KR20060133347A - Cooler for computer parts and manufacturing method of the cooler - Google Patents

Abstract

A device for cooling computer parts and a manufacturing method thereof are provided to improve cooling efficiency by using a fine heat pipe and radiating fins combined with the fine heat pipe. The fine heat pipe(10) includes a heated part combining part(12) thermally combined with the heated parts and a radiating fin combining part(14) forming a curve. The radiating fins(20) are arranged at intervals while combining one end with the radiating fin combining part of the fine heat pipe. A pressing part(30) closely attaches the heated part combining part of the fine heat pipe to the heated part. Each radiating fin is made of thin metallic plate and is combined to one side facing the center of the radiating fin combining part of the fine heat pipe.

Description

Cooling device for computer parts and manufacturing method thereof {Cooler for computer parts and manufacturing method of the cooler}

1 and 2 are a perspective view and a front view, respectively, of a cooling device for a computer component of a first embodiment according to the present invention;

3 is a perspective view showing only the capillary heat pipe of FIG.

4 is a cross-sectional view taken along the line IV-IV of FIG. 3;

5 is a perspective view of a state in which the cooling fan of FIG. 1 is removed;

6 is a front view of FIG. 5;

7 is a detailed view of the virtual line part of FIG. 6;

8, 9 and 10 are front views of a state in which the cooling fans of the second, third and fourth embodiments of the present invention are removed;

11 is a perspective view of a cooling device for a computer part of the fifth embodiment according to the present invention;

12 and 13 are a plan view and a side view, respectively, of the cooling device for computer components of FIG.

14 is a perspective view illustrating only the capillary heat pipe of FIG. 11;

15 and 16 are views for explaining a method of manufacturing a cooling device for computer components according to the present invention.

<Explanation of symbols for the main parts of the drawings>

1, 1a to d ... Chillers for computer parts

10 ... tubular heat pipe 12 ... heating element

14 ... heat sink fins 20 ... heat sink fins

22 ... engagement 24 ... separation

26 ... recess 28 ... recess

30 ... pressurizing means, pressurizing block 32 ... fixing part

40 ... cooling fan 42 ... center drive

44 ... wings

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for a computer component, and more particularly, to cooling a component that generates heat during operation among various components embedded in a computer, a tubular heat pipe and a heat radiation fin coupling having a curved heat radiation fin coupling portion. The present invention relates to a cooling device for computer parts that can more efficiently cool the heat generated by the heat generating parts by using a plurality of heat dissipation fins coupled to the unit.

Among the components mounted inside the computer, there are components that generate heat during operation, such as a heating component such as a chipset mounted on a substrate of a central processing unit (CPU) or a graphic adapter. In this heating part, a large amount of heat is generated during operation. If the heat is not effectively cooled, the temperature of the heating part exceeds an appropriate temperature, and the heating part may cause an operation error or may be damaged in severe cases. In addition, according to the rapid development of science and technology, various heating components installed and operated inside a computer are increasingly increasing the amount of heat generated per unit volume due to integration and high capacity. Therefore, the heat generating component necessarily requires a cooling device capable of appropriately and effectively cooling the generated heat.

In accordance with this demand, an attempt is made to receive heat from the heat-generating component and to effectively transfer it to the heat dissipation means, and to increase the surface area by increasing the volume of the heat dissipation means to dissipate the heat as quickly as possible to the outside of the apparatus. have. As a result of these attempts, cooling devices having various types of heat dissipation means have emerged, and as a result, the heat capacity that these cooling devices can cool is also increasing.

However, the heat dissipation means of such a conventional cooling device has been gradually increased in order to exhibit the required cooling capacity, there is a problem that the heat dissipation means is not effectively used for heat dissipation as a whole. That is, when a portion of the heat dissipation means is relatively unable to effectively use the heat dissipation, this reduces the amount of cooling per unit weight of the heat dissipation means, which requires more material for the desired cooling capacity, which is the weight of the heat dissipation means. Not only increases, but also increases the manufacturing cost.

Therefore, there is a need for a cooling device that improves the cooling capacity per unit weight over the conventional cooling device by using the heat radiating means evenly and effectively as a whole.

An object of the present invention is to provide a cooling device for a computer component that improves cooling capacity by using a tubular heat pipe and a heat dissipation fin coupled to the tubular heat pipe.

The cooling device for computer parts according to the present invention is a device for cooling a heat generating component that generates heat during operation among components embedded in a computer, and includes a heat generating component coupling portion that is thermally coupled to the heat generating component, and a curved shape. A tubular heat pipe including a heat dissipation fin coupling portion bent to achieve; A plurality of heat dissipation fins coupled to one end of the heat dissipation fin coupling portion of the tubular heat pipe, and disposed to be spaced apart from each other; And pressurizing means for closely contacting the heat generating part coupling part of the tubular heat pipe to the heat generating part.

On the other hand, the heat dissipation fin coupling portion of the tubular heat pipe, it is preferable to form a substantially arc shape or to form a part of the ellipse shape.

Each of the heat dissipation fins is a thin plate made of metal, and the plurality of heat dissipation fins is more preferably coupled to a side facing the center of the heat dissipation fin coupling portion of the tubular heat pipe.

In addition, each of the heat dissipation fins, the coupling portion formed by the one end is bent and the separation portion formed by the other end is bent, the coupling portion of the one end of each of the heat dissipation fins is coupled to the heat dissipation fin coupling portion of the tubular heat pipe The plurality of heat dissipation fins is preferably maintained at a constant distance from each other by the spaced portion of the other end of each heat dissipation fin.

Meanwhile, each of the heat dissipation fins is a thin plate made of metal, and the plurality of heat dissipation fins is preferably coupled to at least one of a surface facing the center and a surface facing the heat dissipation fin of the tubular heat pipe. .

On the other hand, the cooling device for a computer component, a cooling fan having a plurality of wings formed on the outer circumferential surface of the central drive unit and the central drive unit with a motor so as to blow air between the heat radiation fins and rotated by the motor It is preferable to further provide.

At this time, the heat dissipation fin coupling portion of the heat pipe is substantially arc-shaped, each of the heat dissipation fin is a thin plate made of metal, the plurality of heat dissipation fins, is coupled to the side facing the center of the heat dissipation fin coupling portion of the tubular heat pipe. In addition, it is preferable that a virtual circle formed by the outer circumferential surface of the center driving unit is formed at the rear of the center driving unit of the cooling fan to be coupled to the heat dissipation fin coupling unit so that an empty space having a penetrating size is formed.

In addition, a recess is formed at one side of each of the heat dissipation fins, and the plurality of heat dissipation fins is preferably provided with a recess for accommodating the cooling fan.

The heating component may be a central processing unit (CPU) mounted on a main board of a computer or a chipset mounted on a board of a graphic adapter mounted on a main board of a computer. desirable.

When the heat generating part is a chipset, the heat generating part coupling part of the heat pipe is thermally coupled to the chipset, and the heat dissipation fin coupling part of the heat pipe is positioned opposite to the heat generating part coupling part with the substrate interposed therebetween. Do.

Hereinafter, with reference to the accompanying drawings, preferred embodiments will be described in detail.

1 to 7, there is shown a cooling device 1 for a computer component of a first embodiment according to the present invention. 1 and 2 are a perspective view and a front view, respectively, of a cooling device for computer components. FIG. 3 shows only a capillary heat pipe, and FIG. 4 is a sectional view taken along the line IV-IV of FIG. 5 is a perspective view of a state in which the cooling fan of FIG. 1 is removed, FIG. 6 is a front view of FIG. 5, and FIG. 7 is a detailed view of the virtual line portion of FIG. 6.

The computer device cooling device 1 is a device for cooling a heat generating component that generates heat during operation among components built into a computer. The cooling apparatus of this embodiment is a case where the heat generating component is a central processing unit (cpu) mounted on a main board of a computer.

Therefore, the cooling device 1 for computer components of a 1st Example is comprised including the tubular heat pipe 10, the heat radiation fin 20, the pressurizing means 30, and the cooling fan 40. As shown in FIG.

The plate heat pipe 10 receives heat generated from a central processing unit (not shown), which is a heat generating part, and serves to quickly transfer the heat to heat dissipation fins. Part 14 is included. The portion connecting the heat generating part coupling part 12 and the heat dissipation fin coupling part 14 is a connection part 13 therebetween.

The tubular heat pipe 10 has a tubular tube 11 long connected therein, and a working fluid is contained in the tubular tube 11. Usually, a tubular heat pipe carries out evaporation and condensation of a working fluid continuously and transports heat in the form of latent heat. The tubular heat pipe has the advantage of being easy to manufacture and freely change the shape because it has no wick structure compared to the tubular heat pipe having a wick therein as a pipe. The tubular heat pipe is also called a vibrating tubular heat pipe. However, the specific operation principle or internal structure of the vibrating tubular heat pipe is not only known, but such detailed operation is not omitted since the operation principle or internal structure does not constitute the main contents of the present invention.

The tubular heat pipe 10 used in the present invention is a bent tubular heat pipe having a long plate shape in the longitudinal direction as shown in FIG.

The heat generating part coupling part 12 is in close contact with the top surface of the central processing unit whose lower surface is a heat generating part by the pressurizing means 30 which will be described later, and is thermally coupled. In addition, the connection part 13, which is a portion extending from the heat generating part coupling part 12, is a part of the heat pipe 10 which is bent properly so that the heat dissipation fin coupling part 14 may be at a desired position.

The heat dissipating fins coupling portion 14 is a portion of the curve bent in the form of customs-type heat pipe (10). The heat dissipation fin coupling portion 14 is a portion extending from the connection portion 13, and forms a curved line and indicates a portion to which the plurality of heat dissipation fins 20 are coupled. The heat dissipation fin coupling portion 14 may have various forms as necessary.

In the case of this embodiment, the heat dissipation fin coupling portion 14 has a substantially arc shape. The term "substantially circular arc" here does not mean only circular arcs as part of a perfect form of a circle by mathematical definition, and as a whole, the shape that is recognized by the ordinary people as arcs or bent to correspond to arcs. Means. In other words, such a heat radiation fin coupling portion 14 may be said to have a ring shape, an annular shape, or a circular shape, substantially or substantially.

On the other hand, the heat dissipation fin coupling portion 14 of the present invention is not limited to the shape having an arc shape, it may have a different shape. That is, the radiating fin coupling portion may be formed of an ellipse portion which substantially forms a part of an oval shape or an elliptical shape. The number provided may be two or more instead of one as necessary.

A plurality of heat dissipation fins 20 are provided, and one end of each of the heat dissipation fins 20 is coupled to the heat dissipation fin coupling portion 14 of the tubular heat pipe 10. The plurality of heat dissipation fins 30 are coupled to the heat dissipation fin coupling 14 at regular intervals from each other. Each heat radiation fin 30 is made of a thin plate of copper or aluminum, which is a metal having a relatively good thermal conductivity.

The plurality of heat dissipation fins 20 are coupled to the side facing the center of the heat dissipation fin coupling portion 14 of the tubular heat pipe. Here, the side facing the center refers to the side facing the center of the arc of the heat pipe 10 of the heat dissipation fin coupling portion 14. Referring to FIG. 7, which is a detailed view of the portion indicated by the phantom line of FIG. 6, the inward facing side surface OS and the opposite facing surface OS are indicated.

The plurality of heat dissipation fins 20 are coupled to the heat dissipation fin coupling portion 14 so as to form a radial shape as a whole, so that only the plurality of heat dissipation fins 20 except for the heat pipe 10 may be observed as a whole. Or cylindrical.

Each of the heat dissipation fins 20 includes a coupling portion 22 and a spacer 24 with reference to FIG. 7.

The coupling portion 22 is a portion formed by bending one side end of the heat dissipation fin 20. The coupling part 22 is fixed to the inner surface IS of the heat dissipation fin coupling part 14 so that the heat dissipation fin 20 is coupled to the tubular heat pipe 10. The inner surface of the coupling portion 22 and the heat dissipation fin coupling portion 14 are coupled to each other by soldering. That is, the heat dissipation fin 20 and the heat dissipation fin coupling part 14 are soldered parts formed by heating after the cream solder is applied to the contact portion 22 and the heat dissipation fin coupling part 14 of the heat dissipation fin 20. By mutual coupling is fixed.

The spacer 24 is a portion formed by bending the other end of the heat dissipation fin 20. The length of the spacer 24 is smaller than the length of the coupling 22. By providing the spacer 24, the other ends of the plurality of heat dissipation fins 20 can be easily maintained at a constant distance from each other. On the other hand, the spacer portion may be formed by bending the end as in the case of the present embodiment, alternatively, may be provided by a protrusion formed by protruding one side of the other end of the heat dissipation fin 20 using a method such as punching. have.

The pressurizing means 30 closely contacts the heat generating part coupling part 12 of the tubular heat pipe 10 to the upper surface of the central processing unit as the heat generating part. Referring to FIG. 5, in the present embodiment, the pressing means 30 is a pressing block located above the heat generating part coupling part 12. The pressure block 30 presses the heat generating part coupling part 12 of the tubular heat pipe 10 disposed above the heat generating part from top to bottom, so that the heat generated from the heat generating part effectively heats the heat generating part of the heat pipe. To be transmitted to the coupling part 12.

The pressing block 30 is provided with a fixed portion 32 extending forward and rearward. Each fixing portion 32 has a through hole formed therein. Appropriate fixing means, for example, screws or the like, are coupled to the substrate on which the heat generating parts are mounted using the through holes. This fixing portion 32 is preferably elastic. On the other hand, the fixing means 30, as long as it can be in close contact with the heat generating part coupling portion 12 of the heat pipe to the heat generating parts, various methods known in the art can be employed.

The cooling fan 40 includes a center driving part 42 and a wing part 44, and is provided in front of the plurality of heat dissipation fins 30.

The center drive part 42 has a motor built therein and is fixed to the duct member 46 by the support part 48. The duct member 46 is supported by a pair of legs 49 to allow the wind generated by the wings 44 to blow effectively between the heat dissipation fins 20.

The wings 44 are coupled to the plurality along the outer circumferential surface of the center of rotation of the center driving part 42, the part generating the wind as it rotates. The wings 44 are arranged to blow air between spaced spaces between the heat dissipation fins 20 coupled to the heat dissipation fin coupling 14.

On the other hand, the plurality of heat dissipation fins 20 of the present embodiment is disposed on the heat dissipation fin coupling portion 14 with an appropriate length so that an empty space is formed behind the center driving portion 42 of the cooling fan 40. The rear of the center driving part 42 indicates the direction in which the wind caused by the wing parts 44 of the cooling fan 40 is blown. The size of the empty space is preferably such that the virtual circle formed by the outer circumferential surface of the central drive part 42 of the cooling fan can penetrate therethrough.

In other words, when a plurality of heat dissipation fins 20 are disposed radially, the size of the empty space formed at the center of the heat dissipation fins 20 is a bottom of an imaginary circle formed by the outer circumferential surface of the center driving part 42. It is preferable that it is a cylinder or the size of a cylinder. The reason for this is that when the cooling fan 40 rotates, the wind is made toward the rear of the cooling fan 40. At this time, the amount of wind blowing to the rear of the center driving part 42 is little, or the rear of the wing 44 Significantly less than. Therefore, by removing the portions of the heat radiation fins 20 located behind the center driving part 42 and leaving the empty spaces, the amount of material required for the heat radiation fins 30 can be significantly reduced, so that the weight of the whole device is light And the manufacturing cost is reduced.

On the other hand, in the present embodiment, since the plurality of heat dissipation fins 20 are coupled to the arc-shaped heat dissipation fin coupling portion 14, the plurality of heat dissipation fins 20 also has a radial shape as a whole. And, as shown in Figure 6 is a front view of the cooling fan 40 is removed, a plurality of heat dissipation fins 20 are disposed in the heat dissipation fin coupling portion 14 so that an empty space is formed in the central portion. The size of the empty space may be determined by the radius of curvature of the heat dissipation fin coupling portion 14 and the length of the heat dissipation fin 20. Due to the presence of the empty space, the amount of material required for the heat dissipation fins 20 can be reduced to a considerable extent as compared with the related art, and the cooling performance can be improved by improving the flow characteristics of the air around the heat dissipation fins 20.

In the present embodiment, the plurality of heat dissipation fins 20 are coupled to the heat dissipation fins such that the spaced apart intervals of the free ends, which are not constrained toward the center, are smaller than the spaced apart intervals of the ends coupled to the heat dissipation fin coupling 14. It is coupled to the portion 14. That is, since the plurality of heat dissipation fins 20 are radially unfolded, the spaced apart intervals of the heat dissipation fins 20 have the smallest ends toward the center of the heat dissipation fin coupling portion 14 and the coupling portions 22 are provided therefrom. As you go outwards, it becomes wider.

The operation and effects of the cooling device 1 for the computer component of the first embodiment according to the present invention having the configuration as described above will be described.

The cooling device 1 for a computer component may include a vibrating tubular heat pipe 10 to receive heat from the heat transfer component, thereby rapidly transferring heat to the heat dissipation fins 20. In particular, the cooling device 1 according to the present invention comprises an annular or annular heat dissipation fin coupling portion 14 which is bent in an arc shape by forming a long plate-shaped tubular heat pipe in a longitudinal direction, so as to be spaced apart from each other. Since it is a configuration having a plurality of combined heat radiation fins 20, there is an advantage that can reduce the material required compared to the prior art. That is, in the related art, since the heat dissipation fins are fitted in a pipe-type straight heat pipe having a wick therein, the heat pipe and the heat dissipation fins are extremely limited in shape, and as a result, the heat dissipation fins are not efficiently used for cooling. There was a downside.

In addition, in the present embodiment, the cooling fan 40 is provided in front of the heat dissipation fins 20, and the heat dissipation fins 20 are radially disposed so as to be located only behind the wing 44 of the cooling fan 40. In order to form an empty space at the rear of the center driving part 42, there is an advantage that the wind generated from the cooling fan 40 can be efficiently used for cooling.

Along with this, other parts except for the rear portion of the wing 44 of the cooling fan 40 are not affected by the wind generated by the wing 44, which is required for the heat dissipation fins 20 of this portion. By removing the material to be used, it is possible to significantly reduce the material required for the heat dissipation fins 30, as described above, without reducing the amount of heat dissipation, and as a result, the amount of heat dissipation per unit weight of the heat dissipation fins 30 becomes significantly larger than in the related art. There is an advantage.

In addition, the wind generated by the wing 44 of the cooling fan 40, the amount is greater in the outer end side of the wings 44 than the root side of the wings 44 in contact with the center drive portion 42, the intensity is also high Strong is common. However, the heat dissipation fins 20 of the present embodiment have a radial shape as a whole and are spaced apart from each other toward the heat dissipation fin coupling portion from the free end of the central portion, so that the relatively weak wind generated inside the wing 44 is narrowly spaced. Blowing through the heat dissipation fins 20 of the central side, the strong and large amount of wind generated from the outside of the wing 44 is blown between the heat dissipation fins 20 with a wide interval to be able to smoothly escape to the rear.

Overall, the flow of wind by the cooling fan 40 occurs smoothly. Accordingly, it is possible to sufficiently and effectively use the wind of the cooling fan 40 to cool the heat transferred to the heat dissipation fins 20. That is, although the mass of the total material required for the heat dissipation fins 20 is relatively smaller than in the related art, by installing the cooling fan 40 to effectively arrange the heat dissipation fins 20 and to use the arrangement as effectively as possible, the unit weight The sugar cooling capacity is considerably larger than in the prior art.

On the other hand, although the cooling device 1 for computer components of the present embodiment has been exemplified as having a cooling fan 40, the present invention is not limited thereto, even if the cooling fan 40 is not directly provided, Except for the effect obtainable by the fan 40, the remaining effects can be sufficiently obtained. That is, even if the cooling fan 40 is not directly provided, the heat radiation fins 20 can be effectively disposed radially on the tubular heat pipe 10 having the heat radiation fin coupling portion 14, thereby improving cooling capability compared to the conventional art. You can expect.

8, 9 and 10 show the second, third and fourth embodiments, respectively. These figures show only the front view of the state with the cooling fan removed in each embodiment. Compared to the first embodiment, the bent shape of the tubular heat pipe 10 and the coupling method of the heat dissipation fins 20 are slightly different. Accordingly, other configurations that are not described are applied in the same or appropriately modified manner as described in the first embodiment. In addition, the same reference numerals are indicated to indicate configurations that play the same technical role.

The cooling device 1a for a computer part of the second embodiment shown in FIG. 8 has a heat generating part coupling part 12 at each end of the tubular heat pipe 10, and forms an arc in the middle part thereof. The heat dissipation fin coupling portion 14 is provided. In addition, the heat generating part coupling part 12 and the heat dissipation fin coupling part 14 are connected by two parts of the connection part 13. The tubular heat pipe 10 of the first embodiment (see FIG. 6) has a heat generating part coupling part 12 at one end thereof, and has one connection part 13 and a heat dissipation fin coupling part 14 extending therefrom. ), A slight difference is shown. However, the shape of the heat radiation fin coupling portion 14 is almost the same. In addition, although only the front view is shown in FIG. 8, the tubular heat pipe 10 is formed as shown in the tubular heat pipe 10 having a predetermined width and a long shape in the longitudinal direction. In addition, the pressurizing means 30 is in close contact with the heat generating parts coupling portion 14 to the heat generating parts as in the first embodiment.

The cooling device 1b for computer components of the third embodiment shown in FIG. 9 includes a tubular heat pipe 10, a plurality of heat dissipation fins 20, and a pressurizing device 30. Compared with the first embodiment, the heat dissipation fins 20 are coupled to the outer surface of the heat dissipation fin coupling portion 14 of the tubular heat pipe 10. Each heat radiation fin 20 has a coupling portion formed by bending one end portion. The coupling portion of each of the heat radiation fins 20 is coupled to the outer surface of the heat radiation fin coupling portion 14, the plurality of heat radiation fins 20 are spaced apart from each other to form a radial as shown. Except for the described configuration, the other configurations are the same as in the first embodiment.

Fig. 10 is a front view of the computer component cooling apparatus 1c of the fourth embodiment with the cooling fan removed. In the cooling device 1c of the present embodiment, the heat dissipation fins 20 and 21 are coupled to both inner and outer surfaces of the heat dissipation fin coupling portion 14 of the tubular heat pipe 10. The heat dissipation fins 20 on the inside correspond to the heat dissipation fins of the first embodiment, and the heat dissipation fins 21 on the outside correspond to the heat dissipation fins of the third embodiment shown in FIG.

As can be seen in the embodiment, the heat dissipation fins may be coupled to at least one of a side facing toward the center and a side facing outward of the heat dissipation fin coupling portion of the tubular heat pipe.

On the other hand, in the case of the first to fourth embodiments described above, the heating component is an example of a central processing unit, but the present invention is not limited thereto. In other words, the cooling device according to the present invention cools down a component other than a central processing unit, such as a chipset mounted on a board of a graphic adapter mounted on a main board of a computer, if necessary. Can be used for

11 to 14 show a cooling device 1d for computer components of a fifth embodiment according to the present invention. However, the description of the fifth embodiment will be made mainly on the part having a different configuration from the previous embodiments, and for the parts not described, the description described with respect to the previous embodiments is modified as it is or appropriately. Apply. In addition, the same reference numerals are indicated to indicate configurations that play the same technical role.

FIG. 11 is a perspective view of the cooling device 1d for the computer component of this embodiment, FIG. 12 is a plan view, FIG. 13 is a side view, and FIG. 14 is a view showing only the tubular heat pipe 10.

In comparison with the first embodiment, the cooling device 1d for the computer part of the fifth embodiment is, firstly, a graphic adapter in which the heat generating component to which the present cooling device 1d is applied is not mounted on the mainboard of the computer but the central processing unit. The difference is that it is a chipset mounted on the board of the (Graphic adapter). That is, the cooling device 1d of this embodiment is used to cool the chipset of the graphics adapter. Since a graphics adapter, usually called a VGA card or the like, is a component used by being inserted into a motherboard, the peripheral space available to the cooling device for the chipset is often limited, so that the cooling device 1d of the present embodiment is relatively suitable for this purpose. It has a deformed shape with low height.

The heat exchanger component coupling portion 12 of the tubular heat pipe 10 of the present embodiment is tightly coupled to the chipset (not shown) by the pressing means 30, and the connection portion 13 is formed to be properly twisted, and then heat The heat dissipation fin coupling portion 14 of the pipe 10 surrounds the chipset and forms an arc (see FIG. 14). The heat dissipation fins 20 are coupled to the inner surface IS of the heat dissipation fin coupling unit 14 to be spaced apart from each other. On the other hand, in the present embodiment, the heat dissipation fins 20 are described as being coupled to the inner surface of the heat dissipation fin coupling portion 14, but is not limited thereto. That is, as the cooling apparatus of the first embodiment has the modified embodiments of the second, third, and fourth, the cooling apparatus 1d of the fifth embodiment may have the modified embodiments.

On the other hand, in the present embodiment, the cooling fan 40 is disposed in the depression 28 formed in the heat radiation fins 20. One of the heat sink fins 20 is shown in FIG. 15. One side of each of the heat radiation fins 20 is formed with a recess 26 formed by removing a portion of the heat radiation fins 20. This recess 26 is for accommodating the cooling fan 40. That is, when the plurality of heat radiation fins 20 having the recess 26 are coupled along the heat dissipation fin coupling portion 14, the depressions 28 recessed in the center of the plurality of heat radiation fins 20 radially unfolded are illustrated in FIG. 11) is formed, the cooling fan 40 is accommodated in the depression (28). Due to the presence of the depression 28, the wind generated in the cooling fan 40 is effectively blown between the heat radiation fins 20. Meanwhile, in the above-described embodiments, the heat dissipation fins 20 may include the recess 26 and the recess 28.

In the above embodiments, the heat radiating fin coupling portion 14 of the heat pipe is erected, and the wind generated by the cooling fan is moved in the horizontal direction. However, in the present embodiment, the heat radiating fin coupling portion 14 and the radiating fin 20 are used. They are laid horizontally, and the wind by the cooling fan moves from top to bottom. As a result, not only the heat generating parts coupled to the heat generating part coupling part 12, but also the heat generating parts on the main surface thereof are also cooled by the wind by the cooling fan 40.

Meanwhile, although the cooling device 1d for the fifth embodiment is mounted on the board of the graphic adapter to cool the chipset, the cooling device 1d is not limited thereto. It can also be used as a cooling device.

Although not shown, when the heating component is a chipset mounted on a substrate of the graphic adapter, the heating component coupling part and the heat dissipation fin coupling part of the tubular heat pipe may be disposed opposite to each other with the substrate therebetween.

That is, the heat generating component coupling portion in the chipset is thermally coupled to the chipset mounted on the front surface of the substrate by the pressing means, the connection portion is bent to pass over the substrate side, the heat radiation fin coupling portion is located on the back of the substrate is coupled to the heat radiation fins will be. The heat sink fins are provided with a cooling fan. The cooling device having such a configuration has an advantage that the space on the rear surface of the substrate can be used efficiently.

On the other hand, this invention discloses the method of manufacturing the cooling device for computer components.

The cooling device for computer parts manufactured by the manufacturing method of this invention is comprised including a tubular heat pipe, many heat sink fins, and a pressurizing device. At this time, the cooling device manufactured by the manufacturing method of the present invention has a feature that the heat dissipation fins are spaced apart and coupled to the curved heat dissipation fin coupling portion of the tubular heat pipe. This is a feature that the cooling devices for computer parts of the embodiment according to the present invention described above have in common.

Briefly describing the configuration of the device, the cooling device for a computer component includes a heat generating component coupling portion which is thermally coupled to the heat generating component to cool the heat generating component that generates heat during operation among the components built into the computer; A tubular heat pipe including a heat radiation fin coupling portion bent to form a curved shape; A plurality of heat dissipation fins coupled to one end of the heat dissipation fin coupling portion of the tubular heat pipe, and disposed to be spaced apart from each other; And pressurizing means for tightly coupling the heat generating part coupling part of the tubular heat pipe to the heat generating part.

As a method of manufacturing a cooling device for such a computer component, the manufacturing method of the present invention comprises the steps of preparing a plurality of heat sink fins having a flat tubular heat pipe and a coupling portion formed by bending one end; A heat dissipation fin coupling step of coupling the plurality of heat dissipation fins to the tubular heat pipe so as to be spaced apart from each other by coupling the coupling part of each of the heat dissipation fins to at least one surface of both sides of the tubular heat pipe; And a heat dissipation fin coupling part forming step of bending a portion of the tubular heat pipe to which the heat dissipation fins are coupled to form a heat dissipation fin coupling part of a curved shape.

In addition, the heat radiation fin coupling step, the cream solder coating step of applying a cream solder to the contact portion of the heat pipe and the coupling portion of each of the heat radiation fins; And a soldering step of applying heat to a portion where the cream solder is applied to form a soldering unit for coupling the heat pipe and each of the heat dissipation fins to each other.

 16 and 17, a method of manufacturing a cooling device for a computer component according to an embodiment of the present invention will be described.

The method for manufacturing a cooling device for computer components includes preparing a tubular heat pipe and a plurality of heat dissipation fins, and a heat dissipation fin coupling step.

In the preparing of the heat pipe 10 and the plurality of heat dissipation fins 20, the heat pipe 10 is a plate-shaped vibrating tubular heat pipe having a length longer than the current width, and is coupled to the heat dissipation fin 20. The part 22 and the spaced part 24 are formed. In FIG. 16, the part to become the heat-transfer part coupling part 12, the connection part 13, and the heat radiation fin coupling part 14 after the tubular heat pipe 10 is shape | molded is indicated.

The following heat dissipation fin coupling step is a step of coupling a plurality of heat dissipation fins 20 to the plate-shaped tubular heat pipe 10. Referring to FIG. 16, the heat sinks 20 are disposed to be spaced apart at appropriate positions of the flat tubular heat pipe 10. At this time, the coupling portion 22 is formed at one end of the heat dissipation fin 20, it is easy to be spaced apart at equal intervals by the length of the coupling portion 22. After arranging the heat dissipation fins 20, the heat dissipation fins 20 are coupled to the tubular heat pipe 10 using a suitable method, for example in the present embodiment, with a cream solder.

That is, after applying the cream solder to the portion where the coupling portion of the tubular heat pipe and the heat dissipation fins contact, heat is applied to the portion to which the cream solder is applied to form a soldering portion which mutually couples the heat pipe and the heat dissipation fins. . In this case, the cream solder is a flowable material, after heating and cooling to a solid, and exhibits a strong bonding force. The method of applying the cream solder may be performed in various ways.

In the next step, the portion of the tubular heat pipe 10 in the state in which the heat dissipation fins 20 are bent to form a heat dissipation fin coupling portion 26 by bending the curved portion (in the case of this embodiment, an arc). At the same time as or before or after forming the heat radiating fin declining portion 26, the remaining portion of the tubular heat pipe 10 is bent to form the heat generating part coupling portion 12 and the connecting portion 13 as well. The completed state is shown in FIG. In this state, the pressurizing means 30 and the cooling fan 40 are provided and mounted on the heat generating parts to cool the heat generated from the heat generating parts.

In the method for manufacturing a cooling device for computer components as described above, after coupling a plurality of heat dissipation fins 30 to the tubular heat pipe 10, the heat pipe 10 of the combined portion of the heat dissipation fin in the form of an arc or a ring. Since the molded part is combined, there is an advantage that the heat dissipation fins 20 to the curved heat dissipation fins coupling portion 14 are regularly spaced apart and coupled to each other by a simple process.

In addition, since soldering is performed using a cream solder, the heat pipe 10 and the heat dissipation fins 20 may be firmly coupled to each other in a simple process. On the other hand, each of the heat dissipation fins 20 is provided with a spaced portion 24, even if the heat dissipation fin coupling portion 14 is formed in an arc shape, it is possible to maintain a constant distance between the inner end portions.

The manufacturing method consisting of the steps described above, in the cooling devices for the computer component illustrated above, the main configuration in which a plurality of heat sink fins are coupled to the heat sink fin coupling portion 14 of the tubular heat pipe curved shape. In other words, the above-described embodiments of the cooling apparatus may be manufactured using a manufacturing method including each step described above.

According to the cooling device for a computer component of the present invention, by using a vibrating tubular heat pipe having a curved heat dissipation fin coupling portion and a plurality of heat dissipation fins coupled to the heat dissipation fin coupling portion, the heat generated from the heat generating parts can be more efficiently cooled. The effect is that it is possible.

Claims (13)

A device for cooling a heat generating component that generates heat during operation among components built into a computer, A tubular heat pipe including a heat generating part coupling part thermally coupled to the heat generating part and a heat dissipation fin coupling part bent to form a curved shape; A plurality of heat dissipation fins coupled to one end of the heat dissipation fin coupling portion of the tubular heat pipe, and disposed to be spaced apart from each other; And And pressurizing means for bringing the heat generating part coupling portion of the tubular heat pipe into close contact with the heat generating part. The method of claim 1, Cooling device for a computer component, characterized in that the heat dissipation fin coupling portion of the tubular heat pipe is substantially arc-shaped, or part of an ellipse. The method of claim 2, Each of the heat radiation fins is a thin plate made of metal, The plurality of heat dissipation fins, the cooling device for a computer component, characterized in that coupled to the side facing the center of the heat dissipation fin coupling portion of the tubular heat pipe. The method of claim 3, Each of the heat dissipation fins includes a coupling portion formed by bending one end portion thereof and a spaced portion formed by bending the other end portion thereof, The coupling portion of one end of each of the heat radiation fins is coupled to the heat radiation fin coupling portion of the tubular heat pipe, The plurality of heat dissipation fins, the cooling device for a computer component, characterized in that the mutually constant intervals are maintained by the spaced apart portion of the other end of each heat dissipation fin. The method of claim 2, Each of the heat radiation fins is a thin plate made of metal, The plurality of heat dissipation fins, the cooling device for a computer component, characterized in that coupled to at least one of the surface facing to the center and the outer surface facing the radiating fin coupling portion of the tubular heat pipe. The method of claim 1, The computer device cooling device, And a cooling fan having a plurality of wings formed on the outer circumferential surface of the central driving part and a central driving part having a motor built therein so as to blow air between the heat dissipation fins and rotating by the motor. Cooling device for The method of claim 6, The heat sink fin coupling portion of the heat pipe substantially forms an arc shape, Each of the heat radiation fins is a thin plate made of metal, The plurality of heat dissipation fins are coupled to a side facing the center of the heat dissipation fin coupling portion of the tubular heat pipe, and an empty space of a size through which a virtual circle formed by an outer circumferential surface of the center driving portion is formed behind the center driving portion of the cooling fan. Cooling device for a computer component, characterized in that coupled to the radiating fin coupling portion to be formed. The method of claim 6, One side of each of the heat radiation fins is formed, The plurality of heat dissipation fins, the cooling device for computer parts, characterized in that the depression that can accommodate the cooling fan is formed. The method of claim 1, The heat generating component is a cooling device for a computer component, characterized in that the central processing unit (CPU) mounted on the main board of the computer. The cooling device of claim 1, wherein the heat generating component is a chipset mounted on a substrate of a graphic adapter mounted on a main board of a computer. The method of claim 10, The heating component coupling portion of the tubular heat pipe is thermally coupled to the chipset, The heat dissipation fin coupling portion of the tubular heat pipe, the cooling device for a computer component, characterized in that located on the opposite side of the heat generating component coupling portion with the substrate therebetween. A tubular heat pipe including a heat generating part coupling part thermally coupled to the heat generating part and a heat dissipation fin coupling part bent to form a curved shape in order to cool a heat generating part that generates heat during operation among components embedded in the computer; A plurality of heat dissipation fins coupled to one end of the heat dissipation fin coupling portion of the tubular heat pipe, and disposed to be spaced apart from each other; And pressurizing means for tightly coupling the heat generating part coupling part of the tubular heat pipe to the heat generating part. A preparation step of preparing a plurality of heat dissipation fins having a flat tubular heat pipe and a coupling portion formed by bending one end thereof; Coupling the radiating fins to each of the radiating fins so as to be spaced apart from each other on at least one surface of both surfaces of the tubular heat pipe; And And a radiating fin coupling part forming step of bending a portion of the capillary heat pipe to which the radiating fin is coupled to form a radiating fin coupling part having a curved shape. The method of claim 12, The radiating fin coupling step, A cream solder coating step of applying a cream solder to a portion where the capillary heat pipe and the coupling portion of the heat dissipation fins come into contact with each other; And And a soldering step of applying heat to the cream solder-coated portion to form a soldering portion for coupling the tubular heat pipe and the respective heat dissipation fins to each other. 2.

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