KR20060002189A - Uv erasure apparatus - Google Patents

Abstract

There is provided an ultraviolet scavenging device that is easy to calibrate. The UV erasing device consists of a chuck with a center point and a boss and a transparent material with a center point at a position corresponding to the center of the wafer inserted into the wafer carrier to be mounted, and a center point at a position corresponding to the center of the wafer when the wafer is placed. And a carrier arm for transferring the wafer onto the boss and the chuck.

 UV erasure, carrier arm, EDS, wafer test

Description

UV erasure apparatus

1 is a plan view of an ultraviolet light erasing device according to an embodiment of the present invention.

2 is a perspective view of a control plate of the ultraviolet light canceling device according to another embodiment of the present invention.

3 is a perspective view showing a coupling relationship between the adjustment plate and the chuck.

4 is a perspective view illustrating a calibration process of the adjustment plate and the chuck.

5 is a perspective view illustrating a coupling relationship between an adjustment plate and a boss.

6 is a perspective view for illustrating a calibration process of the adjustment plate and the boss.

<Explanation of symbols on main parts of the drawings>

200: control panel 202: transparent plate

204: center point 206: support

116, 118: hall

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor test apparatus, and more particularly, to a UV erasing apparatus that is easy to calibrate.

In general, a plurality of semiconductor chips are formed on a wafer through a deposition process, a photo process, an etching process, and an ion implantation process.

As described above, when a plurality of semiconductor chips are formed on a wafer, an electrical characteristic inspection of each semiconductor chip is performed, and an EDS (Electrical Die Sorting) process is performed to select the normally operating semiconductor chips and the defective semiconductor chips.

On the other hand, in order to perform the above-described EDS process more accurately, an ultraviolet light erasing apparatus is used. This makes it possible to erase the information stored in each chip of the wafer, thereby ensuring that the electrical characteristics of each chip of the wafer is accurately performed.

The ultraviolet scavenging device as described above includes a chamber, a chuck, a wafer carrier, a wafer arm, a boss, an ultraviolet irradiation device, and the like.

Briefly referring to the operation of the ultraviolet erasing device, the wafer carrier into which the plurality of wafers are inserted is first moved on the boss of the ultraviolet erasing device by a predetermined moving means. When the wafer carrier is moved on the boss of the ultraviolet erasing device, a wafer carrier is operated to move the wafer into the chamber. The wafer carrier moves toward the wafer carrier and raises one of the wafers aligned in the wafer carrier onto the carrier arm of the wafer carrier and onto the chuck in the chamber. The wafer moved on the chuck is removed from the internal information by the ultraviolet irradiation device, and then moved back into the wafer carrier by the carrier arm of the carrier. As such, when the ultraviolet erasing operation for one wafer is completed, the wafer carrier repeats the above-described operation to move the next wafer.

However, when the above-described ultraviolet erasing operation is performed for a long time, there is a problem that an error occurs in the ultraviolet irradiation process that requires precisely because the carrier arm of the conveying unit, which frequently moves, is slightly spaced apart from its original position.

To avoid this problem, a calibration was required to match the center point of the carrier arm to the center of the chuck and the center of the wafer, respectively.

However, since the carrier arm is made of a non-transparent material, it was difficult to align the center point of the carrier arm to the center of the chuck and the wafer in the conventional UV erasing device, which had to be visually calibrated.

The technical problem to be achieved by the present invention is to provide an ultraviolet scavenging device that is easy to calibrate.

The technical problem to be achieved by the present invention is not limited to the above-mentioned problem, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to an embodiment of the present invention for achieving the above technical problem, the ultraviolet light erasing device is composed of a chuck, the center point is displayed, the boss and the transparent material is displayed the center point at a position corresponding to the center of the wafer to be inserted into the wafer carrier is mounted When the wafer is placed, a center point is formed at a position corresponding to the center of the wafer and includes a transfer arm for transferring the wafer onto the boss and the chuck.

Specific details of other embodiments are included in the detailed description and the drawings.

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms. It is provided to fully convey the scope of the invention to those skilled in the art, and the invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Hereinafter, a first embodiment of the present invention will be described with reference to FIG. 1.

First, the ultraviolet light erasing apparatus according to the first embodiment of the present invention includes a chamber 102, a wafer conveyance unit 106 and a boss 108, an ultraviolet irradiation device (not shown), and the like.

The boss 108 is a plate-shaped structure on which the wafer carrier 110 is placed, and a predetermined fixing means (not shown) is formed thereon, so that the wafer carrier 110 can be easily fixed.

The chamber 102 is a process for erasing information in the wafer 112, and includes a chuck 104, an ultraviolet irradiation device (not shown), and the like, on which the wafer 112 is placed.                     

The wafer transfer unit 106 is a means for moving the wafer 112. The wafer transfer unit 106 may move back and forth, rotate left and right, and operate the transfer arm 120 up and down. Accordingly, the wafer carrier 106 inserts the carrier arm 120 under the wafer 112 mounted at the specific position in the wafer carrier 110 and moves the carrier arm 120 upward by an appropriate distance. The wafer 112 is placed on the arm 120 and then moved over the chuck 104 in the chamber 102.

At this time, the chuck 104 is moved downward and the plurality of wafer support pins (not shown) in the chuck 104 are relatively raised, and the wafer 112 is placed thereon, followed by the ultraviolet erasing operation. do.

For reference, the process of moving the semiconductor wafer 112 back to the wafer carrier 110 may be performed by reversing the above process.

In the center of the chuck 104 is a center point 106. In addition, a center point (not shown) is also displayed on the boss 108, and the center point (not shown) of the boss 108 corresponds to the center of the wafer 110 in the wafer carrier 110 mounted on the boss 108. Is displayed at the position.

On the other hand, the transfer arm 120 of the wafer transfer part 106 is made of a transparent material, and the center point 114 coinciding with the center of the wafer 112 is displayed at the position where the wafer 112 is placed.

Accordingly, when performing the calibration operation, the center point 114 of the carrier arm 120 is placed on the center point 106 formed on the chuck 104 and the center point (not shown) formed on the boss 108. What is necessary is just to calibrate the carrier arm 120 so that each may be aligned.

Hereinafter, a second embodiment of the present invention will be described in detail with reference to FIGS. 2 to 6.

Here, in the ultraviolet light erasing device according to the second embodiment of the present invention, it should be noted that the carrier arm 120a is not a transparent material.

2 is a perspective view of a control plate 200 of the ultraviolet light erasing apparatus according to the second embodiment of the present invention. Referring to FIG. 2, the adjusting plate 200 includes a transparent plate 202 and a support 204.

The transparent plate 202 is a rectangular substrate made of a transparent material, and a support 206 is formed below four corners. The support 206 is formed of four holes formed on the chuck (see 104a in FIG. 3) (see 116 of FIG. 3) and / or four holes formed on the boss (see 108a of FIG. 5) (see 118 of FIG. 5). Is inserted into the transparent plate 202 is to be fixed. On the other hand, a center point 204 is displayed at the center of the transparent plate 202, which is displayed to coincide with the center of the chuck (see 104a in FIG. 3) and / or the boss (see 108a in FIG. 5) when viewed from above.

3 is a perspective view illustrating a coupling relationship between the adjustment plate 200 and the chuck 104a. Referring to this, four holes 116 are formed in the chuck 104a at positions corresponding to the supports 206 of the transparent plate 202, and the support 116 of the transparent plate 202 is formed. It is inserted into this hole 116 and fixed.

4 is a perspective view for illustrating a calibration process of the adjustment plate 200 and the chuck 104a. When the adjustment plate 200 is installed on the chuck 104a as shown in FIG. 3, the transfer part 106 is moved to position the transfer arm 204 in the chuck 104a. At this time, the carrier arm 204 is inserted below the transparent plate 202. In this state, the position of the carrier arm 120a is calibrated so that the center point 114a previously displayed on the carrier arm 120a and the center point 204 displayed on the transparent plate 200 coincide with each other.

5 is a perspective view illustrating a coupling relationship between the adjustment plate 200 and the boss 108. Referring to FIG. 5, four holes 206 are formed in the boss 108a at positions corresponding to the supporting portions 206 of the transparent plate 202. The support 206 of the transparent plate 202 is inserted into the four holes described above to fix the transparent plate 202.

6 is a perspective view for illustrating a calibration process of the adjustment plate 200 and the boss 108a. When the adjustment plate 200 is installed on the boss 108a as shown in FIG. 5, the transfer unit 106 is moved to position the transfer arm 120a on the boss 108a. At this time, the carrier arm 120a is inserted below the transparent plate 202. In this state, the position of the carrier arm 120a is calibrated so that the center point 114a previously displayed on the carrier arm 204 and the center point 204 previously displayed on the boss 108a coincide.

As described above, the ultraviolet light erasing device according to the embodiment of the present invention has been described with reference to the illustrated drawings. However, the present invention is not limited by the embodiments and drawings disclosed herein, and by those skilled in the art within the technical scope of the present invention. Of course, various modifications may be made.

For example, in the ultraviolet light erasing device according to the second embodiment of the present invention, the carrier arm 120a is described as not being a transparent material, but may be a transparent material.

Using the ultraviolet light canceling device according to the present invention has the advantage of easy calibration of the carrier arm. This reduces overall work time and improves work accuracy. In addition, it is possible to reduce an accident of breaking or scratching the wafer.

Claims (4)

Chuck with center point indicated; A boss in which a center point is indicated at a position corresponding to the center of the wafer inserted into the mounted wafer carrier; And And a carrier arm formed of a transparent material and having a center point formed at a position corresponding to the center of the wafer when the wafer is placed and transferring the wafer onto the boss and the chuck. The method of claim 1, Calibration by matching the center point of the carrier arm to the center point displayed on the chuck and the boss, respectively. A chuck with a plurality of holes formed therein; A boss having a plurality of holes formed therein; A carrier arm for displaying a center point at a position corresponding to the center of the wafer when the wafer is placed and transferring the wafer onto the boss and the chuck; A transparent plate on which a center point indicating the center of the chuck and / or the boss is displayed on the upper part, and a plurality of supporting parts formed below the transparent plate and insertable in correspondence to a plurality of holes formed in the chuck and / or the boss. Ultraviolet light canceling device comprising an adjustment plate. The method of claim 3, wherein And the center point of the carrier arm is aligned with the center point displayed on the transparent plate, thereby performing calibration.

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