KR20060026654A - Plasma display apparatus - Google Patents

Abstract

An object of the present invention is to smooth the cooling of the integrated circuit chip that controls the driving of the plasma display panel to ensure the reliability of the plasma display panel, and to extend the life,

In order to achieve this object, the present invention provides a reinforcement for reinforcing the rigidity of the chassis, which is disposed on the rear surface opposite to the surface of the plasma display panel, the chassis supporting the plasma display panel, and the surface supporting the plasma display panel of the chassis. An integrated circuit chip disposed on one of the front surface and the rear surface of the member and the reinforcement member to control driving of the plasma display panel, and disposed between the integrated circuit chip and the reinforcement member and generated in the integrated circuit chip. The present invention provides a plasma display apparatus comprising a heat pipe for dissipating heat through phase change and convection of a material disposed therein.

Description

Plasma display apparatus

1 is an exploded perspective view showing a plasma display device of the present invention;

2 is a cross-sectional view taken along the line II-II of the plasma display device of the present invention;

FIG. 3 is a schematic view for explaining a process of forming a recess in a reinforcing material for arranging the heat pipe in the plasma display device of the present invention and arranging the heat pipe; FIG.

4 is a cross-sectional view showing a cross section of a heat pipe used in the plasma display device of the present invention.

<Description of Symbols for Major Parts of Drawings>

1: plasma display device

30: chassis 32: connection cable

34: integrated circuit chip 40: reinforcing member

50: cover plate 70: heat pipe

100: plasma display panel

110: front panel 120: rear panel

The present invention relates to a plasma display device, and more particularly, to an improvement in heat dissipation performance of an integrated circuit chip that controls driving of a plasma display panel.

Plasma display panels are devices that display images using gas discharge phenomena, and are excellent in various display abilities such as display capacity, brightness, contrast, afterimage, viewing angle, etc., and are being spotlighted as devices that can replace CRTs. In such a plasma display panel, a discharge is generated in a discharge cell filled with a discharge gas by a direct current or an alternating voltage applied between electrodes, and ultraviolet rays emitted from the discharge gas excite a phosphor to emit visible light, thereby realizing an image. do.

The plasma display panel adopts a discharge mechanism that emits light by applying a high voltage to the discharge cells as light emitting means, thereby driving a plasma display panel by applying a predetermined potential to an electrode across the discharge cells of the plasma display panel. . At this time, since the potential applied to the electrode is controlled in correspondence with the image signal received from the outside, the integrated circuit chip controlling the driving of the plasma display panel controls the large amount of signals for an instant and applies the potential to the electrode. . Therefore, the integrated circuit chip must perform a lot of switching work in a short time to control this potential, thereby generating a lot of heat. At this time, when the heat is not smoothly discharged, the driving of the plasma display panel is not reliably performed, which leads to deterioration of quality and lifetime of the plasma display panel. Therefore, heat dissipation of integrated circuit chips is a very important problem in the manufacturing and development of plasma display panels.

The present invention solves the above problems, and proposes a means for smoothing the cooling of the integrated circuit chip that controls the operation of the plasma display panel, through which to ensure the reliability of the plasma display panel, to extend the lifetime to improve the quality It is aimed at letting.

In order to achieve the above object, the present invention is disposed on the rear surface opposite to the surface of the plasma display panel, the chassis for supporting the plasma display panel, and the surface for supporting the plasma display panel of the chassis to reinforce the rigidity of the chassis An integrated circuit chip disposed on any one of a front surface and a rear surface of the reinforcement member to control driving of the plasma display panel, and disposed between the integrated circuit chip and the reinforcement member. And a heat pipe emitting heat generated through phase change and convection of a material disposed therein, which is generated in the integrated circuit chip controlling the driving of the plasma display panel. Plasma Diss by efficiently dissipating large amounts of heat Ensure the reliability of the panel and extends the life of Ray.

At this time, it is preferable that the recess is formed so that the heat pipe is fitted to the surface of the reinforcing member on which the heat pipe is disposed so that the heat pipe is properly disposed to absorb and release heat generated from the integrated circuit chip. .

The heat pipe may include a pipe, a wick disposed in the pipe, a channel formed in the wick, and a phase change material disposed in the wick to emit heat.

In addition, it is desirable to arrange a thermally conductive material between the integrated circuit chip and the heat pipe so that physical contact between the integrated circuit chip and the heat pipe can be made clearly.

On the other hand, the integrated circuit chip is disposed on the rear surface of the reinforcing member, and further comprising a cover plate disposed to cover the integrated circuit chip, so that the heat generated in the integrated circuit chip can be better discharged desirable.

Hereinafter, the plasma display apparatus 1 of the present invention will be described with reference to FIGS. 1 to 2.

The plasma display device according to the present invention uses a front cabinet 10 having a window 11 formed at the front, and a rear surface of the front cabinet 10 to form a phosphor layer by using ultraviolet rays generated during discharge in response to an external image signal. Plasma display panel 100 for realizing an image by emitting light, electromagnetic wave blocking is attached to the front surface of the plasma display panel to block the electromagnetic waves generated during operation of the plasma display panel and harmful to humans and may cause malfunction of other electronic devices The film 14 is provided. In this case, the electromagnetic wave blocking film 14 is not necessarily attached to the front surface of the plasma display panel, and may be separately fixed to the front cabinet by combining with tempered glass. In this case, the filter holder is fixed to the rear of the front cabinet, the filter coupled to the electromagnetic wave blocking film and the tempered glass may be fixed to the filter holder.

In addition, the plasma display apparatus includes a chassis 30 which supports the plasma display panel 100 and is formed of aluminum having good thermal conductivity. The chassis discharges heat conducted from the plasma display panel to prevent the temperature of the plasma display panel from rising above an appropriate level, and prevents the plasma display panel from being deformed by heat or damaged by external impact. In order to support the plasma display panel, the plasma display panel is disposed behind the plasma display panel 100.

On the other hand, since the chassis 30 must support the plasma display panel as described above to prevent the plasma display panel from being deformed or damaged, the chassis 30 must have sufficient rigidity. In order to reinforce the rigidity, the plasma display apparatus includes a reinforcing member 40 disposed on a rear surface opposite to a surface supporting the plasma display panel of the chassis to reinforce the rigidity of the chassis.

On the other hand, the reinforcing member 40 may be simply used as a means for reinforcing the rigidity of the chassis, the integrated circuit chip 40 is disposed on any one surface of the front and rear of the reinforcing member so that the plasma display The heat generated from the panel 100 is prevented from being directly conducted to the integrated circuit chip through the chassis 30, and the surface area with air is increased to induce heat dissipation of the integrated circuit chip. Meanwhile, although the integrated circuit chip 34 is illustrated in the rear surface of the reinforcing member in FIGS. 1 and 2, as described above, heat generated in the plasma display panel due to the presence of the reinforcing member is applied to the integrated circuit chip. Since the integrated circuit chip 34 does not need to be directly conductive, the integrated circuit chip 34 may be disposed on any one of the front and rear surfaces of the reinforcing member 40.

In addition, the plasma display apparatus 1 of the present invention is disposed between the chassis and the plasma display panel, and is in contact with the rear surface of the plasma display panel 100 to prevent accumulation of heat generated when the plasma display panel is driven. The thermally conductive sheet 90 formed of an aluminum sheet, a copper sheet, a thermally conductive resin, or the like is provided.

In addition, the plasma display apparatus 1 of the present invention includes a double-sided tape 80 disposed between the plasma display panel 100 and the chassis 30 to fix the plasma display panel to the chassis.

In addition, the plasma display apparatus 1 of the present invention is installed at the rear of the chassis 30 and controls the image signal applied from the outside of the display panel 100 to implement an image and a stable power to the controller The circuit unit 115 is provided with a power module for supplying. In this case, in the control unit, data drive circuits including an integrated circuit chip 34 for controlling a potential applied to an address electrode to correspond to an external image signal to control driving of the plasma display panel are disposed. In addition, the signal controlled by the integrated circuit chip 34 is a connection cable 32 that electrically connects the integrated circuit chip 34 to electrodes (not shown) disposed inside the plasma display panel in the form of electric potential. Is passed along. In addition, discharge is generated inside the plasma display panel by the potential applied to the electrode, thereby realizing an image.

In addition, the plasma display device 1 of the present invention is disposed between the integrated circuit chip 34 and the reinforcing member 40 to change the phase of the material disposed therein and to generate heat generated in the integrated circuit chip 34. And a heat pipe 70 that discharges through convection. Hereinafter, the heat dissipation of the integrated circuit chip will be described later.

In addition, the plasma display apparatus 1 of the present invention includes a rear cabinet 5 disposed behind the circuit unit 115 and coupled to the front cabinet 10, and formed on the upper side of the rear cabinet for heat dissipation. The air outlet 42, the lower portion is formed with an air inlet 41 for radiating heat by introducing external air.

Hereinafter, the heat dissipation of the integrated circuit chip included in the plasma display apparatus 1 of the present invention will be described with reference to FIG. 2. As described above, in order to realize an image on the plasma display panel 100, the integrated circuit chip 34 performs a large amount of switching operation so that a potential is applied to appropriate electrodes in response to an external image signal. This switching operation generates a large amount of heat in the integrated circuit chip. At this time, the semiconductor devices constituting the integrated circuit chip has a heat-sensitive characteristic, it does not perform its function above a predetermined temperature. And, if such a state persists, the semiconductor elements of the integrated circuit chip are deformed and eventually reach a state in which the integrated circuit chip cannot be restored. In this case, since the integrated circuit chip plays a pivotal role in implementing an image on the plasma display panel, proper heat dissipation of the integrated circuit chip is required to ensure the image quality of the plasma display panel and to secure a predetermined lifetime.

In this case, in order to smoothly discharge the heat generated from the integrated circuit chip 34, an appropriate means may be provided so that heat generated from the integrated circuit chip may sufficiently exchange heat with air introduced from the air inlet 42. There is a need. However, since the integrated circuit chip performs a function of controlling the driving of the plasma display panel, the integrated circuit chip needs to be disposed close to the plasma display panel. For this purpose, it is necessary to be disposed on the rear surface of the chassis disposed behind the plasma display panel. However, as described above, the chassis receives heat generated from the plasma display panel to help heat dissipation of the plasma display panel. Therefore, when the integrated circuit chip is attached to the chassis, the heat generated from the plasma display panel is reduced. Directly transmitted, adversely affect the operation of the integrated circuit chip. For this reason, it is preferable that the integrated circuit chip is not directly attached to the rear surface of the chassis, but disposed on any one of the front and rear surfaces of the reinforcing member 80 disposed on the rear surface of the chassis. However, as described above, the reinforcing member is physically connected to the chassis and should be formed of a thermally conductive material such as aluminum so that local heat accumulation does not occur due to heat emitted from the integrated circuit chip. Therefore, eventually, although the degree is different, the heat conducted from the plasma display panel to the chassis is conducted to the reinforcing member 80, which adversely affects the improvement of the heat dissipation performance of the integrated circuit chip 34. Although this problem can be ignored in the small SD display panel, it is difficult to manufacture such a plasma display panel due to the actual malfunction of the integrated circuit chip in the HD single scan plasma display panel. It's a big problem. Therefore, solving the heat dissipation problem of the integrated circuit chip can be said to be an essential matter for the fabrication of HD plasma display panel.

In order to solve this problem is disposed between the reinforcing member 80 and the integrated circuit chip 34 to discharge the heat generated from the integrated circuit chip 34 through the phase change and convection of the material disposed therein It is preferable to provide the heat pipe 70. When the heat pipe 70 is disposed, heat generated in the integrated circuit chip is consumed by evaporation, convection, and condensation of the phase change material disposed inside the heat pipe through the heat pipe, and as a result, the heat dissipation of the integrated circuit chip is smooth. Become. In particular, when the integrated circuit chip is momentarily overloaded, the latent heat absorption due to the phase change of the material absorbs a considerable amount of thermal energy generated from the integrated circuit chip, thereby preventing the temperature of the integrated circuit chip from rising momentarily. In addition, even in a long time, it is possible to prevent the temperature rise of the integrated circuit chip due to a series of heat absorption and transfer mechanisms of phase change, convection and condensation.

Meanwhile, a cover plate 50 covering the integrated circuit chip may be disposed to more efficiently dissipate heat of the integrated circuit chip 34. The cover plate receives heat generated from the integrated circuit chip. Since the heat dissipation function is performed by contacting the external air with a large surface area, the heat dissipation performance of the integrated circuit chip may be further improved.

On the other hand, in order for the heat generated from the integrated circuit chip 34 to be efficiently conducted to the heat pipe 70, the integrated circuit chip and the heat pipe must be sufficiently in close contact. To this end, the integrated circuit chip may be pressed and disposed on one surface of the heat pipe. If the pressure is applied to a predetermined level or more, there is a risk of damage to the integrated circuit chip, which is not preferable. On the other hand, when the pressure is less than a predetermined level due to the roughness (Roughness) of the integrated circuit chip 34 and the heat pipe (poor contact) due to the poor heat dissipation of the integrated circuit chip may not be smooth, local heat accumulation This can happen. In order to solve this problem, it is preferable to arrange a thermally conductive material, such as a thermally conductive grease, a thermally conductive resin, between the integrated circuit chip and the heat pipe.

Hereinafter, the arrangement and operation of the heat pipe 70 included in the plasma display apparatus of the present invention will be described with reference to FIGS. 3 to 4. As described above, the reinforcing member 80 needs to bear a rotation moment due to thermal deformation of the plasma display panel. Therefore, it is necessary to form the reinforcement member in a direction of increasing the moment of inertia of the chassis. On the other hand, since the arrangement space of the heat pipe is also required, as shown in FIG.

Meanwhile, the heat dissipation of the heat pipe of the present invention will be described with reference to FIG. 4. First, referring to the configuration of the heat pipe, the heat pipe 70 is a pipe 72, the wick 74 disposed in the pipe, the channel 76 formed in the wick and the phase change disposed in the wick It is desirable to have a substance. In this case, the pipe is preferably rectangular in cross section so as to increase the area in contact with the integrated circuit chip, the phase change material is preferably water, alcohol evaporative material is disposed. However, the phase change does not necessarily need to be limited to evaporation, so pyramid-based materials and the like may also be used.

On the other hand, the heat dissipation of the heat pipe, when the heat (Q) generated from the integrated circuit chip 34 to the heat pipe is conducted along the longitudinal direction of one surface of the heat pipe, the heat is transferred to the wick It is delivered to the phase change material disposed and causes a phase change to evaporate, and the vapor flows through the channel 76. Thereafter, the heat is radiated along the longitudinal direction of the heat pipe, and the heat is released while condensing in contact with the outside air (A). Through this, heat dissipation of the integrated circuit chip 34 may be performed.

The present invention proposes a means for smoothing the cooling of the integrated circuit chip for controlling the driving of the plasma display panel, thereby improving the image quality of the plasma display panel, to ensure the reliability and to improve the quality.

In addition, the present invention increases the life of the integrated circuit chip that controls the driving of the plasma display panel, and consequently extends the life of the plasma display panel.                     

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (5)

A plasma display panel; A chassis supporting the plasma display panel; A reinforcing member disposed on a rear surface opposite to a surface supporting the plasma display panel of the chassis to reinforce the rigidity of the chassis; An integrated circuit chip disposed on any one of a front surface and a rear surface of the reinforcing member to control driving of the plasma display panel; And A heat pipe disposed between the integrated circuit chip and the reinforcing member to discharge heat generated in the integrated circuit chip through phase change and convection of a material disposed therein; Plasma display device comprising a. The method of claim 1, And a concave portion is formed on the surface of the reinforcing member on which the heat pipe is disposed so as to fit the heat pipe. The method of claim 1, And the heat pipe includes a pipe, a wick disposed in the pipe, a channel formed in the wick, and a phase change material disposed on the wick. The method of claim 1, And a thermally conductive material disposed between the integrated circuit chip and the heat pipe. The method of claim 1, And the integrated circuit chip further comprises a cover plate disposed on a rear surface of the reinforcing member and disposed to cover the integrated circuit chip.

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