KR20060028374A - Cooler for computer parts and manufacturing method of the cooler - Google Patents

Abstract

The present invention relates to an apparatus for cooling a heat generating part that generates heat during operation among components embedded in a computer, the heat transfer block being tightly coupled to the heat generating part to receive heat generated from the heat generating part; At least one heat pipe including a heat transfer block coupling portion thermally coupled to the heat transfer block, and a heat dissipation fin coupling portion bent to form a curved shape; And a plurality of heat dissipation fins coupled to the heat dissipation fin coupling portion of the heat pipe, and spaced apart from each other along the heat dissipation fin coupling portion.

Description

Cooling device for computer parts and manufacturing method thereof {Cooler for computer parts and manufacturing method of the cooler}

1 is a perspective view of a cooling device for a computer part of the first embodiment according to the present invention;

Figure 1a is a view showing only the heat transfer block and the heat pipe in the cooling device for computer components of Figure 1,

2, 3 and 4 are front, side and back views of the cooling device for the computer component of FIG. 1, respectively.

Figure 5a is a view showing the heat radiation fin of Figure 1,

5B is a cross-sectional view taken along the line b-b 'of FIG. 5A;

6 is a perspective view of a cooling device for a computer part of the second embodiment according to the present invention;

7 is a perspective view of a state in which the duct member of FIG. 6 is removed;

8 is a perspective view showing only the duct member of FIG. 6;

9 is a perspective view of a cooling device for computer components of a third embodiment according to the present invention;

9A is a view showing only the heat transfer block and the heat pipe in the cooling device for computer parts of FIG. 9;

10 and 11 are front and rear views of the cooling device for the computer component of FIG. 9, respectively.

12 is a perspective view of a cooling device for computer components of a fourth embodiment according to the present invention;

12A is a view showing only the heat transfer block and the heat pipe in the cooling device for computer parts of FIG. 12;

13 and 14 are front and side views, respectively, of the cooling device for the computer component of FIG. 12;

15 is a perspective view of a cooling device for computer components of a fifth embodiment according to the present invention;

15A is a view showing only the heat transfer block and the heat pipe in the cooling device for computer parts of FIG. 15;

16 and 17 are front and side views, respectively, of the cooling device for the computer component of FIG. 15;

18 is a perspective view of a cooling device for computer components of a sixth embodiment according to the present invention;

18A shows only the heat transfer block and the heat pipe in the cooling device for computer parts of FIG. 18;

19 is a plan view of the cooling device for computer component of FIG. 18,

20 is a perspective view of a state in which the cooling device for computer parts of the seventh embodiment according to the present invention is mounted on a substrate;

FIG. 21 is a perspective view of the cooling device for computer parts of FIG. 20 viewed from below; FIG.

21A is a view showing only the heat transfer block and the heat pipe in the cooling device for computer parts of FIG. 21;

22 and 23 are bottom and side views, respectively, of the cooling device for computer components of FIG. 20;

24 is a perspective view of a cooling device for computer components of the eighth embodiment according to the present invention;

24A shows only the heat transfer block and the heat pipe in the cooling device for computer parts of FIG. 24;

25 is a plan view of the cooling device for computer component of FIG. 24,

26. Perspective view of a cooling device for a computer part of the ninth embodiment according to the present invention,

FIG. 26A shows only the heat transfer block and the heat pipe in the cooling device for computer parts of FIG. 26;

27 is a plan view of the cooling device for computer component of FIG. 26,

28 and 29 are respectively a perspective view, a front view, and a rear view of the cooling device 1i for a computer component of a tenth embodiment according to the present invention;

30 and 31 are respectively a perspective view, a front view, and a rear view of the cooling device 1j for a computer part according to an eleventh embodiment according to the present invention;

32 and 33 are a perspective view and a plan view, respectively, of a cooling device 1k for computer parts according to a twelfth embodiment according to the present invention;

Fig. 34 is a rear view of the cooling device for computer parts of the thirteenth embodiment according to the present invention;

34A shows only the heat transfer block and the heat pipe in the cooling device for computer parts of FIG. 34;

35 to 37 are views for explaining a method of manufacturing a cooling device for computer components according to the present invention,

<Description of the symbols for the main parts of the drawings>

1, 1a to m ... Chillers for computer parts

10 ... heating block 12 ... first member

14 ... second member 16 ... through hole

18 ... elastic pressing part 19 ... fixing part

20 ... heat pipe 22 ... heating block joint

24 ... connections 26 ... heat sink fin connections

30, 30a, 30b, 30c ... heat sink fins

32 ... through hole 34 ... recess

35 ... depression 36 ... spacer

40 ... cooling fan 42 ... center drive

44 ... wing 50 ... duct member

99 ... substrate

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for computer components, and more particularly, to a heat pipe having a curved heat dissipation fin coupling portion and a heat dissipation fin coupling portion in order to cool a component that generates heat during operation among various components embedded in a computer. The present invention relates to a cooling device for computer parts that can cool the heat generated by the heat generating parts more efficiently by using a plurality of combined heat radiation fins.

Among the components mounted inside the computer, there are components that generate heat during operation, such as a heating component such as a chipset mounted on a substrate of a central processing unit (CPU) or a graphic adapter. In this heating part, a large amount of heat is generated during operation. If the heat is not effectively cooled, the temperature of the heating part exceeds an appropriate temperature, and the heating part may cause an operation error or may be damaged in severe cases. In addition, according to the rapid development of science and technology, various heating components installed and operated inside a computer are increasingly increasing the amount of heat generated per unit volume due to integration and high capacity. Therefore, the heat generating component necessarily requires a cooling device capable of appropriately and effectively cooling the generated heat.

In accordance with this demand, an attempt is made to receive heat from the heat-generating component and to effectively transfer it to the heat dissipation means, and to increase the surface area by increasing the volume of the heat dissipation means to dissipate the heat as quickly as possible to the outside of the apparatus. have. As a result of these attempts, cooling devices having various types of heat dissipation means have emerged, and as a result, the heat capacity that these cooling devices can cool is also increasing.

However, the heat dissipation means of such a conventional cooling device has been gradually increasing in order to exhibit the necessary cooling capacity, there is a problem that the heat dissipation means is not effectively used for heat dissipation as a whole. That is, when a portion of the heat dissipation means is relatively unable to effectively use the heat dissipation, this reduces the amount of cooling per unit weight of the heat dissipation means, which requires more material for the desired cooling capacity, which is the weight of the heat dissipation means. Of course, there is a problem that the manufacturing cost is also increased.

Therefore, there is a need for a cooling device that improves the cooling capacity per unit weight over a conventional cooling device by using the heat radiating means evenly and effectively as a whole.

An object of the present invention is to provide a cooling device for a computer component having improved cooling capability by improving a coupling structure of a heat pipe and a heat radiation fin coupled to the heat pipe.

The cooling device for computer parts according to the present invention is a device for cooling a heat generating component that generates heat during operation among components embedded in a computer, and is tightly coupled to the heat generating component to receive heat generated from the heat generating component. Heat transfer block; At least one heat pipe including a heat transfer block coupling portion thermally coupled to the heat transfer block, and a heat dissipation fin coupling portion bent to form a curved shape; And a plurality of heat dissipation fins coupled to the heat dissipation fin coupling portion of the heat pipe, and spaced apart from each other along the heat dissipation fin coupling portion.

On the other hand, the heat transfer block coupling portion of the heat pipe, at least one end of the both ends of the heat pipe, the heat dissipation fin coupling portion is preferably at least a portion of the intermediate portion connecting the both ends.

Alternatively, the heat block coupling portion of the heat pipe is an intermediate portion of the heat pipe, and the heat dissipation fin coupling portion is preferably at least a portion of each portion extending from both ends of the heat block coupling portion.

On the other hand, the heat dissipation fin coupling portion of the heat pipe, it is preferable to form a substantially arc shape or to form a part of the ellipse shape.

Each of the heat dissipation fins may be a thin plate made of metal, and the plurality of heat dissipation fins may be formed such that the spaced apart intervals of the inner side ends of the heat dissipation fin coupling portions are smaller than the spaced intervals of the end portions of the heat dissipating fin coupling portions toward the outside. It is preferable to be disposed on the radiating fin coupling portion.

On the other hand, the heat dissipation fin coupling portion is generally circular, each of the heat dissipation fin is a thin plate made of a metal, the plurality of heat dissipation fins, it is preferable that the heat dissipation fins are arranged radially to the heat dissipation fin coupling portion so that the outer shape as a whole.

Each of the heat dissipation fins may be a thin plate member made of metal, and at least a portion thereof may be formed in a wave shape.

Meanwhile, each of the plurality of heat dissipation fins has a through hole through which the heat dissipation fin coupling portion of the heat pipe passes, and the heat dissipation fin coupling portion and each of the heat dissipation fins of the heat pipe are preferably coupled to each other by soldering. .

In addition, the heat dissipation fin coupling portion of the heat pipe may be disposed such that a virtual surface substantially including these heat dissipation fin coupling portions is formed perpendicular to or parallel to the top surface of the heat transfer block.

On the other hand, the cooling device for computer components, a cooling fan having a central drive unit with a motor built-in and a plurality of wings formed on the outer circumferential surface of the central drive unit to generate wind as it rotates, the one side of the plurality of heat radiation fins It is preferable to provide.

The central axis of the rotation of the center driving part of the cooling fan is disposed to pass through the inside of the heat dissipation fin coupling portion of the heat pipe, and the wing portion is arranged to blow air between spaced spaces of the heat dissipation fins coupled to the heat dissipation fin coupling portion. The plurality of heat dissipation fins may be disposed and coupled to the heat dissipation fin coupling unit so that an empty space is formed at the rear of the center driving unit of the cooling fan.

The heat dissipation fin coupling portion of the heat pipe may be substantially arc-shaped, and the plurality of heat dissipation fins may have a size through which a virtual circle formed by at least an outer circumferential surface of the center driving portion of the cooling fan is formed at a central portion of the heat dissipation fin coupling portion. It is preferable to arrange | position so that an empty space may be formed.

On the other hand, the plurality of heat dissipation fins are enclosed as a whole, it may further include a duct member which is opened in the direction in which the blowing wind and blowing direction generated by the cooling fan.

In addition, the heat dissipation fin coupling portion of the heat pipe is substantially arc-shaped, the plurality of heat dissipation fins are formed in a cylindrical shape as a whole, each of the heat dissipation fins, the duct forming portions having at least a portion of the outer end is bent, The duct portion may be formed on an outer side surface of the cylinder formed by the plurality of heat dissipation fins.

On the other hand, one side of each of the heat radiation fins is formed, the plurality of heat radiation fins, it is preferable that the recessed portion that can accommodate the cooling fan is formed.

Further, the heat dissipation fin coupling portion of the heat pipe is substantially arcuate, and the plurality of heat dissipation fins are formed so that the air flow generated by the cooling fan passes through the heat dissipation fins and keeps spiral about the rotation axis of the cooling fan. An air passage therebetween may be formed to spiral in the direction of rotation of the cooling fan with respect to the rotation axis.

Each of the heat dissipation fins has a side toward the upstream side of the air flow generated by the cooling fan and the other side facing the downstream side with respect to one plane through which the middle portion of the heat dissipation fin and the rotation axis of the cooling fan are simultaneously passed. It is preferable to bend in the opposite direction.

On the other hand, the heat dissipation fin coupling portion of the heat pipe, may be disposed such that the virtual surface that substantially includes the heat dissipation fin coupling portion to form an acute angle with the upper surface of the heat transfer block.

The heating component may be a central processing unit (CPU) mounted on a main board of a computer, or a chipset mounted on a board of a graphic adapter mounted on a main board of a computer. It is preferable.

On the other hand, when the heat generating component is a chipset, the heat block is tightly coupled to the chipset, the heat dissipation fin coupling portion of the heat pipe, it is preferable that the heat transfer block is located opposite to the heat transfer block.

Hereinafter, with reference to the accompanying drawings, preferred embodiments will be described in detail.

1 to 5, there is shown a cooling device for a computer component of a first embodiment according to the present invention. 1 is a perspective view of a cooling device for computer parts, and FIGS. 2, 3 and 4 are front, side and back views, respectively, of the cooling device for computer parts of FIG.

The computer device cooling device 1 is a device for cooling a heat generating component that generates heat during operation among components built into a computer. The cooling apparatus of this embodiment is a case where the heat generating component is a central processing unit (cpu) mounted on a main board of a computer.

Therefore, the cooling device 1 for the computer component of the first embodiment is for cooling the heat generated in the central processing unit of the computer, the heat transfer block 10, the heat pipe 20, a plurality of heat radiation fins 30 and The cooling fan 40 is comprised.

The heat block 10 includes a first member 12 and a second member 14 made of a metal such as copper or aluminum, which is relatively superior to other metals having thermal conductivity. The first member 12 is fixed to the top surface of the heat generating part (not shown; in the present embodiment, the central processing unit), and receives heat generated from the heat generating part. The second member 14 is tightly fixed to the upper portion of the first member 12.

At this time, the 1st member 12 and the 2nd member 14 are formed in the groove part which has a semicircle cross section in each surface which mutually faces. Therefore, when the first member 12 and the second member 14 are combined, the heat pipe coupling is fitted to the outer peripheral surface of the heat transfer block coupling portion 22 of the heat pipe 20 to be described later to meet the groove portion The ball 16 is formed. The number of the coupling hole 16 is provided to correspond to the number of the heat pipe (20). In the present embodiment, all three heat pipes 20 are provided, so that both ends of each of the heat pipes 20 can be combined, all six coupling holes 16 of the heating block 10 are provided. .

However, in the present embodiment, the first member 12 and the second member 14 are coupled to the cylindrical coupling hole 16 is an example, but the present invention is not limited thereto. That is, even if the cylindrical coupling hole 16 is not formed, a corresponding portion of the heat pipe may be disposed between the first member and the second member and fixed while causing some plastic deformation.

On the other hand, in order to securely fix the first member 12 and the second member 14 to the heat generating parts, in the present embodiment, a pair of elastic pressing units 18 are provided. The pair of elastic pressing parts 18 is made of an elastic member, and the whole is made of one member. Referring to Figure 3, the upper portion of the heat transfer block 10 is provided with two elastic pressing units 18, one each on the left and right. One end of each elastic pressing unit 18 is positioned above the first member 12, and a fixing unit 19 is provided at the other end.

The lower surface of the heating block 10 is positioned on the upper surface of the heat generating part, and based on the direction of FIG. 3, the other end of each of the elastic pressing parts 18 on the left and right sides of the heating block 10 is not supported by a main board (not shown). After the elastic deformation in the downward direction to reach the upper surface of the fixed portion 19 is fixed to the motherboard. As a method of fixing, a conventional bolt is used to fix the bolt through a hole provided in the center of the fixing portion 19 to the main board. At this time, the fixing unit 19 may be directly fixed to the main board, but after fixing the intermediate member called the cooler guide or the cooler supporting member on the main board, the fixing unit 19 is fixed to the intermediate member. use. In this way, the pair of elastic pressing units 18 strongly presses the heat transfer block 10 on the upper surface of the heat generating part by the restoring force, and as a result, the heat transfer block 10 can be tightly fixed to the heat generating part, thereby generating the heat generating part. The heat generated from can be effectively transmitted.

The heat pipe 20 serves to transfer heat transferred from the heat generating component to the heat transfer block 10 and transfer the heat to the plurality of heat dissipation fins 30, which will be described later. The connection part 24 and the heat radiation fin coupling part 26 are provided. In the present embodiment, all three heat pipes 20 are provided. However, the number of such heat pipes 20 can be added or subtracted as needed.

In the case of the present invention, the heat pipe 20 absorbs heat in a relatively high temperature portion and quickly transfers it to a relatively low temperature portion, which is also called a heat transfer tube. In addition, in the process of transferring heat, since the heat is dissipated in the air other than the portion of the heat pipe 20 coupled to the heat transfer block 10, the heat pipe 20 also serves to cool the heat. However, the specific configuration of the heat pipe 20 for transmitting or dissipating heat is not only known, and since the specific configuration itself does not constitute the main contents of the present specification, further description thereof will be omitted. .

The heat block coupling portion 22 is straight, and is inserted into and coupled to the heat pipe coupling hole 16 provided in the heat block 10. The outer circumferential surface of the heat transfer block coupling portion 22 is thermally coupled to the heat transfer block 10 in a manner in close contact with the inner surface of the coupling hole 16 to receive heat of the heat transfer block 10 transferred from the heat generating component again. . On the other hand, in the present embodiment, the heat transfer block coupling portion 22 is provided at both ends of the heat pipe (20).

The connection portion 24 is a portion extending from the heat block coupling portion 22 and is a portion connecting the heat dissipation fin coupling portion 26 and the heat block coupling portion 22. That is, the connecting portion 24 refers to a portion corresponding to the heat block coupling portion 22 and the heat dissipation fin coupling portion 26 in one heat pipe 20. The connection part 24 is bent appropriately so that the heat dissipation fin coupling part 26 can be located on one imaginary plane at a desired position on top of the heat transfer block 10.

On the other hand, in the present embodiment, although the connection portion 24 is provided in both places of the heat pipe 20, although not shown, when the heat block coupling portion is provided only at one end of the heat pipe, the heat connection block coupling portion It may be provided with only one place to connect the radiating fin coupling portion. That is, the heat transfer block coupling portion is formed only at one end, and a portion extending therefrom forms a connection portion, and the heat dissipation fin coupling portion may be formed in all the remaining portions.

For convenience of description, referring to FIG. 3, which shows the heat pipe 20 disposed on the left side of the three heat pipes 20 in a thick imaginary line, the heat pipe 20 is coupled to the coupling hole 16 of the heat transfer block 10. The two connecting portions 24 extending from both ends of the heat pipe 20 are twisted and bent in three dimensions so that the heat dissipation fin coupling portion 26 may be located on a virtual surface P perpendicular to the drawing.

In addition, referring to FIG. 4, the portion extending from the heat block coupling portion 22 to the right side forms one connection portion 24 and is connected to the heat radiation fin coupling portion 26 on the left side of the heat radiation fin coupling portion 26. do. In addition, the portion extending to the left from the heat block coupling portion 22 forms another connection portion 24, and is connected to the heat radiation fin coupling portion 26 on the right side of the heat radiation fin coupling portion 26. That is, the connection part 24 of the present embodiment is formed to cross each other, which is to reduce the height of the heat radiation fin coupling portion 26, and also to maximize the portion of the heat pipe to which the heat radiation fin 30 is coupled. . On the other hand, such a connection portion 24 may be modified and molded differently from the present embodiment as needed.

The heat dissipation fin coupling portion 26 is a portion of the heat pipe having a curved shape rather than a straight line. The heat dissipation fin coupling part 26 extends from the heat transfer block coupling part 22 to form the connection part 24, and forms a curve and indicates a part to which the heat dissipation fins 30 are coupled. The heat dissipation fin coupling portion 26 may have various forms as necessary. One or more heat dissipation fin couplings 26 may be formed in one heat pipe 20.

In the case of the present embodiment, the heat dissipation fin coupling portion 26 is a heat dissipation fin coupling portion 26 having a substantially arc shape, and the number provided is one. The term "substantially circular arc" here does not mean only circular arcs as part of a perfect form of a circle by mathematical definition, and as a whole, the shape that is recognized by the ordinary people as arcs or bent to correspond to arcs. Means. In other words, the heat dissipation fin coupling portion 26 may be said to have a ring shape, an annular shape, or a circular shape, substantially or substantially.

On the other hand, the heat dissipation fin coupling portion 26 of the present invention is not limited to the shape having an arc shape, it may have a different shape. That is, the heat dissipation fin coupling portion 26 may be formed of an ellipse portion that substantially forms a part of an elliptical shape or an elliptical shape. The number provided may be two or more instead of one as necessary. The thing having an ellipse is mentioned later.

Referring to FIG. 4, in the virtual circle C centering on the virtual point P1, the heat dissipation fin coupling part 26 is friendly among circular arcs connecting two virtual points P2 and P3. 모양) has the shape corresponding to the arc.

In FIG. 2, referring to the detailed view portion shown in a circular shape, the heat dissipation fin coupling part 26 is closely coupled to the inner circumferential surfaces of the through holes 32 and the spacer parts 26 of the heat dissipation fin 30. Only a small portion of the radiating fin coupling portion 26 is exposed to the outside between the radiating fins 30.

Meanwhile, in FIG. 1A, the heat dissipation fins 30 and the cooling fan 40 are removed from the cooling device 1 of FIG. 1 so that the overall shape of the heat dissipation fin coupling portion 26 may be better shown. ) And only heat pipes 20 are shown.

On the other hand, in the present embodiment, the heat dissipation fin coupling portion 26 is formed in a portion other than the connection portion 24 among the extension portions extending from the heat transfer block coupling portions 22 at both ends of the heat pipe 20. In addition, the heat dissipation fin coupling part 26 is disposed to be substantially perpendicular to the top surface of the heat transfer block 10 in which a virtual surface substantially including the heat dissipation fin coupling part 26 is horizontally disposed. That is, referring to FIG. 3, the virtual plane P to which the heat dissipation fin coupling part 26 belongs is substantially perpendicular to the top surface of the heat transfer block 10.

A plurality of heat dissipation fins 30 are provided and are coupled to the heat dissipation fin coupling portion 26 of the heat pipe 20. Each heat radiation fin 30 is made of a thin plate of copper or aluminum, which is a metal having a relatively good thermal conductivity. The plurality of heat dissipation fins 30 are coupled to be spaced apart from each other along the heat dissipation fin coupling portion 26. In the present embodiment in which the heat dissipation fin coupling portion 26 constitutes an arc-shaped heat dissipation fin coupling portion 26, referring to FIGS. 1 and 4, the plurality of heat dissipation fins 30 are radially coupled to the heat dissipation fin coupling portion 26 so as to form a radial shape. In the arrangement, when a plurality of heat dissipation fins 30 are observed as a whole, the outer shape is cylindrical or cylindrical.

Referring to FIG. 5A, which illustrates one heat sink fin 30, the heat sink fin 30 includes through holes 32. The number of the through holes 32 provided is the same as the number of the heat pipes 20, and the heat dissipation fin coupling portion 26 of the heat pipes 20 is penetrated to each through hole 32.

In addition, each of the heat dissipation fins 30 includes a spacer portion 36 that maintains a constant distance between the plurality of heat dissipation fins 30. The spacer portion 36 protrudes along the outer circumferential surface of the through hole 32 of the heat dissipation fin 30. Referring to FIG. 5B, which is a sectional view taken along the line b-b of FIG. 5A, the spacer portion 36 is formed to protrude to the right from the heat dissipation fin 30. According to the protruding height of the spacer part 36, the separation distance between the heat dissipation fins 30 is determined.

In the case of the present embodiment, since the heat dissipation fin 30 is made of a soft material, the spacer portion 36 forms a through hole 32 in the heat dissipation fin 30 using a punching method or the like. It can be formed by protruding the outer peripheral surface of the). The spacer portion 36 may form a completely cylindrical shape, but in some cases, a part of the spacer portion 36 may be torn and protrude.

On the other hand, the spacer portion 36 may be formed by cutting a portion of the heat dissipation fin 30, for example, by cutting a portion corresponding to three sides of the quadrangle and folding the quadrangular shape while leaving the remaining portion intact. It may be formed by attaching to the heat radiation fin (30).

In the present embodiment, one side of each of the heat radiation fins 30 is formed with a recess 34 formed by removing a portion of the heat radiation fins 30. This recess 34 is for accommodating the cooling fan 40 to be described later. That is, when the plurality of heat dissipation fins 30 having the concave portion 34 are disposed along the heat dissipation fin coupling portion 26, as shown in FIG. 1, the heat dissipation fins 30 are recessed at one inlet portion of the plurality of heat dissipation fins 30 radially unfolded. The recessed portion 35 is formed so that the cooling fan 40 is accommodated in the recessed portion 35. Due to the presence of the depression 35, the wind generated by the cooling fan 40 is effectively blown between the heat dissipation fins 30.

The heat dissipation fins 30 and the heat dissipation fin coupling portions 26 of the heat pipes 20 are coupled to each other by soldering. In the present embodiment, between the circumferential portion of each through hole 32 of the heat radiating fin 30 and the heat radiating fin coupling portion 26 inserted into the through hole 32, a soldering portion formed by applying a cream solder and then heating is formed. So, the heat dissipation fin 30 and the heat dissipation fin coupling portion 26 is fixed to each other.

Meanwhile, in the present embodiment, since the plurality of heat dissipation fins 30 are coupled to the arc-shaped heat dissipation fin coupling portion 26, the plurality of heat dissipation fins 30 also has a radial shape as a whole. 4, the plurality of heat dissipation fins 30 are disposed on the heat dissipation fin coupling part 26 so that an empty space is formed at the central portion of the plurality of heat dissipation fins 30 which are essentially radial. The size of the empty space may be determined by the radius of curvature of the heat dissipation fin coupling portion 26 and the length of the portion extending from the through hole 32 of the heat dissipation fin 30 to an upper portion (see FIG. 5A). Due to the presence of the empty space, the amount of material required for the heat dissipation fins 30 can be reduced to a considerable extent as compared with the related art, and the cooling performance can be improved by improving the flow characteristics of the air around the heat dissipation fins 30.

In the present embodiment, the plurality of heat dissipation fins 30 are spaced apart from each other toward the center of the heat dissipation fin coupling 26, and spaced apart from the ends of the heat dissipation fin coupling 26 toward the outside. It is coupled to the radiating fin coupling portion 26 to be smaller. 2 and 4, since the plurality of heat dissipation fins 30 are radially unfolded, the spaced apart intervals of the heat dissipation fins 30 are the smallest at the ends toward the center of the heat dissipation fin coupling portion 26. As you go outwards, it becomes wider.

The cooling fan 40 includes a center driving part 42 and a wing part 44, and is provided at one side of the plurality of heat dissipation fins 30. In the present embodiment, the cooling fan 40 is disposed in the depression 35 formed on one side of the plurality of heat dissipation fins 30.

The center driving part 42 includes a driving part in which a motor is built and fixed to the heat transfer block 10, and a rotation center part that rotates together with the rotation shaft of the motor. In the present embodiment, the driving part of the center driving part 42 is supported and fixed to the heat transfer block 10 by a pair of leg parts 46. The rotation axis of the center driving part 42 is disposed near the center of the heat dissipation fin coupling part 26 of the heat pipe 20.

The wings 44 are coupled to the plurality along the outer circumferential surface of the center of rotation of the center driving part 42, the part generating the wind as it rotates. The wings 44 are arranged to blow air between spaced spaces between the heat dissipation fins 30 coupled to the heat dissipation fin coupler 26.

On the other hand, the plurality of heat dissipation fins 30 of the present embodiment is disposed in the heat dissipation fin coupling portion 26 so that an empty space is formed behind the center driving portion 42 of the cooling fan 40. The rear of the center driving part 42 indicates the direction in which the wind caused by the wing parts 44 of the cooling fan 40 is blown. Preferably, the size of the empty space is such that the virtual circle formed by the outer circumferential surface of the center driving part 42 of the cooling fan can penetrate.

In other words, when a plurality of heat dissipation fins 30 are radially disposed, the size of the empty space formed at the center of the heat dissipation fins 30 is based on a virtual circle formed by the outer circumferential surface of the center driving part 42 as the bottom surface. It is preferable that it is a cylinder or the size of a cylinder. The reason for this is that when the cooling fan 40 rotates, the wind is made toward the rear of the cooling fan 40. At this time, the amount of wind blowing to the rear of the center driving part 42 is little, or the rear of the wing 44 Significantly less than. Therefore, by removing the portions of the heat radiation fins 30 located behind the center driving part 42 and leaving the empty spaces, the amount of material required for the heat radiation fins 30 can be significantly reduced. And the manufacturing cost is reduced.

The operation and effects of the cooling device 1 for the computer component of the first embodiment according to the present invention having the configuration as described above will be described.

The cooling device 1 for a computer component may include a heat pipe 20 to quickly transfer heat from the heat transfer block 10 to the heat dissipation fins 30. In particular, in the cooling device 1 according to the present invention, the heat dissipation fins 30 are coupled to an annular or annular heat dissipation fin coupling portion 26 that is bent in an arc shape of the heat pipe 20, unlike the conventional art. In addition, the material required can be reduced. In the related art, since the heat dissipation fins are fitted in a straight heat pipe, the heat pipe and the heat dissipation fins are extremely limited in shape, and thus, the heat dissipation fins are not effectively formed to dissipate heat.

In addition, in the present embodiment, the cooling fan 40 is provided on one side of the heat dissipation fins 30, and the heat dissipation fins 30 are radially disposed so as to be located only behind the wing 44 of the cooling fan 40. In order to form an empty space at the rear of the center driving part 42, there is an advantage that the wind generated from the cooling fan 40 can be efficiently used for cooling.

Along with this, other parts of the cooling fan 40 other than the rear part of the wing 44 are not affected by the wind generated by the wing 44, which is required for the heat dissipation fins 30 of this part. By removing the material to be used, it is possible to significantly reduce the material required for the heat dissipation fins 30, as described above, without reducing the amount of heat dissipation, and as a result, the amount of heat dissipation per unit weight of the heat dissipation fins 30 becomes significantly larger than in the related art. There is an advantage.

In addition, the wind generated by the wing 44 of the cooling fan 40, the amount is greater in the outer end side of the wings 44 than the root side of the wings 44 in contact with the center drive portion 42, the intensity is also high Strong is common. However, the heat dissipation fins 30 of the present embodiment are radially formed as a whole and are spaced apart from each other toward the outer end from the inwardly facing end, so that the relatively weak wind generated inside the wing part 44 has a narrow inner space. Blowing in between the heat dissipation fins 30 of the, strong and a large amount of wind generated from the outside of the wing 44 is blown between the heat dissipation fins 30 of the wide intervals to be able to smoothly escape to the rear.

Overall, the flow of wind by the cooling fan 40 occurs smoothly. Accordingly, it is possible to sufficiently and effectively use the wind of the cooling fan 40 to cool the heat transferred to the heat radiating fins 30. That is, although the heat radiation fins 30 are formed with a relatively small mass compared to the conventional apparatus, by installing the cooling fan 40 to effectively arrange them and use the arrangement as effectively as possible, the cooling capacity per unit weight is lower than that of the conventional apparatus. It is quite large.

On the other hand, although the cooling device 1 for computer components of the present embodiment has been exemplified as having a cooling fan 40, the present invention is not limited thereto, and even if the cooling device 40 is not provided, the cooling fan 40 is not. Except for the effect obtained by (40), the remaining effects can be sufficiently obtained. That is, even without the cooling fan 40, the heat dissipation fins 20 can be radially effectively disposed on the heat pipe 20 having the heat dissipation fin coupling portion 26, so that an improved cooling capacity can be expected. do.

Meanwhile, other embodiments according to the present invention are illustrated in FIGS. 6 to 33. Hereinafter, these modified embodiments will be described. However, the description will be made mainly on the part having a configuration different from that of the first embodiment, and for the parts not described, the description described in connection with the first embodiment or the description of the preceding embodiment is modified as it is or appropriately. Is applied. In addition, the same reference numerals are indicated to indicate configurations that play the same technical role.

6 to 8, there is shown a cooling device 1a for a computer component of a second embodiment according to the present invention. FIG. 6 is a perspective view of the entire apparatus 1a, FIG. 7 is a perspective view of the state in which the duct member 50 is removed, and FIG. 8 is a perspective view showing only the duct member 50.

The cooling device 1a for computer components of the second embodiment is characterized in that it comprises a chuck member 50 as compared with the first embodiment.

The duct member 50 surrounds the plurality of heat dissipation fins 30 from the outside, and serves to effectively flow the wind generated by the cooling fan 40 between the plurality of heat dissipation fins 30 without loss. In addition, the duct member 50, when the heat radiation fin 30 is formed of a very thin metal plate, serves to prevent the heat radiation fins 30, which should be kept spaced apart from contact with any external object and deform. In addition, it is possible to prevent the user from getting burned on the heat radiation fin 30 is hot.

The duct member 50 is spaced apart from the outside of the heat dissipation fins 30, but the distance is preferably as short as possible. The duct member 50 is opened in the direction in which the wind generated by the cooling fan 40 blows in and in the direction in which it blows out. The duct member 50 has a cylindrical or pipe shape as a whole, and is fixed to the heat transfer block 10 by a pair of leg portions 52 (see FIG. 8) provided under the duct member 50. At this time, the heat transfer block 10 of the second embodiment is slightly longer in the horizontal direction than the first embodiment in order to fix the leg portion 52 of the duct member 50.

Except for the duct member 50, the configuration of the heat transfer block 10, the heat pipe 20, the plurality of heat radiation fins 30, and the cooling fan 40 is similar to the first embodiment. However, one side of the heat dissipation fins 30 may not be provided with a recess for the cooling fan 40, and thus the cooling fan 40 has a relatively large size and is provided at one side of the heat dissipation fin 30.

9 to 11, there is shown a cooling device 1b for a computer component of a third embodiment according to the present invention. 9 is a perspective view of the entire apparatus 1b, FIG. 10 is a front view, and FIG. 11 is a rear view.

The bent form of the heat pipe 20 is different from that of the first embodiment in the cooling device 1b for computer components of the third embodiment. That is, although the heat pipe coupling part 22, the connection part 24, and the heat radiation fin coupling part 26 are provided in the heat pipe 20, the bent shape of the connection part 24 is different. 10 and 11, the connection portions 24 of the heat pipes 20 do not cross each other, but extend directly to the heat dissipation fin coupling portion 26. Although the total length of the heat dissipation fin coupling portion 26 is smaller than that of the first embodiment, the heat dissipation fin coupling portion 26 also has a circular arc shape.

Meanwhile, in FIG. 9A, the heat dissipation fins 30 and the cooling fan 40 of FIG. 9 are removed so that the overall shape of the heat dissipation fin coupling portion 26 may be better seen, and the heat transfer block 10 and the heat coupled thereto. Only pipe 20 is shown.

Except for the shape of the heat pipe 20, the configuration of the heat transfer block 10, the plurality of heat radiation fins 30 and the cooling fan 40 is similar to the same as the first embodiment.

12 to 14, there is shown a cooling device 1c for computer components of a fourth embodiment according to the present invention. 12 is a perspective view of the entire apparatus 1c, FIG. 13 is a front view, and FIG. 14 is a side view.

The bent form of the heat pipe 20 is different from the first and second embodiments in the cooling device 1c for computer components of the fourth embodiment according to the present invention. That is, the heat pipe 20 is the same as having the heat transfer block coupling portion 22, the connection portion 24 and the heat radiation fin coupling portion 26, but the length of the connection portion 24 is relatively short. That is, referring to FIG. 13, the connection portions 24 of the heat pipes 20 do not form the heat dissipation fin coupling portion 26 after being staggered or extended upwards, but extending from the heat transfer block 10. It is formed to form a heat radiation fin coupling portion 26. The total length of the heat dissipation fin coupling portion 26 is smaller than that of the first embodiment, but also forms a circular arc shape or a part of a ring shape.

Meanwhile, in FIG. 12A, only the heat transfer block 10 and the heat pipe 20 coupled thereto are illustrated so that the overall shape of the heat dissipation fin coupling portion 26 may be better seen.

In addition, in the present embodiment, the coupling direction of the heat pipe 20 and the heat transfer block 10 is different from the previous embodiments, but the role and function thereof are not changed. The rest of the components, the heat block 10, the plurality of heat sink fins 30 and the cooling fan 40 is similar to the first embodiment.

15 to 17, there is shown a cooling device 1d for computer components of a fifth embodiment according to the present invention. 15 is a perspective view of the entire apparatus 1d, FIG. 16 is a front view, and FIG. 17 is a side view.

The bent form of the heat pipe 20 is different from that of the first embodiment in the cooling device 1d for computer components of the fifth embodiment. That is, the heat pipe 20 is the same as having the heat transfer block coupling portion 22, the connection portion 24 and the heat radiation fin coupling portion 26, but the heat radiation fin coupling portion 26 of the heat pipe 20 is the heat transfer block It is different in that it is located in the upper part of rear rather than the upper part of (10).

In FIG. 15A, only the heat transfer block 10 and the heat pipe 20 coupled thereto are illustrated so that the overall shape of the heat dissipation fin coupling portion 26 may be better seen.

Referring to FIG. 17, the connection part 24 of the heat pipe 20 is formed to form an L shape, and the heat dissipation fin coupling part 26 is not positioned on the upper portion of the heat transfer block 10 but located on the rear upper part. . However, the heat dissipation fin coupling portion 26 is also formed in the form of a circular arc shape or a part of the ring shape as a whole. Except for the shape of the heat pipe 20, the configuration of the heat transfer block 10, the plurality of heat radiation fins 30 and the cooling fan 40 is substantially the same as the first embodiment.

18 and 19, a cooling device 1e for computer components of a sixth embodiment according to the present invention is shown. 18 is a perspective view of the entire apparatus 1e, and FIG. 19 is a plan view.

Compared to the first embodiment, the cooling device 1e for computer parts of the sixth embodiment has a virtual surface substantially including the heat dissipation fin coupling portion of the heat pipe 20 substantially with the upper surface of the heat transfer block 10. The difference is that they are parallel. That is, the heat pipe 20 is the same as the heat block coupling portion 22, the connection portion 24 and the heat radiation fin coupling portion 26, but the arrangement direction of the heat radiation fin coupling portion 26 is the case of the first embodiment As described above, it is different from the heat transfer block 10 in that it is arranged in a horizontal direction instead of vertically. In addition, the connection part 24 of the heat pipes 20 is not mutually staggered.

However, except that the shape of the heat pipe 20 is different and accordingly the direction in which the heat dissipation fins 30 are arranged, the heat transfer block 10, the plurality of heat dissipation fins 30, and the cooling fan 40 are basically different. The mutual configuration and the respective operations for the?) Are similar to those of the first embodiment. However, since the total height of the cooling device 1e of the present embodiment is small, the space occupied by the cooling device 1e can be reduced as a whole.

Meanwhile, in FIG. 18A, only the heat transfer block 10 and the heat pipe 20 coupled thereto are illustrated so that the overall shape of the heat dissipation fin coupling portion 26 may be better seen.

On the other hand, in the case of the first to sixth embodiments described above, the heating element is an example of a central processing unit, but the present invention is not limited thereto. In other words, the cooling device according to the present invention cools down a component other than a central processing unit, such as a chipset mounted on a board of a graphic adapter mounted on a main board of a computer, if necessary. Can be used for

20 to 23 show a cooling device 1f for a computer component of a seventh embodiment according to the present invention. FIG. 20 is a perspective view of the apparatus 1f mounted on the substrate 99, FIG. 21 is a perspective view of the apparatus 1f of FIG. 20 viewed from below, FIG. 22 is a rear view, and FIG. 23 is a side view. .

Compared to the sixth embodiment, the cooling device 1f for the computer parts of the seventh embodiment is, firstly, a graphic adapter in which the heating element to which the present cooling device 1f is applied is not mounted on the mainboard of the computer but the central processing unit. The difference is that it is a chipset mounted on the substrate 99 of the (Graphic adapter). That is, the cooling device 1f of this embodiment is used to cool the chipset of the needle graphic adapter. Since a graphics adapter, usually called a VGA card or the like, is a component used by being inserted into a motherboard, the peripheral space available to the cooling device for the chipset is often limited, so the cooling device 1f of the present embodiment is modified to suit this. Has a modified form.

The heat transfer block 10 of the present embodiment is tightly coupled to the chipset, and the heat dissipation fin coupling portion 26 of the heat pipe 20 is positioned on the opposite side of the heat transfer block 10 with the substrate 99 interposed therebetween. The heat dissipation fin coupling part 26 is a heat dissipation fin coupling part 26 having an arc shape close to a circle as a whole even in this embodiment. The connecting portion 24 connecting the heat transfer block coupling portion 22 and the heat dissipation fin coupling portion 26 surrounds the outside of the substrate and is bent appropriately. That is, the cooling device 1f does not use the space on the front surface where the chipset is mounted, and the heat pipes so that the heat dissipation fin coupling portion 26 and the plurality of heat dissipation fins 30 coupled thereto use the space on the rear surface of the substrate 99. (20) is molded. The description of the configuration except for this difference is appropriately applied to the description of the case of the sixth embodiment.

Meanwhile, in FIG. 21A, only the heat transfer block 10 and the heat pipe 20 coupled thereto are shown in the cooling device 1f of FIG. 21 so that the overall shape of the heat dissipation fin coupling portion 26 may be better seen. Become

24 and 25 show a cooling device 1g for a computer part of the eighth embodiment according to the present invention. 24 is a perspective view of the cooling device 1g in a state where it is mounted on the substrate 99 of the graphic adapter, and FIG. 25 is a plan view of FIG.

The cooling device 1g for computer parts of the eighth embodiment is a cooling device suitable for a chipset mounted on the board 99 of a graphic adapter mounted on the main board of the computer, as in the seventh embodiment. to be. However, unlike the seventh embodiment, the heat dissipation fin coupling portion 26 of the heat transfer block 10 and the heat pipe 20 is located on the same side of the substrate 99. The heat dissipation fin coupling portion 26 of the heat pipe 20 extends from the heat block coupling portion 22 to form the connection portion 24 at the same height as the heat block coupling portion 22, and then the same height. Furnace is formed in a shape surrounding the heat transfer block 10 as a whole.

Since the plurality of heat radiation fins 30 are also located on the outer surface of the heat transfer block 10 in the horizontal direction, the size thereof is relatively smaller than other embodiments. Accordingly, the space formed at the center of the heat dissipation fins 30 is larger than that of other embodiments.

However, each configuration is only somewhat modified in its form, the basic role is the same as the above-described embodiments. Meanwhile, in FIG. 24A, only the heat transfer block 10 and the heat pipe 20 coupled thereto are illustrated so that the overall shape of the heat dissipation fin coupling portion 26 may be better shown.

26 and 27, a cooling device 1h for a computer part of the ninth embodiment according to the present invention is shown. FIG. 26 is a perspective view of the cooling device 1h mounted on the substrate 99 of the graphic adapter, and FIG. 27 is a plan view of FIG.

The cooling device 1h for the computer component of the ninth embodiment is, like the eighth embodiment, a cooling device suitable for a chipset mounted on the board 99 of a graphic adapter mounted on the main board of the computer. The height away from the substrate of the heat pipe 20 is also similar to the eighth embodiment. However, in the cooling device 1h of the present embodiment, unlike the eighth embodiment or the first embodiment, the heat transfer block coupling portion 22 (indicated by an imaginary line in FIG. 27) of the heat pipe 20 is heat pipe. It is formed in the middle part rather than at both ends of (20). After the portions extending from both ends of the heat block coupling portion 22 form the connection portion 24, the remaining portions form a ring-shaped or semi-circular arc-shaped radiating fin coupling portion 26. Looking at the heat dissipation fin coupling portion 26 on both sides as a whole, it can be said to form a heat dissipation fin coupling portion 26 as in the above-described embodiments. Since the plurality of heat dissipation fins 30 are located on the outer surface of the heat transfer block 10 in the horizontal direction, their size is relatively small, and thus, the space formed at the center of the heat dissipation fins 30 is larger than other embodiments.

Meanwhile, in FIG. 26A, only the heat transfer block 10 and the heat pipe 20 coupled thereto are illustrated so that the overall shape of the heat dissipation fin coupling portion 26 may be better seen.

Meanwhile, the cooling devices 1g and 1h for the computer parts of the eighth embodiment and the ninth embodiment are respectively shown to be mounted on the board 99 of the graphic adapter in the illustrated drawings to cool the chipset. The cooling devices 1g and 1h are not limited thereto, and may be used as a cooling device for cooling the heat of the central processing unit as necessary.

In particular, the cooling devices 1g and 1h of the eighth and ninth embodiments may be usefully used when the overall height is relatively low and space constraints are applied. It can also be used as a cooling device for cooling the heat generating parts of a notebook computer. For other configurations that are not described, the description of the above-described embodiments applies as appropriate.

28 and 29, a cooling device 1i for a computer component of a tenth embodiment according to the present invention is shown. FIG. 28 is a perspective view of the cooling device 1i viewed from the rear, and FIG. 29 is a front view.

In the cooling device 1i for computer components, the outer end of each heat sink fin 30i is formed in a wave shape. In other words, the heat dissipation fin 30i of the present embodiment is extended to the outside of the heat dissipation fin coupling portion 26 of the heat pipe 20, although the same point is made of a thin plate member made of metal as compared with the previous embodiments. The feature is that the part is molded to form a wavy shape. Each of the heat dissipation fins 30i formed in the shape of a wave has an advantage of increasing the surface area within the entire outer volume of the same as compared to the flat heat dissipation fins 30 of the previous embodiment.

On the other hand, in the present embodiment, for example, but the cooling fin is formed to form a constant wave shape, it is also possible to increase the surface area relatively in another way. That is, although not shown, each of the heat radiation fins may be formed in a straight zigzag shape instead of a wave shape.

30 and 31 show a cooling device 1j for computer parts according to the eleventh embodiment according to the present invention. 30 is a perspective view of the cooling device 1j viewed from the rear, and FIG. 31 is a front view.

The computer device cooling device 1i is characterized in that the radiating fins form a duct portion. In the second embodiment, the duct member 50 (see FIGS. 6 and 8) is provided as a separate member. However, in the present embodiment, each of the heat dissipation fins 30j is bent at an angle of approximately 90 °. The duct forming part 31j formed is provided. When the heat dissipation fins 30j are spaced apart and coupled to the heat dissipation fin coupling portion 26, the duct forming portions 31j are adjacent to each other in close proximity to each other to form a duct portion serving as a duct. A plurality of heat dissipation fins (30j) to form a cylindrical as a whole is to form a duct portion on the outer surface of this cylinder. That is, it is not provided with a separate duct member, the duct forming portions 31j formed in each of the heat radiation fins are connected to form a duct portion.

However, in the present exemplary embodiment, the duct forming part 31j is provided at two of the outer ends of the heat dissipation fin 30j, but in another embodiment, a recess is formed in the outer end of the heat dissipation fin 30j. Instead, the duct forming portion 31j may be formed as one throughout the longitudinal direction of the heat dissipation fins 30j.

32 and 33 show a cooling device 1k for computer parts according to a twelfth embodiment according to the present invention. 32 is a perspective view of the cooling device 1k, and FIG. 33 is a plan view.

In the cooling device 1k for the computer component, the plurality of heat dissipation fins 30k maintain the spiral of the air flow generated by the cooling fan 40 about the central axis C of the rotation of the cooling fan 40. To this end, the air passage formed between the radiating fins (30k) is characterized in that formed in a spiral along the rotational direction of the cooling fan 40 with respect to the central axis (C).

When the cooling fan 40 shown in FIG. 32 is rotated in the direction of the arrow, the blades of the cooling fan generate a flow of air flowing helically in a counterclockwise direction, rather than a straight wind to the rear thereof. . However, in the present embodiment, since the air passage formed between the radiating fins 30k is formed to form a counterclockwise spiral like the rotational direction of the cooling fan 40 (that is, the spiral direction of the wind), the cooling fan The helical wind formed by 40 is able to flow better between the heat dissipation fins 30k. Due to this configuration, the cooling efficiency can be further improved.

On the other hand, in order to form a spiral air passage between the radiation fins (30k), each of the radiation fins (30k) will have a three-dimensional shape rather than a planar shape. Specifically, each of the heat dissipation fins 30k has one side facing the upstream side of the air flow generated by the cooling fan 40 and the other side facing the downstream side of the heat dissipation fin 30k and the cooling fan 40. It is bent in the opposite direction with respect to one plane Pk passing through the rotation axis C at the same time.

That is, with reference to the direction shown in FIG. 33 again, the upper side (upstream) of the heat dissipation fin 30k with respect to one plane Pk simultaneously passing through the intermediate portion of the rotating shaft C and one heat dissipation fin 30k. The part of the side) is bent to the left, and the part of the lower part (downstream) is bent to the right. When the heat radiation fins 30k are coupled to the heat radiation fin coupling portion 26 of the heat pipe 20, a spiral air passage is formed.

34 shows a cooling device 1m for computer parts according to a thirteenth embodiment according to the present invention. 34 is a rear view of the cooling device 1m.

In the cooling device 1m of the present embodiment, the shape of the heat dissipation fin coupling portion of the heat pipe 30 is different from that of the previous embodiments. That is, in the above embodiments, the heat dissipation fin coupling portion 26 of the heat pipe has a circular arc shape as a whole. However, in the present embodiment, the heat transfer block coupling portions are formed at both ends of the heat pipe 20, and the two heat radiating fin coupling portions 26m and the two heat dissipation fin coupling portions 26m are connected to portions extending therefrom. The straight part 25 is provided.

Here, each of the heat dissipation fin coupling portion 26m has a shape that may be referred to as a part of a semi-circular shape or an elliptical shape. Alternatively, the heat dissipation fin coupling portion 26m may be expressed as a track shape. Similarly, the two heat dissipation fins 26m are radially coupled to the two heat dissipation fins 26m, and the heat dissipation fins 30 are also spaced apart and coupled to the straight portion 25 side by side.

Meanwhile, in FIG. 34A, only the heat transfer block 10 and the heat pipe 20 coupled thereto are illustrated so that the overall shape of the heat dissipation fin coupling portion 26m may be better shown.

And the cooling apparatus 1m of this embodiment is equipped with two cooling fans 40 in the front surface. Such a cooling device 1m will be suitable for use when the space in which the device is installed and the available space is constrained upward and there is room in the transverse direction.

On the other hand, although not shown, as another embodiment, the heat dissipation fin coupling portion of the heat pipe, may be arranged so that the imaginary surface substantially includes the heat dissipation fin coupling portion acute angle with the upper surface of the heat transfer block. At this time, the cooling device has a cooling fan. That is, in the above embodiments, the imaginary surface including the heat dissipation fin coupling part is perpendicular to or parallel to the top surface of the heat dissipation block. Alternatively, the virtual surface including the heat dissipation fin coupling part is acute from the top surface of the heat dissipation block. That is, it may be arranged to make an angle larger than 0 ° and smaller than 90 °. The acute angle preferably forms an angle of approximately 30 ° to 60 °.

As such, when the virtual surface including the heat dissipation fin coupling part is inclined, the wind generated by the cooling fan not only cools the heat generating parts in which the heating block is in close contact, but also cools the other heat generating parts arranged in the vicinity. The advantage is that you can.

On the other hand, this invention discloses the method of manufacturing the cooling device for computer components.

The cooling device for computer parts manufactured by the manufacturing method of this invention is comprised including an electric heat block, a heat pipe, and many heat radiation fins. At this time, the cooling device manufactured by the manufacturing method of the present invention has a feature that the heat dissipation fins are spaced apart and coupled to the curved heat dissipation fin coupling portion of the heat pipe. This is a feature that the cooling devices for computer parts of the embodiment according to the present invention described above have in common.

Briefly describing the configuration of the device, the cooling device for a computer component, the heat transfer block is tightly coupled to the heat generating component to receive heat generated from the heat generating component; At least one heat pipe having at least one heat block coupling part thermally coupled to the heat block and at least one heat radiation fin coupling part extending from the heat block coupling part and bent to form a curved shape; And a plurality of heat dissipation fins coupled to the heat dissipation fin coupling portion of the heat pipe, the through heat dissipation fin coupling portions passing through the heat pipes and spaced apart from each other along the heat dissipation fin coupling portion.

As a method of manufacturing a cooling device for such a computer component, the manufacturing method of the present invention includes a preparation step of preparing a plurality of heat sinks having a straight heat pipe and a through hole formed in each; Inserting the heat dissipation fins into the heat pipes using the through holes formed therein, and disposing the heat dissipation fins so as to be spaced apart from each other at regular intervals; And a heat dissipation fin coupling part forming step of bending a portion of the heat pipe in which the heat dissipation fins are disposed to form a heat dissipation fin coupling unit.

In addition, the cream solder coating step of applying a cream solder to the portion in contact with the outer circumferential surface of the through-holes of the heat pipe and the heat radiation fins; And a soldering step of applying heat to a portion to which the cream solder is applied to form a soldering portion for coupling the heat pipe and the respective heat radiation fins to each other.

The coating step may be performed before the radiating fin coupling part forming step, and the soldering step may be performed after the radiating fin coupling part forming step.

 35 to 37, a method of manufacturing a computer-aided cooling apparatus according to an embodiment of the present invention will be described.

A method of manufacturing a cooling device for a computer component includes preparing a heat pipe and a plurality of heat dissipation fins, inserting a heat pipe, applying a cream solder, forming a heat dissipation fin joint, and soldering.

In the preparing of the heat pipe and the plurality of heat dissipation fins 30, the heat pipes 20 are currently linear, and the heat dissipation fins 30 have the same number of penetrations as the number of the straight heat pipes 20 prepared. A ball 32 (see FIG. 5A) is formed. In FIG. 35, the portion to be the heat block coupling portion 22, the connection portion 24, and the heat radiation fin coupling portion 26 after the heat pipe 20 is molded is indicated.

The next heat pipe inserting step is to insert a plurality of heat dissipation fins 30 into the linear heat pipe 20. Referring to FIG. 36, the heat dissipation plates 30 are inserted into the heat pipe 20 using the through holes 32 formed in the respective heat generating plates. At this time, the spacer portion 32 is formed on the outer circumferential surface of the through hole 32 of the heat dissipation fin 30, so that only a plurality of heat dissipation fins 30 are sequentially inserted into the heat pipe of the portion to be the heat dissipation fin coupling portion 26 later. Lower surfaces of the heat dissipation fins 30 are equally spaced apart from each other by the height of the spacer portion 32. On the other hand, in the heat pipe insertion step, the plurality of heat dissipation fins 30 are aligned so that the through-holes are arranged in a straight line, and then a straight heat pipe may be inserted into the plurality of heat dissipation fins at once.

Next, the step of applying a cream solder. The cream solder is applied to a portion where the heat dissipation fin 30 and the heat pipe 20 meet. Cream solders are flowable materials that, when heated later, become solid and exert binding forces. The method of applying the cream solder may be performed in various ways.

However, applying the cream solder may be performed at the same time as the heat pipe is inserted into the heat radiation fins in the heat pipe insertion step. That is, while the heat radiation fin 30 is inserted into the through hole, and at the same time continuously blur the cream solder around the heat pipe, the heat pipe is inserted into the heat radiation fins with the cream solder, the insertion step and the application step is performed together . On the other hand, the cream solder coating step may be performed after forming the heat radiation fin coupling portion 26 to be described later, if necessary.

In the present embodiment, after applying the cream solder, the heat pipe 20 is bent in a ring shape or an arc shape to form a heat dissipation fin coupling portion 26. In a state as shown in FIG. 36, the heat pipe 30 is bent as it is while the heat dissipation fins 30 are fitted to form the heat dissipation fin coupling portion 26. In this embodiment, the heat dissipation fin coupling part 26 is a heat dissipation fin coupling part 26. Forming the heat radiation fin coupling portion 26 is preferably performed by a mechanized automatic equipment. On the other hand, as shown in Figure 37, the connecting portion 24 and the heat block coupling portion 22 also, after forming the heat radiation fin coupling portion 26 in the heat pipe 20, or forming the heat radiation fin coupling portion 26. At the same time it is formed.

Next, the soldering step is performed. In the state where the cream solder is applied, when the heat radiation fin coupling portion 26 is formed, heat is applied to the applied cream solder portion. The heated cream solder penetrates between the heat dissipation fin 30 and the portion where the heat dissipation fin coupling portion 26 of the heat pipe 20 is in contact. When the applied heat is removed, the cream solder is cooled to form a solid soldering portion 91 and the heat radiating fin and the heat pipe 20 are tightly coupled to each other.

In the method of manufacturing a cooling device for a computer component as described above, after coupling a plurality of heat dissipation fins 30 to the heat pipe 20, the heat pipe 20 of the coupled portion is a heat dissipation fin coupling portion having an arc or a ring shape. Since the molding, there is an advantage that the heat radiation fin 30 is coupled to the heat radiation fin coupling portion of the curved shape can be manufactured by a simple process. Conventionally, since only a method of simply inserting and fixing a plurality of heat dissipation fins into a straight heat pipe 20 is used, a product in which heat dissipation fins are fixed through a curved heat pipe cannot be produced.

In addition, since soldering is performed using a cream solder, the heat pipe 20 and the heat dissipation fins 30 may be firmly coupled to each other in a simple process. On the other hand, the heat dissipation fins 30 are provided with a spacer portion 32, it is made easy to maintain a constant distance from each other.

However, in the case of the manufacturing method of the present embodiment, the preparation step, the heat pipe inserting step, the cream solder coating step, the heat dissipation fin coupling portion forming step and the soldering step, but it is an example, but the present invention is not limited thereto. . That is, depending on the shape or convenience of the heat dissipation fins, both the coating step and the soldering step may be performed before the heat dissipation fin coupling part forming step, or both the applying step and the soldering step may be performed after the heat dissipating fin coupling part forming step.

As described above, the manufacturing method composed of the steps is a manufacturing method suitable for manufacturing the heat dissipation fin coupling portion 26 and the heat dissipation fins 30 coupled thereto provided in each of the cooling devices for the computer parts exemplified above. That is, the above-described embodiments can be manufactured by a manufacturing method including each step described above.

According to the cooling device for a computer component of the present invention, the heat pipe having a heat dissipation fin coupling portion and a plurality of heat dissipation fins coupled to the heat dissipation fin coupling portion can be used to more efficiently cool the heat generated by the heat generating parts. have.

Claims (24)

A device for cooling a heat generating component that generates heat during operation among components built into a computer, A heat transfer block tightly coupled to the heat generating parts to receive heat generated from the heat generating parts; At least one heat pipe including a heat transfer block coupling portion thermally coupled to the heat transfer block, and a heat dissipation fin coupling portion bent to form a curved shape; And And a plurality of heat dissipation fins coupled to the heat dissipation fin coupling parts of the heat pipe, and spaced apart from each other along the heat dissipation fin coupling parts. The method of claim 1, The heat transfer block coupling portion of the heat pipe is an end of at least one of both ends of the heat pipe, Cooling device for a computer component, characterized in that the radiating fin coupling portion is at least a part of the intermediate portion connecting the both ends. The method of claim 1, Heat transfer block coupling portion of the heat pipe, the middle portion of the heat pipe, The heat dissipation fin coupling portion, at least a portion of each portion extending from both ends of the heat transfer block coupling portion. The method of claim 1, Cooling device for a computer component, characterized in that the heat dissipation fin coupling portion of the heat pipe substantially forms an arc shape or a portion of an ellipse shape. The method of claim 1, Each of the heat radiation fins is a thin plate made of metal, The plurality of heat dissipation fins are disposed on the heat dissipation fin coupling portion such that the spaced apart intervals of the inner side ends of the heat dissipation fin coupling portion are smaller than the spaced intervals of the distal ends of the heat dissipation fin coupling portions. Chiller. The method of claim 1, The heat dissipation fin coupling portion forms a circle as a whole, Each of the heat radiation fins is a thin plate made of metal, The plurality of heat dissipation fins, the cooling device for a computer component, characterized in that the outer shape is disposed radially spread on the heat dissipation fin coupling portion to form a cylindrical shape as a whole. The method of claim 1, Each of the heat dissipation fins is a thin plate member made of metal, and at least a portion thereof is formed in a wave shape. The method of claim 1, Each of the plurality of heat dissipation fins has a through hole penetrating the heat dissipation fin coupling portion of the heat pipe, Cooling device for a computer component, characterized in that the heat dissipation fin coupling portion and each of the heat dissipation fins of the heat pipe are coupled to each other by soldering. The method of claim 1, And a heat dissipation fin coupling part of the heat pipe is disposed such that an imaginary surface substantially including these heat dissipation fin coupling parts is perpendicular to or parallel to an upper surface of the heat transfer block. The method of claim 1, The computer device cooling device, Cooling for a computer component further comprising a cooling fan having a central drive unit built in the motor and a plurality of wings formed on the outer circumferential surface of the central drive unit to generate wind as it rotates. Device. The method of claim 10, The central axis of the rotation of the center driving unit of the cooling fan is arranged to pass through the inside of the heat dissipation fin coupling portion of the heat pipe, the wing portion is arranged to blow air between the spaced space of the heat dissipation fins coupled to the heat dissipation fin coupling portion, The plurality of heat dissipation fins, the cooling device for a computer component, characterized in that arranged in the heat dissipation fin coupling portion to be formed so that the empty space to the rear of the center drive of the cooling fan. The method of claim 11, The heat sink fin coupling portion of the heat pipe substantially forms an arc shape, The plurality of heat dissipation fins are arranged in a central portion of the heat dissipation fin coupling portion such that an empty space having a size penetrating a virtual circle formed by an outer circumferential surface of the center driving portion of the cooling fan is formed. . The method of claim 10, Cooling device for a computer component characterized in that it further comprises a duct member which is wrapped around the plurality of heat dissipation fins as a whole, opening in the direction in which the wind generated by the cooling fan blows in and out. The method of claim 10, The heat dissipation fin coupling portion of the heat pipe substantially forms an arc shape, and the plurality of heat dissipation fins has a cylindrical shape as a whole. And each of the heat dissipation fins has a duct forming portion in which at least a portion of the outer end portion is bent, such that the duct forming portions form a duct portion on a cylindrical outer surface formed by the plurality of heat dissipation fins. The method of claim 10, One side of each of the heat radiation fins is formed, The plurality of heat dissipation fins, the cooling device for computer parts, characterized in that the depression that can accommodate the cooling fan is formed. The method of claim 10, The heat dissipation fin coupling portion of the heat pipe substantially forms an arc shape, The plurality of heat dissipation fins have an air passage therebetween so that the air flow generated by the cooling fan passes through the heat dissipation fins and maintains a spiral with respect to the rotation axis of the cooling fan. Cooling device for a computer component, characterized in that formed along the spiral. The method of claim 16, Each of the heat dissipation fins is opposite to each other with respect to a plane in which one side facing the upstream side of the air flow generated by the cooling fan and the other side facing the downstream side simultaneously pass through the middle portion of the heat dissipation fin and the rotation axis of the cooling fan. Cooling device for a computer component, characterized in that the curved. The method of claim 10, And a heat dissipation fin coupling part of the heat pipe is disposed such that a virtual surface of the heat dissipation fin coupling part substantially includes an acute angle with an upper surface of the heat transfer block. The method of claim 1, The heat generating component is a cooling device for a computer component, characterized in that the central processing unit (CPU) mounted on the main board of the computer. The cooling device of claim 1, wherein the heat generating part is a chipset mounted on a substrate of a graphic adapter mounted on a main board of a computer. The method of claim 20, The heat block is tightly coupled to the chipset, Cooling device for a computer component, characterized in that the heat radiating fin coupling portion of the heat pipe is located on the opposite side of the heat transfer block with the substrate therebetween. A heat transfer block tightly coupled to the heat generating parts to receive heat generated from the heat generating parts in order to cool the heat generating parts that generate heat during operation among the components embedded in the computer; At least one heat pipe having a heat transfer block coupling portion thermally coupled to the heat transfer block, and a heat dissipation fin coupling portion bent to form a curved shape; And a plurality of heat dissipation fins coupled to the heat dissipation fin coupling portion of the heat pipe, the heat dissipation fin coupling portions penetrating through the heat pipe fins and spaced apart from each other along the heat dissipation fin coupling portion. In the manufacturing method, A preparation step of preparing a plurality of straight heat pipes and a plurality of heat radiation fins each having a through hole formed therein; Inserting the heat dissipation fins into the heat pipes using the through holes formed therein, and disposing the heat dissipation fins so as to be spaced apart from each other at regular intervals; And And forming a heat dissipation fin coupling part by bending a portion of the heat pipe on which the heat dissipation fins are disposed to form a heat dissipation fin coupling part. The method of claim 22, A cream solder application step of applying a cream solder to a portion of the heat pipe and in contact with an outer circumferential surface of the through hole of each of the heat dissipation fins; And And applying a heat to the portion to which the cream solder is applied to form a soldering portion for coupling the heat pipes and the heat dissipation fins to each other. The method of claim 23, The coating step is made before the heat radiation fin coupling portion forming step, Wherein the soldering step, characterized in that after the forming step of the radiating fin coupling portion cooling device for a computer component.

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