JP4419831B2 - Appearance sorter for chip-type electronic components - Google Patents

Description

  The present invention relates to an appearance sorting apparatus for chip-type electronic components.

  For example, an illumination device described in Patent Document 1 is known as an illumination device for an appearance sorting device for chip-type electronic components. As shown in FIG. 13, this illuminating device 101 emits a ring-shaped light beam L emitted from a ring-shaped light source 105 into a hollow body (light diffusion means) 103 having an outer peripheral incident surface 103a and an inner peripheral output surface 103b. Is transmitted through the hollow body 103, and the chip-type electronic component 110 placed on the central axis C of the hollow body 103 and below the hollow body 103 is irradiated with the light beam L from above.

  The ring-shaped light source 105 is formed by uniformly arranging optical fiber bundles in a ring shape. When the other end of the optical fiber bundle is irradiated with a light source such as a light bulb, a ring-shaped light beam L is emitted. The hollow body 103 is made of a translucent milky white resin or glass subjected to a light diffusion process, and is a so-called rotationally symmetric body. Although not shown, an imaging camera is attached to the upper part of the hollow body 103. The reflecting means 106 is cylindrical and has a cylindrical inner surface 106a surrounding the hollow body 103, and the inner surface 106a is mirror-finished.

  By the way, since this illuminating device 101 irradiates the light beam L from the surroundings so as to surround the chip-type electronic component 110 that is an object to be irradiated, it is necessary to place the hollow body 103 close to the vicinity of the chip-type electronic component 110. is there. For this reason, when this lighting device 101 is used by being incorporated in the appearance sorting device of the chip-type electronic component 110, it is necessary to secure a wide installation space for the lighting device 101 in the appearance sorting device body.

However, in recent years, with the progress of miniaturization of chip-type electronic components, the demand for miniaturization of the appearance sorting apparatus has increased, and it has become difficult for the conventional illumination device 101 to cope with it.
JP 2003-107006 A

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an external appearance sorting apparatus for chip-type electronic components that includes an illumination device that has a small installation space and a simple structure.

In order to achieve the above object, the chip type electronic component appearance sorting apparatus according to the present invention is a chip type electronic component appearance sorting apparatus including an illumination device and an imaging camera. The lighting device emits light from a light source and a light source. A light guide that causes the incident light to enter, transmits and guides the incident light, and emits the light, and a light diffusing unit integrally provided on an output surface of the light guide, the light guide and the light guide The light diffusing means has a conical hollow body structure, and the outer peripheral surface and the inner peripheral surface of the light guide and the light diffusing means have a conical structure in which the exit surface side of the light diffusing means is narrower than the light source side. It is characterized by having. As the light diffusion means, a diffusion plate or the like is used.

  With the above configuration, the light beam emitted from the light source is incident on the light guide, then transmitted and guided through the light guide, and emitted from the light diffusion means as diffused light.

In addition, the light guide integrally provided with the light diffusing means has a stop portion that narrows the light to be transmitted and guided, and thus has a tapered shape, and the installation space of the lighting device is reduced. At this time, the diaphragm is designed so as to have an inclined outer peripheral surface of 10 ° or more and 22.5 ° or less with respect to the central axis of the light guide, whereby the light beam is efficiently transmitted through the light guide.

  In addition, by performing mirror treatment on the entrance, exit, and outer peripheral surface of the light guide integrally provided with the light diffusing means, light loss when light rays pass through the light guide and the light diffusing means is reduced. The Further, by arranging the light guide member between the light source and the light guide, the light source and the light guide are connected with little light loss.

  The chip type electronic component appearance sorting apparatus according to the present invention further includes a conveying member that conveys the chip type electronic component to a position where it can be imaged by the imaging camera, and the chip type electronic component based on the image captured by the imaging camera. It is characterized by including a pass / fail judgment unit for judging pass / fail of parts.

  The conveying member includes a substantially disc-shaped main body, a V-shaped groove formed on the periphery of the main body and capable of contacting two surfaces of a chip-shaped electronic component having an outer shape of a substantially rectangular parallelepiped shape, and communicated with the V-shaped groove. And a suction path to be provided. Alternatively, the peripheral edge of the main body of the conveying member is bent downward, and the imaging camera and the light diffusing means of the illumination device are integrated at a position below the conveying member and overlapping the conveying member in plan view. Alternatively, a light guide provided may be provided. Further, the conveying member includes a conveying surface formed with a V-shaped groove on which two surfaces of the chip-type electronic component whose outer shape is a substantially rectangular parallelepiped shape can contact, and the chip-type electronic component is disposed along the V-shaped groove. You may make it slide and convey.

  The chip-type electronic component has a substantially rectangular parallelepiped shape, and at least two of the four surfaces except for the two surfaces held by the V-shaped groove can be imaged at the same time at the position of the imaging camera and the illumination device. A light guide body in which the light diffusing means is integrally provided may be arranged.

  According to the present invention, the light beam from the light source is transmitted and guided through the light guide and emitted from the light diffusion means as diffused light. And this diffused light can irradiate the whole test | inspection surface of the chip-type electronic component which is a to-be-irradiated object uniformly. In addition, the light guide integrated with the light diffusing means has a narrowed portion that narrows the light to be transmitted and guided, and thus has a tapered shape, and the installation space of the lighting device can be reduced. As a result, it is possible to obtain a chip-type electronic component appearance sorting device including a lighting device with a small installation space and a simple structure. In addition, a plurality of imaging cameras and a light guide for the illumination device can be arranged at one imaging position, and it is possible to determine the quality of the appearance by simultaneously imaging a plurality of surfaces of the chip-type electronic component.

  Embodiments of a chip type electronic component appearance sorting apparatus according to the present invention will be described below with reference to the accompanying drawings.

(First embodiment, FIGS. 1 to 7)
As shown in FIG. 1, the appearance sorting device 1 is roughly composed of a disc-shaped suction transport drum 2 that transports a chip-type electronic component 40 in a suspended state, a hopper 3 disposed in the vicinity of the suction transport drum 2, It is comprised by the parallel feeder 4, the illuminating devices 5-10, the cameras 11-16 for imaging, and the trays 21-23.

  A large number of chip-type electronic components 40 placed in the hopper 3 are sequentially dropped onto one end side of the conveying surface of the parallel feeder 4 and then fed into the non-vibrating portion 4 a on the other end side by the vibration of the parallel feeder 4. The chip-type electronic component 40 of the non-vibrating portion 4a is appropriately applied by vacuum suction from the suction path 2b in a V-shaped receiving recess 2a provided at a predetermined interval on the lower surface of the outer periphery of the disc-type suction conveyance drum 2. It is held one by one. The suction conveyance drum 2 that holds the chip-type electronic component 40 in a suspended state is driven to rotate in the direction of arrow K.

  When the chip-type electronic component 40 stands by on the non-vibrating part 4a, the upper surface and one side surface are imaged by the imaging cameras 11 and 12, and the appearance inspection of these two surfaces is performed. Then, the chip-type electronic component 40 is vacuum-sucked to the suction-conveying drum 2 so that the two surfaces that have already undergone the appearance inspection come into contact with the inner wall surface of the housing recess 2a having a V-shaped cross section (as shown in FIG. 2). (See A-A arrow view). The chip-type electronic component 40 is set so that its longitudinal direction is parallel to the radial direction of the suction conveyance drum 2. Furthermore, while the chip-type electronic component 40 is being transported by the suction transport drum 2, the lower surface and the other side surface exposed from the suction transport drum 2 are imaged by the imaging cameras 13 and 14. The appearance inspection is performed, and both end surfaces exposed from the suction conveyance drum 2 are imaged by the imaging cameras 15 and 16, and the both end surfaces are inspected.

  Thereafter, the chip-type electronic component 40 that is determined to be defective in appearance is discharged to the defective product tray 21, and the chip-type electronic component 40 that is determined to be re-inspected is discharged to the re-inspection tray 22. The determined chip-type electronic component 40 is discharged to the non-defective product tray 23.

  By the way, as shown in FIG. 2, the chip-type electronic component 40 has external electrodes 41 formed at both ends of a rectangular parallelepiped chip. In this specification, 40a is an upper surface, 40b is a lower surface, and 40c. Is referred to as a side surface, and 40d is referred to as an end surface.

  Here, among the illuminating devices 5 to 10, the illuminating devices 9 and 10 that irradiate the end face of the chip-type electronic component 40 are, as shown in FIG. The light guide member 33, the optical fiber 34, and the light source 35 are used. The illumination devices 5 to 8 may be well-known illumination devices or may be the same as the illumination devices 9 and 10.

  As shown in FIG. 3, the light guide 31 has an incident surface 31a on one end surface and an output surface 31b on the other end surface, and is made of a transparent acrylic material or the like. A diffusion plate 32 is attached to the emission surface 31b, and the light guide 31 and the diffusion plate 32 are integrated. The diffusing plate 32 is made of milky white resin, light-diffused glass, or the like. The light guide 31 integrated with the diffusion plate 32 has a mirror-finished outer surface including the entrance (the entrance surface 31a of the light guide 31) and the exit (the exit surface 32b of the diffusion plate 32). Thereby, the light loss at the time of a light ray passing through the light guide 31 can be suppressed.

  The light guide 31 integrated with the diffusion plate 32 is a so-called rotationally symmetric body, has a substantially conical hollow body structure, has a ring-shaped entrance 31a and a ring-shaped exit 32b, and the imaging camera 15. And a fixed portion joined to the ring-shaped light guide member 33, and a stop portion for narrowing (condensing) the transmitted light beam. The aperture portion of the light guide 31 is composed of a first aperture portion and a second aperture portion having different inclination angles of the outer peripheral surface, and the boundary position between the first aperture portion and the second aperture portion is the diffusion plate 32 and the light guide body 31. And the position of the joint surface. The first aperture portion of the light guide 31 is designed to have an inclined outer peripheral surface of 22.5 ° or less (preferably 10 ° to 17.5 °) with respect to the central axis C of the light guide 31. Thereby, the light beam is efficiently transmitted through the light guide 31. A light beam symmetric with respect to the central axis C is emitted from the ring-shaped exit port 32b, and the chip-type electronic component 40 is uniformly irradiated.

  The light guide body 31 has a tapered portion that narrows down the light beam passing therethrough, thereby having a tapered shape, and the installation space of the illumination device 9 can be reduced. In the case of the first embodiment, the shape of the inner peripheral surface of the light guide 31 is a circular cross section, but the shape is not particularly limited.

  The imaging camera 15 is composed of a CCD camera body 37 and a camera lens barrel 38. The end portion of the camera lens barrel 38 is fitted to the fixed portion of the light guide 31. The imaging camera 15 is disposed on the central axis C of the light guide 31 and similarly inspects the appearance of the chip-type electronic component 40 conveyed by the suction conveyance drum 2 on the central axis C of the light guide 31.

  The ring-shaped light guide member 33 has an incident side connected to the optical fiber 34 and an output side connected to a fixing portion of the light guide 31. The ring-shaped light guide member 33 emits a light beam from the light source 35 that has passed through the optical fiber 34 as a ring-shaped light beam. Thereby, the light source 35 and the light guide 31 are connected with little optical loss.

  The imaging camera 15 and the light guide 31 and the ring-shaped light guide member 33 integrated with the diffusion plate 32 of the illumination device 9 are positioned below the suction transport drum 2 and overlap the suction transport drum 2 in plan view. Is arranged.

  In the illuminating device 9 having the above configuration, the light emitted from the light source 35 is guided to the light guide 31 through the optical fiber 34 and the ring-shaped light guide member 33. The light beam incident from the incident surface 31 a of the light guide 31 is collected by the stop portion of the light guide 31 and guided to the output surface 31 b, and becomes diffused light by the diffusion plate 32. The diffused light uniformly irradiates the end surface (the entire inspection surface) of the chip-type electronic component 40 conveyed by the suction conveyance drum 2 from the inside of the suction conveyance drum 2, and similarly enters the inside of the suction conveyance drum 2. The end face of the chip-type electronic component 40 is imaged by the arranged imaging camera 15 and an appearance inspection is executed. Since the light guide 31 is provided with the diffusing plate 32, it is possible to irradiate the chip-type electronic component 40 with light rays from the peripheral direction. Light can be irradiated.

  In addition, the light guide 31 has a narrowed portion that narrows the light beam to be transmitted and guided, and thus has a tapered shape, so that the installation space for the illumination device is reduced. At this time, the diaphragm portion of the light guide 31 is designed to have an inclined surface of 22.5 ° or less with respect to the central axis C of the light guide 31, so that light can efficiently pass through the light guide 31. To do.

  In particular, the second diaphragm portion is formed so as to have a larger inclination with respect to the central axis C of the light guide 31 than the first diaphragm portion, whereby the incident light beam is reflected by the second diaphragm portion, and the chip type The electronic component 40 can be irradiated with more light with a shallow incident angle. As a result, even if the R surface is formed on the ridge line portion of the chip-type electronic component 40, a clear image can be obtained, so that the ridge line portion can be inspected with higher accuracy. Since the ridge line portion of the normal chip-type electronic component 40 is an R surface, the ridge line portion image tends to be unclear. The diffusing plate 32 is intended to generate light having a shallow incident angle with respect to the chip-type electronic component 40 by diffusing the incident light from the light source 35, but the purpose of the second diaphragm is also the same. In combination with 32, a synergistic effect is obtained.

  Furthermore, since the light guide 31 is small, the appearance sorting device 1 is below (behind) the suction conveyance drum 2 that is too large to be arranged by the conventional illumination device 101 shown in FIG. In this space, the imaging camera 15 and the light guide 31 of the lighting device can be arranged. Therefore, it becomes possible to inspect the end face of the chip-type electronic component 40 being transported while being hung on the suction transport drum 2 from the inside of the suction transport drum 2, thereby reducing the size of the appearance sorting device 1. It becomes possible.

  Further, the light guide 31 integrated with the diffusion plate 32 can be variously modified according to the specifications. For example, as shown in FIG. 4, the light guide member 33 has a structure in which the end face of the fixing portion of the light guide 31 and the end face of the camera lens barrel 38 of the imaging camera 15 are joined in a state of being abutted. Also good. Furthermore, as shown in FIG. 5, the aperture portion of the light guide 31 may not be divided into a first aperture portion and a second aperture portion. Alternatively, as illustrated in FIG. 6, the boundary position between the first diaphragm portion and the second diaphragm portion of the light guide 31 is shifted from the position of the joint surface between the light guide 31 and the diffusion plate 32 toward the diffusion plate 32. As shown in FIG. 7, the boundary position between the first diaphragm portion and the second diaphragm portion of the light guide 31 is shifted from the position of the joint surface between the light guide 31 and the diffusion plate 32 toward the light guide 31. It may be.

(Second embodiment, FIG. 8)
As shown in FIG. 8, a chip-type electronic component appearance sorting apparatus 50 according to the second embodiment uses a triangular prism 51 as a light guide. The triangular prism 51 has an entrance surface 51a and an exit surface 51b, and is made of a transparent acrylic material or the like. A diffusion plate 52 is attached to the emission surface 51b, and the triangular prism 51 and the diffusion plate 52 are integrated. The triangular prism 51 integrated with the diffusing plate 52 has a mirror-finished outer surface including the entrance (the entrance surface 51a of the triangular prism 51) and the exit (the exit surface 52b of the diffusing plate 52).

  The light beam L emitted from the light source 35 is guided to the triangular prism 51 through an optical fiber (not shown). The light beam L incident from the incident surface 51 a of the triangular prism 51 is totally reflected by the oblique side surface 51 c of the triangular prism 51. This is because if the triangular prism 51 is an acrylic material, when light rays travel from the acrylic material into the air, the light is totally reflected when the incident angle is 42 ° 10 ′ or more. The light beam L totally reflected by the oblique side surface 51 c is guided to the emission surface 51 b and becomes diffused light L by the diffusion plate 52. With this diffused light L, the chip-type electronic component 40 conveyed by the conveyance belt 55 is irradiated obliquely from above, and the chip-type electronic component is disposed by the imaging camera 15 disposed above the chip-type electronic component 40. 40 is imaged and an appearance inspection is executed.

  The appearance sorting apparatus 50 having the above configuration has the same effects as the appearance sorting apparatus 1 of the first embodiment, and can change the direction of the light beam L inside the triangular prism 51 which is a light guide. Therefore, the freedom degree of design of an illuminating device becomes high.

(Third embodiment, FIG. 9)
As shown in FIG. 9, the chip type electronic component appearance sorting device 60 according to the third embodiment uses a curved light guide 61. The curved light guide 61 has an entrance surface 61a and an exit surface 61b, and is made of a transparent acrylic material or the like. A diffusion plate 62 is attached to the emission surface 61b, and the curved light guide 61 and the diffusion plate 62 are integrated. The curved light guide 61 integrated with the diffusion plate 62 has a mirror-finished outer surface including the entrance (incident surface 61a of the curved light guide 61) and the exit (exit surface 62b of the diffuser 62). .

  The light beam L emitted from the light source 35 is guided to the curved light guide 61 through an optical fiber (not shown). The light beam L incident from the incident surface 61 a of the curved light guide 61 is repeatedly totally reflected on the inner wall surface of the curved light guide 61 and guided to the output surface 61 b, and becomes diffused light L by the diffusion plate 62. With this diffused light L, the chip-type electronic component 40 conveyed by the conveyance belt 55 is irradiated obliquely from above, and the chip-type electronic component is disposed by the imaging camera 15 disposed above the chip-type electronic component 40. 40 is imaged and an appearance inspection is executed.

  The appearance sorting device 60 having the above configuration has the same effects as the appearance sorting device 1 of the first embodiment and can change the direction of the light beam L inside the curved light guide 61. The degree of freedom in device design is increased.

(Fourth embodiment, FIG. 10)
As shown in FIG. 10, a chip-type electronic component appearance sorting device 70 according to the fourth embodiment uses a J-shaped (or U-shaped) light guide 71. The J-shaped light guide 71 has an entrance surface 71a and an exit surface 71b, and is made of a transparent acrylic material or the like. A diffusion plate 72 is attached to the emission surface 71b, and the J-shaped light guide 71 and the diffusion plate 72 are integrated. The J-shaped light guide 71 integrated with the diffusing plate 72 has a mirror-finished outer surface including the entrance (the entrance surface 71a of the J-shaped light guide 71) and the exit (the exit surface 72b of the diffusing plate 72). ing.

  The light beam L emitted from the light source 35 is guided to the J-shaped light guide 71 through an optical fiber (not shown). The light beam L incident from the incident surface 71 a of the J-shaped light guide 71 is totally reflected by the oblique sides 71 c and 71 d of the J-shaped light guide 71 and guided to the exit surface 71 b, and becomes diffused light L by the diffusion plate 72. . With this diffused light L, the chip-type electronic component 40 that has been transported while being held by vacuum suction from the suction path 2d in the housing recess (V-shaped groove) 2c formed on the outer peripheral edge of the suction transport drum 2A. The chip electronic component 40 is imaged by the imaging camera 15 disposed on the side opposite to the light source 35 while irradiating from the direction opposite to the direction of the light source 35, and the appearance inspection is executed.

  The appearance sorting device 70 configured as described above has the same operational effects as the appearance sorting device 1 of the first embodiment, and can change the direction of the light beam L inside the J-shaped light guide 71. The degree of freedom in designing the lighting device is increased.

(5th Example, FIG. 11)
As shown in FIG. 11, a chip-type electronic component appearance sorting apparatus 80 according to the fifth embodiment arranges two imaging cameras 15A and 15B at an angular interval of 90 ° in one imaging station, and thereby provides chip-type electronic components. Two surfaces of the component 40 are imaged simultaneously. In FIG. 11, the same reference numerals as those in FIG. 2 indicate the same members, and redundant descriptions are omitted.

  In the appearance sorting apparatus 80, the chip-type electronic component 40 is conveyed in the direction of arrow M by a sliding conveyance method using suction force through a V-shaped groove 82 formed on the conveyance member 81, and the lower surface is imaged by the imaging camera 15A. Then, the side surface is imaged by the imaging camera 15B.

  In the fifth embodiment, since the distal end portion of the illumination device 9 has a tapered shape, two imaging cameras 15A and 15B are arranged without causing spatial interference in one imaging station.

(Sixth embodiment, FIG. 12)
As shown in FIG. 12, the chip type electronic component appearance sorting device 90 according to the sixth embodiment is one in which four imaging cameras 15A to 15D are arranged in one imaging station. The imaging cameras 15A and 15B are arranged at an angular interval of 90 ° as in the fifth embodiment, and image the lower surface and side surfaces of the chip-type electronic component 40. The imaging cameras 15C and 15D are arranged to face each other in the horizontal direction, and image both end surfaces of the chip-type electronic component 40.

  In the appearance sorting device 90, the chip-type electronic component 40 is conveyed in a state where it is held by vacuum suction from the suction path 2f to a housing recess (V-shaped groove) 2e formed on the outer peripheral edge of the suction conveyance drum 2B. To the station.

  In the sixth embodiment, since the distal end portion of the illumination device 9 has a tapered shape, four imaging cameras 15A to 15D are arranged without causing spatial interference in one imaging station.

(Other examples)
In addition, this invention is not limited to the said Example, It can change variously within the range of the summary. As the light diffusing means, in addition to the diffusing plate, a color filter, a deflection filter, an ultraviolet filter, or the like may be used. Thereby, the characteristic of illumination light can be changed, without changing a light source. Further, instead of combining the light source 35 and the ring-shaped light guide member 33, a ring-shaped light source may be used.

The top view which shows schematic structure of 1st Example of the external appearance sorter | selector of the chip-type electronic component which concerns on this invention. FIG. 2 is a partial cross-sectional view illustrating the illumination device and the imaging camera illustrated in FIG. 1. Sectional drawing of the light guide in which the light-diffusion means shown in FIG. 2 was provided integrally. Sectional drawing which shows the modification of the light guide in which the light-diffusion means shown in FIG. 2 was provided integrally. Sectional drawing which shows another modification of the light guide in which the light-diffusion means shown in FIG. 2 was provided integrally. Sectional drawing which shows another modification of the light guide in which the light-diffusion means shown in FIG. 2 was provided integrally. Sectional drawing which shows another modification of the light guide in which the light-diffusion means shown in FIG. 2 was provided integrally. The schematic block diagram which shows 2nd Example of the external appearance sorter | selector of the chip-type electronic component which concerns on this invention. The schematic block diagram which shows 3rd Example of the external appearance sorter | selector of the chip type electronic component which concerns on this invention. The schematic block diagram which shows 4th Example of the external appearance sorter | selector of the chip type electronic component which concerns on this invention. The schematic block diagram which shows 5th Example of the external appearance sorter | selector of the chip type electronic component which concerns on this invention. The schematic block diagram which shows 6th Example of the external appearance sorter | selector of the chip type electronic component which concerns on this invention. Sectional drawing which shows the illuminating device of a prior art example.

Explanation of symbols

1, 50, 60, 70, 80, 90 ... Appearance sorting device 2, 2A, 2B ... Adsorption conveyance drums 2a, 2c, 2e ... Housing recess (V-shaped groove)
2b, 2d, 2f ... suction paths 5-10 ... illumination devices 11-16 ... imaging camera 31 ... light guide 31a ... entrance surface 32 ... diffuser plate 32b ... exit surface 33 ... ring-shaped light guide member 35 ... light source 51 ... Triangular prism (light guide)
52, 62, 72 ... Diffuser 61 ... Curved light guide 71 ... J-shaped light guide 81 ... Conveying member 82 ... V-shaped groove

Claims (14)

In the appearance sorting device for chip-type electronic components equipped with an illumination device and an imaging camera,
The illuminating device is provided integrally with a light source, a light guide that makes the light emitted from the light source incident, and transmits and guides the incident light to be emitted. Light diffusing means,
The light guide and the light diffusing means have a conical hollow body structure,
The chip-type electronic component characterized in that the outer peripheral surface and inner peripheral surface of the light guide and the light diffusing means have a conical structure in which the exit surface side of the light diffusing means is narrower than the light source side Appearance sorting device.   2. The chip type electronic component appearance sorting apparatus according to claim 1, wherein the light diffusing means comprises a diffusion plate.   The light guide body in which the light diffusing means is integrally provided has a ring-shaped incident port, a ring-shaped light emitting port, and a diaphragm for narrowing a light beam to be transmitted and guided. The appearance sorter for chip type electronic parts according to claim 1 or 2. The diaphragm part of the light guide body in which the light diffusing means is provided integrally is composed of a first diaphragm part and a second diaphragm part,
The second diaphragm portion has a larger inclination than the first diaphragm portion with respect to the center line of the light guide, and is provided on the emission side of the light diffusing means with respect to the first diaphragm portion. The appearance sorting apparatus for chip-type electronic components according to claim 3, wherein:   The diaphragm portion of the light guide integrally provided with the light diffusing means has an inclined outer peripheral surface of 10 ° or more and 22.5 ° or less with respect to the central axis of the light guide. The appearance sorter for chip type electronic parts according to claim 3.   The first diaphragm portion of the light guide integrally provided with the light diffusing means has an inclined outer peripheral surface of 10 ° or more and 22.5 ° or less with respect to the central axis of the light guide. The appearance sorter for chip type electronic parts according to claim 4.   5. The chip type electronic component appearance sorting apparatus according to claim 4, wherein the light diffusing means constitutes the second aperture portion.   8. The chip-type electron according to claim 1, wherein an incident port, an emission port, and an outer peripheral surface of a light guide integrally provided with the light diffusing unit are mirror-finished. 9. Appearance sorting device for parts.   9. A light guide member that enters a light beam from the light source and emits the light beam in a ring shape is disposed between the light source and the light guide. Appearance sorter for chip type electronic parts given in 2. A conveying member that conveys the chip-type electronic component to a position where it can be imaged by the imaging camera;
A pass / fail determination unit for determining pass / fail of the chip-type electronic component based on an image captured by the imaging camera;
An external appearance sorting apparatus for chip-type electronic components according to claim 1, comprising:   The conveying member includes a substantially disc-shaped main body, a V-shaped groove formed on the periphery of the main body and capable of contacting two surfaces of a chip-shaped electronic component having an outer shape of a substantially rectangular parallelepiped shape, and communicated with the V-shaped groove. The chip | tip electronic component external appearance sorter | selector of Claim 10 characterized by the above-mentioned. The conveying member has a peripheral edge bent downward,
A light guide body integrally provided with light diffusing means of the imaging camera and the illuminating device is disposed at a position below the transport member and overlapping the transport member in plan view;
The appearance sorter of chip type electronic parts according to claim 10 or 11 characterized by these.   The conveying member includes a conveying surface formed with a V-shaped groove on which two surfaces of a chip-type electronic component having an outer shape of a substantially rectangular parallelepiped can come into contact, and the chip-type electronic component slides along the V-shaped groove. 11. The chip type electronic component appearance sorting apparatus according to claim 10, wherein the chip type electronic component is sorted and conveyed. The chip-type electronic component has a substantially rectangular parallelepiped shape,
A light guide body in which at least two of the four surfaces excluding the two surfaces held by the V-shaped groove can be imaged at the same time, the light diffusing means of the imaging camera and the illumination device are integrally provided. The placement,
The appearance sorter for chip type electronic parts according to any one of claims 11 to 13.

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