KR20050087578A - A parallelepiped type directional condenser microphone for smd - Google Patents

Abstract

The present invention relates to a directional condenser microphone, which becomes a parallelepiped type, and has a sound path for a rear sound and a sound hole in a PCB.

The microphone of the present invention includes a rectangular cylindrical case in which one surface is opened and a sound hole for introducing front sounds and a sound hole for introducing rear sounds is formed on the bottom surface; A ring diaphragm that can be inserted into a rectangular cylindrical case; Ring-shaped thin spacers; A cylindrical insulating ring having an upper and lower opening; A disk-shaped back plate in which sound holes are formed; An annular conductive ring for electrically connecting the back plate to the circuit board; Sound holes are formed in the central part, and components (IC, MLCC) are mounted on one side and a rectangular plate type PCB is formed on the other side. The diaphragm, spacer, insulation ring, back plate, conductive ring, and PCB are formed in the case. After being arranged sequentially, the end of the case was assembled into a structure that was cured.

Therefore, the directional microphone of the present invention receives the rear sound through the acoustic path formed between the rectangular case and the circular internal element, and the sound hole formed in the PCB to provide directivity of positive characteristics.

Description

A parallelepiped type directional condenser microphone for SMD}

The present invention relates to a condenser microphone. More particularly, the present invention relates to a directional condenser microphone, in which an acoustic path is formed in an assembly as well as a parallel hexahedron, and an acoustic hole is formed in a PCB.

In general, microphones are classified into omnidirectional (directional) microphones and directional microphones according to directivity characteristics. Directional microphones are classified into bi-directional microphones and uni-directional microphones. The bidirectional microphone faithfully reproduces the front and rear incident sounds and exhibits attenuation characteristics for the incident sound from the lateral angle, so that the polar pattern of the sound source is 8-shaped, and the near field characteristic is good. Widely used for noisy stadium announcers. The unidirectional microphone maintains the output value in response to a wide front incident sound, and the back incident sound source cancels the output value to improve the S / N ratio of the front sound source, and it is widely used in speech recognition equipment because of its clearness.

1 is a schematic diagram illustrating a conventional directional condenser microphone.

The conventional directional condenser microphone 10 has a first base, conductor, in the form of a ring of polar ring, diaphragm, spacer, back plate, and insulator in a case made of sound metal and formed of a cylindrical metal as shown in FIG. The second base and the PCB having sound holes for introducing sound from the outside are mounted, and the assembly is cylindrical in shape, and two connection terminals are formed on the PCB.

However, when mounting the surface, it is necessary to connect the connection terminal of the main PCB terminal and the condenser microphone correctly. The connection terminal of the conventional cylindrical condenser microphone as described above is not suitable for the surface mounting (SMD), and the terminal surface is lower than the curing surface of the case. Due to this problem, solder adhesion defects occur during surface mounting.In particular, when a large number of connection terminals are provided, it is difficult to check the direction of the connection terminals. There is a problem in that the connection is broken and only a part of the connection is made, resulting in an increase in connection failure.

In addition, the directional condenser microphone generally forms sound holes in the case and the PCB surface, thereby providing directivity using the phase difference between the front sound and the rear sound. However, when the directional microphone is mounted on a main PCB such as a mobile phone, the microphone is mounted by forming a space for the microphone in a mobile phone case having a complicated mechanical shape and connected to the main PCB by a jumper wire or an FPC. That is, in the case of a mobile phone case, the mechanical shape is very complicated to mount components of various shapes at high density, and the internal space formed around the microphone is irregular.

Therefore, conventionally, when the directional microphone is mounted on an apparatus having a complicated shape such as a mobile phone, a space for mounting on the case of a mobile phone must be configured. Furthermore, the acoustic field is irregular due to the complicated mechanism inside the case. There was a problem that it is difficult to form and obtain an accurate directing effect.

The present invention has been proposed to solve the above problems, the sound hole is formed on the PCB and the acoustic path is formed in the assembly to improve the static characteristics even in a complex mechanical environment, the parallel hexahedron surface mounted It is an object of the present invention to provide a parallelepiped directional condenser microphone which is easy to check the direction of a component in a (SMD) process.

In order to achieve the above object, the microphone of one embodiment of the present invention includes a rectangular cylindrical case in which one surface is opened and a sound hole for introducing a front sound and a rear sound is introduced into a bottom surface; A ring diaphragm that can be inserted into the rectangular cylindrical case; Ring-shaped thin spacers; Cylindrical insulating ring with upper and lower openings; A disk-shaped back plate in which sound holes are formed; An annular conductive ring for electrically connecting the back plate to the circuit board; A sound hole for rear sound is formed in the center part, and components (IC, MLCC) are mounted on one side and a rectangular plate-shaped PCB formed with a protruding terminal on the other side, so that the diaphragm, spacer, insulation ring, back plate, and conduction are formed in the case. Ring, PCB is arranged in sequence, characterized in that assembled to the structure of the end of the case is cured.

In order to achieve the above object, the microphone of another exemplary embodiment of the present invention includes a rectangular cylindrical case in which one surface is opened and a sound hole for introducing a front sound and a rear sound for introducing a rear sound is formed on the bottom surface; A ring diaphragm that can be inserted into the rectangular cylindrical case; Ring-shaped thin spacers; An annular shield ring for insulating the backplate; A disk-shaped back plate in which sound holes are formed; An integrated base having a conductive layer formed on the inner circumferential surface of the cylindrical insulating body having upper and lower openings for providing electrical connection between the back plate and the PCB; And a rectangular plate type PCB having components (IC, MLCC) mounted on one side and protruding terminals formed on the other side, and the diaphragm, spacer, shield ring, back plate, integrated base, and PCB are sequentially disposed in the case. Characterized in that the assembled structure of the end of the cured.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a perspective view of a parallelepiped directional condenser microphone according to the present invention.

In the directional condenser microphones 100 and 200 according to the present invention, as shown in FIG. 2, the components are inserted into the parallelepiped casing and connected to the main PCB through the protruding terminals formed on the PCB surface. Since the directional condenser microphones 100 and 200 of the present invention have a parallel hexahedron shape, they can easily align the direction of components during surface mounting, so that the connection surface of the connection terminal of the main PCB and the connection terminal of the condenser microphone is distorted or changed in direction. Can be solved. In addition, the directional condenser microphone (100,200) of the present invention can further improve the directivity by adding a separate sound hole to the PCB surface to have directivity by receiving the rear sound through the rear sound hole and the sound passage formed in the case. It is supposed to be.

[First embodiment (bidirectional)]

3 is an exploded perspective view showing a first embodiment of a parallelepiped bidirectional condenser microphone according to the present invention.

Referring to FIG. 3, the bidirectional condenser microphone 100 of the present invention has a rectangular cylindrical shape in which one surface is opened and a sound hole 102a for introducing front sounds and a sound hole 102b for introducing rear sounds are formed on the bottom surface. A case 102, a ring-shaped diaphragm 104 that can be inserted into the rectangular cylindrical case 102, a ring-shaped thin spacer 106, a cylindrical insulating ring 108 that is opened up and down, and a sound hole 110a. ) Is formed of a disk-shaped back plate 110, an annular conductive ring 112 for electrically connecting the back plate 110 to the circuit board (PCB) 114, and a sound hole 114a for the rear sound at the center portion thereof. It is formed of a square plate-shaped PCB 114 is formed, the component (IC, MLCC) is mounted on one surface and the protruding terminal 116 is formed on the other surface. At this time, except for the case 102 and the PCB 114, the internal elements are all circular (or cylindrical, ring-shaped), and after completing the assembly of the internal elements in the case 102, the acoustic path is formed at the four corners of the rectangular parallelepiped. In the present invention, the sound hole 102b for the rear sound is additionally formed in the case 102 at the position corresponding to the sound path, so that the rear sound is introduced.

The bottom center of the case 202 is a suction position for picking up from the tape & reel package with a vacuum chuck for surface mount (SMD), and the diaphragm 104 is polarized for electrical connection with the case 102. 104a and a vibrating membrane 104b vibrated by sound pressure, the back plate 110 has an organic film fused to a metal plate and an electret formed on the organic film.

4A and 4B are diagrams illustrating a PCB structure of a directional microphone according to the present invention.

According to the present invention, the insulating ring 108 and the conductive ring 112 may be removed to allow the rear sound coming from the acoustic paths P1 and P2 formed between the case 102 and the internal elements to flow into the back chamber 120. A through-passing acoustic path is required. In the embodiment of the present invention, as shown in FIGS. 4A and 4B, at least two protrusion patterns 114d are formed on the surface of the PCB, and then the protrusion patterns 114d are formed. By supporting the insulating ring 108 and the conductive ring 112, the rear sound can pass through the space formed by the protruding pattern 114d. At this time, since the conductive ring 112 needs to electrically connect the component 114e and the back plate 110 on the PCB, instead of the conventional ring-shaped conductive pattern, the connection pattern 114b protruding at the same height as the protrusion pattern is provided. Need to be formed. In addition, the PCB 114 is formed with a rear sound hole 114a for introducing a rear sound, and according to the present invention, the rear sound is formed on the path and the PCB flowing through the rear sound hole 102b and the acoustic passage formed in the case. It may be introduced into the back chamber 120 through two paths such as a path flowing through the formed rear sound hole (114a).

4A and 4B, a component 114e is mounted at the center of the PCB substrate 114, and three protruding patterns 114d and a portion are provided at the portions supporting the insulating ring 108 and the conductive ring 112. One connection pattern 114b is formed so that the rear sound from the acoustic path formed by the case 102 and the internal elements can be introduced into the back chamber. In this case, the protrusion pattern 114d does not need to be a conductor, but the connection pattern 114b should be a conductor.

5 is a side cross-sectional view of the assembly of the first embodiment shown in FIG.

Referring to FIG. 5, the condenser microphone 100 of the first embodiment includes a diaphragm 104a and 104b, a spacer 106, an insulating ring 108, and a back plate which are circular in a rectangular cylindrical case 102. 110, the conductive ring 112 is disposed and then assembled with a structure in which the end of the case 102 is cured by closing the rectangular plate-shaped PCB 114.

In addition, the exposed surface of the PCB 114 is formed such that the protruding terminal 116 protrudes from the curing surface of the case 102 so that the microphone 100 can be attached to the main PCB, for example, the PCB of the mobile phone by SMD method. The protruding terminal 116 may be a terminal for connecting Vdd and a ground terminal, and terminals required according to additional functions.

The operation of the bidirectional condenser microphone according to the first embodiment is as follows.

The protruding terminal 116 of the bidirectional condenser microphone according to the present invention is connected to the connection terminal of the main PCB to which Vdd and GND power are applied. Accordingly, in the bidirectional condenser microphone 100 according to the present invention, the vibrating membrane 104b is electrically connected to the PCB 114 via the case 102 and the polar ring 104a, and the back plate 110 is electrically conductive. It is electrically connected to the PCB 114 through 112.

In such a state, the front sound from the external sound source is introduced into the microphone through the front sound hole 102a of the case and transmitted to the vibrating membrane 104b, and the rear sound is the rear sound hole 102b and the sound passage P1 of the case. After being introduced into the back chamber 120 through the P2, the sound is introduced into the back chamber 120 through the sound hole 114a formed in the PCB 114, and the sound introduced into the back chamber 120 is the back plate 110. Passed through the sound hole (110a) of the vibration membrane (104b).

Accordingly, the diaphragm 104b vibrates with a positive orientation that reacts only to the front and rear sounds due to the canceling effect of the side sounds caused by the synthesized sound pressures of the front and rear sounds, thereby vibrating the membrane 104b. The distance between the back plate 110 and the back plate 110 is changed. As a result, the capacitance formed by the vibrating membrane 104b and the back plate 110 is changed to obtain a change in the electrical signal (voltage) according to sound waves. The signal is transferred to the IC mounted on the PCB 114 along the electrical connection line described above, amplified, and then output to the external circuit through the protruding terminal 116.

Second Embodiment (Bidirectional)

6 is an exploded perspective view of a second embodiment of a bidirectional condenser microphone according to the present invention.

Referring to FIG. 6, the bidirectional condenser microphone 200 of the present invention has a rectangular cylindrical case in which one surface is opened and a sound hole 202a for introducing a front sound and a sound hole 202b for a rear sound are formed on a bottom surface thereof. 202, a ring-shaped diaphragm 204 that can be inserted into the rectangular cylindrical case 202, a ring-shaped thin spacer 206, and an annular shield ring 208 for insulating the back plate 210, A conductive layer for providing an electrical connection between the back plate 210 and the PCB 214 on the inner circumferential surface of a disc-shaped back plate 210 having a sound hole 210a and a cylindrical insulating body 212a having an upper and lower openings. Integrated base 212 formed with 212b, a sound hole 214a for the rear sound is formed in the center portion, the component (IC, MLCC) is mounted on one surface and the rectangular plate-shaped PCB (protrusion terminal 216 formed on the other surface ( 214). Here, the diaphragm 204 is composed of a polar ring 204a for electrical connection with the case 202 and a vibrating membrane 204b vibrated by sound pressure, and the back plate 210 is fused with a metal plate on an organic film. And electrets are formed on the organic film. The integrated base 212 forms a hollow cylindrical insulating body 212a using a PCB technology as a PCB substrate, and then conducts a metal plating layer to have an outer diameter smaller than the outer diameter on both surfaces and the inner circumferential surface of the insulating body 212a. The layer 212b is formed. As described above, the integrated base 212 according to the present invention includes a first base having a conventional insulation function and a second base having a conductive function as one integrated base. At this time, the outer diameter of the metal plating layer should be smaller than the outer diameter of the insulating body so as not to be in electrical contact with the case. Here, the insulating body 212a may be implemented with an insulator printed substrate of glass epoxy, resin, or PVC.

In addition, although not shown in detail, the insulating body 212a serves as an insulating function, and a metal plating layer is formed on the inner side of one surface contacting the back plate 210 and the other surface contacting the PCB 214 in the insulating body 212a. After that, the upper and lower metal plating layers may be connected through through holes or via holes to provide conductive functions by allowing the metal plating layers on both sides to be conductive.

FIG. 7 is an assembly side cross section of the second embodiment shown in FIG. 6.

Referring to FIG. 7, the bidirectional condenser microphone 200 of the second embodiment includes diaphragms 204a and 204b, spacers 206, shield rings 208, and backplates 210 in a rectangular cylindrical case 202. As shown in FIG. After the integrated base 212 and the rectangular plate-shaped PCB 214 are sequentially arranged, the end of the case 202 is assembled.

In addition, the exposed surface of the PCB 214 is protruded terminal 216 is formed to protrude more than the curing surface of the case 202 so that the microphone 200 can be attached to the main PCB, for example, the PCB of the mobile phone by SMD method. The protruding terminal 216 may be a terminal for connecting Vdd and a ground terminal, and terminals required according to additional functions.

In addition, in the second embodiment, the rectangular components may have a round shape at which edges of the squares meet each other according to the convenience of manufacturing or assembling each component, and the IC mounted on the PCB may have a field effect transistor (JFET). It consists of an amplifier, an analog-to-digital (A / D) converter, or an IC that customizes an amplifier and an analog-to-digital (A / D) converter (ASIC).

The operation of the bidirectional condenser microphone of the second embodiment is as follows.

The protruding terminal 216 of the bidirectional condenser microphone according to the present invention is connected to the connection terminal of the main PCB to apply the Vdd and the GND power. Accordingly, in the condenser microphone 200 according to the present invention, the vibrating membrane 204b is electrically connected to the PCB 214 via the case 202 and the polar ring 204a, and the back plate 210 is integrated base 212. Is electrically connected to the PCB 214 through the conductive layer 212b.

In such a state, the front sound from the external sound source is introduced into the microphone through the front sound hole 202a of the case and transmitted to the vibrating membrane 204b, and the rear sound is formed from the rear sound hole 202b formed in the case 202. In addition to the back chamber 120 through the sound path (P1, P2) and also into the back chamber 120 through the sound hole (214a) of the PCB, the sound introduced into the back chamber is the sound hole of the back plate 210 ( Passed through 210a to the vibrating membrane 204b.

Therefore, the diaphragm 204b vibrates with a positive orientation that reacts only to the front and rear sounds due to the canceling effect of the side sounds by the synthesized sound pressure of the front and rear sounds, and thus vibrating membrane 204b. The distance between the back plate 210 and the back plate 210 is changed. As a result, the capacitance formed by the vibrating membrane 204b and the back plate 210 is changed to obtain a change in the electrical signal (voltage) according to sound waves. The signal is transmitted to the IC mounted on the PCB 214 along the above electrical connection line, amplified, and then output to the external circuit through the protruding terminal 216.

[First embodiment (unidirectional)]

8 is an exploded perspective view showing a first embodiment of a parallelepiped unidirectional condenser microphone according to the present invention.

Referring to FIG. 8, the unidirectional condenser microphone 100 ′ of the present invention has a rectangular cylindrical shape in which one surface is opened and a sound hole 102a for introducing front sound and a sound hole 102b for introducing rear sound are formed on the bottom surface. Casing 102, a ring-shaped diaphragm 104 that can be inserted into a rectangular cylindrical case 102, a ring-shaped spacer (106), a cylindrical insulating ring 108, the upper and lower openings, sound holes ( A disk-shaped back plate 110, an acoustic resistor 111, and an annular conductive ring 112 for electrically connecting the back plate 110 to a circuit board (PCB) 114 having a 110a formed therein, and a rear sound at a center portion thereof. The sound hole 114a is formed for a component (IC, MLCC) is mounted on one surface and is composed of a square plate-shaped PCB 114 formed with a protruding terminal 116 on the other surface. At this time, except for the case 102 and the PCB 114, the internal elements are all circular (or cylindrical, ring-shaped), so that the acoustic path is formed at the four corners of the rectangular parallelepiped after the internal elements are assembled in the case 102. In the present invention, the sound hole 102b for the rear sound is additionally formed in the case 102 at the position corresponding to the sound path, so that the rear sound is introduced.

The diaphragm 104 is composed of a polar ring 104a for electrical connection with the case 102 and a vibrating membrane 104b vibrated by sound pressure, and the back plate 110 is fused with an organic film on a metal plate. The electret is formed in the organic film.

9 is a side cross-sectional view of the assembly of the first embodiment shown in FIG.

9, the condenser microphone 100 'of the first embodiment includes a diaphragm 104a, 104b, a spacer 106, an insulation ring 108, a back plate, which are circular in a rectangular cylindrical case 102. As shown in FIG. 110, the acoustic resistor 111, and the conductive ring 112 are disposed, and then closed with a rectangular plate-shaped PCB 114 to assemble the end of the case 102.

In addition, the exposed surface of the PCB 114 is formed such that the protruding terminal 116 protrudes from the curing surface of the case 102 so that the microphone 100 'may be attached to the main PCB, for example, the PCB of the mobile phone by SMD method. The protruding terminal 116 may be a terminal for connecting Vdd and a ground terminal, and terminals required according to additional functions.

The operation of the unidirectional condenser microphone of the first embodiment is as follows.

The protruding terminal 116 of the unidirectional condenser microphone according to the present invention is connected to the connection terminal of the main PCB so that Vdd and GND power are applied. Accordingly, in the unidirectional condenser microphone 100 'according to the present invention, the vibrating membrane 104b is electrically connected to the PCB 114 via the case 102 and the polar ring 104a, and the back plate 110 is an acoustic resistor. Electrically connected to the PCB 114 through the 111 and the conductive ring 112.

In such a state, the front sound from the external sound source is introduced into the microphone through the front sound hole 102a of the case and transmitted to the vibrating membrane 104b, and the rear sound is the rear sound hole 102b and the sound passage P1 of the case. After being introduced into the back chamber 120 through P2, the sound is introduced into the back chamber 120 from the sound hole 114a of the PCB, and the sound introduced into the back chamber 120 is attenuated or phase-delayed in the acoustic resistor 111. After passing through the sound hole (110a) of the back plate 110 is transmitted to the vibration membrane (104b). At this time, the rear sound is attenuated by the acoustic resistor 111 so that the vibration membrane 104b reacts only with the front sound.

Therefore, the vibrating membrane 104b vibrates by the sound pressure of the front sound, and thus, the distance between the vibrating membrane 104b and the back plate 110 is changed. As a result, the vibrating membrane 104b and the back plate 110 are changed. The capacitance formed by this is changed to obtain a change in the electrical signal (voltage) according to the sound wave, which is transmitted to the IC mounted on the PCB 114 along the electrical connection line, amplified, and then protruded. It is output to an external circuit through 116.

Second Embodiment (unidirectional)

10 is an exploded perspective view of a second embodiment of a unidirectional condenser microphone according to the present invention.

Referring to FIG. 10, the unidirectional condenser microphone 200 ′ of the present invention has a rectangular cylindrical case in which one surface is opened and a sound hole 202a for introducing front sound and a sound hole 202b for rear sound are formed on the bottom surface. 202, a ring-shaped diaphragm 204 that can be inserted into a rectangular cylindrical case 202, a ring-shaped thin spacer 206, and an annular shield ring 208 for insulating the back plate 210. In the inner circumferential surface of the disk-shaped back plate 210, the acoustic resistor 211, and the cylindrical insulating body 212a having the upper and lower openings formed therebetween, the back plate 210 and the PCB 214 are electrically connected to each other. An integrated base 212 formed with a conductive layer 212b for providing a connection, a sound hole 214a for a rear sound is formed in a center portion, and components (IC, MLCC) are mounted on one surface thereof, and a protruding terminal 216 on the other surface thereof. Is composed of a rectangular plate-shaped PCB 214 is formed. Here, the diaphragm 204 is composed of a polar ring 204a for electrical connection with the case 202 and a vibrating membrane 204b vibrated by sound pressure, and the back plate 210 is fused with a metal plate on an organic film. And electrets are formed on the organic film. The integrated base 212 forms a hollow cylindrical insulating body 212a using a PCB technology as a PCB substrate, and then conducts a metal plating layer to have an outer diameter smaller than the outer diameter on both surfaces and the inner circumferential surface of the insulating body 212a. The layer 212b is formed. As described above, the integrated base 212 according to the present invention includes a first base having a conventional insulation function and a second base having a conductive function as one integrated base. At this time, the outer diameter of the metal plating layer should be smaller than the outer diameter of the insulating body so as not to be in electrical contact with the case. Here, the insulating body 212a may be implemented with an insulator printed substrate of glass epoxy, resin, or PVC.

In addition, although not shown in detail, the insulating body 212a serves as an insulating function, and a metal plating layer is formed on the inner side of one surface contacting the back plate 210 and the other surface contacting the PCB 214 in the insulating body 212a. After that, the upper and lower metal plating layers may be connected through through holes or via holes to provide conductive functions by allowing the metal plating layers on both sides to be conductive.

FIG. 7 is an assembly side cross section of the second embodiment shown in FIG. 6.

Referring to FIG. 7, the unidirectional condenser microphone 200 ′ of the second embodiment includes the diaphragms 204a and 204b, the spacer 206, the shield ring 208, and the back plate 210 in a rectangular cylindrical case 202. ), The acoustic resistor 211, the integrated base 212, and the rectangular plate-shaped PCB 214 are sequentially arranged and assembled into a structure in which the end of the case 202 is cured.

In addition, the exposed surface of the PCB 214 is formed with a protruding terminal 216 protruding from the curing surface of the case 202 so that the microphone 200 'may be attached to the main PCB, for example, a PCB of a mobile phone by SMD. The protruding terminal 216 may be a terminal for connecting Vdd and a ground terminal, and terminals required according to additional functions.

Looking at the operation of the unidirectional condenser microphone of the second embodiment as follows.

The protruding terminal 216 of the unidirectional condenser microphone according to the present invention is connected to the connection terminal of the main PCB so that Vdd and GND power are applied. Accordingly, in the condenser microphone 200 'according to the present invention, the vibrating membrane 204b is electrically connected to the PCB 214 via the case 202 and the polar ring 204a, and the back plate 210 is integrated base ( The conductive layer 212b and the acoustic resistor 211 of 212 are electrically connected to the PCB 214.

In such a state, the front sound from the external sound source is introduced into the microphone through the front sound hole 202a of the case and transmitted to the vibrating membrane 204b, and the rear sound is formed from the rear sound hole 202b formed in the case 202. In addition to the back chamber 120 through the acoustic paths (P1, P2) and also into the back chamber 120 through the sound hole 214a of the PCB, the sound introduced into the back chamber 120 is the acoustic resistor 211 After being attenuated or phase delayed from the sound plate 210a of the back plate 210 is transmitted to the vibrating membrane 204b. At this time, the rear sound is attenuated by the acoustic resistor 211 so that the vibration membrane 204b reacts only with the front sound.

Therefore, the vibrating membrane 204b vibrates by the sound pressure of the front sound, and thus, the distance between the vibrating membrane 204b and the back plate 210 is changed. As a result, the vibrating membrane 204b and the back plate 210 are changed. The capacitance formed by this is changed to obtain a change in the electrical signal (voltage) according to the sound wave, which is transmitted to the IC mounted on the PCB 214 along the electrical connection line and amplified, and then the protruding terminal. It is output to an external circuit through 216.

As described above, the parallelepiped condenser microphone according to the present invention can provide good static characteristics even in a complicated mechanical environment through an acoustic path formed between a rectangular case and a circular internal element, and in particular, sound holes are also provided on a PCB. Can be formed to have more improved directivity

In addition, the condenser microphone of the present invention can easily fit the connection terminal by checking the direction of the component in the surface mount (SMD) process, so the connection surface of the connection terminal of the connection terminal of the main PCB and the connection terminal of the condenser microphone is distorted or the direction (polarity) is There is an effect to reduce the changing connection failure.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand that you can.

1 is a schematic diagram showing a conventional general directional condenser microphone;

2 is a perspective view of a parallelepiped directional condenser microphone according to the present invention;

3 is an exploded perspective view of a first embodiment of a bidirectional condenser microphone according to the present invention;

4 is a detailed view of the PCB shown in FIG.

5 is a side cross-sectional view of the assembly of the first embodiment shown in FIG.

6 is an exploded perspective view of a second embodiment of a bidirectional condenser microphone according to the present invention;

FIG. 7 is a side cross-sectional view of the assembly of the second embodiment shown in FIG. 6;

8 is an exploded perspective view of a first embodiment of a unidirectional condenser microphone according to the present invention;

9 is a side cross-sectional view of the assembly of the first embodiment shown in FIG. 8;

10 is an exploded perspective view of a second embodiment of a unidirectional condenser microphone according to the present invention;

11 is a side cross-sectional view of the assembly of the second embodiment shown in FIG.

* Explanation of symbols for main parts of the drawings

100,200: directional condenser microphone 102: case

102a: front sound hole 102b: rear sound hole

104: diaphragm 106: spacer

108: insulation ring 110: back plate

112: conductive ring 114: PCB

Claims (3)

A rectangular cylindrical case 102 having one surface open and a sound hole 102a for introducing front sounds and a sound hole 102b for introducing rear sounds; A ring-shaped diaphragm 104 that can be inserted into the case 102; Ring-shaped thin spacers 106; Cylindrical insulating ring 108, the upper and lower openings; A disk-shaped back plate 110 having a sound hole 110a formed therein; An annular conductive ring 112 for electrically connecting the back plate 110 to a circuit board (PCB) 114; And The sound hole 114a for the rear sound is formed in the center part, and components (IC, MLCC) are mounted on one surface, and the PCB 114 is formed of a square plate shape having a protruding terminal 116 formed on the other surface. The diaphragm 104, the spacer 106, the insulating ring 108, the back plate 110, the conductive ring 112, and the PCB 114 are sequentially disposed in the case, and the end of the case is cured to form a rectangular shape. A parallel hexahedral topographical condenser microphone, characterized in that a sound path for rear sound is formed between a case and a circular internal element. A rectangular cylindrical case 202 having one surface opened and a sound hole 422a for introducing front sounds and a sound hole 202b for introducing rear sounds; A ring diaphragm 204 that can be inserted into the case 202; Ring-shaped thin spacers 206; An annular shield ring 208 for insulating the backplate 210; A disk-shaped back plate 210 having a sound hole 210a formed therein; An integrated base 212 formed with a conductive layer 212b for providing an electrical connection between the back plate 210 and the PCB 214 on the inner circumferential surface of the cylindrical insulating body 212a having an upper and lower openings; And The sound hole 214a for the rear sound is formed at the center part, and components (IC, MLCC) are mounted on one surface, and the PCB 214 is formed in a square plate shape having a protruding terminal 216 formed on the other surface. The diaphragm, spacer, shield ring, back plate, integrated base, and PCB are sequentially arranged in the case, and the end of the case is cured to form an acoustic path for rear sound between the rectangular case and the circular inner element. A parallelepiped directional condenser microphone, characterized in that. The method of claim 1, wherein the condenser microphone A parallelepiped directional condenser microphone, further comprising an acoustic resistor for attenuating or delaying rear sounds on the rear surface of the back plate.