KR20050092837A - Method for patterning liquid crystal display device - Google Patents

Abstract

The present invention relates to a patterning method of a liquid crystal display device in which a patterning time is reduced by attaching, exposing and developing a DFR (Dry Film Resist) layer on an inline, wherein a material layer is deposited on an in-line. Mounting a substrate, laminating a Dry Film Resist (DFR) layer on the substrate through a lamination roller, emitting a light from the UV lamp and a UV lamp at an inner center in a predetermined region of the DFR layer Exposing using a light collecting unit that collects light onto a substrate, and an exposure roller including an open area and a surface surrounding the light collecting unit, developing the DFR layer, and developing the developed DFR. Patterning the material layer using the layer as a mask.

Description

Patterning method for liquid crystal display device {Method for Patterning Liquid Crystal Display Device}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to a patterning method of a liquid crystal display device in which a patterning time is reduced by laminating, exposing and developing a dry film resist (DFR) layer on an inline.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELD), and vacuum fluorescent (VFD) Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices.

Among them, LCD is the most widely used as the substitute for CRT (Cathode Ray Tube) for mobile image display device because of its excellent image quality, light weight, thinness, and low power consumption. In addition to the use of the present invention has been developed in various ways such as a television and a computer monitor for receiving and displaying broadcast signals.

In order to use such a liquid crystal display as a general screen display device in various parts, it is a matter of how high quality images such as high definition, high brightness and large area can be realized while maintaining the characteristics of light weight, thinness and low power consumption. Can be.

A general liquid crystal display device may be largely divided into a liquid crystal panel displaying an image and a driving unit for applying a driving signal to the liquid crystal panel, wherein the liquid crystal panel includes first and second glass substrates bonded to each other with a predetermined space; It consists of a liquid crystal layer injected between the said 1st, 2nd glass substrate.

Here, the first glass substrate (TFT array substrate) has a plurality of gate lines arranged in one direction at regular intervals, a plurality of data lines arranged at regular intervals in a direction perpendicular to the gate lines, A plurality of pixel electrodes formed in a matrix form in each pixel region defined by crossing a gate line and a data line, and a plurality of thin film transistors switched by signals of the gate line to transfer the signal of the data line to each pixel electrode. Is formed.

In the second glass substrate (color filter substrate), a black matrix layer for blocking light in portions other than the pixel region, an R, G, B color filter layer for expressing color colors, and a common image for implementing an image An electrode is formed.

The driving principle of the general liquid crystal display device uses the optical anisotropy and polarization property of the liquid crystal. Since the liquid crystal is thin and long in structure, the liquid crystal has directivity in the arrangement of molecules, and the direction of the arrangement of molecules can be controlled by artificially applying an electric field to the liquid crystal.

Therefore, when the molecular arrangement direction of the liquid crystal is arbitrarily adjusted, the molecular arrangement of the liquid crystal is changed, and light is refracted in the molecular arrangement direction of the liquid crystal by optical anisotropy, thereby representing image information.

Currently, an active matrix LCD, in which a thin film transistor and pixel electrodes connected to the thin film transistor are arranged in a matrix manner, is attracting the most attention due to its excellent resolution and ability to implement video.

Hereinafter, a wiring of a conventional liquid crystal display and a method of manufacturing the liquid crystal display will be described with reference to the accompanying drawings.

1 is an exploded perspective view showing a conventional liquid crystal display, and FIG. 2 is a structural cross-sectional view taken along line II ′ of FIG. 1.

As shown in FIGS. 1 and 2, a conventional liquid crystal display device includes a first substrate 1 and a second substrate 2, and a first substrate 1 and a second substrate 2 bonded to each other with a large space. It consists of the liquid crystal layer 3 injected in between.

More specifically, the first substrate 1 includes a plurality of gate lines 4 formed in one direction at regular intervals to define the pixel region P, and in a direction perpendicular to the gate lines 4. A plurality of data lines 5 formed at regular intervals are arranged. In addition, a pixel electrode 6 is formed in each pixel region P, and a thin film transistor T is formed at a portion where the gate line 4 and the data line 5 cross each other, so that the thin film transistor is formed. The data signal of the data line is applied to each pixel electrode according to the signal of the gate line.

In addition, a black matrix layer 7 is formed on the second substrate 2 to block light in portions other than the pixel region P, and portions R corresponding to the respective pixel regions are formed to express colors. A, G, B color filter layer 8 is formed, and a common electrode 9 for realizing an image is formed on the color filter layer 8.

In the liquid crystal display as described above, the liquid crystal layer 3 formed between the first and second substrates 1 and 2 is aligned by an electric field between the pixel electrode 6 and the common electrode 9, and the liquid crystal is aligned. According to the degree of alignment of the layer 3, the amount of light passing through the liquid crystal layer 3 may be adjusted to express an image.

In more detail, a conventional liquid crystal display device is implanted between a first substrate 1 and a second substrate 2 bonded to each other with a predetermined space, and between the first substrate 1 and the second substrate 2. It consists of the liquid crystal layer 3 which became.

On the first substrate 1, a plurality of gate lines 4 (see FIG. 1) and data lines 5 (see FIG. 1) and a plurality of gate lines 4 and data lines that vertically intersect define a pixel area. Pixel electrodes 6 formed in each pixel region where (5) intersect, and a thin film transistor T formed in a portion where each of the gate lines 4 and the data lines 5 intersect.

The thin film transistor T includes a gate electrode 11a, a semiconductor layer 14 covering an upper portion of the gate electrode 11a with a predetermined width, and source / drain electrodes formed corresponding to both sides of the gate electrode 11a. (12a, 12b). Here, the semiconductor layer 14 is formed by stacking an amorphous silicon layer 14a and an n + layer 14b from which portions corresponding to the top and channel regions are removed.

Such a conventional liquid crystal display device comprises the following steps.

First, a metal material such as Mo, Al, or Cr is deposited on the first substrate 1 by sputtering, and then patterned through a first mask (not shown) to form a plurality of gate lines 4 and the gate lines. The gate electrode 11a is formed in the shape which protrudes from (4).

Subsequently, an insulating material such as SiNx is deposited on the first substrate 1 including the gate lines 4 to form a gate insulating layer 13.

Subsequently, the semiconductor layer 14 is formed on the gate insulating layer 13 to cover the gate electrode 11a. The semiconductor layer 14 may be formed by continuously depositing an amorphous silicon layer 14a and an n + layer 14b heavily doped with phosphorus (P) on the gate insulating layer 13, followed by a second mask ( It is formed by patterning the n + layer 14b and the amorphous silicon layer 14a at the same time.

Subsequently, a metal material such as Mo, Al, or Cr is deposited on the entire surface by a sputtering method, and then patterned by using a third mask (not shown), so that the source electrode 12a is disposed on both sides of the data line 5 and the gate electrode 11a. The drain electrode 12b is formed. In this case, the source electrode 12a is formed to protrude from the data line 5, and the drain electrode 12b is formed to be spaced apart from the predetermined interval. In this metal patterning process, over etching is performed to the n + layer 14b under the source electrode 12a and the drain electrode 12b, so that the n + layer 14b is over the gate electrode 11a. To be removed. Accordingly, the amorphous silicon layer is exposed on the gate electrode 11a, and the exposed portion is a region defined as a channel region of the thin film transistor T. Here, the semiconductor layer 14 is composed of the amorphous silicon layer 14a and the n + layer 14b.

Subsequently, the chemical vapor deposition (CVD) method is performed on the gate insulating layer 13 including the semiconductor layer 14 and the source electrode 12a, the drain electrode 12b, and the data line 12. A passivation film 15 of SiNx is deposited on the entire surface. As the material of the protective film 15, an inorganic material such as SiNx or an organic material having a low dielectric constant such as BCB (BenzoCycloButene), SOG (Spin On Glass) or Acryl is mainly used.

Subsequently, a portion of the passivation layer 15 on the drain electrode 12b is selectively etched through a fourth mask (not shown) to form a contact hole exposing a portion of the drain electrode 102b.

Subsequently, a transparent electrode material is sputtered and deposited to sufficiently fill the contact hole on the passivation layer 15, and then patterned through a fifth mask (not shown) to form the pixel electrode 6 in the pixel region.

On the second substrate 2 facing the first substrate 1, a black matrix layer 7 is formed to block light of portions (gate lines and data line regions, thin film transistor regions) except pixel regions. R, G, and B color filter layers 8 corresponding to the pixel areas are formed to express color colors, and are formed on the entire surface of the second substrate 2 including the black matrix layer 7 and the color filter layer 8. The common electrode 9 is formed.

Subsequently, first and second alignment layers 21 and 22 are formed on top surfaces of the first and second substrates 1 and 2 facing each other.

Thus, after completing the array process of each of the 1st board | substrate 1 and the 2nd board | substrate 2, the spacer 30 is spread | dispersed on one board | substrate of the 1st board | substrate 1 or the 2nd board | substrate 2, After printing or dispensing a seal pattern (not shown) around the active region of the other substrate except for the liquid crystal injection hole, the first and second substrates 1 and 2 are appropriately pressed and bonded. do.

Subsequently, the bonded first and second substrates 1 and 2 are cut in panel units.

Next, a liquid crystal is injected through the liquid crystal injection hole to form a liquid crystal panel.

Subsequently, the liquid crystal panel, the driver, and the backlight unit are combined to complete a liquid crystal display.

The wiring of the liquid crystal display device, that is, the gate line, the data line, and the like may be deposited in the form of a single wiring as follows, but as described below, it is deposited in a form having a barrier metal film at the bottom to obtain an effect of improving resistance with the contact surface. .

3A to 3D are process perspective views illustrating a patterning method of a conventional liquid crystal display.

As shown in FIG. 3A, a conventional method of patterning a liquid crystal display device first deposits a material layer 45 to be patterned on a substrate 40, and then spins the substrate 40 on the material layer 45. A liquid photoresist (PR) 46 is applied.

Here, in the application process of the photosensitive film 46, after mounting the substrate 40 to a spin chuck (not shown), by dispensing the photosensitive film material in a state in which the substrate 40 is rotated or stopped, The spin chuck is rotated at a high speed to apply the photosensitive film 46 on the material layer 45 to a uniform thickness.

As shown in FIG. 3B, after the substrate 40 is mounted below the exposure apparatus 50, the photosensitive film on the substrate 40 is formed by using a light source 52 and a mask 51 provided in the exposure apparatus 50. The pattern is exposed at 46a. The exposed pattern portion of the photosensitive film 46a causes a chemical reaction through the exposure. As such, since the exposed pattern is simply a chemical reaction of the material, it is difficult to visually identify the area, and the contrast between the exposed and unexposed areas becomes apparent only after completing the development process.

As illustrated in FIG. 3C, the substrate 40 is immersed in a bath 69 containing a developer, and the photosensitive film 46a is developed according to the exposed pattern to form the photosensitive film pattern 46b.

As shown in FIG. 3D, the exposed portion of the material layer 45 on the substrate 40 is selectively etched using the photoresist pattern 46b as a mask to form a pattern 45a of the deposition layer.

The etching process transfers the substrate 40 through the transfer apparatus 65, and sprays the etchant solution through the spray apparatus 70 to etch the material layer 45.

Subsequently, the substrate 40 having completed the etching process is immersed in a stripper solution to remove the remaining photoresist layer 46b. In this case, the solution strips only the photosensitive film 46b and uses a stripper of a component that does not damage the structure on the remaining substrate 40.

Next, the abnormality of the material layer pattern 45a remaining after the removal of the photosensitive film pattern 46b is inspected.

However, the above-described patterning method of the conventional liquid crystal display has the following problems.

First, during the patterning, the photoresist coating, exposure, and development processes are performed on separate lines, so that the process takes a long time.

Second, during exposure, the mask may be spaced apart or directly in contact with the photoresist film. When the photoresist film is in contact with the mask, an expensive mask may be contaminated with the liquid photoresist film.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and provides a patterning method of a liquid crystal display device in which a patterning time is shortened by laminating, exposing and developing a dry film resist (DFR) layer on an inline. The purpose is.

The patterning method of the liquid crystal display device of the present invention for achieving the above object comprises the steps of mounting a substrate on which a material layer is deposited on an in-line (D-R) through a roller on the substrate; Laminating the layer, a predetermined area of the DFR layer, a UV lamp in an inner center, a light condensing unit for collecting light emitted from the UV lamp onto a substrate, and an open area and surrounding the light condensing unit. Exposing using an exposure roller comprising a surface surrounding the film; developing the DFR layer; and patterning the material layer using the developed DFR layer as a mask. have.

In the DFR layer, a first protective film, a photosensitive film, and a second protective film are sequentially stacked.

When laminating the DFR layer to the substrate, the first protective film or the second protective film corresponding to the substrate is removed, and then the photosensitive film is in direct contact with the substrate.

Lamination of the DFR layer is achieved by heating the roller.

Exposure of the DFR layer is achieved by heating the substrate.

Predetermined regions of the DFR layer correspond to slits on the substrate to adjust their size.

An open area of the exposure roller corresponds to a predetermined area of the DFR layer.

Hereinafter, a patterning method of a liquid crystal display of the present invention will be described in detail with reference to the accompanying drawings.

4 is a cross-sectional view showing a DFR layer lamination of the liquid crystal display of the present invention, and FIG. 5 is a cross-sectional view showing a exposure after DFR film lamination.

In the method of patterning the liquid crystal display of the present invention, as shown in FIG. 4, the material layer 101 to be patterned is deposited on the substrate 100 and mounted on the in-line 110. Subsequently, the DFR layer 102 is laminated on the substrate 100 in one direction. Here, laminating means being flaked and attached onto a substrate.

The DFR layer 102 is a solid film layer, which is rolled in a state in which a protective film is coated on the upper and lower sides thereof, and is pushed by a lamination roller 130 in one direction, and is laminated on the substrate 100. Is attached. At this time, the DFR layer 102 laminated on the actual substrate 100 has a lower protective film (refer to FIG. 7, described in detail below), and the material layer 101 directly contacts the photosensitive film layer. Are formed to be adjacent to each other.

Here, when laminating the DFR layer 102, the lamination roller 130 is appropriately heated to improve adhesion of the material layer 101 on the DFR layer 102.

Subsequently, as shown in FIG. 5, the light condensing unit 141 and some open portions of the UV lamp 142 and the light emitted from the UV lamp 142 are concentrated on the DFR layer 102 positioned below. An exposure roller 140 consisting of a surface 143 having an area is prepared. In particular, the open area corresponds to a portion adjacent to the lower DFR layer 102.

The exposure roller 140 is positioned above the substrate 100, the substrate 100 corresponds to the open area of the exposure roller 140, and the substrate 100 corresponds to both sides of the open area of the exposure roller 140. ), A slit (or aperture) 150 is prepared, the size of the exposed area of the DFR layer 102 of the substrate 100 is adjusted, and the exposure is performed on the DFR layer 102. do. At this time, by heating the substrate 100 through the inline roller 110 under the substrate 100 at the same time as the exposure process, the stress is reduced, the curing time is shortened, and the adhesion with the lower film Increase

Subsequently, although not shown, the exposed DFR layer 102 is developed to remove the DFR layer 102 of the exposed portion when the DFR is positive, and when the DFR is negative. Pattern the DFR layer 102 leaving only the exposed portion.

Subsequently, the material layer 101 is etched using the patterned DFR layer 102 as a mask.

Subsequently, after etching the material layer 101, the remaining DFR layer 102 is removed with a stripper to complete the patterning process.

6 is a process cross-sectional view showing a patterning method of the present invention running on an in-line.

As illustrated in FIG. 6, in the patterning method of the liquid crystal display of the present invention, film lamination and exposure may be performed on the in-line 110 by changing only the roller for each process.

Although not shown in the drawing, the exposure may proceed in-line until the process of developing the DFR layer 102 after exposure. As such, if the film lamination (exposure of film), exposure and development are performed on one line without going through a separate line, the loading / unloading does not need to be repeated for each step. The time is shortened.

7 is a cross-sectional view showing a DFR layer of the present invention.

As shown in FIG. 7, the DFR film used in the present invention is a film in which protective films 111 and 113 are coated on upper and lower portions of the solid photosensitive film 112 and the solid photosensitive film 112. In fact, when the DFR layer 102 is laminated on the material layer 101, the protective film 113 of the lower portion of the DFR film is peeled off through a separate roller other than the lamination roller 130 that proceeds lamination. The surface of the photosensitive film 112 is removed to directly contact the upper portion of the material layer 101. Therefore, the DFR layer 102 formed on the material layer 101 is a double layer of the protective film 111 and the photosensitive film 112.

As described above, the lamination is performed after the protective film 113 under the photosensitive film 112 is removed. The protective film 113 may be formed after the exposure and development processes without removing the protective film 113. This is because the protective layer 113 remains below the patterned photosensitive film 112 and thus becomes a factor that interferes with the etching of the material layer 101.

Therefore, as a result, the protective film 111 is further coated on the material layer 101 on the photoresist film 112, so that a mask (not shown) is in direct contact with the protective film 111 to perform an exposure process. Even if it is, contamination of the mask (not shown) is prevented.

In some cases, the upper and lower portions of the photosensitive film 112 may be laminated on the material layer 101 with all of the protective layers 111 and 113 removed. In this case, contamination of a mask (not shown) during the exposure process may occur. In order to prevent the mask from the photosensitive film 112 is positioned a little spaced apart.

The patterning method of the liquid crystal display of the present invention as described above has the following effects.

First, lamination, exposure and development of the DFR can all be done on inline, thereby reducing the process time required for patterning.

Second, by using a DFR film having a protective film formed on the upper and lower photosensitive film as a photosensitive film, even if the exposure is made in contact with the mask, the protective film can prevent direct contact with the photosensitive film to prevent contamination of the mask.

1 is an exploded perspective view showing a general liquid crystal display device

2 is a structural cross-sectional view taken along line II ′ of FIG. 1.

3A to 3D are process perspective views showing a patterning method of a conventional liquid crystal display device.

4 is a cross-sectional view illustrating a method of laminating a DFR layer of a liquid crystal display of the present invention.

5 is a process sectional view showing an exposure method after lamination of a DFR film.

6 is a process sectional view showing a patterning method of the present invention running on an in-line

7 is a cross-sectional view showing a DFR layer of the present invention.

* Description of the symbols showing the main parts of the drawings

100 substrate 101 material layer

102: DFR layer 110: inline

111: first protective layer 112: film layer

113: second protective layer 120: conveyor belt (Conveyer Belt)

130: lamination roller 140: exposure roller

141: light collecting unit 142: UV lamp

150: slit

Claims (7)

Mounting a substrate on which an material layer is deposited on an in-line; Laminating a dry film resist (DFR) layer on the substrate through a lamination roller; An exposure roller comprising a UV lamp in an inner center of the DFR layer, a light collecting unit for collecting light emitted from the UV lamp onto a substrate, and an open area and a surface surrounding the light collecting unit; Exposing using; Developing the DFR layer; And And patterning the material layer by using the developed DFR layer as a mask. The method of claim 1, The DFR layer is a patterning method of a liquid crystal display device, characterized in that the first protective film, the photosensitive film, the second protective film is laminated in this order. The method of claim 2, And when the DFR layer is laminated on the substrate, after removing the first protective film or the second protective film corresponding to the substrate, the photosensitive film is in direct contact with the substrate. The method of claim 1, And the lamination of the DFR layer is performed by heating the lamination roller. The method of claim 1, And the exposure of the DFR layer is performed by heating the substrate. The method of claim 1, The predetermined area of the DFR layer is a patterning method of the liquid crystal display device, characterized in that for controlling the size of the slit corresponding to the substrate. The method of claim 1, And an open area of the exposure roller corresponds to a predetermined area of the DFR layer.