KR20060030132A - Tuner - Google Patents

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Publication number
KR20060030132A
KR20060030132A KR1020040078896A KR20040078896A KR20060030132A KR 20060030132 A KR20060030132 A KR 20060030132A KR 1020040078896 A KR1020040078896 A KR 1020040078896A KR 20040078896 A KR20040078896 A KR 20040078896A KR 20060030132 A KR20060030132 A KR 20060030132A
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South Korea
Prior art keywords
circuit board
printed circuit
tuner
heat
heat dissipation
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KR1020040078896A
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Korean (ko)
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KR101103572B1 (en
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유병석
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엘지이노텍 주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03J—TUNING RESONANT CIRCUITS; SELECTING RESONANT CIRCUITS
    • H03J1/00—Details of adjusting, driving, indicating, or mechanical control arrangements for resonant circuits in general
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

인쇄회로기판의 방열구조를 개선한 튜너가 개시된다. 상기 튜너는 IC의 내부 저면에 모인 열이 IC의 저면과 접촉된 인쇄회로기판의 부위에 형성된 비아홀을 통하여 인쇄회로기판의 상면에서 하면측으로 즉시 전달되어 튜너의 외측으로 방열된다. 그러므로, IC 내부가 가열되지 않으므로 제품의 내구성이 향상되고, 방열효율이 향상된다.A tuner having an improved heat dissipation structure of a printed circuit board is disclosed. The tuner is immediately transferred from the upper surface of the printed circuit board to the lower surface side through the via hole formed in the portion of the printed circuit board in contact with the bottom surface of the IC to radiate heat to the outside of the tuner. Therefore, since the inside of the IC is not heated, the durability of the product is improved and the heat radiation efficiency is improved.

Description

튜너 {TUNER}Tuner {TUNER}

도 1은 종래의 튜너의 개략적 구성을 보인 단면도.1 is a cross-sectional view showing a schematic configuration of a conventional tuner.

도 2는 본 발명의 일 실시예에 따른 튜너의 개략적 구성을 보인 단면도.Figure 2 is a cross-sectional view showing a schematic configuration of a tuner according to an embodiment of the present invention.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

110 : 섀시, 121,125 : 상부, 하부커버110: chassis, 121,125: upper, lower cover

130 : 인쇄회로기판 130a : 비아홀130: printed circuit board 130a: via hole

130b : 도체 131,135 : 동박130b: Conductor 131,135: copper foil

141 : IC 150 : 방열패드141: IC 150: heat dissipation pad

본 발명은 인쇄회로기판의 방열구조를 개선한 튜너에 관한 것이다.The present invention relates to a tuner having an improved heat dissipation structure of a printed circuit board.

튜너(Tuner)란 무선 수신 장치의 입력부에 사용되는 것으로 일정한 전파 또는 전기신호의 주파수에 동조(同調)하여 그 전파만을 선택하여 꺼내는 장치를 말한다.Tuner is used in the input part of a radio receiver, and refers to a device that tunes to a frequency of a fixed radio wave or an electric signal and selects and extracts only the radio wave.

도 1은 종래의 튜너의 개략적 구성을 보인 단면도로써, 이를 설명한다.1 is a cross-sectional view showing a schematic configuration of a conventional tuner, which will be described.

도시된 바와 같이, 튜너(10)는 사각형상의 섀시(20), 섀시(20)의 내부에 설 치된 인쇄회로기판(30), 섀시(20)의 상면 및 하면에 결합된 상부 및 하부커버(41,45)를 가진다. 인쇄회로기판(30)에는 IC(Integrated Circuit)(51), 콘덴서 및 저항 등과 같은 수동부품(55)이 설치되어 상호 전기적으로 연결된다.As shown, the tuner 10 includes a rectangular chassis 20, a printed circuit board 30 installed inside the chassis 20, and upper and lower covers 41 coupled to upper and lower surfaces of the chassis 20. , 45). The printed circuit board 30 is provided with passive components 55 such as an integrated circuit (IC) 51, a capacitor and a resistor, and the like are electrically connected to each other.

인쇄회로기판(30)에 설치된 IC(51)에서는 고열이 발생하는데, IC(51)에서 발생되는 열을 방열하기 위하여 IC(51)와 대향하는 상부커버(41)의 부위에는 방열핀(42)이 형성된다. 방열핀(42)은 상부커버(41)의 일부를 절개한 후 IC(51)측으로 벤딩시켜 형성한다. 그리고, 방열핀(42)의 자유단부측을 IC(51)의 상면에 설치된 방열패드(53)와 접촉시켜 IC(51)에서 발생되는 열을 외부로 방열한다.In the IC 51 installed on the printed circuit board 30, high heat is generated. In order to dissipate heat generated from the IC 51, a heat dissipation fin 42 is provided at a portion of the upper cover 41 facing the IC 51. Is formed. The heat dissipation fin 42 is formed by cutting a part of the upper cover 41 and bending the IC 51 toward the IC 51. The free end side of the heat dissipation fin 42 is brought into contact with the heat dissipation pad 53 provided on the upper surface of the IC 51 to radiate heat generated by the IC 51 to the outside.

그러나, 상기와 같은 종래의 튜너(10)는 IC(51)에서 발생되는 열을 신속하게 방열할 수 없는 단점이 있다. 상세히 설명하면, IC(51)의 저면 내부에는 IC(51)의 코아(51a)에서 발생되는 열을 흡수하는 패드(51b)가 설치되는데, 패드(51b)에 모인 열은 인쇄회로기판(30)으로 전달된 후 외부로 방열되도록 설계되어 있다. 그런데, 인쇄회로기판(30)은 열전도율이 낮아서 미쳐 방열되지 못한 열은 IC(51)를 가열하게 되고, 잉여의 열은 IC(51) 상부의 방열패드(53)를 통하여 방열된다. 이로인해, 방열효율이 저하되어 튜너의 성능이 저하되는 단점이 있다.However, the conventional tuner 10 as described above has a disadvantage in that it is not possible to quickly dissipate heat generated by the IC 51. In detail, a pad 51b for absorbing heat generated from the core 51a of the IC 51 is installed inside the bottom of the IC 51, and the heat collected in the pad 51b is a printed circuit board 30. It is designed to dissipate to the outside after being transferred to. However, since the thermal conductivity of the printed circuit board 30 is so low that heat cannot be radiated, the IC 51 is heated, and the excess heat is radiated through the heat dissipation pad 53 above the IC 51. Due to this, there is a disadvantage that the heat radiation efficiency is lowered and the performance of the tuner is lowered.

본 발명은 상기와 같은 종래 기술의 문제점을 해결하기 위하여 창작된 것으로, 본 발명의 목적은 IC의 패드로 모이는 열이 즉시 외부로 방열되도록 하여 IC의 내구성 및 방열효율을 향상시킬 수 있는 튜너를 제공함에 있다.The present invention was created to solve the problems of the prior art as described above, an object of the present invention is to provide a tuner that can improve the durability and heat dissipation efficiency of the IC by allowing the heat collected by the pad of the IC to be immediately radiated to the outside. Is in.

상기 목적을 달성하기 위한 본 발명에 따른 튜너는, 섀시; 상기 섀시의 상면 또는 하면에 각각 결합된 상부커버 및 하부커버; 상기 섀시의 내부에 설치되며 고열을 발생하는 발열소자인 IC(Integrated Circuit)가 실장된 부위에는 비아홀(Via Hole)이 형성된 인쇄회로기판; 상기 비아홀이 형성된 상기 인쇄회로기판의 부위 및 상기 하부커버와 각각 접촉되는 방열패드; 상기 비아홀에 제공되어 상기 IC에서 발생되는 열을 상기 방열패드로 전달하는 도체를 구비한다.Tuner according to the present invention for achieving the above object, the chassis; An upper cover and a lower cover respectively coupled to the upper or lower surface of the chassis; A printed circuit board installed in the chassis and having a via hole formed at a portion where an integrated circuit (IC), which is a heat generating device, generating high heat; A heat dissipation pad in contact with portions of the printed circuit board on which the via holes are formed and the lower cover, respectively; And a conductor provided in the via hole to transfer heat generated from the IC to the heat dissipation pad.

이하, 첨부한 도면을 참조하여 본 발명의 일 실시예에 따른 튜너를 상세히 설명한다.Hereinafter, a tuner according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명의 일 실시예에 따른 튜너의 개략적 구성을 보인 단면도이다.2 is a cross-sectional view showing a schematic configuration of a tuner according to an embodiment of the present invention.

도시된 바와 같이, 본 실시예에 따른 튜너(100)는 사각형상의 섀시(110), 섀시(110)의 상면 하면에 결합된 상부 및 하부커버(121,125), 섀시(110)의 내부에 설치된 인쇄회로기판(130)을 가진다.As shown, the tuner 100 according to the present embodiment has a rectangular chassis 110, upper and lower covers 121 and 125 coupled to the upper and lower surfaces of the chassis 110, and printed circuits installed in the chassis 110. It has a substrate 130.

인쇄회로기판(130)의 상면 및 하면에는 동박(131,135)이 형성되고, 인쇄회로기판(130)의 상면에 형성된 동박(131)에는 상호 전기적으로 연결된 IC(Integrated Circuit)(141)와 콘데서 및 저항 등과 같은 다수의 수동소자(145)가 설치된다. IC(141)의 내부에는 고열을 발생하는 코아(141a)가 설치되고, 내부 저면에는 코아(141a)와 접촉되어 코아(141a)에서 발생되는 열을 방열하기 위한 패드(141b)가 설치된다.Copper foils 131 and 135 are formed on the upper and lower surfaces of the printed circuit board 130, and an integrated circuit 141 and a capacitor and a resistor are electrically connected to the copper foil 131 formed on the upper surface of the printed circuit board 130. A plurality of passive elements 145 are installed. A core 141a for generating high heat is installed inside the IC 141, and a pad 141b for dissipating heat generated from the core 141a by contacting the core 141a is installed on an inner bottom surface thereof.

본 실시예에 따른 튜너(100)는 코아(141a)에서 발생되어 패드(141b)로 전달된 열을 IC(141)의 하측을 통하여 외부로 즉시 방열시킬 수 있도록 마련되는데, 이 를 설명한다.The tuner 100 according to the present embodiment is provided to immediately dissipate heat generated from the core 141a and transferred to the pad 141b to the outside through the lower side of the IC 141, which will be described.

IC(141)가 접촉하는 IC(141) 바로 하측의 인쇄회로기판(130)의 부위에는 다수의 비아홀(Via Hole)(130a)이 형성된다. 비아홀(130a)에는 인쇄회로기판(130)의 상면 및 하면에 형성된 동박(131,135)을 일체로 연결하는 열전도성이 우수한 동(Cu)과 동일한 소재의 도체(130b)가 삽입된다.A plurality of via holes 130a are formed in a portion of the printed circuit board 130 directly below the IC 141 to which the IC 141 contacts. A conductor 130b of the same material as copper Cu having excellent thermal conductivity is inserted into the via hole 130a to integrally connect the copper foils 131 and 135 formed on the upper and lower surfaces of the printed circuit board 130.

인쇄회로기판(130)의 하면과 하부커버(135) 사이에는 방열패드(150)가 마련되는데, 방열패드(150)는 인쇄회로기판(130)의 하면에 형성된 동박(135)과 하부커버(125) 와 각각 접촉한다. 그리고, 상부 또는 하부커버(121,125)에는 다수의 방열공(121a,125a)이 각각 형성된다.The heat dissipation pad 150 is provided between the lower surface of the printed circuit board 130 and the lower cover 135. The heat dissipation pad 150 is formed of the copper foil 135 and the lower cover 125 formed on the lower surface of the printed circuit board 130. ) Respectively. A plurality of heat dissipation holes 121a and 125a are formed in the upper or lower covers 121 and 125, respectively.

상기와 같은 구성의 본 실시예에 따른 튜너(100)의 방열과정을 설명한다.The heat dissipation process of the tuner 100 according to the present embodiment having the above configuration will be described.

IC(141)의 내부에 마련된 코아(141a)에서 발생되는 열은 IC(141)의 저면에 설치된 패드(141b)에 모인다. 그런데, 패드(141a)는 인쇄회로기판(130)의 상면에 형성된 동박(131)과 접촉되어 있으므로, 패드(141a)에 모인 열은 인쇄회로기판(130)의 상면에 형성된 동박(131) → 도체(130b) → 인쇄회로기판(130)의 하면에 형성된 동박(135) → 방열패드(150) → 하부커버(125)를 통하여 외부로 전달된다. 즉, IC(141)의 패드(141a)에서 인쇄회로기판(130)의 상면측으로 전달된 열이 비아홀(130a)에 삽입된 도체(130b)를 통하여 인쇄회로기판(130)의 하면측으로 즉시 전달되어 튜너(100)의 외측으로 방열되는 것이다. 그리고, 섀시(110)의 내부에 존재하는 열은 상부 및 하부커버(121,125)에 형성된 방열공(121a,125a)을 통하여 튜너(100)의 외부로 방열된다. Heat generated from the core 141a provided in the IC 141 is collected in the pad 141b provided on the bottom of the IC 141. However, since the pad 141a is in contact with the copper foil 131 formed on the upper surface of the printed circuit board 130, the heat collected on the pad 141a is the copper foil 131 formed on the upper surface of the printed circuit board 130 → conductor. 130b is transferred to the outside through the copper foil 135 formed on the lower surface of the printed circuit board 130, the heat radiation pad 150, and the lower cover 125. That is, heat transferred from the pad 141a of the IC 141 to the upper surface side of the printed circuit board 130 is immediately transferred to the lower surface side of the printed circuit board 130 through the conductor 130b inserted into the via hole 130a. The heat is radiated to the outside of the tuner 100. The heat existing inside the chassis 110 is radiated to the outside of the tuner 100 through heat dissipation holes 121a and 125a formed in the upper and lower covers 121 and 125.

이상에서 설명하듯이, 본 발명에 따른 튜너는 IC의 내부 저면에 모인 열이 IC의 저면과 접촉된 인쇄회로기판의 부위에 형성된 비아홀을 통하여 인쇄회로기판의 상면에서 하면측으로 즉시 전달되어 튜너의 외측으로 방열된다. 그러므로, IC 내부가 가열되지 않으므로 제품의 내구성이 향상되고, 방열효율이 향상된다.As described above, the tuner according to the present invention is immediately transferred from the upper surface of the printed circuit board to the lower surface side through the via hole formed in the portion of the printed circuit board in contact with the bottom surface of the IC to the outside of the tuner Heat dissipation. Therefore, since the inside of the IC is not heated, the durability of the product is improved and the heat radiation efficiency is improved.

이상에서는, 본 발명의 일 실시예에 따라 본 발명을 설명하였지만, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 변경 및 변형한 것도 본 발명에 속함은 당연하다.In the above, the present invention has been described in accordance with one embodiment of the present invention, but those skilled in the art to which the present invention pertains have been changed and modified without departing from the spirit of the present invention. Of course.

Claims (3)

섀시;Chassis; 상기 섀시의 상면 및 하면에 각각 결합된 상부커버 및 하부커버;An upper cover and a lower cover respectively coupled to upper and lower surfaces of the chassis; 상기 섀시의 내부에 설치되며 고열을 발생하는 발열소자인 IC(Integrated Circuit)가 실장된 부위에는 비아홀(Via Hole)이 형성된 인쇄회로기판;A printed circuit board installed in the chassis and having a via hole formed at a portion where an integrated circuit (IC), which is a heat generating device, generating high heat; 상기 비아홀이 형성된 상기 인쇄회로기판의 부위 및 상기 하부커버와 각각 접촉되는 방열패드;A heat dissipation pad in contact with portions of the printed circuit board on which the via holes are formed and the lower cover, respectively; 상기 비아홀에 제공되어 상기 IC에서 발생되는 열을 상기 방열패드로 전달하는 도체를 구비하는 것을 특징으로 하는 튜너.And a conductor provided in the via hole to transfer heat generated from the IC to the heat dissipation pad. 제 1 항에 있어서,The method of claim 1, 상기 도체는 상기 인쇄회로기판에 형성된 동박과 동일한 소재인 것을 특징으로 하는 튜너.The conductor is a tuner, characterized in that the same material as the copper foil formed on the printed circuit board. 제 1 항에 있어서,The method of claim 1, 상기 상부 또는 하부커버에는 방열공이 형성된 것을 특징으로 하는 튜너.Tuner, characterized in that the heat dissipation hole is formed in the upper or lower cover.
KR1020040078896A 2004-10-05 2004-10-05 Tuner KR101103572B1 (en)

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WO2012050290A1 (en) * 2010-10-12 2012-04-19 주식회사 에이치앤에스솔루션 Heat-dissipating device of liquid crystal display device using rear case

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KR100533276B1 (en) * 1999-02-26 2005-12-05 엘지전자 주식회사 Manufacturing method of PCB and PCB thereby
KR20050091177A (en) * 2004-03-11 2005-09-15 (주)한양써키트 Via in pad pcb and building up method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012050290A1 (en) * 2010-10-12 2012-04-19 주식회사 에이치앤에스솔루션 Heat-dissipating device of liquid crystal display device using rear case

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