KR20060011489A - Synthetic resin chip with jade powder - Google Patents

Synthetic resin chip with jade powder Download PDF

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Publication number
KR20060011489A
KR20060011489A KR1020040060354A KR20040060354A KR20060011489A KR 20060011489 A KR20060011489 A KR 20060011489A KR 1020040060354 A KR1020040060354 A KR 1020040060354A KR 20040060354 A KR20040060354 A KR 20040060354A KR 20060011489 A KR20060011489 A KR 20060011489A
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synthetic resin
chip
jade
resin
jade powder
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KR1020040060354A
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Korean (ko)
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신윤기
박찬수
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주식회사 한국고분자
신윤기
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Priority to KR1020040060354A priority Critical patent/KR20060011489A/en
Publication of KR20060011489A publication Critical patent/KR20060011489A/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)

Abstract

본 발명은 옥가루가 혼합된 합성수지칩에 관한 것으로서, 특히 합성수지내에 위치하는 옥이 분말형태로 유지되게 하여 표면적을 넓게 하므로서 옥으로부터 발산되는 기파장(원적외선, 음이온)의 발생이 가능한 많게 하여 옥의 효능을 배가시킬 수 있게 함과 동시에 옥가루가 혼입된 합성수지칩을 이용하여 필요한 여러형태의 제품성형에 사용할 수 있도록 하며, 필요한 경우에는 옥가루와 함께 수지발포제를 투입하여 발포되게 하여 효능을 향상케 할 뿐 아니라 더욱 다양한 제품에 적용사용할 수 있게 한 것이다.The present invention relates to a synthetic resin chip in which jade powder is mixed, and in particular, jade located in the synthetic resin is maintained in the form of powder to increase the surface area, thereby increasing the generation of airwaves (far infrared rays, anions) emitted from the jade, thereby doubling the efficacy of the jade. At the same time, it can be used for molding various types of products by using synthetic resin chips mixed with jade powder, and if necessary, resin foaming agent is added together with jade powder to foam and improve efficiency. Applicable to the product.

Description

옥가루가 혼입된 합성수지칩{Synthetic resin chip with jade powder}Synthetic resin chip with jade powder

본 발명은 합성수지칩 제조시 옥분말을 혼합하여 칩으로 제조하거나, 필요에 따라 옥분말과 함께 발포제를 첨가하여 발포성 합성수지칩, 혹은 발포합성수지칩을 제조한 다음 필요한 용도로 사용케 하므로서 옥의 표면적을 가능한 넓게 하여 효능을 배가시킬 수 있도록 할뿐 아니라 다양한 제품에 적용사용할 수 있도록 한 것이다.The present invention is made of a chip by mixing jade powder in the manufacture of synthetic resin chips, or by adding a blowing agent with jade powder, if necessary to prepare a foamable synthetic resin chip, or a foamed synthetic resin chip and then use it for the necessary use by making the surface area of jade possible It is not only to increase the efficacy by widening, but also to be applied to various products.

일반적으로 옥은 인체에 극히 필요한 광물질인 칼슘과 마그네슘을 함유하고 있으며, 마그네슘은 엽록소의 구성 물질로 되어 있다.In general, jade contains calcium and magnesium, which are extremely necessary for the human body, and magnesium is composed of chlorophyll.

또한 인체를 구성하고 있는 세포 역시, 마그네슘으로 되어 있어 옥에서 나오는 기파동(원적외선)과 인체세포의 기파동이 같은 파동이다.In addition, the cells constituting the human body are also made of magnesium, which is the same wave as the airwaves (far infrared rays) coming out of the jade and the human cells.

따라서 옥에서 발산하는 기파동이 인체세포에 골고루 침투하여 공명공진작용을 함으로써 조직의 부활, 순액순환, 체내유해노페물 배설 등을 증진시키게 되므로 건강유지에 유익한 효능이 있는 것으로 알려져 있다.Therefore, it is known that the stimulating waves emitted from the jade evenly penetrate the human cells and have a resonance resonance function, thereby enhancing the revival of the tissues, the circulation of circulating fluids, and the excretion of harmful wastes in the body.

뿐만 아니라 옥에서 나오는 기파동(원적외선) 및 음이온은 산소를 풍부하게 활성화시켜줄 뿐 아니라, 물의 오염을 방지하는 역할과 함께 탈취의 효능 등이 탁 월한 것으로 알려져 있다.In addition, airwaves (far-infrared) and anions from the jade not only activates abundant oxygen, but is also known to be excellent in deodorizing efficacy with the role of preventing contamination of water.

그러나 지금까지 주로 사용되고 있는 옥의 형태는 옥자체를 가공하거나 파쇄하여 방석이나 메트리스, 베개 등과 같은 용품에 부착하여 사용하는 것이 대부분으로서 사용품목이 한정적인 것이었다.However, the most commonly used form of jade is the processing or crushing of the jade body to attach to articles such as cushions, mattresses, pillows, etc., and the use items are limited.

또한 옥의 사용량에 대하여 원적외선이나 음이온이 발산되는 표면적이 제한적이므로 얻을 수 있는 옥의 효능이 반감되는 등의 단점이 있는 것이었다.In addition, since the surface area from which far-infrared rays or anions are emitted with respect to the amount of jade used is limited, there is a disadvantage in that the effect of jade obtained is halved.

본 발명은 이러한 종래의 단점을 시정하고자 동일량의 옥을 사용하더라도 옥의 표면적을 보다 넓게 하여 옥의 효능을 배가시킬 수 있도록 함과 동시에 다양한 제품에 적용하여 사용할 수 있도록 것이다.The present invention is to use the same amount of jade in order to correct the disadvantages of the prior art to increase the surface area of the jade to increase the efficacy of the jade and to be used in a variety of products at the same time.

상기 목적을 달성하기 위하여 본 발명은 옥을 분쇄하여 옥분말을 얻고, 상기 옥분말을 합성수지칩 제조공정에서 용융된 합성수지와 혼합한 다음 압출, 냉각, 절단하여 옥분말이 혼합된 합성수지칩을 얻고, 상기 칩을 이용하여 제품성형에 사용토록 한 것이다.In order to achieve the above object, the present invention obtains an jade powder by pulverizing jade, and mixing the jade powder with a synthetic resin melted in a synthetic resin chip manufacturing process and then extruding, cooling, and cutting to obtain a synthetic resin chip mixed with jade powder. It is to be used for molding products using chips.

상기에서 옥분말 투입과 함께 적량의 수지발포제를 투입한 다음 칩화하는 과정에서 미발포칩, 즉 발포성 칩 상태로 제조하거나 압출하는 과정에서 발포되게 하면서 냉각 절단되게 하여 발포된 상태의 합성수지칩을 제공할 수도 있다.In addition to the addition of a jade powder in the appropriate amount of the resin foaming agent and then chipped in the process of forming a non-expanded chip, that is, foamed chip in the manufacturing or extruding process to be foamed in the cooling process to provide a foamed synthetic resin chip It may be.

상기에서 발포, 미발포의 조정은 칩성형기의 용융실 내부 온도 조정으로 이루어질 수 있게 된다.In the above, the adjustment of the foamed, unfoamed can be made by adjusting the temperature inside the melting chamber of the chip molding machine.

이하 본 발명에서 제공하고자 하는 옥분말이 함유된 합성수지칩 제조과정을 상세히 설명하면 다음과 같다.Hereinafter, the synthetic resin chip manufacturing process containing the jade powder to be provided in the present invention will be described in detail.

먼저 용융된 합성수지에 투입하고자 하는 옥을 분쇄기로 분쇄하여 분말화된 옥가루를 얻는다.First, jade to be put into the molten synthetic resin is pulverized by a pulverizer to obtain powdered jade powder.

상기 분쇄된 옥가루는 대략 325μ정도가 적당하나 구애될 필요성은 없으며 필요에 따라 입자를 조정하여 사용할 수 있다.The pulverized jade powder is about 325μ is suitable, but there is no need to be particular, it can be used by adjusting the particles as necessary.

상기에서와 같이 옥을 필요로 하는 입자로 분쇄완료되면 합성수지를 옥가루와 함께 칩성형기의 용융실에 투입한 다음 170∼230℃로 가열한 상태에서 교반하여 합성수지가 용융되면서 옥가루와 골고루 혼합되게 하여 혼합수지액을 얻는다.When the pulverization is completed as the particles needing jade as described above, the synthetic resin is added to the melting chamber of the chip molding machine together with the jade powder and then stirred in a heated state at 170 ~ 230 ℃ to mix the jade powder evenly mixed with the jade powder. Obtain the resin solution.

이때 합성수지와 옥가루의 혼합비율은 20∼50% : 50 : 80%의 부피비로 혼합하는 것이 이상적이다.At this time, the mixing ratio of synthetic resin and jade powder is ideally mixed in a volume ratio of 20 to 50%: 50: 80%.

상기 혼합비율은 옥가루가 혼입된 칩을 제조한 다음 상기칩을 이용하여 제품화하고자 하는 물품의 용도에 따라 조정하여 사용하면 된다.The mixing ratio may be used by manufacturing a chip containing jade powder and then adjusting it according to the use of the article to be commercialized using the chip.

상기에서와 같이 칩성형기에 투입된 합성수지가 완전 용융되면서 옥가루와 충분히 혼합된 혼합수지액을 칩성형기를 통하여 압출시켜 선상으로 압출되게 함과 동시에 냉각 절단하여 본 발명에서 얻고자 하는 수지칩을 제조하게 된다.As described above, the resin mixed in the chip forming machine is completely melted, and the mixed resin solution sufficiently mixed with jade powder is extruded through the chip forming machine to be extruded in a linear form and cooled and cut to prepare the resin chip to be obtained in the present invention. .

상기 절단과정에서 절단되는 칩의 크기는 특별히 한정할 필요성이 없으므로 통상의 칩크기와 동일하게 절단하면 된다.Since the size of the chip to be cut in the cutting process does not need to be particularly limited, the chip may be cut in the same way as a conventional chip size.

상기 본 발명에서 제공하고자 하는 옥가루가 혼합된 합성수지칩을 제조함에 있어서, 옥가루 투입과 함께 적량의 수지발포제를 혼입시켜 칩으로 제조사용할 수 도 있다.In preparing the synthetic resin chip mixed with jade powder to be provided in the present invention, it may be used as a chip by incorporating an appropriate amount of resin foaming agent with the addition of jade powder.

상기에서 수지발포제의 투입량은 합성수지와 옥가루에 대하여 5∼7%(부피비) 정도 투입하게 되며 옥가루의 투입량이 많으면 수지발포제의 첨가량을 늘여 원활한 발포가 이루어질 수 있도록 하는 것이 바람직하다.The amount of the resin foaming agent is 5 to 7% (volume ratio) relative to the synthetic resin and jade powder, and if the amount of jade powder is added, it is preferable to increase the amount of the resin foaming agent so that smooth foaming can be achieved.

이때 합성수지와 옥가루와 함께 수지발포제를 첨가할 경우에도 칩을 두가지형태로 제조할 수가 있다.In this case, even when a resin foaming agent is added together with the synthetic resin and jade powder, the chip can be manufactured in two forms.

즉 제조된 칩이 미발포된 상태와 발포된 상태의 칩을 제조할 수 있다.That is, the chip in the unfoamed state and the foamed state can be manufactured.

먼저 미발포된 칩의 제조과정을 설명하면 칩성형기에 형성된 용융실내의 온도를 발포제가 발포되는 온도(170∼230℃)이하로 유지되게 한 상태에서 합성수지를 용융시킴과 동시에 옥가루와 수지발포제가 골고루 혼합되게 하고, 상기한 상태에서 수지혼합액을 가압하여 선상으로 압출되게 하면서 냉각, 절단하면 미발포된 발포성 수지칩의 제조가 완료된다.First, the manufacturing process of the unfoamed chip is melted synthetic resin while keeping the temperature in the melt chamber formed in the chip molding machine below the temperature at which the blowing agent is foamed (170-230 ° C.), and at the same time, the jade powder and the resin foaming agent are evenly distributed. When the mixture is mixed and cooled and cut while pressurizing the resin mixture in the above state to be extruded linearly, the production of the unfoamed foamable resin chip is completed.

또한 발포된 수지칩을 제조하고자 할 경우에는 칩성형기의 용융실내에 합성수지와 옥가루 및 적량의 수지발포제를 투입한 다음 용융실내의 온도를 170∼230℃ 정도로 가열하여 용융되게 하고, 상기한 상태에서 수지혼합액을 가압하여 압출되게 하면 발포제가 혼합된 혼합수지액은 분사노즐로 압출되면서 발포된다.In order to manufacture the foamed resin chip, a synthetic resin, jade powder and an appropriate amount of resin foaming agent are added to the melting chamber of the chip molding machine, and then heated to a temperature of about 170 to 230 ° C. to melt the resin in the above state. When the mixed solution is pressurized and extruded, the mixed resin solution mixed with the blowing agent is foamed while being extruded into the spray nozzle.

이때 분사노즐 입구부를 냉각수로 분사하여 냉각되게 하면 발포가 정지되고, 동시에 절단하여 발포된 칩을 얻게 된다.At this time, when the injection nozzle inlet portion is cooled by cooling with the cooling water, foaming is stopped and at the same time, the chips are cut and foamed.

이때 발포정도를 조정하고자 할 경우에는 냉각수로 발포수지의 냉각시기를 조정하면 발포정도를 조정할 수 있게 된다.At this time, if you want to adjust the degree of foaming can be adjusted by adjusting the cooling time of the foaming resin with cooling water.

이상과 같이 하여 옥가루가 혼입된 수지칩과, 상기 수지칩에 수지발포제가 첨가된 발포성 수지칩, 또는 발포된 수지칩을 얻을 수 있게 되며, 상기 옥가루가 첩가된 칩을 이용하여 여러형태의 제품에 적용사용할 수 있게 된다.As described above, it is possible to obtain a resin chip in which jade powder is mixed, a foamable resin chip in which a resin foaming agent is added to the resin chip, or a foamed resin chip. Application can be used.

또한 상기에서 사용되는 합성수지는 최종적으로 사용하고자 하는 제품에 따라 적합한 수지를 선택하여 사용할 수 있다.In addition, the synthetic resin used above may be used by selecting a suitable resin according to the product to be finally used.

본 발명에서 제조된 수지칩의 사용은 다음과 같이 할 수 있다.Use of the resin chip produced in the present invention can be as follows.

먼저 합성수지와 옥가루로 된 수지칩의 경우에는 압출성형기 및 사출성형기를 통하여 필요로 하는 모든형태의 제품을 성형하여 사용할 수 있다.First, in the case of a resin chip made of synthetic resin and jade powder, it is possible to mold and use all types of products required through an extrusion molding machine and an injection molding machine.

또한 발포성수지칩의 경우에는 발포성수지칩을 성형기에 적당량 투입한 다음 170∼230℃로 가열되게 하면 수지칩에 첨가된 발포제에 의해 수지칩이 발포되면서 제품이 성형된다.In addition, in the case of the foamable resin chip, when the foaming resin chip is added to the molding machine in an appropriate amount and heated to 170 to 230 ° C, the product is molded while the resin chip is foamed by the foaming agent added to the resin chip.

상기한 경우 시트나 베개, 방석 및 메트의 쿠션용으로 사용하거나 수족관의 바닥에 깔아 사용할 수 있을 뿐 아니라 냉장고의 탈취제용도로 사용할 수 있게 된다.In the above case, it can be used for cushioning of sheets or pillows, cushions and mats, or can be used on the bottom of an aquarium as well as deodorant for refrigerators.

이러한 경우 성형된 제품내에는 옥가루가 50∼80%정도 차지하면서 발포제에의 발포되어 있어 제품에는 무수한 기공이 형성되고, 동시에 옥가루는 보다 넓은 표면적을 유지할 수 있게 되므로 옥의 효능을 최대로 유지시킬 수 있게 된다.In this case, jade powder occupies about 50% to 80% of the product and is foamed with a foaming agent, thereby forming numerous pores in the product, and at the same time, jade powder can maintain a larger surface area, thereby maintaining jade's efficacy to the maximum. do.

다시 설명 하면 베게나, 방석, 메트와 같은 제품에 적용하여 사용하게 될 경우에는 옥으로부터 발산되는 원적외선이나 음이온이 신체의 신진대사를 원활히 함은 물론 혈액순환을 좋게 하므로 건강증진에 도움이 된다.In other words, when applied to products such as pillows, cushions and mats, far-infrared rays or anions emitted from jade help the body's metabolism as well as improve blood circulation, thereby helping to promote health.

또한 시트를 대형수족관에 적용하게 될 경우에는 산소를 풍부하게 하면서 물의 오염현상을 줄일 수 있게 되며, 냉장고용 탈취제용도로 사용하게 되면 냉장고내의 잡냄새를 현격히 줄일 수 있게 된다.In addition, when the sheet is applied to a large aquarium, it is possible to reduce the contamination of water while enriching oxygen, and when used as a deodorant for a refrigerator, the smell of the refrigerator can be significantly reduced.

뿐만 아니라 수중의 부표에 적용사용하게 되는 옥으로부터 발산되는 원적외선의 효능에 의해 적조나 녹조 및 백화현상을 줄일 수 있게 된다.In addition, it is possible to reduce red tide, green algae and white phenomena due to the efficacy of far-infrared rays emitted from jade applied to the buoys in the water.

본 발명의 수지칩을 제조함에 있어서 발포된 상태의 수지칩으로 제조할 경우에도, 베갯속으로 사용하거나, 상기 발포된 수지칩을 형틀내에 투입한 다음 가열하여 필요한 형상의 제품을 성형할 수 있으며, 이러한 경우에도 위와 같은 효능을 얻을 수 있게 된다.In manufacturing the resin chip of the present invention, even in the case of manufacturing the resin chip in the foamed state, it can be used as a pillow, or the foamed resin chip is put into the mold and heated to form a product of the required shape. Even in this case, the same effect can be obtained.

이상 설명한 바와 같이 본 발명은 합성수지칩을 제조함에 있어서, 합성수지에 적량의 옥가루를 혼입하거나, 동시에 수지발포제를 투입하여 여러형태의 수지칩을 얻고, 상기 수지칩을 이용하여 필요한 제품을 제조사용케 하므로서 옥의 표면적을 최대로 넓게 하여 옥의 효능을 배가시킬 수 있게 되는 등의 효과가 있는 것이다.As described above, in the present invention, in manufacturing a synthetic resin chip, an appropriate amount of jade powder is mixed into the synthetic resin, or at the same time, a resin foaming agent is added to obtain various types of resin chips, and the necessary products are manufactured and used using the resin chips. By increasing the surface area to the maximum, the effect of jade can be doubled.

Claims (4)

칩성형기내에 합성수지 20∼50%(부피비)와 분쇄된 옥가루 50∼80%(부피비)를 투입한 다음 170∼230℃로 가열하면서 혼합하여 혼합수지액을 얻고, 상기 혼합수지액을 가압하여 선상으로 압출되게 한 다음, 냉각, 절단하여 제조함을 특징으로 하는 옥가루가 혼입된 합성수지칩.20-50% (volume ratio) of synthetic resin and 50-80% (volume ratio) of pulverized jade powder are added to a chip molding machine, followed by mixing while heating to 170-230 ° C., to obtain a mixed resin solution, and pressurizing the mixed resin solution into a shipboard. Oxygen-containing synthetic resin chips, characterized in that the extrusion and then cooled, and cut. 제1항에 있어서, 칩성형기내에 합성수지 및 옥가루와 함께 수지발포제를 전체 부피비의 5∼7% 첨가되게 함을 특징으로 하는 옥가루가 혼입된 합성수지칩.The synthetic resin chip having jade powder mixed therein according to claim 1, wherein a resin foaming agent is added to the chip molding machine together with the synthetic resin and jade powder. 제2항에 있어서, 칩성형기내에 합성수지와 옥가루 및 수지발포제를 투입하여 용융하면서 혼합하되, 발포온도이하에서 용융혼합되게 하여 제조된 합성수지칩이 발포되지 않게 함을 특징으로 하는 옥가루가 혼입된 합성수지칩.According to claim 2, wherein the synthetic resin chip is mixed with jade powder and jade powder and resin foaming agent in the chip molding machine, but melted and mixed under the foaming temperature to prevent the manufactured synthetic resin chip is characterized in that the foam mixed with jade powder . 제2항에 있어서, 칩성형기내에 합성수지와 옥가루 및 수지발포제를 투입용융하되, 용융실내의 온도를 170∼230℃유지되게 하여 압출 냉각, 절단되는 수지칩이 발포되게 함을 특징으로 하는 옥가루가 혼입된 합성수지칩.The method of claim 2, wherein the synthetic resin, the jade powder and the resin foaming agent is melted in the chip forming machine, and the jade powder is mixed to keep the temperature in the melting chamber at 170 to 230 ° C. so that the resin chips to be cooled by extrusion and foamed are foamed. Synthetic resin chips.
KR1020040060354A 2004-07-30 2004-07-30 Synthetic resin chip with jade powder KR20060011489A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102025169B1 (en) 2019-02-22 2019-09-25 주식회사 스카이바이오 Water-Soluble Jade Extract and Preparation Method Thereof
KR20200113478A (en) 2019-03-25 2020-10-07 임재선 Water-Soluble Jade Extract and Preparation Method Thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102025169B1 (en) 2019-02-22 2019-09-25 주식회사 스카이바이오 Water-Soluble Jade Extract and Preparation Method Thereof
KR20200113478A (en) 2019-03-25 2020-10-07 임재선 Water-Soluble Jade Extract and Preparation Method Thereof

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