be described later. In the present embodiment, the case of the fitting gap formed in the housing 140 has been described. However, this is an example, and a space provided in the housing 140 in terms of design or function. Also good.

  Here, the distance relationship among the electronic component 2, the gap 10, and the conductive member 6 in the electronic device 61 will be described with reference to FIG. 6. First, the distance from the gap 10 to the conductive member 6 is D6. When the distance from the gap 10 to the electronic component 2 is D7, the distance relationship between the electronic component 2, the gap 10 and the conductive member 6 is D6 <D7. That is, the conductive member 6 is provided at a location where the distance from the gap 10 is shorter than the electronic component 2. Thereby, the static electricity discharged to the gap 10 can be applied to the conductive member 6. In the present embodiment, the distance relationship between the electronic component 2, the gap 10, and the conductive member 6 is described as D6 <D7. However, the impedance of the conductive member 6 is lower than that of the electronic component 2. For example, it is not limited to the case of D6 <D7.

  Next, the operation of the electronic apparatus 61 having the above configuration will be described. First, static electricity 7 is generated outside the electronic device 61. At this time, since the housing 140 has insulating properties, the static electricity 7 is discharged into the gap 10 formed in the housing 140. The static electricity 7 enters the electronic device 61 through the gap 10. Here, the static electricity 7 is located at a short distance from the gap 10 and has an electrical conductivity and has a low impedance (easy to flow electricity). Accordingly, the conductive electronic component 2 and the conductive member 6 that are inside the electronic device 61 have a lower impedance than the electronic component 2 and a short distance from the gap 10 (D6 <D7). 6, static electricity is applied. The static electricity 7 is discharged from the grounded conductive member 6. For this reason, the electronic component 2 inside the electronic device 61 can be protected from static electricity, and the reliability of the electronic device can be improved.

  The present invention can be used for electronic devices such as mobile phones, PHS (Personal Handyphone System), fixed telephone terminals, PDAs (Personal Digital Assistance), and has industrial applicability.

FIG. 3 is an enlarged cross-sectional view showing the periphery of an electronic component and a conductive member of an electronic device in Example 1. It is explanatory drawing explaining the distance relationship of the electronic component in an electronic device, a non-insulating part, and a conductive member. FIG. 6 is an enlarged cross-sectional view showing the periphery of an electronic component and a conductive member of an electronic device in Example 2. FIG. 6 is an enlarged cross-sectional view showing the periphery of an electronic component and a conductive member of an electronic device in Example 3. FIG. 10 is an enlarged cross-sectional view showing the periphery of an electronic component and a conductive member of an electronic device in Example 4. FIG. 10 is an enlarged cross-sectional view showing the periphery of an electronic component and a conductive member of an electronic device in Example 5.

Explanation of symbols

1, 21, 31, 51, 61 Electronic device 2 Electronic component 3 Substrate 4,140 Housing 5 Non-insulating portion 6, 60 Conductive member 7 Static electricity 8 Other conductive member 9 Solder 10 Clearance 41, 141 Upper housing 42 142 lower housing

Claims (12)

An electronic device comprising a board on which electronic components are mounted and an insulating housing that houses the board,
An electronic apparatus comprising: a conductive member having a lower impedance than the electronic component and grounded on the substrate.   The electronic device according to claim 1, wherein the conductive member is disposed at a position where a distance from the non-insulating portion or the gap formed in the housing is shorter than the electronic component. The electronic device according to claim 2, wherein the shape of the conductive member is formed such that a distance between the conductive member and the non-insulating portion or the gap is further shortened. The electronic apparatus according to claim 3, wherein another conductive member having a lower impedance than the electronic component is provided on the conductive member. The electronic device according to claim 4, wherein the other conductive member is solder. The electronic device according to claim 1, 2, 3, 4, or 5, wherein the conductive member is an electrode formed on the substrate. A substrate on which an electronic component is mounted, wherein the substrate is provided with a conductive member having a lower impedance than the electronic component and grounded.   The substrate according to claim 7, wherein the conductive member is arranged at a position where a distance is shorter than the electronic component from a non-insulating portion or a gap formed in a housing in which the substrate is accommodated.   9. The substrate according to claim 8, wherein the shape of the conductive member is formed such that a distance between the conductive member and the non-insulating portion or the gap is further shortened.   The substrate according to claim 9, wherein another conductive member having a lower impedance than the electronic component is provided on the conductive member.   The board according to claim 10, wherein the other conductive member is solder. 12. The substrate according to claim 7, 8, 9, 10 or 11, wherein the conductive member is an electrode formed on the substrate.

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