KR20050081170A - Appearance selection device of chip type electronic component - Google Patents

Abstract

An object of the present invention is to provide an appearance sorting device for a chip-type electronic component provided with a lighting device having a small installation space and a simple structure.

According to the configuration of the present invention, the lighting device 9 is composed of a light guide 31, a diffusion plate 32 as a light diffusion means, a ring-shaped light guide member 33, an optical fiber 34 and a light source 35 have. The light guide member 31 integrated with the diffusion plate 32 has a substantially conical hollow structure, has a ring-shaped entrance port 31a and a ring-shaped exit port 32b, and is also an imaging camera. It consists of the fixing part joined to 15 and the ring-shaped optical guide member 33, and the aperture part which collects (condenses) the light beam which permeate | transmits. The aperture of the light guide 31 is composed of a first aperture and a second aperture having different inclination angles of the outer circumferential surface, and the boundary positions of the first aperture and the second aperture are the diffusion plate 32 and the light guide 31. Coincides with the position of the joining surface. The first aperture of the light guide 31 is designed to have an inclined outer circumferential surface of 22.5 ° or less with respect to the central axis C of the light guide 31.

Description

Appearance selection device of chip type electronic component

The present invention relates to an appearance sorting apparatus for a chip type electronic component.

As a lighting apparatus of the external appearance sorting apparatus of a chip type electronic component, the lighting apparatus of patent document 1 is known, for example. As shown in FIG. 13, this illumination apparatus 101 uses the ring-shaped light beam L radiated | emitted from the ring-shaped light source 105, and the incidence surface 103a of the outer periphery, and the exit surface 103b of the inner periphery. The hollow body 103 is guided to the incident surface 103a of the hollow body (light diffusing means) having it, and the hollow body 103 is transmitted. The hollow body 103 is on the central axis C of the hollow body 103. The light beam L is irradiated from the top to the chip-shaped electronic component 110 placed below the.

The ring light source 105 is formed by uniformly arranging optical fiber bundles in a ring shape. When the other end of this optical fiber is irradiated with a light source such as a light bulb, the ring-shaped light beam L is emitted. The hollow body 103 is made of translucent milky white resin or glass subjected to light diffusion treatment, and is a so-called rotational symmetrical body. Although not shown, an imaging camera is attached to the upper portion of the hollow body 103. The reflecting means 106 is cylindrical and has a cylindrical inner surface 106a that surrounds the hollow body 103, and the inner surface 106a is mirror-polished.

By the way, since the illumination device 101 irradiates the light beam L from the surroundings so as to surround the chip-shaped electronic component 110 which is an object to be irradiated, the hollow body 103 is approached and disposed in the vicinity of the chip-shaped electronic component 110. There is a need. For this reason, when this illuminating device 101 is incorporated and used in the exterior sorting device of the chip type electronic component 110, it is necessary to ensure a large installation space of the lighting device 101 in the exterior sorting device main body.

However, as miniaturization of chip-type electronic components has progressed in recent years, the demand for miniaturization of the appearance sorting device has also increased, and it has become difficult to cope with the conventional lighting device 101.

[Patent Document 1] Japanese Patent Publication No. 2003-107006

It is therefore an object of the present invention to provide an appearance sorting device for a chip type electronic component having a lighting device having a small installation space and a simple structure.

In order to achieve the above object, the external appearance sorting device for a chip type electronic component according to the present invention is an external appearance sorting device for a chip type electronic component including a lighting device and an imaging camera, wherein the lighting device is a light source and a light beam radiated from the light source. And a light guiding member which transmits the incident light by transmitting light and transmits the light, and light diffusing means integrally formed on the exit surface of the light guiding body. As the light diffusion means, a diffusion plate, a color filter, a deflection filter, an ultraviolet filter, or the like is used.

By the above structure, the light beam radiated | emitted from a light source enters a light guide body, and then transmits and guides a light guide body, and it exits as a diffused light from light-diffusion means.

In addition, the light guide body in which the light diffusing means is integrally formed has an aperture portion for collecting the light to transmit and guide, so that the light guide member becomes thinner toward the end, thereby reducing the installation space of the lighting apparatus. At this time, the diaphragm is designed to have an inclined outer circumferential surface of 22.5 degrees or less with respect to the central axis of the light guide, so that the light beams efficiently pass through the light guide.

In addition, by mirror-mirring the inlet, the outlet, and the outer circumferential surface of the light guide body in which the light diffusion means are integrally formed, the light loss when the light passes through the light guide and the light diffusion means is reduced. Further, by arranging the light guide member between the light source and the light guide body, the light loss between the light source and the light guide body is reduced.

The appearance sorting apparatus of the chip-type electronic component according to the present invention further determines whether the chip-type electronic component is judged based on the conveying member for conveying the chip-shaped electronic component to a position that can be picked up by the imaging camera and the image picked up by the pick-up camera. It is characterized by including a pass / fail determination unit that performs the above operation.

The conveying member includes a substantially disk-shaped main body, a V-shaped groove formed at a circumferential edge of the main body and capable of contacting two surfaces of a chip-shaped electronic component having a substantially rectangular parallelepiped shape, and suction connected to the V-shaped groove. A route may be provided. Alternatively, in the conveying member, the peripheral edge of the main body is bent downward, and the light diffusing means of the imaging camera and the illuminating device are integrally positioned at the position below the conveying member and overlapping with the conveying member in plan view. You may arrange | position the formed light guide body. In addition, the conveying member has a conveying surface formed with a V-shaped groove in which two surfaces of a chip-shaped electronic component having an external shape substantially rectangular parallelepiped can be contacted, and sliding the chip-shaped electronic component along the V-shaped groove. It may be conveyed.

In addition, the chip-shaped electronic component has a substantially rectangular parallelepiped shape, and the light diffusing means of the imaging camera and the lighting apparatus at a position capable of simultaneously imaging at least two surfaces among four surfaces other than the two surfaces supported by the V-shaped grooves. This integrally formed light guide may be disposed.

Embodiment of the Invention

EMBODIMENT OF THE INVENTION Below, the Example of the external appearance sorting apparatus of the chip type electronic component which concerns on this invention is described with reference to attached drawing.

(First Embodiment, Figs. 1 to 7)

As shown in FIG. 1, the external appearance sorting apparatus 1 is a disk-shaped adsorption conveying drum 2 which conveys roughly the chip-shaped electronic component 40 in a suspended state, and the hopper arrange | positioned in this adsorbing conveyance drum 2 vicinity. 3), a parallel feeder 4, lighting devices 5 to 10, imaging cameras 11 to 16, and trays 21 to 23;

The plurality of chip-shaped electronic components 40 put into the hopper 3 sequentially fall to one end side of the conveying surface of the parallel feeder 4, and then the vibration-free part 4a on the other end side due to the vibration of the parallel feeder 4. Is sent). The chip-shaped electronic component 40 of the vibration-free part 4a is appropriately provided from the suction path 2b in the V-shaped accommodating recess 2a formed at predetermined intervals on the lower surface of the outer peripheral part of the disc-shaped adsorption conveying drum 2. It is supported one by one by vacuum adsorption. The adsorption conveyance drum 2 which supported the chip-shaped electronic component 40 in the suspended state is rotationally driven in the arrow K direction.

When the chip-shaped electronic component 40 is waiting on the vibration-free part 4a, the upper surface and one side surface are imaged by the imaging cameras 11 and 12, and the external appearance inspection of these two surfaces is performed. Then, the chip-shaped electronic component 40 is vacuum-adsorbed to the adsorption conveying drum 2 so that the two surfaces which have already been visually inspected come into contact with the inner wall surface of the accommodating recess 2a of the cross section V shape (shown in FIG. 2). The chip-shaped electronic component 40 is set so that the longitudinal direction thereof may become parallel to the radial direction of the adsorption conveying drum 2. In addition, while the chip-shaped electronic component 40 is being conveyed by the adsorption conveyance drum 2, the lower surface and the other side surface which are exposed from the adsorption conveyance drum 2 are imaged with the imaging cameras 13 and 14, and are photographed. While the external inspection of these two surfaces is performed, both end surfaces exposed from the adsorption conveying drum 2 are imaged by the imaging cameras 15 and 16, and the external inspection of both end surfaces is performed.

Thereafter, the chip-shaped electronic component 40 judged to be defective in appearance is discharged to the defective product tray 21, and the chip-shaped electronic component 40 determined to be retested is discharged to the retest tray 22, and the appearance is good. The chip-shaped electronic component 40 determined to be is discharged to the non-defective tray 23.

By the way, regarding the chip type electronic component 40, as shown in FIG. 2, the external electrode 41 was formed in the both ends of the chip | tip which form a rectangular parallelepiped, In this specification, when 40a is made into the upper surface and 40b, 40c is called a side and 40d is called a cross section.

Here, the illuminating devices 9 and 10 which irradiate the cross section of the chip-shaped electronic component 40 in the illuminating devices 5-10 are the light guide 31 and the diffuser plate which are light-diffusion means, as shown in FIG. It consists of 32, the ring-shaped optical guide member 33, the optical fiber 34, and the light source 35. As shown in FIG. The lighting apparatuses 5-8 may be well-known lighting apparatuses, and may be the same as the lighting apparatuses 9 and 10.

As shown in FIG. 3, the light guide 31 has an entrance face 31a on one end face and an exit face 31b on the other end face, and is made of a transparent acrylic material or the like. The diffusion plate 32 is attached to the emission surface 31b, and the light guide 31 and the diffusion plate 32 are integrated. The diffusion plate 32 is made of a milky white resin, glass subjected to light diffusion treatment, or the like. The light guide 31 integrated with the diffuser plate 32 has an outer surface including an entrance hole (incident surface 31a of the light guide 31) and an exit hole (emission surface 32b of the diffusion plate 32). This mirror surface treatment is carried out. Thereby, the light loss at the time of the light ray passing through the light guide 31 can be suppressed.

The light guide member 31 integrated with the diffusion plate 32 is a so-called rotationally symmetrical body, has a substantially conical hollow structure, and has a ring-shaped entrance port 31a and a ring-shaped exit port 32b. It consists of a fixed part joined with the imaging camera 15 and the ring-shaped optical guide member 33, and an aperture part which collects (condenses) the transmitted light. The aperture of the light guide 31 is composed of a first aperture and a second aperture having different inclination angles of the outer circumferential surface, and the boundary positions of the first aperture and the second aperture are the diffusion plate 32 and the light guide 31. Coincides with the position of the joining surface. The first stop of the light guide 31 is designed to have an inclined outer circumferential surface of 22.5 ° or less (preferably 10 ° to 17.5 °) with respect to the central axis C of the light guide 31. As a result, the light beams effectively pass through the light guide 31. Light rays symmetrical with respect to the central axis C are radiated from the ring-shaped exit port 32b to uniformly irradiate the chip electronic component 40.

The light guide member 31 has an aperture part for collecting light rays passing through, and thus becomes thinner toward the end, thereby making it possible to reduce the installation space of the lighting device 9. On the other hand, in the case of the first embodiment, the shape of the inner circumferential surface of the light guide 31 has a circular cross section, but the shape is not particularly limited.

The imaging camera 15 is composed of a CCD camera body 37 and a camera lens barrel 38. The end of the camera lens barrel 38 is fitted to the fixing portion of the light guide 31. The imaging camera 15 is disposed on the center axis C of the light guide 31, and similarly the chip type electrons conveyed by the adsorption transport drum 2 on the center axis C of the light guide 31. Inspect the part 40 externally.

The ring-shaped optical guide member 33 is connected to the optical fiber 34 at the incidence side and is connected to the fixing portion of the light guide 31. The ring-shaped light guide member 33 emits light rays from the light source 35 that have passed through the optical fiber 34 as ring-shaped light rays. This leads to less light loss between the light source 35 and the light guide 31.

The light guide 31 and the ring-shaped optical guide member 33 integrated with the imaging camera 15 and the diffuser plate 32 of the illuminating device 9 are located below the adsorption conveying drum 2 and are planar. It is arrange | positioned at the position which overlaps with the said adsorption conveyance drum 2 in view.

In the illuminating device 9 having the above configuration, the light rays emitted from the light source 35 are guided to the light guide 31 through the optical fiber 34 and the ring-shaped optical guide member 33. Light rays incident from the incident surface 31a of the light guide 31 are collected by the aperture of the light guide 31 and guided to the exit surface 31b, and are diffused by the diffusion plate 32. With this diffused light, the adsorption conveying drum 2 is similarly irradiated while uniformly irradiating the end face (the entire inspection surface) of the chip-shaped electronic component 40 conveyed by the adsorption conveying drum 2 from the inside of the adsorption conveying drum 2. The cross section of the chip-shaped electronic component 40 is picked up by the imaging camera 15 arranged inside, and the appearance inspection is performed. Since the diffuser plate 32 is formed in the light guide 31, it is possible to irradiate the chip-shaped electronic component 40 with light rays from the circumferential direction. It becomes possible to irradiate light rays.

In addition, the light guide 31 has a diaphragm which collects the light to transmit and guide, and thus becomes thinner toward the end, thereby reducing the installation space of the lighting apparatus. At this time, the diaphragm of the light guide 31 is designed to have an inclined surface of 22.5 degrees or less with respect to the central axis C of the light guide 31, so that the light beams efficiently penetrate the inside of the light guide 31.

In particular, the second aperture is formed to have an inclination larger than that of the first aperture with respect to the central axis C of the light guide 31, thereby reflecting the incident light rays by the second aperture, thereby forming the chip type electronic component 40. ), More light can be irradiated with a shallower angle of incidence. As a result, even if the R surface is formed in the ridge portion of the chip-shaped electronic component 40, a clear image is obtained, so that the inspection of the ridge portion can be performed with higher accuracy. Since the ridge portion of the normal chip type electronic component 40 has an R surface, the ridge portion image is less likely to be clear. The diffusion plate 32 is intended to generate light having a small incident angle to the chip-shaped electronic component 40 by diffusing the incident light from the light source 35. The second aperture has the same purpose, and the diffusion plate is the same. A synergistic effect is obtained by using together with (32).

In addition, since the light guide 31 is small, the appearance sorting apparatus 1 is the lower side (back) of the adsorption conveying drum 2 which was too large to arrange | position in the conventional illuminating apparatus 101 shown in FIG. In this space, the imaging camera 15 and the light guide 31 of the lighting apparatus can be disposed. Therefore, the cross section of the chip-shaped electronic component 40 conveyed in the state suspended by the adsorption conveyance drum 2 can be inspected from the inside of the adsorption conveyance drum 2, and the external appearance sorting apparatus 1 can be miniaturized. Become.

In addition, the light guide 31 integrated with the diffusion plate 32 can be modified in various ways according to the specification. For example, as shown in FIG. 4, in the state where the end surface of the fixing part of the light guide body 31 and the end surface of the camera lens barrel 38 of the imaging camera 15 are abutted inside the optical guide member 33. As shown in FIG. The structure to join may be sufficient. In addition, as shown in FIG. 5, the aperture part of the light guide 31 may not be divided into a 1st aperture part and a 2nd aperture part. Or, as shown in FIG. 6, the boundary position of the 1st aperture part and the 2nd aperture part of the light guide 31 moves from the position of the joint surface of the light guide 31 and the diffuser plate 32 to the diffuser plate 32 side. As shown in FIG. 7, the boundary positions of the first and second apertures of the light guide 31 are set from the position of the joint surface of the light guide 31 and the diffusion plate 32. It may be off to the side.

(2nd Example, FIG. 8)

As shown in FIG. 8, the external appearance sorting apparatus 50 of the chip type electronic component which is 2nd Example uses the triangular prism 51 as a light guide. The triangular prism 51 has an entrance face 51a and an exit face 51b and is made of a transparent acrylic material or the like. The diffusion plate 52 is attached to the exit surface 51b, and the triangular prism 51 and the diffusion plate 52 are integrated. The triangular prism 51 integrated with the diffusion plate 52 has an outer surface including an entrance hole (incident surface 51a of the triangular prism 51) and an exit hole (output surface 52b of the diffusion plate 52). This mirror surface treatment is carried out.

The light beam L emitted from the light source 35 is led to the triangular prism 51 through an optical fiber or the like not shown. The light beam L incident from the incident surface 51a of the triangular prism 51 totally reflects on the quadrilateral surface 51c of the triangular prism 51. This is because when the triangular prism 51 is an acrylic material, when light rays travel from the acrylic material into the air, the total reflection is performed when the incident angle becomes 42 ° 10 'or more. The light beam L totally reflected from the quadrilateral surface 51c is guided to the emission surface 51b and becomes the diffused light L by the diffusion plate 52. With this diffused light L, while imaging the chip-shaped electronic component 40 conveyed by the conveyance belt 55 obliquely from the upper side, with the imaging camera 15 arrange | positioned above the chip-shaped electronic component 40 The chip type electronic component 40 is imaged and visual inspection is performed.

The appearance sorting device 50 having the above-described configuration has the same effect as the appearance sorting device 1 of the first embodiment, and changes the direction of the light beam L inside the triangular prism 51 that is the light guide. As a result, the degree of freedom in designing the lighting device is increased.

(Third Embodiment, Fig. 9)

As shown in FIG. 9, the external appearance sorting apparatus 60 of the chip type electronic component which is 3rd Example uses the curved light guide 61. As shown in FIG. The curved light guide 61 has an entrance face 61a and an exit face 61b and is made of a transparent acrylic material or the like. The diffusion plate 62 is attached to the emission surface 61b, and the curved light guide 61 and the diffusion plate 62 are integrated. The curved light guide 61 integrated with the diffuser plate 62 includes an entrance hole (incident surface 61a of the curved light guide 61) and an exit port (output surface 62b of the diffusion plate 62). The outer surface is mirrored.

The light beam L emitted from the light source 35 is led to the curved light guide 61 through an optical fiber or the like not shown. The light beam L incident from the incident surface 61a of the curved light guide 61 is guided to the exit surface 61b by repeating total reflection on the inner wall surface of the curved light guide 61, and is diffused by the diffusion plate 62. It becomes diffused light L. FIG. With this diffused light L, while imaging the chip-shaped electronic component 40 conveyed by the conveyance belt 55 obliquely from the upper side, with the imaging camera 15 arrange | positioned above the chip-shaped electronic component 40 The chip type electronic component 40 is imaged and visual inspection is performed.

The appearance sorting device 60 having the above configuration has the same effect as the appearance sorting device 1 of the first embodiment, and can change the direction of the light beam L inside the curved light guide 61. As a result, the degree of freedom in designing the lighting device is increased.

(4th Example, FIG. 10)

As shown in FIG. 10, the appearance sorting apparatus 70 of the chip type electronic component which is 4th Example uses the J-shaped (or U-shaped) light guide 71. As shown in FIG. The J-shaped light guide 71 has an entrance face 71a and an exit face 71b and is made of a transparent acrylic material. A diffusion plate 72 is attached to the emission surface 71b, and the J-shaped light guide 71 and the diffusion plate 72 are integrated. The J-shaped light guide 71 integrated with the diffusion plate 72 has an entrance hole (incident surface 71a of the J-shaped light guide 71) and an exit hole (emission surface 72b of the diffusion plate 72). The outer surface it contains is mirror-processed.

The light beam L emitted from the light source 35 is led to a J-shaped light guide 71 through an optical fiber or the like not shown. The light beam L incident from the incidence surface 71a of the J-shaped light guide 71 is totally reflected from the quadrilateral surfaces 71c and 71d of the J-shaped light guide 71 and guided to the exit surface 71b, and is diffused. 72 becomes diffused light L. As shown in FIG. The chip type which has been conveyed by this diffused light L in the state supported by the vacuum suction from the suction path 2d to the accommodation recessed part (V-shaped groove | channel) 2c formed in the outer peripheral edge of 2 A of adsorption conveyance drums 2A. The electronic component 40 is irradiated in a direction opposite to the direction of the light source 35, while the chip type electronic component 40 is imaged by the imaging camera 15 disposed on the side opposite to the light source 35 to inspect the appearance. Run

The appearance sorting device 70 having the above configuration has the same effect as the appearance sorting device 1 of the first embodiment, and changes the direction of the light beam L inside the J-shaped light guide 71. As a result, the degree of freedom in designing the lighting device is increased.

(Fifth Embodiment, Fig. 11)

As shown in FIG. 11, the chip | tip sorting apparatus 80 of the chip | tip electronic component which is 5th Example arrange | positions two imaging cameras 15A and 15B in one imaging station by 90 degree angular space, and a chip | tip electronic component Two surfaces of 40 are simultaneously imaged. In FIG. 11, the same code | symbol as FIG. 2 represents the same member, and the overlapping description is abbreviate | omitted.

In this appearance sorting apparatus 80, the chip-shaped electronic component 40 conveys the V-shaped groove 82 formed on the conveyance member 81 in the direction of arrow M by a sliding conveyance by a suction force, and the imaging camera The lower surface thereof is imaged by 15A, and the side surface thereof is imaged by the imaging camera 15B.

In the fifth embodiment, since the distal end portion of the illumination device 9 becomes thinner toward the end, two imaging cameras 15A and 15B are arranged in one imaging station without causing spatial interference. .

(Sixth Embodiment, Fig. 12)

As shown in FIG. 12, the appearance sorting apparatus 90 of the chip type electronic component which is 6th Example arrange | positions four imaging cameras 15A-15D in one imaging station. The imaging cameras 15A and 15B are arranged at angular intervals of 90 degrees as in the fifth embodiment, and image the bottom and side surfaces of the chip-shaped electronic component 40. The imaging cameras 15C and 15D are arranged to face each other in the horizontal direction, and image both end surfaces of the chip electronic component 40.

In this appearance sorting device 90, the chip-shaped electronic component 40 is vacuum suctioned from the suction path 2f to a receiving recess (V-shaped groove) 2e formed at the outer circumferential edge of the adsorption conveying drum 2B. It conveys in the state supported by and reaches an imaging station.

In the sixth embodiment, since the distal end portion of the lighting device 9 becomes thinner toward the end, four imaging cameras 15A to 15D are arranged in one imaging station without causing spatial interference. .

(Other embodiment)

In addition, this invention is not limited to the said Example, It can change variously within the range of the summary. As the light diffusion means, in addition to the diffusion plate, a color filter, a deflection filter, an ultraviolet filter, or the like may be used. Thereby, the characteristic of illumination light can be changed, without changing a light source. Alternatively, instead of combining the light source 35 and the ring-shaped light guide member 33, a ring-shaped light source may be used.

According to the present invention, the light beam from the light source transmits and guides the light guide body and exits from the light diffusing means as diffused light. And this diffused light can irradiate the whole test surface of the chip-type electronic component which is an irradiated object uniformly. In addition, the light guide body integrated with the light diffusing means has a diaphragm that collects the light to transmit and guide, thereby becoming thinner toward the end, thereby making it possible to reduce the installation space of the lighting apparatus. As a result, an appearance sorting device for chip type electronic parts having a lighting device having a small installation space and a simple structure can be obtained. In addition, the light guides of the plurality of imaging cameras and the lighting apparatus can be arranged at one imaging position, and imaging of the plural surfaces of the chip-shaped electronic component can be performed at the same time to determine the appearance or not.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows schematic structure of 1st Example of the external appearance sorting apparatus of the chip type electronic component which concerns on this invention.

FIG. 2 is a partial sectional view showing the lighting apparatus and the imaging camera shown in FIG. 1.

3 is a cross-sectional view of the light guide body in which the light diffusing means shown in FIG. 2 is integrally formed.

4 is a cross-sectional view showing a modification of the light guide body in which the light diffusing means shown in FIG. 2 is integrally formed.

FIG. 5 is a cross-sectional view showing another modification of the light guide body in which the light diffusing means shown in FIG. 2 is integrally formed.

6 is a cross-sectional view showing still another modification of the light guide body in which the light diffusing means shown in FIG. 2 is integrally formed.

FIG. 7 is a cross-sectional view showing still another modification of the light guide body in which the light diffusing means shown in FIG. 2 is integrally formed.

Fig. 8 is a schematic block diagram showing a second embodiment of the appearance sorting apparatus for chip type electronic parts according to the present invention.

Fig. 9 is a schematic configuration diagram showing a third embodiment of the appearance sorting apparatus for chip-type electronic components according to the present invention.

Fig. 10 is a schematic block diagram showing a fourth embodiment of the appearance sorting apparatus for chip type electronic components according to the present invention.

Fig. 11 is a schematic configuration diagram showing a fifth embodiment of the appearance sorting apparatus for chip-type electronic components according to the present invention.

12 is a schematic configuration diagram showing a sixth embodiment of an appearance sorting apparatus for chip type electronic components according to the present invention.

It is sectional drawing which shows the lighting apparatus of a prior art example.

<Brief description of the main parts of the drawing>

1, 50, 60, 70, 80, 90: appearance sorting device

2, 2A, 2B: adsorption conveying drum

2a, 2c, 2e: accommodation recess (V-shaped groove)

2b, 2d, 2f: suction path

5 to 10 Illumination apparatus 11 to 16 camera for imaging

31: light guide 31a: incident surface

32: diffuser plate 32b: exit surface

33 ring-shaped light guide member 35 light source

51: triangular prism (light guide) 52, 62, 72: diffuser plate

61: curved light guide 71: J-shaped light guide

81: conveying member 82: V-shaped groove

Claims (14)

Appearance sorting device for a chip-type electronic component having a lighting device and an imaging camera, The illuminating device injects a light source, a light guide body through which the light beam emitted from the light source is incident, and transmits and guides the incident light beam, and a light diffusion integrally formed on an exit surface of the light guide body. Apparatus for sorting appearance of chip type electronic parts, comprising means. The exterior sorting device for a chip electronic component according to claim 1, wherein the light diffusion means comprises at least one of a diffusion plate, a color filter, a deflection filter, and an ultraviolet filter. The external appearance of a chip-type electronic component according to claim 1 or 2, wherein the light guide body integrally formed with the light diffusing means has a ring-shaped entrance hole, a ring-shaped exit port, and an aperture portion for collecting light transmitted through the light. Screening device. 4. The device of claim 3, wherein the diaphragm of the light guide body in which the light diffusing means is formed integrally comprises a first diaphragm and a second diaphragm. The device of claim 3, wherein the diaphragm of the light guide body integrally formed with the light diffusing means has an inclined outer circumferential surface of 22.5 degrees or less with respect to the central axis of the light guide body. 5. An appearance sorting apparatus according to claim 4, wherein the first aperture portion of the light guide body integrally formed with the light diffusion means has an inclined outer circumferential surface of 22.5 degrees or less with respect to the central axis of the light guide body. 5. The chip type electron according to claim 4, wherein the boundary positions of the first and second aperture portions of the light guide body in which the light diffusion means are integrally formed coincide with the junction positions of the diffusion means and the light guide body. Appearance sorting device for parts. The exterior sorting device for a chip type electronic component according to claim 1, wherein an entrance port, an exit port, and an outer circumferential surface of the light guide body in which the light diffusion means are integrally formed are mirror-treated. 2. An appearance sorting apparatus according to claim 1, wherein an optical guide member is arranged between the light source and the light guide to inject light rays from the light source and emit light rays in a ring shape. The conveyance member of Claim 1 which conveys a chip-shaped electronic component to the position which can be imaged with the said imaging camera, An appearance sorting device for a chip type electronic part, comprising: a quality determining part that determines whether the chip type electronic part is judged on the basis of an image picked up by the imaging camera. The V-shaped groove according to claim 10, wherein the conveying member has a substantially disk-shaped main body, a V-shaped groove formed at a circumferential edge of the main body and capable of contacting two surfaces of a chip-shaped electronic component whose outer shape is substantially rectangular parallelepiped. An appearance sorting device for a chip type electronic component, comprising a suction path passing through the groove. The circumferential edge of the main body of claim 10 or 11 is bent downward, The light guide member integrally formed with the light diffusing means of the imaging camera and the illuminating device is disposed at a position below the conveying member and overlapping with the conveying member in plan view. Appearance sorting device. 11. The conveying member according to claim 10, wherein the conveying member has a conveying surface formed with a V-shaped groove in which two surfaces of a chip-shaped electronic component having a substantially rectangular parallelepiped shape are in contact with each other. An external appearance sorting device for chip type electronic components, characterized by sliding and conveying. The chip-shaped electronic component of claim 11, wherein the chip-shaped electronic component has a substantially rectangular parallelepiped shape. A light guide body integrally formed with the light-diffusing means of the imaging camera and the illumination device is disposed at a position capable of simultaneously imaging at least two of four surfaces other than the two surfaces supported by the V-shaped grooves. Appearance sorting apparatus for chip type electronic parts.