KR20050113782A - Apparatus for fabricating liquid crystal display pane - Google Patents

Abstract

The present invention relates to an apparatus for manufacturing a liquid crystal display panel which can reduce the volume and shorten the process time of the liquid crystal display panel.

An apparatus for manufacturing a liquid crystal display panel according to the present invention comprises: a process chamber in which any one of the processes of manufacturing a liquid crystal display device is performed; A load lock chamber that receives the substrate of the sputtering process target from the outside and is directly connected to the process chamber; And transfer means for transferring the substrate in the load lock chamber into the process chamber.

Description

Apparatus For Fabricating Liquid Crystal Display Pane

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a liquid crystal display panel, and more particularly, to an apparatus for manufacturing a liquid crystal display panel which can reduce the volume and shorten the process time of the liquid crystal display panel.

1 is a perspective view illustrating a general liquid crystal display panel.

The liquid crystal display panel shown in FIG. 1 includes a color filter substrate 81 and a TFT substrate 91 bonded together with a liquid crystal 86 interposed therebetween.

The liquid crystal 86 is rotated in response to an electric field applied to the liquid crystal 86 to adjust the amount of light transmitted through the TFT substrate 91.

The color filter substrate 81 includes a color filter 82 and a common electrode 84 formed on the rear surface of the upper substrate 80a. In the color filter 82, the color filter layers of red (R), green (G), and blue (B) colors are arranged in a stripe form to transmit light of a specific wavelength band, thereby enabling color display. A black matrix (not shown) is formed between the color filters 82 of adjacent colors to absorb the light incident from the adjacent cells, thereby preventing the lowering of the contrast.

The TFT substrate 91 is formed so that the data line 99 and the gate line 94 cross each other on the front surface of the lower substrate 80b, and the TFT 90 is formed at the intersection thereof. The TFT 90 includes a gate electrode connected to the gate line 94, a source electrode connected to the data line 99, and a drain electrode facing the source electrode with a channel interposed therebetween. The TFT 90 is connected to the pixel electrode 92 through a contact hole penetrating through the drain electrode. The TFT 90 selectively supplies the data signal from the data line 99 to the pixel electrode 92 in response to the gate signal from the gate line 94.

The pixel electrode 92 is positioned in a cell region divided by the data line 99 and the gate line 94 and is made of a transparent conductive material having high light transmittance. The pixel electrode 99 generates a potential difference from the common electrode 84 formed on the upper substrate 80a by the data signal supplied via the drain electrode. Due to this potential difference, the liquid crystal 86 located between the lower substrate 80b and the upper substrate 80a is rotated by dielectric anisotropy. Accordingly, the light supplied from the light source via the pixel electrode 92 is transmitted toward the upper substrate 80a.

A sputtering apparatus is used when depositing an inorganic material such as signal lines such as semiconductor layers, insulating layers, a plurality of gate electrodes, and data lines of a liquid crystal display panel having such a configuration. A sputtering apparatus is a device for depositing a target material on a substrate by accelerating ions by plasma to cause ions to collide with a target. The sputtering process using this sputtering device has the advantage of forming a thin film while maintaining the substrate at a low temperature of about 400 ℃ compared to the chemical vapor deposition proceeding at a high temperature.

FIG. 2 is a view schematically illustrating an apparatus for manufacturing a liquid crystal display panel including a conventional sputtering apparatus.

The apparatus for manufacturing a liquid crystal display panel illustrated in FIG. 2 includes a trans chamber 2 disposed at the center, a load lock 4 chamber radially disposed around the trans chamber 2, an unload lock 6 chamber, and a first chamber. The first door 16 and the unload lock chamber 6, which are formed of the fourth process chambers 8, 9, 10, 11, and the like, and are located in an area where the load lock chamber 4 and the trans chamber 2 are connected. ) And a second door 17 positioned in an area where the trans chamber 2 is connected, and an area connecting the trans chamber 2 and the first to fourth process chambers 8, 9, 10, and 11. The third doors 12 are arranged in the.

In the transfer chamber 4, a first robot capable of automatically transferring the substrate 10 as a transfer mechanism is installed to transfer the substrate loaded in the load lock chamber 2 to a process chamber, for example, the first process chamber 8. Let's do it.

The load lock chamber 4 is loaded with a substrate by a second robot.

Since the sputtering device is located in the first to fourth process chambers 8, 9, 10, 11, the sputtering process is actually performed.

The first door 16 serves to separate the environment of the load lock chamber 4 and the transition chamber 2, and the second door 17 serves as the unload lock chamber 6 and the transition chamber 2, respectively. It separates each environment. The third doors 12 serve to separate the environment of the trans chamber 2 and the process chambers 8, 9, 10, 11 and maintain high vacuum of the process chambers 8, 9, 10, 11. Do it.

When the operation of such sputtering equipment is explained, a predetermined number (about 25 sheets) of the substrate is accommodated in the substrate cassette, and the substrate is placed in the load lock chamber 4 by the second robot. Then, the first robot of the transchamber 2 takes out the substrates in the load lock chamber 4 one by one, sequentially transfers them to the respective process chambers 8, 9, 10, and 11 and performs various processes including sputtering. Then, it returns to the unload lock chamber 6. In the unload lock chamber 6, the substrate cassette is similarly arranged, and the processed substrate can be accommodated up to a predetermined number.

3A to 3E are diagrams for explaining a process and sputtering of the substrate being transferred into the process chamber by the first robot disposed in the conventional trans chamber 2.

First, as shown in FIG. 3A, the substrate 30 transferred into the transchamber 2 is configured by the first robot 32 of the transchamber 2 being transferred to the process chamber, for example, the first process chamber 8. Move to the puttying device 40. The arm 34 of the first robot is loaded with a substrate 30 and the robot arm 34 moves to the sputtering device 40 as shown in FIG. 3B and the susceptor 36 as shown in FIG. 3C. The substrate 30 is seated on a lift pin 38 positioned thereon, and the first robot 32 is retracted out of the process chamber 8. Accordingly, the substrate 30 is loaded into the sputtering apparatus 40 as shown in FIG. 3D. Subsequently, as shown in FIG. 3E, the rotation part 42 of the susceptor rotates so that the substrate 30 and the target part TP are parallel to each other. The target portion TP consists of a magnet 50, a back plate 48, and a target 46. The magnet 50 applies a magnetic field to prevent electrons generated in the plasma from escaping to other parts of the sputtering apparatus. The back plate 48 fixes the target 46, which is a deposition material formed on the substrate 30 by sputtering.

When the substrate and the target 46 are positioned as described above, the target 46 and the susceptor 36 on which the substrate 30 is positioned are connected to the cathode and anode terminals of the power supply, respectively, and a high frequency is generated to apply a DC power supply. The action of generates electrons in the target 46 and these electrons are accelerated to the extreme ends. Here, the accelerating electrons collide with the inert gas supplied to the chamber to generate a plasma in which the inert gas is ionized. Accordingly, the cation of the inert gas collides with the target 46 connected to the cathode by the action of an electric field, thereby causing a sputtering phenomenon in which target 46 atoms are released from the surface of the target 46, and the electrons of the inert gas accelerate to the anode end. do. The separated target 46 atoms are formed on the substrate 30 to form an inorganic material such as a gate electrode.

On the other hand, the conventional manufacturing apparatus of the liquid crystal display panel has a problem that the volume of the entire manufacturing apparatus is increased by providing the trans chamber 2 including the first robot, the substrate loaded in the load lock chamber (4) The process time is increased by transferring the 30 to the process chamber 8 via the trans chamber 2.

Accordingly, an object of the present invention is to provide an apparatus for manufacturing a liquid crystal display panel which can reduce the volume and shorten the process time of the liquid crystal display panel by removing the trans chamber.

In order to achieve the above object, the apparatus for manufacturing a liquid crystal display panel according to the present invention comprises a process chamber in which any one of the manufacturing process of the liquid crystal display device is carried out; A load lock chamber that receives the substrate of the sputtering process target from the outside and is directly connected to the process chamber; And transfer means for transferring the substrate in the load lock chamber into the process chamber.

The conveying means may include a first LM guide having a rail and a conveying member movable along the rail; A first transfer unit installed on the first LM guide and receiving the substrate from the outside; A second LM guide having a rail and a transfer member movable along the rail in the load lock chamber, the second LM guide providing a transfer path between the load lock chamber and the process chamber; A third LM having a rail and a conveying member movable along the rail, the third LM guide forwarding the second LM guide toward the first LM guide and providing a path for retracting the second LM guide from the first LM guide; With a guide; A first drive source for moving back and forth the conveying member of the first LM guide; A second drive source for moving back and forth the conveying member of the second LM guide; And a third drive source for moving back and forth the conveying member of the third LM guide.

A second transfer unit which receives the substrate from the transfer means in the processor chamber and supports the substrate during the process; A fourth LM guide having a rail and a conveying member movable along the rail and disposed in the processor chamber in parallel with the second LM guide on a straight line to guide linear movement of the second conveying unit; And a fourth driving source for back and forth the conveying member of the fourth LM guide.

A disc supporting the fourth LM guide from below and rotatable; And a fifth drive source for rotating the disc.

A first target, a first cathode, and a first magnet disposed on a first side of the process chamber and opposed to the substrate; And a second target, a second cathode, and a second magnet disposed on a second side opposite to the first side with the substrate interposed therebetween in the process chamber and facing the substrate.

A rotatable movable portion for rotating the second flow unit on the fourth LM guide; And a sixth drive source for rotating the rotatable movable portion.

And a cathode facing the substrate in the second transfer unit.

Other objects and features of the present invention in addition to the above object will be apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 4 to 7.

4 is a view schematically showing an apparatus for manufacturing a liquid crystal display panel including a sputtering apparatus according to the present invention.

The apparatus for manufacturing a liquid crystal display panel illustrated in FIG. 4 includes at least one process chamber 108 including a sputtering apparatus capable of performing any one of the processes of manufacturing a liquid crystal display panel, a substrate subjected to a sputtering process, and receives the process chamber. A load lock chamber 104 directly connected to 108, a plurality of transfer means for transferring the substrate in the load lock chamber 104 into the process chamber 108, for example, an LM guide.

Each LM guide 155 has a rail 164 and a conveying body 162 movable along the rail 164 as shown in FIG. It is driven by the drive unit using at least one. Here, the bearing 166 or the like may be inserted between the rail 164 and the conveying member 162.

The first LM guide 150 is provided with a first transfer unit 170 for receiving a substrate from the outside to provide a transfer path between the outside and the load lock chamber 104. The first transfer unit 170 includes a fixing part 172 fixed on the first LM guide 150, a support part 176 connected to the fixing part 172, and a lift pin 174. Here, the support portion 176 and the fixing portion 172 forms an inclination angle of about 70 degrees to about 87 degrees so that the substrate can be easily seated on the first transfer unit 170.

The second LM guide 160 has a transfer path between the load lock chamber 104 and the process chamber 108 and includes a second transfer unit 180 that receives the substrate from the first transfer unit 170. do. The second transfer unit 180 is positioned between the support part 182 on which the substrate is mounted, the support part 182 and the second LM guide 160 to allow the support part 182 to rotate at a predetermined angle, and the second The rotating part 184 which fixes the support part 182 to the LM guide 160, and the auxiliary support part 183 connected with the support part 182 to fix a board | substrate to a support part are provided.

Meanwhile, a third LM guide (not shown) may be further provided to provide a path for advancing and retracting the second LM guide 160 toward the first LM guide 150.

The fourth LM guide 190 is disposed in parallel with the second LM guide 160 in the process chamber 108 and is a straight line of the second transfer unit 180 installed on the second LM guide 160. It will serve as a guide to the clouds.

Under the fourth LM guide 190, a rotatable disc 195 is positioned while supporting the fourth LM guide 190. This disc 195 is also driven by a cylinder, a motor, and air pressure. On the other hand, when the rail 164 of the second LM guide 160 is disposed to be separated from only the first door 120 and connected to the processor chamber 108, the transfer body 162 of the second LM guide 160 is a processor. It may also move directly to the chamber 108.

The first door 120 positioned in the region where the load lock chamber 104 and the process chamber 108 are connected serves to separate the environment of the load lock chamber 104 and the process chamber 108, respectively.

The operation of the apparatus for manufacturing a liquid crystal display panel will be described below.

A predetermined number (about 25 sheets) of the substrate 130 is accommodated in the substrate cassette, and as illustrated in FIG. 6A, a first transfer unit fixed by the first LM guide 150 by a robot (not shown) The substrate 130 is loaded into 170.

As the first driving unit (not shown) of the first LM guide 150 is driven, the transfer member 162 of the first LM guide 150 moves to the load lock chamber 104 so that the first transfer unit 170 and The substrate 130 is located in the load lock chamber 104. Thereafter, as shown in FIG. 6B, the second transfer unit 180 fixed by the second LM guide 160 positioned in the load lock chamber 104 is moved by the third LM guide 160 to the first transfer unit. (170). In this case, the third LM guide (not shown) may use a rail and a conveying body capable of linear movement by a screw and a nut. Thereafter, as the rotating unit 184 of the second transfer unit 180 rotates, the support unit 182 of the second transfer unit 180 is aligned side by side with the substrate 130, and as shown in FIG. 6C by vacuum adsorption. Likewise, the support 182 of the second transfer unit 180 receives the substrate 130.

Thereafter, the third LM guide (not shown) retreats and the second transfer unit 160 enters the process chamber 108 by the second LM guide 160. At this time, the first door 120 is opened and the fourth LM guide 190 disposed in the process chamber 104 also moves toward the second LM guide 160 so that the second transfer unit 180 moves to the fourth LM guide 190. After the first door 120 is closed, the process chamber 108 maintains a high vacuum.

Subsequently, as shown in FIG. 6D, the sputtering apparatus is disposed on one side of the process chamber 108 and faces the substrate 130, and the first target 246, the first magnet 250, and the first back plate 248. ) And a second target 346, a second magnet 350, and a second back plate 348 positioned on the opposite side of one side of the process chamber 108.

The first and second magnets 250 and 350 apply a magnetic field to prevent electrons generated from the plasma from escaping to other parts of the sputtering device. The first and second back plates 248 and 348 fix the targets 246 and 346, which are deposition materials formed on the substrate 130 by sputtering.

When the substrate 130 and the first target 246 are in the correct position, the first target 246 and the support part 182 on which the substrate 130 is located are connected to the cathode and anode terminals of the power supply, respectively, and generate a high frequency power. When is applied, electrons are generated in the first target 246 under the action of the electric field, and these electrons are accelerated to the extreme ends. Here, the accelerating electrons collide with the inert gas supplied to the chamber to generate a plasma in which the inert gas is ionized. Accordingly, the cation of the inert gas collides with the first target 246 connected to the cathode end by the action of an electric field, and a sputtering phenomenon occurs in which the atoms of the first target 246 are separated from the surface of the first target 246. Electrons are accelerated to both ends. The separated first target 246 atoms are formed on the substrate 130 to deposit an inorganic layer such as a gate electrode of the liquid crystal display panel.

After the sputtering process is performed in the first target portion, the disc 195 supporting the fourth LM guide 190 rotates so that the substrate 130 faces the second target 346 as shown in FIG. 6E. The sputtering process can be performed immediately.

After the various processes including sputtering, the process chamber 108 is formed using the fourth and second LM guides 190 and 160 by the same process as the second transfer unit 180 is transferred to the process chamber 180. After the substrate 130 is reloaded into the first transfer unit 170 positioned in the first LM guide 150, the first LM guide 150 exits the load lock chamber 104. Subsequently, the substrate 130 loaded on the first transfer unit 170 is placed back into the cassette by the robot. On the other hand, in the load lock chamber 104 and the process chamber 108 is provided with a control unit for controlling the entry, stop, etc. of each LM guide.

As described above, in the apparatus for manufacturing a liquid crystal display panel according to the present invention, the trans chamber is removed and the substrate is transferred directly from the load lock chamber to the process chamber. Accordingly, the volume of the manufacturing apparatus is simplified and downsized. In addition, the manufacturing process is simplified by transferring in line form between the loader lock chamber and the process chamber by the LM guide and the transfer unit.

As described above, the apparatus for manufacturing a liquid crystal display panel according to the present invention simplifies and miniaturizes volume and manufactures a liquid crystal display panel by removing a trans chamber and moving directly from a load lock chamber to a process chamber using an LM guide. The process is simplified.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

1 is a view showing a conventional liquid crystal display panel.

2 is a schematic view of an apparatus for manufacturing a liquid crystal display panel for performing a sputtering process.

3A to 3E are diagrams for describing substrate transfer and sputtering from the trans chamber to the processor chamber.

4 is a view showing an apparatus for manufacturing a liquid crystal display panel according to the present invention.

5 is a view showing the LM guide shown in FIG.

6A to 6E are views for explaining the operation of the apparatus for manufacturing a liquid crystal display panel according to the present invention.

<Description of Symbols for Main Parts of Drawings>

4,104: Load lock chamber 8,108: Process chamber

30,130: substrate 40: sputtering device

150,160,190: LM Guide 170,180: Transfer Unit

Claims (7)

A process chamber in which any one of the steps of manufacturing the liquid crystal display device is performed; A load lock chamber that receives the substrate of the sputtering process target from the outside and is directly connected to the process chamber; And transfer means for transferring the substrate in the load lock chamber into the process chamber. The method of claim 1, The transfer means, A first LM guide having a rail and a conveying body movable along the rail; A first transfer unit installed on the first LM guide and receiving the substrate from the outside; A second LM guide having a rail and a transfer member movable along the rail in the load lock chamber, the second LM guide providing a transfer path between the load lock chamber and the process chamber; A third LM having a rail and a conveying member movable along the rail, the third LM guide forwarding the second LM guide toward the first LM guide and providing a path for retracting the second LM guide from the first LM guide; With a guide; A first drive source for moving back and forth the conveying member of the first LM guide; A second drive source for moving back and forth the conveying member of the second LM guide; And a third driving source for moving back and forth the conveying member of the third LM guide. The method of claim 2, A second transfer unit which receives the substrate from the transfer means in the processor chamber and supports the substrate during the process; A fourth LM guide having a rail and a conveying member movable along the rail and disposed in the processor chamber in parallel with the second LM guide on a straight line to guide linear movement of the second conveying unit; And a fourth driving source for moving back and forth the conveying member of the fourth LM guide. The method of claim 3, wherein A disc supporting the fourth LM guide from below and rotatable; And a fifth driving source for rotating the original plate. The method of claim 1, A first target, a first cathode, and a first magnet disposed on a first side of the process chamber and opposed to the substrate; And a second target, a second cathode, and a second magnet disposed on a second side opposite to the first side with the substrate interposed therebetween in the process chamber, the second target being opposite to the substrate. Panel manufacturing apparatus. The method of claim 1, A rotatable movable portion for rotating the second flow unit on the fourth LM guide; And a sixth driving source for rotating the rotatable movable portion. The method of claim 5, And a cathode facing the substrate in the second transfer unit.