KR100268666B1 - Printed circuit board for reducing a radiation noise - Google Patents

Printed circuit board for reducing a radiation noise Download PDF

Info

Publication number
KR100268666B1
KR100268666B1 KR1019970038837A KR19970038837A KR100268666B1 KR 100268666 B1 KR100268666 B1 KR 100268666B1 KR 1019970038837 A KR1019970038837 A KR 1019970038837A KR 19970038837 A KR19970038837 A KR 19970038837A KR 100268666 B1 KR100268666 B1 KR 100268666B1
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
pcb
radiation noise
communication terminal
Prior art date
Application number
KR1019970038837A
Other languages
Korean (ko)
Other versions
KR19990016317A (en
Inventor
이석근
Original Assignee
윤종용
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤종용, 삼성전자주식회사 filed Critical 윤종용
Priority to KR1019970038837A priority Critical patent/KR100268666B1/en
Publication of KR19990016317A publication Critical patent/KR19990016317A/en
Application granted granted Critical
Publication of KR100268666B1 publication Critical patent/KR100268666B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE: A printed circuit board for removing radiation noise and a structuring method thereof are provided to reduce a number of manufacturing process, manufacturing cost, and radiation noise. CONSTITUTION: The first PCB(10) is a main PCB. The second PCB(20) is an auxiliary PCB. Various kinds of components for a portable communication terminal are mounted on upper surfaces of the PCBs(10,20). Lower surfaces of the PCBs(10,20) are ground plates for removing radiation noise. A component of the portable communication terminal having a surface mounting device(SMD) shape is mounted on the upper surface of the auxiliary PCB(20). The SMD shaped component is seriously affected by the radiation noise. The component having the SMD may be a voice speech circuit. Other components of the portable communication terminal which are not affected much by the radiation noise are mounted on the upper surface of the main PCB(10).

Description

방사노이즈의 제거를 위한 인쇄회로기판{PRINTED CIRCUIT BOARD FOR REDUCING A RADIATION NOISE}Printed Circuit Board for Removal of Radiated Noise {PRINTED CIRCUIT BOARD FOR REDUCING A RADIATION NOISE}

본 발명은 휴대용 통신단말기에 사용하기 위한 인쇄회로기판에 관한 것으로, 특히 방사노이즈의 제거를 위한 인쇄회로기판에 관한 것이다.The present invention relates to a printed circuit board for use in a portable communication terminal, and more particularly to a printed circuit board for the removal of radiation noise.

일반적으로 휴대용 통신단말기의 각종 구성요소들은 단말기의 내부에 실장된 인쇄회로기판(Printed Circuit Board: 이하 "PCB"라 칭함)에 납땜에 의해 부착되게 된다. 이때 통상의 PCB는 도 1에 도시된 바와 같이 4층(Layer)으로 구조된다.In general, various components of a portable communication terminal are attached to a printed circuit board (hereinafter referred to as "PCB") mounted inside the terminal by soldering. At this time, the conventional PCB is structured in four layers (Layer) as shown in FIG.

도 1을 참조하면, PCB의 1층(Layer 1) 동박에는 각종 부품이 실장되고, 3층(Layer 3) 및 4층(Layer 4) 동박은 접지면(Ground Plate)으로 처리된다. 이와 같이 3층 및 4층 동박을 접지면으로 처리하는 것은 부품 실장 반대면으로 유입되는 방사노이즈(radiation noise)를 제거하기 위한 것이다. 여기서 방사노이즈란 휴대용 통신단말기의 안테나를 통해 방사되는 전파에 의해 PCB상에 실장된 부품에 영향을 미치는 것으로, 통신단말기의 음성통화회로(Speech Circuit)는 이러한 방사노이즈에 의해 가장 커다란 영향을 받는 구성요소이다. 또한 부품 실장면으로 방사노이즈가 유입될 수도 있는데, 이러한 방사노이즈는 부품 실장면의 표면에 실드캔(shield CAN) 등을 처리함으로써 제거되기도 한다.Referring to FIG. 1, various components are mounted on one layer (Layer 1) copper foil of a PCB, and three layers (Layer 3) and four layers (Layer 4) copper foil are treated with a ground plate. In this way, the three- and four-layer copper foils are treated with ground planes to remove radiation noise that enters the opposite side of the component mounting. Radiation noise refers to a component mounted on a PCB by radio waves radiated through an antenna of a portable communication terminal, and a speech circuit of the communication terminal is most affected by such radiation noise. Element. In addition, radiation noise may flow into the component mounting surface, which may be removed by treating shield CAN on the surface of the component mounting surface.

한편 종래 기술에 따른 휴대용 통신단말기의 각종 구성요소들이 실장되는 PCB는 전술한 바와 같이 4층으로 구조되었다. 이에 따라 휴대용 통신단말기에서 양호한 통화에 지장을 주는 방사노이즈가 어느 정도 제거될 수는 있었지만, 4층으로 구조됨에 따라 PCB 제작의 공수가 증가하는 문제점이 있었다. 또한 4층으로 구조되는 만큼 제작원가가 상승하는 문제점도 있었다.On the other hand, the PCB on which various components of the portable communication terminal according to the prior art are mounted has four layers as described above. As a result, although radiation noise disturbing a good call can be eliminated to some extent in the portable communication terminal, there is a problem in that the number of PCB manufacturing processes increases due to the four-layer structure. In addition, as the four-layer structure, there was a problem that the manufacturing cost increases.

따라서 본 발명의 목적은 휴대용 통신단말기에 사용하기 위한 PCB를 제작함에 있어 그 제작공수를 절감시키는데 있다.Therefore, an object of the present invention is to reduce the manufacturing labor in manufacturing a PCB for use in a portable communication terminal.

본 발명의 다른 목적은 휴대용 통신단말기에 사용하기 위한 PCB를 제작함에 있어 그 제작원가를 줄이는데 있다.Another object of the present invention is to reduce the manufacturing cost in manufacturing a PCB for use in a portable communication terminal.

본 발명의 또다른 목적은 휴대용 통신단말기에서 보다 개선된 형태로 방사노이즈를 줄일 수 있는 PCB를 제공함에 있다.It is another object of the present invention to provide a PCB which can reduce radiation noise in an improved form in a portable communication terminal.

이러한 목적들을 달성하기 위한 본 발명은 휴대용 통신단말기의 각종 구성요소들이 실장되는 PCB를 각각이 2층으로 이루어지는 메인 PCB(10) 및 보조 PCB(20)로 구조화시키는 것을 특징으로 한다. 상기 보조 PCB(20)에는 휴대용 통신단말기에서 방사노이즈에 영향을 많이 받는 부품들이 실장되도록 하며, 이 보조 PCB(20)는 메인 PCB(10)의 부품 실장면에 부착되게 된다. 이때 메인 PCB(10)의 부품 실장면에 부착되는 보조 PCB(20)의 하부면은 접지면으로 처리되며, 보조 PCB(20)에는 메인 PCB(10)와의 부착을 위한 패드(PAD)(21)가 형성될 수 있다. 인쇄회로기판 전체를 4층으로 구조화시키는 대신에 2층으로 구조화시키고, 특히 방사노이즈에 의한 영향이 있는 경우에 대해서만 4층으로 구조화시킴으로써 PCB 조립의 공수 및 조립의 원가를 절감하는 이점이 있다.The present invention for achieving these objects is characterized in that the PCB on which the various components of the portable communication terminal is mounted is structured into a main PCB 10 and a secondary PCB 20 each consisting of two layers. The auxiliary PCB 20 is to be mounted to the components that are highly affected by radiation noise in the portable communication terminal, the auxiliary PCB 20 is attached to the component mounting surface of the main PCB (10). At this time, the lower surface of the auxiliary PCB 20 attached to the component mounting surface of the main PCB 10 is treated as a ground plane, the pad (PAD) 21 for attachment with the main PCB 10 to the auxiliary PCB (20). Can be formed. Instead of structuring the entire printed circuit board into four layers, it is structured into two layers, and in particular, the structure of the printed circuit board is structured into four layers only when there is an effect of radiation noise, thereby reducing the cost of PCB assembly and assembly.

도 1은 종래 기술에 따른 인쇄회로기판의 구조를 보여주는 도면.1 is a view showing the structure of a printed circuit board according to the prior art.

도 2는 본 발명에 따른 인쇄회로기판에 대한 단면도.2 is a cross-sectional view of a printed circuit board according to the present invention.

도 3은 도 2에 도시된 인쇄회로기판의 각 단면을 분리하여 보여주는 도면.FIG. 3 is a cross-sectional view of each cross section of the printed circuit board of FIG. 2.

도 4는 본 발명에 따른 인쇄회로기판에 대한 정면도.4 is a front view of a printed circuit board according to the present invention;

도 5는 도 4에 도시된 보조 인쇄회로기판의 구조를 보다 구체적으로 보여주는 도면.FIG. 5 illustrates the structure of the auxiliary printed circuit board shown in FIG. 4 in more detail.

이하 본 발명의 바람직한 실시예의 상세한 설명이 첨부된 도면들을 참조하여 설명될 것이다. 우선 각 도면의 구성요소들에 참조부호를 부가함에 있어서, 동일한 구성요소들에 대해서는 비록 다른 도면상에 표시되더라도 가능한한 동일한 부호를 가지도록 하고 있음에 유의해야 한다. 또한 하기에서 본 발명을 설명함에 있어, 관련된 공지 기능 또는 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명을 생략할 것이다. 그리고 후술되는 용어들은 본 발명에서의 기능을 고려하여 정의내려진 용어들로서 이는 사용자 또는 칩설계자의 의도 또는 관례 등에 따라 달라질 수 있으므로, 그 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.DETAILED DESCRIPTION A detailed description of preferred embodiments of the present invention will now be described with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. In addition, the terms to be described below are terms defined in consideration of functions in the present invention, which may vary according to the intention or custom of the user or chip designer, and the definitions should be made based on the contents throughout the present specification.

도 2는 본 발명에 따른 PCB에 대한 단면도이고, 도 3은 도 2에 도시된 PCB의 각 단면을 분리하여 보여주는 도면이다.2 is a cross-sectional view of a PCB according to the present invention, Figure 3 is a view showing a separate cross-sectional view of the PCB shown in FIG.

상기 도 2 및 도 3을 참조하면, 본 발명에 따른 PCB는 각각이 2층으로 구조된 메인 PCB로서의 제1PCB 10과, 보조 PCB로서의 제2PCB 20으로 구조된다. 상기 각 PCB 10,20의 상부면은 휴대용 통신단말기의 각종 부품들이 실장되는 면이고, 하부면은 방사노이즈의 제거를 위한 접지면(Ground Plate)으로 처리된다. 이때 보조 PCB 20의 상부면에는 방사노이즈에 의해 커다란 영향을 받는 표면실장부품(SMD: Surface Mounting Device)형태를 가지는 휴대용 통신단말기의 구성요소(예: 음성통화회로)가 실장되며, 메인 PCB 10의 상부면에는 방사노이즈에 적은 영향을 받는 휴대용 통신단말기의 다른 구성요소들이 실장된다. 즉, 방사노이즈에 의해 커다란 영향을 받는 구성요소들에 한해서는 기존의 기술과 같이 4층 구조의 PCB에 실장되는 효과가 나타나도록 구조화시킨 것이다.2 and 3, the PCB according to the present invention is constructed of a first PCB 10 as a main PCB and a second PCB 20 as an auxiliary PCB each having two layers. The upper surfaces of the PCBs 10 and 20 are surfaces on which various components of the portable communication terminal are mounted, and the lower surfaces are treated with a ground plate for removing radiation noise. At this time, a component of a portable communication terminal (eg, voice communication circuit) having a surface mounting device (SMD) type that is greatly affected by radiation noise is mounted on the upper surface of the auxiliary PCB 20. On the upper side, other components of the portable communication terminal which are less affected by radiation noise are mounted. In other words, the components that are greatly affected by the radiation noise is structured to have the effect of mounting on the PCB of the four-layer structure like the existing technology.

한편 상기 도 2 및 도 3에서 메인 PCB 10 및 보조 PCB 20의 상부면에는 실드캔이 더 구조되는데, 이는 부품 실장면에 유기되는 방사노이즈의 영향을 제거시키기 위한 것이다.Meanwhile, in FIG. 2 and FIG. 3, the shield can is further structured on the upper surfaces of the main PCB 10 and the auxiliary PCB 20 to remove the influence of radiation noise induced on the component mounting surface.

도 4는 본 발명에 따른 PCB에 대한 정면도이고, 도 5는 도 4에 도시된 보조 PCB 20의 구조를 보다 구체적으로 보여주는 도면이다.4 is a front view of a PCB according to the present invention, and FIG. 5 is a view showing the structure of the auxiliary PCB 20 shown in FIG. 4 in more detail.

도 4를 참조하면, 보조 PCB 20은 메인 PCB 10보다 작은 크기(면적)를 갖는다. 이는 본 발명에서는 휴대용 통신단말기의 구성요소중 방사노이즈에 커다란 영향을 받는 구성요소만을 보조 PCB 20에 실장시킨다는 점을 상기한다면 당연하게 얻어지는 결과이다.Referring to FIG. 4, the auxiliary PCB 20 has a smaller size (area) than the main PCB 10. This is a natural result obtained by recalling that in the present invention, only the components of the portable communication terminal that are greatly affected by the radiation noise are mounted on the auxiliary PCB 20.

도 5를 참조하면, 보조 PCB 20의 좌측면 및 우측면에는 패드(PAD) 21이 형성된다. 이 패드 21은 보조 PCB 20이 메인 PCB 10의 상부면에 부착될 수 있도록 하는 것으로 반타원형의 관통홀(through hole)로서 처리된다. 이 관통홀에 납땜을 가하게 되면 보조 PCB 20은 메인 PCB 10의 상부면에 손쉽게 부착될 수 있다. 보조 PCB 20의 메인 PCB 10의 상부면에의 부착은 이러한 패드 이외에도 각종 컨넥터에 의해 연결될 수도 있다.Referring to FIG. 5, pads PAD 21 are formed on the left and right sides of the auxiliary PCB 20. The pad 21 allows the auxiliary PCB 20 to be attached to the top surface of the main PCB 10 and is treated as a semi-oval through hole. Soldering this through hole allows the auxiliary PCB 20 to be easily attached to the top surface of the main PCB 10. The attachment of the auxiliary PCB 20 to the top surface of the main PCB 10 may be connected by various connectors in addition to these pads.

상술한 바와 같이 본 발명은 휴대용 통신단말기에 사용하기 위한 PCB를 4층으로 구조화시키는 대신에 2층으로 구조화시킴으로써 전체 PCB를 4층으로 하는 경우에 비해 제작공수를 줄이고, 제작원가를 절감하는 이점이 있다. 이때 방사노이즈에 의해 많은 영향을 받는 구성요소에 대해서는 2층으로 구조된 PCB 2개를 부착시켜 4층 PCB의 효과가 나타나도록 함으로써 방사노이즈에 의한 영향 또한 제거하는 효과가 있다.As described above, the present invention has the advantage of reducing the manufacturing cost and manufacturing cost compared to the case where the entire PCB is four layers by structuring the two layers instead of the four layers of the PCB for use in the portable communication terminal. have. At this time, by attaching two PCBs structured in two layers to the components affected by radiation noise, the effect of the four-layer PCB is shown, thereby removing the effects of radiation noise.

한편 본 발명의 상세한 설명에서는 구체적인 실시예에 관해 설명하였으나, 본 발명의 범위에서 벗어나지 않는 한도내에서 여러가지 변형이 가능하다. 그러므로 본 발명의 범위는 설명된 실시예에 국한되어 정해져서는 않되며 후술하는 특허청구의 범위뿐만 아니라 이 특허청구의 범위와 균등한 것들에 의해 정해져야 한다.Meanwhile, in the detailed description of the present invention, specific embodiments have been described, but various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the scope of the following claims, but also by the equivalents of the claims.

Claims (5)

휴대용 통신단말기의 각종 부품들이 실장되는 인쇄회로기판에 있어서,In a printed circuit board mounted with various components of a portable communication terminal, 부품 실장을 위한 상부면과 방사노이즈의 제거를 위해 접지면으로 처리된 하부면의 2층으로 구조화되는 메인 인쇄회로기판(10)과,A main printed circuit board 10 structured as two layers of an upper surface for component mounting and a lower surface treated with a ground plane for removal of radiation noise; 상기 메인 인쇄회로기판(10)보다 적은 크기를 가지며, 부품 실장을 위한 상부면과 방사노이즈의 제거를 위해 접지면으로 처리된 하부면의 2층으로 구조화되며, 상기 메인 인쇄회로기판(10)의 상부면에 상기 하부면이 부착되어지는 보조 인쇄회로기판(20)으로 이루어짐을 특징으로 하는 인쇄회로기판.The main printed circuit board 10 has a smaller size than the main printed circuit board 10 and is structured as two layers of an upper surface for component mounting and a lower surface treated with a ground surface for removal of radiation noise. Printed circuit board, characterized in that consisting of the auxiliary printed circuit board 20 is attached to the lower surface on the upper surface. 제1항에 있어서, 상기 보조 인쇄회로기판(20)에는 연결용 패드(21)가 형성되며, 이 연결용 패드(21)를 통해 상기 메인 인쇄회로기판(10)의 상부면에 부착되는 것을 특징으로 하는 인쇄회로기판.According to claim 1, wherein the auxiliary printed circuit board 20 is formed with a connection pad 21, characterized in that attached to the upper surface of the main printed circuit board 10 through the connection pad 21. Printed circuit board. 제2항에 있어서, 상기 연결용 패드(21)는 반타원형 관통홀임을 특징으로 하는 인쇄회로기판.The printed circuit board of claim 2, wherein the connection pad is a semi-elliptical through hole. 제3항에 있어서, 상기 연결용 패드(21)는 상기 보조 인쇄회로기판 (20)의 좌측면 및 우측면에 형성되는 것을 특징으로 하는 인쇄회로기판.4. The printed circuit board of claim 3, wherein the connection pads are formed on the left and right sides of the auxiliary printed circuit board. 제1항 내지 제4항중의 어느 한 항에 있어서, 상기 메인 인쇄회로기판 (10) 및 상기 보조 인쇄회로기판(20)의 상부면에는 방사노이즈의 제거를 위한 실드캔이 더 구조되는 것을 특징으로하는 인쇄회로기판.The upper surface of each of the main printed circuit board 10 and the auxiliary printed circuit board 20, the shield can for removing the radiation noise is further structured. Printed circuit board.
KR1019970038837A 1997-08-14 1997-08-14 Printed circuit board for reducing a radiation noise KR100268666B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970038837A KR100268666B1 (en) 1997-08-14 1997-08-14 Printed circuit board for reducing a radiation noise

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970038837A KR100268666B1 (en) 1997-08-14 1997-08-14 Printed circuit board for reducing a radiation noise

Publications (2)

Publication Number Publication Date
KR19990016317A KR19990016317A (en) 1999-03-05
KR100268666B1 true KR100268666B1 (en) 2000-10-16

Family

ID=19517490

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970038837A KR100268666B1 (en) 1997-08-14 1997-08-14 Printed circuit board for reducing a radiation noise

Country Status (1)

Country Link
KR (1) KR100268666B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754985B1 (en) 2006-06-16 2007-09-04 정경현 Dmb receiver using active antenna

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754985B1 (en) 2006-06-16 2007-09-04 정경현 Dmb receiver using active antenna

Also Published As

Publication number Publication date
KR19990016317A (en) 1999-03-05

Similar Documents

Publication Publication Date Title
US6958732B2 (en) Small-sized and high-gained antenna-integrated module
US5488540A (en) Printed circuit board for reducing noise
EP1513379A3 (en) Compact radio equipment and method of mounting the same
EP1041633A4 (en) Semiconductor device, method of manufacture thereof, circuit board, and electronic device
EP0996154A4 (en) Semiconductor device and method for manufacturing the same, circuit substrate, and electronic device
DE69831700D1 (en) Arrangement for shielding an electronic circuit board against radio waves
US20090135576A1 (en) Stacking structure of printed circuit board
EP0977298A3 (en) High-frequency module
US7295083B2 (en) Structure for electromagnetically shielding a substrate
CA2222857A1 (en) Process to create metallic stand-offs on an electronic circuit
EP1075026A3 (en) Multilayer circuit board layout
KR100268666B1 (en) Printed circuit board for reducing a radiation noise
CA2283150A1 (en) Printed circuit board for electrical devices having rf components, particularly for mobile radio telecommunication devices
US20070075418A1 (en) Emi shielding device for pcb
KR980007895A (en) Plastic ball grid array module
NO20011677D0 (en) Electronic component for high frequency attenuation and bonding wire for the component
KR950034895A (en) Antenna element mounted on a cordless phone
ATE301387T1 (en) MACRO COMPONENT MOLDED COMMUNICATIONS TERMINAL, INTERMEDIATE PIECE, AND DEVICE FOR CONNECTING TO A BASE BOARD
KR100349379B1 (en) Printed circuit board structure with electromagnetic wave blocking function
JP2000138425A (en) Connecting wiring structure
JPH0750357A (en) Surface mount hybrid ic
JPS63300599A (en) Electromagnetic shielding structure of communication equipment
US4857375A (en) Shielding of semiconductor module
KR200368158Y1 (en) Assembly Structure for Hidding the Eelectronic Unit
JPH08130361A (en) Printed wiring board

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080604

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee