KR20050101421A - Microphone assembling method and condenser microphone for the same - Google Patents

Abstract

The present invention relates to a condenser microphone assembling method and a condenser microphone for preventing the sound quality degradation due to the inflow of the rear sound by assembling in the reverse order to the front side. The assembly method of the present invention comprises the steps of placing the PCB in the center of the bottom surface is formed in the exposed hole and the outer surface facing the exposure hole in the open case; Placing an insulating ring on the PCB; Inserting a conductive ring in the insulating ring; Inserting a backplate into the conductive ring; Placing a spacer on the insulating ring; Placing a diaphragm on the spacer; And placing a metal plate on which the sound hole is formed on the diaphragm, and curing the end of the case at an edge of the metal plate. Therefore, according to the present invention, while exposing the connection terminal of the PCB through the exposure hole formed in the bottom surface of the microphone case to be in close contact with the edge portion of the PCB and the case bottom surface to prevent the rear sound from flowing into the inside, The front sound is introduced through the sound hole of the metal plate added to the curry surface.

Description

Microphone Assembling Method And Condenser Microphone For the Same

The present invention relates to a method for assembling a condenser microphone, and more particularly, to a condenser microphone assembling method capable of preventing sound degradation due to inflow of rear sound by assembling in the reverse order to the front side, and a condenser microphone for the same. will be.

In general, a condenser microphone widely used in a mobile communication terminal or an audio device includes a voltage bias element, a diaphragm / backplate pair forming a capacitor C that changes in response to sound pressure, and a buffer for output signal. It consists of a field effect transistor (JFET).

The condenser microphone is composed of an assembly in which a diaphragm, a spacer ring, an insulating ring, a back plate, an energizing ring, and a PCB are integrally assembled in one case, and a conventional electret condenser microphone is shown in FIG. A casing 102 made of a cylindrical metal with a hole 102a formed therein, a diaphragm 104 having a conductive pole ring and a vibrating membrane integrated therein, a spacer 106, a ring-shaped first base 108 made of an insulator, and a bipolar plate. 110, a conductor 2nd base 112, and a PCB 114 on which circuit components are mounted and connecting terminals are formed.

However, the conventional condenser microphone has a problem in that the rear sound is introduced by the curling surface and the sound quality is degraded because the curving surface 102C is assembled after the PCB side as shown in FIG. 1B. That is, in the conventional packaging method of the condenser microphone, the diaphragm 104 is inserted from the bottom surface of the case 102 and the PCB 114 is inserted into the PCB. In this case, since the edge portion of the PCB 114 to be cured is not completely sealed, the rear sound may be incident on the curing surface, thereby degrading acoustic characteristics of the microphone.

The present invention has been proposed to solve the above problems, to provide a condenser microphone assembly method and condenser microphone for preventing the sound quality degradation due to the inflow of the rear sound by assembling in the reverse order to the front side to provide The purpose is.

In order to achieve the above object, the packaging method of the present invention, in the packaging method of the condenser microphone, the exposure hole is formed in the center of the bottom surface and the other side is the PCB so that the external connection surface facing the exposure hole in the open case. After the mounting, the internal elements are sequentially assembled, and finally, after disposing a metal plate on which an acoustic hole is formed, the end of the case is cured at the edge of the metal plate to form a microphone assembly.

In order to achieve the above object, the assembly method of the present invention comprises the steps of placing the PCB in the center of the bottom surface and the other surface is opened in the case the external connection surface facing the exposure hole; Placing an insulating ring on the PCB; Inserting a conductive ring in the insulating ring; Inserting a backplate into the conductive ring; Placing a spacer on the insulating ring; Placing a diaphragm on the spacer; And placing a metal plate on which the sound hole is formed on the diaphragm, and curving the end of the case at an edge of the metal plate.

In addition, the condenser microphone of the present invention, in order to achieve the above object, the exposure hole is formed in the center of the bottom surface and the other side of the case is opened; A PCB coupled to the case such that an external connection terminal is exposed to the outside through the exposure hole; An insulation ring for insulating an element inside the case; A conductive ring inserted into the insulating ring to provide a conductive function to the PCB; A back plate supported by the conductive ring and electrically connected in the insulating ring; Spacers for forming gaps; A diaphragm comprising a pole ring made of a metal plate and a vibrating membrane attached to the pole ring so as to face the back plate with the spacer interposed therebetween; And a metal plate having a sound hole for introducing front sound, and the components are sequentially coupled to the case, and the end of the case is cured at the edge of the metal plate to form a single assembly.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a flow chart showing the assembly procedure of the condenser microphone according to the present invention.

First, the front and rear positions of the case are reversed in order to apply the microphone assembly method according to the present invention. That is, in the past, the bottom surface of the case is the front and the open surface where the curling operation is performed is the rear, but according to the assembling method of the present invention, the bottom surface of the case is the rear, and the open surface where the curl is made is the front. To this end, as shown in FIG. 3, the case 302 has a wide hole 302b formed to expose the connection terminal of the PCB on the bottom surface, and the edge portion 302a of the PCB 304 and the case bottom surface. ) Should be in close contact. In order to cover the open surface of the case, a metal plate 316 having a sound hole 316a serving as a cover and introducing front sound is required.

Referring to Figure 2, the microphone assembly method according to the present invention is a PCB (so that the external connection surface facing the exposure hole 302b in the case 302, the exposure hole 302b is formed in the center of the bottom surface and the other surface is opened) Putting the insulating ring 306 on the PCB 304, placing the insulating ring 306 on the PCB 304, inserting the conductive ring 308 into the insulating ring 306 (S4); Inserting the back plate 310 into the conductive ring 308 (S5), placing the spacer 312 on the insulating ring 306 (S6), placing the diaphragm 314 on the spacer 312 In operation S7, the metal plate 316 on which the sound hole 316a is formed is placed on the diaphragm 314, and the ends of the case 302 are cured at the edges of the metal plate 316 (S8 and S9). It can be seen that this assembly (packaging) procedure is the reverse of the conventional assembly procedure.

[First Embodiment]

3A is an exploded perspective view of the first embodiment for applying the assembly method of the present invention, and FIG. 3B is an assembly side cross-sectional view of the first embodiment shown in FIG. 3A.

3A and 3B, in the microphone of the first embodiment, an exposure hole 302b is formed at the center of the bottom surface, and an opposite side thereof is opened, and an external connection terminal is externally exposed through the exposure hole 302b. PCB 304 coupled to the case so as to be exposed to the substrate, an insulation ring 306 for isolating elements therein from the case 302, and a conductivity inserted into the insulation ring 306 to provide a conductive function to the PCB 304. The back plate 310, which is supported by the conductive ring 308 and electrically connected in the insulating ring 306, the spacer 312, a metal pole ring and a vibration membrane attached to the pole ring The diaphragm 314 facing the back plate 310 with the 312 interposed therebetween, and the metal plate 316 formed with the sound hole 316a for introducing the front sound are formed in the case 302. After being sequentially coupled, the end of the case is the most of the metal plate 316 Curing (302C) in place as a single assembly.

Second Embodiment

4A is an exploded perspective view of a second embodiment for applying the assembly method of the present invention, and FIG. 4B is an assembled side cross-sectional view of the second embodiment shown in FIG. 4A.

In the second embodiment, the assembly method of the present invention is applied to a microphone having an integrated base, and the upper part of the case 402 is opened, inserted from the PCB 404, inserted into the diaphragm 414, and the sound hole 416a is formed. By inserting the metal plate 416 and curing at the edge of the metal plate 416, the rear sound incident to the upper part of the case is blocked, thereby eliminating the problem of deteriorating acoustic characteristics caused by the incident of the rear sound of the condenser microphone. That is, in the second embodiment, when packaging the condenser microphone to which the integrated base is applied, the metal plate 416 having the acoustic hole 416a formed on the diaphragm 414 is not inserted into the PCB surface as shown in FIG. 4B. Curing is performed at the edge of the metal plate 416.

4A and 4B, in the condenser microphone according to the second embodiment of the present invention, an exposed hole 402b is formed in the center of the bottom surface of the condenser microphone, and the opposite side of the condenser microphone is opened, and the external connection terminal is exposed. The PCB 404 coupled to the case 402 to be exposed to the outside through the hole 402b, and provides an electrical connection between the back plate 410 and the PCB 404 on the inner circumferential surface of the cylindrical insulated body that is opened up and down An integrated base 406 having a conductive pattern 406a formed therein, an annular back plate insulating ring 408 for insulating the back plate 410, a disc shaped back plate 410 having a sound hole, and a diaphragm 414. And a spacer 412 for spacing between the back plate and the back plate 410, and a diaphragm 414 facing the back plate 410 with the spacer 412 interposed therebetween with a spacer made of a metal ring and a vibration membrane attached to the pole ring. And electrical connection of the diaphragm 414 with the case 402 A sound hole 416a for introducing the front sound is formed, and a metal plate 416 is formed to cover the internal parts, and the components are sequentially coupled in the case 402. Curing 402C at the edge of 416 is one assembly.

As described above, according to the present invention by exposing the connection terminal of the PCB through the exposure hole formed in the bottom surface of the microphone case to ensure that the edge portion of the PCB and the case bottom surface to be in close contact to prevent the rear sound from entering the interior. The front sound may be introduced through the sound hole of the metal plate added to the cured surface of the case. Therefore, even if the curing surface of the case is not completely sealed as in the prior art, even if the front sound is introduced, the same as the front sound introduced through the sound hole, there is an advantage that does not affect the characteristics of the microphone.

1A and 1B are views of a condenser microphone assembled according to a conventional method,

2 is a flow chart showing a microphone assembly procedure according to the present invention,

3A is an exploded perspective view of a first embodiment for applying the assembly method of the present invention;

3B is an assembled side cross-sectional view of the first embodiment shown in FIG. 3A;

Figure 4a is an exploded perspective view of a second embodiment for applying the assembly method of the present invention,

4B is an assembled side cross-sectional view of the second embodiment shown in FIG. 4A.

* Explanation of symbols for main parts of the drawings

302: Case 302a: Bottom edge

302b: exposed hole 304: PCB

306: insulating ring 308: conductive ring

310: back plate 312: spacer

314: diaphragm 316: metal plate

316: sound hole

Claims (5)

In the packaging method of the condenser microphone, After the exposure hole is formed in the center of the bottom surface and the other side is placed on the case with the external connection surface facing the exposure hole in the opened case, the internal elements are sequentially assembled, and finally the metal plate with the acoustic hole is formed. And curing the end of the case at an edge of the metal plate to form a microphone assembly. Placing a PCB with an exposed hole formed in the center of the bottom surface and having an external connection surface facing the exposed hole in the opened case; Placing an insulating ring on the PCB; Inserting a conductive ring in the insulating ring; Inserting a backplate into the conductive ring; Placing a spacer on the insulating ring; Placing a diaphragm on the spacer; And And placing a metal plate on which the sound hole is formed on the diaphragm, and curving the end of the case at an edge of the metal plate. A case in which an exposure hole is formed at the center of the bottom surface and the other surface is opened; A PCB coupled to the case such that an external connection terminal is exposed to the outside through the exposure hole; An insulation ring for insulating an element inside the case; A conductive ring inserted into the insulating ring to provide a conductive function to the PCB; A back plate supported by the conductive ring and electrically connected in the insulating ring; Spacers for forming gaps; A diaphragm comprising a pole ring made of a metal plate and a vibrating membrane attached to the pole ring so as to face the back plate with the spacer interposed therebetween; And Consists of a metal plate formed with sound holes for introducing the front sound  And the components are sequentially coupled to the case, and the end of the case is cured at the edge of the metal plate to form a single assembly. A case in which an exposure hole is formed at the center of the bottom surface and the other surface is opened; A PCB coupled to the case such that an external connection terminal is exposed to the outside through the hole; An integrated base having a conductive pattern for providing an electrical connection to an inner circumferential surface of a cylindrical insulating body having a top and bottom opening; Back plate insulation ring; A back plate electrically insulated from the case by the back plate insulating ring and electrically connected to the PCB by the conductive pattern of the integrated base; Spacers for spacing; A diaphragm composed of a metal pole ring and a vibration membrane attached to the pole ring, the diaphragm facing the back plate with the spacer interposed therebetween; An electrical hole is formed to electrically connect the diaphragm to the case and to inject the front sound, and is composed of a metal plate for covering the internal parts.  And the components are sequentially coupled to the case, and the end of the case is cured at the edge of the metal plate to form a single assembly. The shape of the condenser microphone according to claim 3 or 4, wherein A condenser microphone, characterized in that it is cylindrical or parallelepiped.