KR20050112618A - 반도체 패키지 - Google Patents
반도체 패키지 Download PDFInfo
- Publication number
- KR20050112618A KR20050112618A KR1020040037733A KR20040037733A KR20050112618A KR 20050112618 A KR20050112618 A KR 20050112618A KR 1020040037733 A KR1020040037733 A KR 1020040037733A KR 20040037733 A KR20040037733 A KR 20040037733A KR 20050112618 A KR20050112618 A KR 20050112618A
- Authority
- KR
- South Korea
- Prior art keywords
- mounting plate
- chip mounting
- semiconductor package
- exposed
- chip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (3)
- 칩탑재판의 저면이 노출되는 반도체 패키지에 있어서,상기 반도체 패키지의 칩탑재판을 몰딩공정시 이젝트 핀과 접촉되지 않는 한도내의 크기로 채택하여서, 칩탑재판의 노출면적을 증대시킨 구조를 특징으로 하는 반도체 패키지.
- 청구항 1에 있어서, 상기 칩탑재판은 대각 방향의 모서리부분이 직각으로 절개된 형상으로서, 이 절개된 부분에는 이젝트 핀과 접촉되게 수지로 몰딩된 것을 특징으로 하는 반도체 패키지.
- 청구항 1에 있어서, 상기 칩탑재판은 대각 방향의 모서리부분이 위쪽으로 절곡된 형상으로서, 이 절곡된 부분은 이젝트 핀과 접촉되게 몰딩된 수지의 내부에 위치되는 것을 특징으로 하는 반도체 패키지.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20040037733A KR100597762B1 (ko) | 2004-05-27 | 2004-05-27 | 반도체 패키지 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20040037733A KR100597762B1 (ko) | 2004-05-27 | 2004-05-27 | 반도체 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050112618A true KR20050112618A (ko) | 2005-12-01 |
KR100597762B1 KR100597762B1 (ko) | 2006-07-05 |
Family
ID=37287477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20040037733A KR100597762B1 (ko) | 2004-05-27 | 2004-05-27 | 반도체 패키지 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100597762B1 (ko) |
-
2004
- 2004-05-27 KR KR20040037733A patent/KR100597762B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR100597762B1 (ko) | 2006-07-05 |
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