KR20050053110A - Bonding device for liquid crystal display device - Google Patents

Abstract

The present invention relates to a bonding apparatus provided with a separation means for easily separating between the upper stage and the substrate when the upper stage is raised after bonding the substrate, so that the loading or unloading of the substrate is made while selectively forming a vacuum or atmospheric pressure state. A vacuum chamber in which an outlet is formed, and an upper stage and a lower stage which are respectively installed in the upper space and the lower space of the vacuum chamber so as to fix and bond the respective substrates brought into the vacuum chamber; And separating means for separating the substrate from the upper stage.

Description

Bonding device for liquid crystal display device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for manufacturing a liquid crystal display device, and more particularly, to a bonding apparatus provided with separation means for easily separating the upper stage and the substrate when the upper stage is raised after bonding the substrate.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, the LCD (Lipuid Crystal Display Device), PDP (Plasma Display Panel), ELD (Electro Luminescent Display), and VFD (Vacuum Fluorescent) Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices.

Among them, LCD is the most widely used as the substitute for CRT (Cathode Ray Tube) for mobile image display because of its excellent image quality, light weight, thinness, and low power consumption. In addition to the use of the present invention, a variety of applications such as a television, a computer monitor, and the like for receiving and displaying broadcast signals have been developed.

As described above, although various technical advances have been made in order for a liquid crystal display device to serve as a screen display device in various fields, the task of improving the image quality as a screen display device is often arranged with the above characteristics and advantages. . Therefore, in order to use a liquid crystal display device in various parts as a general screen display device, the key to development is how much high definition images such as high definition, high brightness, and large area can be realized while maintaining the characteristics of light weight, thinness, and low power consumption. It can be said.

Such a liquid crystal display may be largely divided into a liquid crystal panel displaying an image and a driving unit for applying a driving signal to the liquid crystal panel, wherein the liquid crystal panel has a predetermined space and is bonded to the first and second glass substrates. And a liquid crystal layer injected between the first and second glass substrates.

The first glass substrate (TFT array substrate) may include a plurality of gate lines arranged in one direction at a predetermined interval, a plurality of data lines arranged at regular intervals in a direction perpendicular to the gate lines, and A plurality of pixel electrodes formed in a matrix form in each pixel region defined by crossing each gate line and data line, and a plurality of thin films that transmit signals of the data line to each pixel electrode by being switched by signals of the gate line Transistors are formed.

The second glass substrate (color filter substrate) includes a black matrix layer for blocking light in portions other than the pixel region, an R, G and B color filter layer for expressing color colors, and a common electrode for implementing an image. Is formed.

The first and second substrates are bonded to each other by a seal material having a predetermined space by a spacer and having a liquid crystal injection hole, so that the liquid crystal is injected between the two substrates.

At this time, in the liquid crystal injection method, the liquid crystal is injected between the two substrates by osmotic pressure when the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates bonded by the real material. When the liquid crystal is injected as described above, the liquid crystal injection hole is sealed with a sealing material.

However, in such a method of manufacturing a liquid crystal display liquid crystal display device, since the liquid crystal is injected into the liquid crystal liquid by cutting the unit panel in a vacuum state between the two substrates and then injecting the liquid crystal, it takes a lot of time for the liquid crystal injection. When the liquid crystal display device having a large area is lowered and the liquid crystal is injected by the liquid crystal injection method, the liquid crystal is not completely injected into the panel, which causes a defect.

Therefore, in recent years, the manufacturing method of the liquid crystal display device using the method of dropping a liquid crystal is researched. Among them, Japanese Unexamined Patent Application Publication No. 2000-147528 discloses a technique using the following liquid crystal dropping method.

The manufacturing method of the conventional liquid crystal display device using the liquid crystal dropping method is as follows.

1A to 1F are cross-sectional views of a liquid crystal display device according to a conventional liquid crystal dropping method.

As shown in FIG. 1A, an ultraviolet curable material 1 is applied to the first glass substrate 3 on which the thin film transistor array is formed to have a thickness of about 30 μm, and the liquid crystal 2 is disposed inside the material 1 (a thin film transistor array). Dropping At this time, the real material 3 is formed without a liquid crystal injection hole.

The first glass substrate 3 as described above is mounted on the table 4 in the vacuum container C that is movable in the horizontal direction, and the entire lower surface of the first glass substrate 3 is mounted on the first adsorption mechanism 5. ) By vacuum adsorption.

As shown in Fig. 1B, the entire lower surface of the second glass substrate 6 on which the color filter array is formed is vacuum-adsorbed and fixed by the second adsorption mechanism 7, and the vacuum vessel C is closed and vacuumed. Then, the second adsorption mechanism 7 is lowered in the vertical direction so that the distance between the first glass substrate 3 and the second glass substrate 6 is 1 mm, and the first glass substrate 3 is mounted. The table 4 is moved in the horizontal direction to preliminarily position the first glass substrate 3 and the second glass substrate 6.

As shown in FIG. 1C, the second adsorption mechanism 7 is lowered in the vertical direction to bring the second glass substrate 6 into contact with the liquid crystal 2 or the actual material 1.

As shown in FIG. 1D, the table 4 on which the first glass substrate 3 is mounted is moved in the horizontal direction to adjust the position of the first glass substrate 3 and the second glass substrate 6.

As shown in FIG. 1E, the second adsorption mechanism 7 is lowered in the vertical direction to bond the second glass substrate 6 to the first glass substrate 3 through the actual material 1, and to press to 5 μm. .

As shown in FIG. 1F, after the adsorption force of the second adsorption mechanism 7 is released and the second adsorption mechanism 7 is raised, the first and second glass substrates bonded to each other from the vacuum vessel C ( 3, 6) are taken out and the ultraviolet rays are irradiated to the substance 1 to cure the substance 1 to complete the liquid crystal display device.

However, such a conventional bonding apparatus has the following problems.

That is, after the substrate is bonded, when the upper second adsorption mechanism is raised, a phenomenon in which the substrate is lifted by the attraction force between the second adsorption mechanism and the bonded substrate is generated, so that the bonded first and second substrates are separated or the two substrates are separated. Damage is generated to the sealing material to which the substrate is bonded, so that air flows between the two bonded substrates.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and after bonding the substrates, when the upper stage is raised, the object of the present invention is to provide a bonding apparatus for a liquid crystal display device having separation means installed on the upper stage so that the stage and the substrate can be easily separated. There is this.

 In accordance with one aspect of the present invention, a bonding apparatus for a liquid crystal display device includes a vacuum chamber in which an outlet is formed so that a substrate may be loaded or unloaded while selectively forming a vacuum state or an atmospheric pressure state, and an upper space in the vacuum chamber. And an upper stage and a lower stage which are respectively installed in the lower space and opposed to each other to fix and adhere the substrates brought into the vacuum chamber, and separation means for separating the substrates installed in the upper stage from the upper stage. It is characterized by being constructed.

In addition, the bonding apparatus of the liquid crystal display device according to the present invention for achieving the above object, the base frame forming the appearance, the lower chamber unit mounted to the base frame and the lower chamber unit in a free state from the base frame An upper chamber unit positioned at an upper side of the chamber, chamber moving means provided on the base frame to move the upper chamber unit up and down, and an upper stage provided in an inner space of each chamber unit to fix a pair of substrates; A lower stage, provided on the surface of at least one chamber unit, and when the chamber units are coupled to each other, sealing means for sealing the space in which each stage is mounted and the outer space thereof, and a substrate installed in the upper stage With a separating means for separating from said upper stage As there is another characteristic.

Referring to the attached device of the liquid crystal display device according to the invention having the features as described above in more detail with reference to the accompanying drawings.

First, the applicant has previously filed a bonding apparatus of two kinds of liquid crystal display devices (see Korean Patent Application Nos. 10-2002-0006640 and 10-2002-071227).

Figure 2 schematically shows a bonding apparatus (Korean Patent Application 10-2002-0006640) previously filed by the applicant.

That is, the bonding apparatus of a liquid crystal display element is comprised including the adapter chamber 110, a stage part, a stage moving apparatus, a vacuum apparatus, the vent apparatus, and the loader part 30. As shown in FIG.

The interior of the adapter chamber 110 is selectively vacuumed or atmospheric pressure, and the adhesion through pressure between the substrates and the adhesion using the pressure difference are sequentially performed. Or, the outlet 111 is formed to be carried out.

At this time, the adapter chamber 110 is connected to an air discharge pipe 112 through which the air suction force transmitted from the vacuum device is transmitted to one side of the circumferential surface and the air existing in the inner space is discharged, and air from the outside thereof. Alternatively, other gas (N ₂ ) is introduced to the vent pipe 113 for maintaining the interior of the adapter chamber 110 in the standby state is connected to form or release a selective vacuum of the interior space, It is configured to be possible.

In addition, the air discharge pipe 112 and the vent pipe 113 in the above is provided with on-off valves 112a and 113a which are electronically controlled for the selective opening and closing of the pipe.

In addition, the stage unit is installed in the upper space and the lower space in the adapter chamber 110, respectively, and each substrate (10, 20) carried into the adapter chamber 110 through the loader unit 30 It is configured to include an upper stage 121 and the lower stage 122 to serve to fix to the working position in the adapter chamber 110.

At this time, the upper and lower stages 121 and 122 are provided with at least one electrostatic chuck (ESC) 121a, 122a to provide a constant power to fix the substrate, and to provide vacuum power. At least one vacuum hole 121b is formed to receive and fix the substrate.

The electrostatic chucks 121a and 122a as described above are formed of a plurality of flat plate electrode pairs, and DC power of different polarities is applied to each of the flat plate electrodes so that electrostatic attachment of each substrate is possible.

In addition, in the configuration of the upper stage 121, the vacuum hole 121b is formed by forming a plurality along the periphery of each electrostatic chuck 121a mounted on the bottom of the upper stage 121, the respective vacuum The holes 121b are formed to communicate with each other through a single or multiple pipe lines 121c so as to receive the vacuum force generated by the vacuum pump 123 connected to the upper stage 121.

At least one electrostatic chuck 122a is mounted on the upper surface of the lower stage 122 to provide the electrostatic power to fix the substrate, and at least one vacuum hole may be sucked to fix the substrate by receiving a vacuum force. Illustration is omitted).

The stage moving device has a moving shaft 131 for selectively moving the upper stage 121 up and down, and has a rotating shaft 132 for selectively rotating the lower stage 122 horizontally. Drive motors 133 and 134 are configured to selectively drive the respective shafts in the state coupled to the stages 121 and 122 inside or outside the chamber 110.

The vacuum device serves to transfer suction force so that the interior of the adapter chamber 110 can achieve a vacuum state selectively, and constitutes a suction pump driven to generate a normal air suction force. The space provided with the 200 is formed to communicate with the air discharge pipe 112 of the adapter chamber 110.

In addition, the loader unit 30 is constructed outside the combiner chamber 110 as a separate device from the various components provided in the combiner chamber 110 and the combiner chamber 110. The first substrate 10 having the liquid crystals loaded therein, or the second substrate 20 having the sealant applied thereon, respectively, may be selectively loaded into or taken out from inside the adapter chamber 110 of the bonding apparatus. .

At this time, the loader unit as described above is any one arm (hereinafter referred to as "first arm") 31 for conveyance of the first substrate 10 in which the liquid crystal is dropped, and the second substrate coated with the sealing material ( A second arm (hereinafter referred to as a “second arm”) 32 for conveyance of the first and second substrates 10, 20, and the respective arms 31, 32. The first arm 31 is configured to be positioned above the second arm 32 in the standby state before being conveyed into the combiner chamber 110 by being placed thereon.

This is because the first substrate 10 mounted on the first arm 31 is in a state where liquid crystal is dropped on the upper surface thereof, and the second substrate 20 mounted on the second arm 32 is coated with a sealing material. Considering that the surface is located on the lower surface, if the second arm 32 is positioned above the first arm 31, various foreign matters may be generated and scattered according to the movement of the second arm 32. The first arm 31 is attached to the second arm 32 so as to prevent the problem that the liquid crystal of the first substrate 10 placed on the first arm 31 falls and causes the loss. It is configured to be located above.

In addition, an alignment device 60 is installed to check an alignment state between the substrates 10 and 20 loaded into the vacuum chamber 110 by the loader and loaded into the stages 121 and 122.

The liquid crystal display device manufacturing method using the bonding apparatus configured as described above is as follows.

First, after forming a thin film transistor array, a first substrate 10 having liquid crystals dropped thereon and a second substrate 20 coated with a sealing material after the color filter array is formed are prepared.

As shown in the dotted line of FIG. 2, the loader unit 30 waits for the first substrate 10 on which the liquid crystal is dropped on the first arm 31, and seals the seal on the second arm 32. The second substrate 20 to which ash is applied is waited.

In this state, when the outlet 111 of the vacuum chamber 110 is opened, the loader part 30 controls the second arm 32 so that the second substrate 20 to which the seal material is applied is opened. The first arm 31 is controlled by bringing the upper stage 121 into the upper stage 121 installed in the upper space in the vacuum chamber 110 so that the upper stage 121 vacuum-adsorbs the second substrate 20. The liquid crystal is dropped into the first substrate 10 into the lower stage 122 installed in the lower space in the vacuum chamber 110 so that the lower stage 122 vacuum suction the first substrate 10 do.

In the above process, if a bonding process is performed immediately before the bonding stage is present in the lower stage, the second arm 32 into which the C / F substrate is loaded is attached to the lower stage after the loading of the substrate. Unloading the substrate allows loading and unloading to be performed at the same time, resulting in a reduction in the working time.

When the loading of the substrates 10 and 20 through the above-described process is completed, the arms 31 and 32 constituting the loader unit 30 exit to the outside of the vacuum chamber 110 and the vacuum chamber As the shielding door 114 installed at the outlet 111 of the 110 is operated, the outlet 111 is closed to form an airtight state inside the vacuum chamber 110.

Thereafter, the suction pump 200 is driven to generate an air suction force, and the opening / closing valve 112a provided in the air discharge pipe 112 of the vacuum chamber 110 opens the air discharge pipe 112. The inside of the vacuum chamber 110 is maintained in a vacuum state.

As such, when the inside of the vacuum chamber 110 is in a vacuum state by driving the suction pump 200 for a predetermined time, the driving of the suction pump 200 is stopped and at the same time the opening / closing valve 112a of the air discharge pipe 112. Is operated to maintain the air discharge pipe 112 in a closed state.

In addition, when the inside of the vacuum chamber 110 achieves a complete vacuum state as described above, the upper stage 121 and the lower stage 122 apply power to their respective static electricity providing devices 121a and 122a to provide a substrate 10. 20 is electrostatically adsorbed.

In this state, the stage shifting device drives the driving motor 133 to move the upper stage 121 downward, thereby positioning the upper stage proximate to the lower stage 122, and together with the alignment apparatus 60. In addition to confirming the alignment between the substrates 10 and 20 attached to the stages 121 and 122, the control signals are transmitted to the moving shafts 131 and 132 and the rotating shafts axially coupled to the stages 121 and 122, respectively. Will be aligned to each other.

Subsequently, the stage moving device receives and drives the continuous driving signal while keeping the second substrate 20 attached to the upper stage 121 in close contact with the first substrate 10 attached to the lower stage 122. Pressing is performed to perform the primary coalescing with each other.

In this case, the primary bonding means not to complete the complete bonding process through pressurization by the movement of the stages 121 and 122, but to bond only enough to prevent air from flowing between the substrates when changing to atmospheric pressure. Say.

Therefore, when the primary bonding process is completed, the electrostatic attraction force of the upper stage 121 is released and the upper stage 121 is separated from the bonded substrates 10 and 20. Then, the vent pipe 113 is opened while the opening / closing valve 113a closing the vent pipe 113 is operated. As a result, the inside of the vacuum chamber 110 gradually becomes atmospheric, and the vacuum chamber 110 is opened. The pressure difference is given to the inside, and the bonding between the substrates is caused again.

Thus, a more complete substrate-to-substrate bonding is performed, and when the bonding process is completed, the shielding door 114 of the vacuum chamber 110 is driven to open the outlet 111 closed by the shielding door.

Subsequently, the unloading of the bonded substrate is performed by the loader unit 30, and the bonding between the substrates is performed while repeatedly performing the above-described series of processes.

In addition, the present applicant has previously filed a bonding apparatus in which a vacuum chamber is formed when the upper and lower chamber units are contacted by including an upper chamber unit and a lower chamber unit without forming a vacuum chamber separately (Korean patent) Application 10-2002-071227).

3 is a configuration diagram showing an initial state of a substrate bonding apparatus (Korean Patent Application No. 10-2002-071227) for a liquid crystal display device manufacturing process previously filed by the present applicant.

As can be seen from this, the bonding apparatus is largely the base frame 100, the upper chamber unit 210 and the lower chamber unit 220, the chamber moving means (310, 320, 330, 340, 350), the upper stage 230 and the lower stage 240, sealing means, a pair of low vacuum chamber units 410, 420, alignment means 510, 520, 530, vacuum pumping means 610, 622, support means 710, and photocuring means. It is composed.

The base frame 100 forms the exterior of the bonding apparatus in a state of being fixed to the ground, and serves to support other components.

In addition, the upper chamber unit 210 and the lower chamber unit 220 are mounted on the upper and lower ends of the base frame 100, respectively, and are coupled to each other.

The upper chamber unit 210 is tightly fixed to the upper base 211 exposed to the external environment and the bottom surface of the upper base 211, the inside of the upper chamber plate made of a rectangular frame having an arbitrary space 212 is configured.

In this case, an upper stage 230 is provided in an arbitrary space formed in the upper chamber plate 212, and the upper stage 230 is mounted to interlock with the upper chamber unit 210.

In addition, a seal member (hereinafter referred to as a “first seal member”) 213 is provided between the upper base 211 and the upper chamber plate 212 constituting the upper chamber unit 210 to provide the upper chamber plate. Between the inner space and the outer space of 212 is blocked.

In addition, the lower chamber unit 220 is mounted on the lower base 221 fixed to the base frame 100 and on the upper surface of the lower base 221 so as to be movable in the front, rear, left and right directions, and the inside thereof. Is configured to include a lower chamber plate 222 made of a rectangular frame having any space.

In this case, a lower stage 240 is provided in an arbitrary space formed in the lower chamber plate 222, and the lower stage 240 is fixed to an upper surface of the lower base 221.

In addition, a seal member (hereinafter referred to as a “second seal member”) 224 is provided between the lower base 221 constituting the lower chamber unit 220 and the lower chamber plate 222 to provide the second seal. The space between the space provided with the lower stage 240 inside the lower chamber plate 222 and the outer side of the member 224 is blocked.

In addition, at least one support part 225 is provided between the lower base 221 and the lower chamber plate 222 so that the lower chamber plate 222 is spaced apart from the lower base 221 by a predetermined interval. Support to maintain

At this time, one end of the support part 225 is fixed to the bottom of the lower chamber plate 222, and the other end thereof is free to flow in a horizontal direction from a part fixed to the bottom of the lower base 221. Is mounted. The support unit 225 allows the lower chamber plate 222 to be freed from the lower base 221 so that the lower chamber plate 222 can be moved back and forth and left and right.

The first seal member 213 and the second seal member 224 are formed of a sealing material such as a gasket or an O-ring.

In addition, the chamber moving means includes a drive motor 310 fixed to the base frame 100, a drive shaft 320 axially coupled to the drive motor 310, and a direction perpendicular to the drive shaft 320. The connecting shaft 330 connected to receive the driving force from the drive shaft 320 as a state, the connecting portion 340 for connecting the drive shaft 320 and the connecting shaft 330, and the end of the connecting shaft 330 It is configured to include a mounted jockey 350.

At this time, the drive motor 310 is located in the inner bottom of the base frame 100 is composed of a biaxial motor protruding the axis in a direction parallel to the ground.

In addition, the drive shaft 320 is connected to each other to transmit a driving force in a horizontal direction with respect to the two axes of the drive motor 310, the connecting shaft 330 is a driving force in a direction perpendicular to the drive shaft 320 Is connected to pass.

The jockey 350 mounted at the end of the connecting shaft 330 moves upwardly or downwardly according to the rotation direction of the connecting shaft 330 in contact with the upper chamber unit 210. 210 serves to move, and achieves the same configuration as a conventional nut housing.

In addition, the connection part 340 is composed of a bevel gear to transmit the rotational force of the drive shaft 320 transmitted in the horizontal direction to the connection shaft 330 connected in the vertical direction.

Each of the stages 230 and 240 may include fixed plates 231 and 241 fixed to the chamber units 210 and 220, adsorption plates 232 and 242 to which each substrate is fixed, and fixed plates 231 and 241 and adsorption plates 232 and 242. It is configured to include a plurality of fixed blocks (233, 243) provided between.

In this case, each of the adsorption plates 232 and 242 is formed of a polymer-based polyimide, and is composed of an electrostatic chuck (ESC) for fixing each substrate by electrostatic power.

The sealing means is an O-ring (hereinafter referred to as “third seal member”) 250 mounted to protrude to an arbitrary height along the upper surface of the lower chamber plate 222 of the lower chamber unit 220. The third seal member 250 is formed of a conventional rubber material.

In this case, the third seal member 250 has a thickness such that when the upper and lower chamber units 210 and 220 are coupled to each other, a pair of substrates fixed to the stages 230 and 240 of the inner space are not in close contact with each other. It is formed to have.

In addition, each of the low vacuum chamber units 410 and 420 may be formed to have a space forming a vacuum state, and one surface of each of the low vacuum chamber units 410 and 420 may be in close contact with the upper surface of the upper chamber unit 210 and the lower surface of the lower chamber unit 220. .

In this case, each of the low vacuum chamber units 410 and 420 is formed such that the inner space gradually increases toward its central portion.

The shape of the upper chamber unit 210 and the lower chamber unit 220 is coupled to each other when the internal space is vacuumed by the difference in atmospheric pressure with the atmospheric pressure of the outside of the chamber units (210, 220) described above Each stage (230,240) can be bent, in particular, because the degree of warpage gradually increases toward the center portion is to prevent the deflection of the center portion as described above.

The alignment means is used to align positions between the substrates 110 and 120 fixed to the stages 230 and 240, and does not change the position of the lower stage 240, but moves the lower chamber unit 220. By performing the position shift of the upper stage 230, the alignment between the substrates 110 and 120 is performed.

Such an alignment means includes a plurality of linear actuators 510, a plurality of alignment cameras 520, a plurality of cams 530, and a plurality of restoring means (not shown). .

Each of the linear actuators 510 is mounted along the circumference of the upper chamber unit 210, and moves the moving shaft 511 downward so that the moving shaft 511 is lower chamber plate 222 of the lower chamber unit 220. Operate to be accommodated in the receiving groove (222a).

In addition, the linear actuator 510 is corrected so that the upper stage 230 is inclined to be equal to the inclination degree of the lower stage 240 so that the working surfaces of the stages 230 and 240 are horizontal to each other.

The linear actuator 510 should be provided at least at two diagonal corners of the upper chamber unit 210, more preferably at four corners of the upper chamber unit 210.

At this time, the receiving grooves 222a are formed to correspond to the end shapes of the respective moving shafts 511. That is, the bottom surface of each of the moving shafts 511 and the inner surface of the receiving grooves 222a are gradually inclined downward toward the center side thereof.

When the contact between the respective moving shafts 511 and the receiving grooves 222a is made, even if the positions are not exactly matched with each other, the ends of the moving shafts 511 are inclined in the receiving grooves 222a. This is to ensure that the location of each other is exactly matched in the process of receiving guidance.

In addition, each alignment camera 520 is an alignment mark (not shown) of a substrate (not shown) to be fixed to each stage 230 or 240 through the upper chamber unit 210 or the lower chamber unit 220. Is omitted, and at least two or more are positioned to observe at least two diagonal edges of each substrate to be fixed to the upper stage 230 and the lower stage 240.

The vacuum pumping means (610, 622) is provided in at least one chamber unit (210, 220), serves to vacuum the inner space of each chamber unit (210, 220).

The support means 710 is configured to protrude upward through the lower stage 240 to seat the substrate 120 loaded into the lower stage 240 and the bonded substrate seated on the lower stage 240. It serves to unload (110, 120).

Of course, when the substrate 120 is not loaded, the upper surface of the support means 710 is positioned lower than the upper surface of the lower stage 240.

The photocuring means is mounted through at least one of the chamber units 210 and 220 and serves to temporarily cure the seal material applying region of the substrates 110 and 120 fixed to the respective stages 230 and 240. The photocuring means is composed of a UV irradiation unit 800 for performing UV irradiation.

In addition, an upper chamber is further provided on the surface of the lower chamber plate 222 of the lower chamber unit in order to check the gap between the chamber units 210 and 220, and the upper chamber during the bonding process between the substrates 110 and 120. Errors in the movement of the unit 210 can be confirmed in advance.

Hereinafter, the manufacturing method of the liquid crystal display device using the bonding apparatus configured as described above will be briefly described.

First, the 1st board | substrate with which the liquid crystal was dripped, and the 2nd board | substrate with which the sealing material was apply | coated are prepared by another process line.

Inside the space between the chamber units 210 and 220 so that the portion coated with the seal member faces the second substrate coated with the seal member (not shown in the drawing) by a loader (not shown). Bring in

In addition, the upper chamber unit 210 moves downward to bring the upper stage 230 to the loaded second substrate so that the upper chamber unit 210 moves by the vacuum suction force and the electrostatic suction force by the suction plate (electrostatic chuck) 232. The upper stage 230 attaches and raises the loaded second substrate.

When the attachment of the second substrate to the upper stage 230 is completed, the upper chamber unit 210 is raised to return to the original position, and the first substrate on which the liquid crystal is dropped by the loader is located in each chamber unit. It is brought into the space between 210 and 220.

In this state, the support means 710 mounted on the lower stage 240 lifts up, and the loader part is carried out along with the first substrate mounted on the loader part. The support means 710 descends to seat the first substrate on the lower stage 240, and the lower stage 240 fixes the first substrate by using vacuum force and electrostatic force.

When the loading of each substrate is completed, the driving motor 310 of the chamber moving means is driven to rotate the driving shaft 320 and the connecting shaft 330 to move the jockey 350 downward. In this case, the upper chamber unit 210 mounted on the jockey 350 moves gradually downward with the jockey 350.

At this time, since each of the moving shafts 511 is protruded downward by a certain height by the driving of each linear actuator 510, when the upper chamber unit 210 moves downward, the respective moving shafts 511 The end of is received in each receiving groove (222a) and is in contact with the inner surface of each receiving groove (222a).

Thereafter, the moving shaft 511 of each linear actuator 510 is moved downward along the upper chamber unit 210 which is moved downward by the chamber moving means in a state of protruding by the determined protruding height, and the jockey 350 The upper chamber unit 210 mounted on the upper surface of the upper chamber unit 210 continuously contacts the upper surface of the third seal member 250 mounted on the bottom of the upper chamber plate 212 along the circumferential portion of the lower chamber plate 222. do.

In this state, if the jockey portion 350 is continuously moved downward, the jockey portion 350 is taken out of the upper chamber unit 210 and each substrate is formed by the weight and atmospheric pressure of the upper chamber unit 210 itself. The interior space of each chamber unit 210, 220 where the 110, 120 is located is sealed from the exterior space.

In addition, each substrate attached to each of the stages 230 and 240 is pressurized by a predetermined portion by the weight and atmospheric pressure of the upper chamber unit 210.

At this time, the respective substrates are not completely bonded, but are bonded only to the extent that positional variation of any one substrate is possible. The interval between the upper chamber unit 210 and the lower chamber unit 220 is used by the information read by the interval confirmation sensor 920.

In the above state, the vacuum pump means 610 is driven, and the space provided with each substrate is vacuumed. When a full vacuum of the space is made, the alignment of the substrates by the alignment means is performed.

That is, the alignment camera 520 observes each alignment mark formed on each substrate to check the deviation amount between the substrates, and after confirming the distance to which the upper stage 230 should move based on the deviation amount, This is performed by moving the lower chamber plate 222 by manipulating the rotation amount of the cam 530.

In this case, the lower chamber plate 222 is connected to the upper chamber unit 210 by the linear actuator 510, and is spaced apart from the lower base 221 by the support unit 225 at a predetermined interval. If the lower chamber plate 222 is moved in one direction by the rotation of each cam 530, the upper chamber unit 210 is also moved in the movement direction of the lower chamber plate 222.

Particularly, since the lower chamber plate 222 is formed separately from the lower stage 240, only the upper stage 230 is moved to obtain an effect of moving only the upper stage 230. This is possible.

After aligning the substrates and pressing the seal members to be bonded to each other, the release force and the electrostatic force applied to the upper stage 230 are released, and the chamber moving means is operated to move the upper chamber unit 210 to a predetermined height. Raise.

At this time, the second substrate attached to the upper stage 230 maintains a state where the second substrate adhered to the first substrate attached to the lower stage 240 apart from the upper stage 230.

Of course, the rising distance of the upper chamber unit 210 should be increased by a minute height such that the space inside the chamber plates 212 and 222 is kept closed by the third seal member 250 from the external environment.

In this state, the alignment camera 520 again checks the positional alignment between the substrates. In this case, the positional alignment is confirmed using the alignment marks formed on the substrates.

If, as a result of checking the position alignment, the position alignment between the substrates is not precisely made and the error range is exceeded, the position adjustment of the upper stage 230 is performed again using each cam 530.

If the alignment between the substrates is correct as a result of the alignment check, N2 gas is injected into the space in which the substrates are positioned to bring the space into the atmospheric pressure to press the two substrates bonded by the seal material.

That is, since the space between the two substrates bonded to the seal material is in a vacuum state, the two substrates are further pressurized by the difference in air pressure between the respective substrates and the outside to achieve complete bonding.

Then, the seal material of the two bonded substrates is irradiated with UV to cure the seal member, and then the bonded substrate is unloaded.

As the unloading of the bonded substrates is performed as described above, the bonding between the other substrates is repeatedly performed.

However, in the bonding apparatus previously filed by the present applicant as described in FIG. 2 and FIG. 3, after bonding the two substrates together, the vacuum or electrostatic adsorption force provided to the upper stages 121 and 230 is released and the bonding is performed. When the upper stages 121 and 230 are raised to separate the upper stages 121 and 230 from the substrate, a phenomenon in which the substrate is lifted due to the attraction between the upper stages 121 and 230 and the bonded substrates occurs. . Therefore, the first and second bonded substrates are separated or damage is generated to the sealing material to which the two substrates are bonded, so that air is introduced between the two bonded substrates, thereby causing a defect in the bonding process.

4A to 4C are cross-sectional views of the process in the bonding apparatus of FIG. 2 or 3.

As shown in FIG. 4A, the first and second substrates 10 and 20 are loaded into the upper stage 121 or 230 and the lower stage 122 or 240, and the upper stage 121 or 230 is loaded as shown in FIG. 4B. It descends and aligns the first and second substrates 10 and 20, and then presses the seal material to bond.

In addition, when the suction force of the upper stage 121 or 230 is released and the upper stage 121 or 230 is raised before the bonding apparatus is vented, the substrates 10 and 20 bonded to the upper stage 121 or 230. Since the substrate rises due to the attraction of the liver, the bonded first and second substrates are separated or air is introduced between the two substrates, thereby causing a defect in the bonding process.

The present invention forms a separation means in the upper stage (121, 230) to solve this problem.

Referring to the separation means according to the invention in more detail with reference to the accompanying drawings as follows.

5 is a cross-sectional view briefly showing that the separating means are formed in the upper stage in the bonding apparatus according to the present invention.

That is, as shown in FIG. 5, when the upper stage 121 or 230 is raised from the bonded substrates 10 and 20 before or after pressurizing the seal material and venting the chamber, the separation pin 552 is driven. This prevents the substrate from being lifted by the attractive force between the upper stage and the bonded substrate.

FIG. 6 is a plan view of the upper stage in which the separating means according to the present invention is formed, and FIG. 7 is a cross-sectional view of the upper stage along the line II ′ of FIG. 6 according to the first embodiment of the present invention.

In FIG. 2, a moving shaft 131 for elevating the upper stage 121 is installed at the center portion of the upper stage 121. Therefore, the first and second cylinders 550 and 560 for lifting and lowering the separating means are fixed on the upper stage 121 on both sides of the moving shaft. In addition, a power transmission member 551 is installed in the cylinder shaft of each of the cylinders 550 and 560 in parallel to the upper stage 121, and the through hole 553 may penetrate a pin in the upper stage 121. The pins 552 are formed at regular intervals, and a plurality of pins 552 are formed in the power transmission member 551 to vertically move through the through holes 553 in a vertical direction.

Such a configuration can also be applied to the bonding apparatus in FIG. 3.

That is, since the bonding device of FIG. 3 does not have a moving shaft and does not have a separate vacuum chamber, in the configuration as shown in FIGS. 6 and 7, one cylinder 550 is provided at the center of the upper stage 230. And the outflow of air between the through hole 553 and the pin 552 should be blocked. Therefore, an O ring 554 is further provided between the through hole 553 and the pin 552.

8 is a cross-sectional view of the upper stage taken along line II ′ of FIG. 6 according to the second exemplary embodiment of the present invention.

As shown in FIG. 8, the separating means according to the second embodiment of the present invention further includes a through hole 553 as well as an operating space 555 inside the upper stage 121 or 230 for elevating the separating means. Is formed. Accordingly, the first and second cylinders 550 and 560 for elevating the separating means are fixed on the upper stage 121 on both sides of the moving shaft, and the power transmission member 551 is installed in parallel to the upper stage 121, is connected to the power transmission member 551 is formed with a connecting member 557 in the working space, the connecting member 557 in the vertical direction A plurality of pins 552 are formed to allow vertical movement through the through holes 553.

This configuration of the second embodiment of the present invention can also be applied to the bonding apparatus in FIG.

That is, since the cementing apparatus of FIG. 3 does not have a moving shaft and does not have a separate vacuum chamber, in the configuration as shown in FIGS. 6 and 8, one cylinder 550 is provided at the center of the upper stage 230. It should be installed, and the outflow of air should be blocked between the through-hole 553 and the power transmission member 551. Thus, an O-ring 554 is further provided between the through hole 553 and the power transmission member 551.

Such a separating means is not limited to being simply formed in a pin shape, but may be formed in a bar shape.

9-12 are rear views of the upper stage according to the invention.

That is, as shown in FIG. 9, the separating means may not only be formed in a pin shape, but also may be formed in a bar shape as shown in FIGS. 10 to 12.

That is, a recess is formed in a bar shape on the rear surface of the upper stage 121 or 230, and the bar 558 is accommodated in the recess. 6 to 8, the cylinder 550 is fixed to the upper surface of the upper stage 121 or 230, and the power transmission member 551 and / or to the upper stage 121 or 230. A through hole 553 or an operating space 555 is formed to move the connection member 557 so that the bar 558 is connected to the power transmission member 551 or the connection member 557.

10 shows an embodiment in which the bars 558 are formed in one direction, FIG. 11 shows an embodiment in which the bars 558 are arranged in a matrix form, and FIG. 12 shows the bars 558 in a plurality of ring shapes. The embodiment arranged is shown.

In the bonding apparatus according to the present invention as described above, the following effects are obtained.

A separate means for separating the substrate from the upper stage is installed in the upper stage, and the two substrates are bonded together. Then, when the upper stage is raised before and after venting the vacuum chamber, the separated means is bonded from the upper stage using the separating means. The substrate can be separated.

Accordingly, when the upper stage is raised due to the attraction force between the upper stage and the bonded substrate, a phenomenon in which the substrate rises may occur, causing the first and second bonded substrates to be separated or the two substrates bonded to each other. Damage may be generated to prevent the air from flowing in between the two bonded substrates.

1A to 1F are cross-sectional views of a liquid crystal display device according to a conventional liquid crystal dropping method.

Figure 2 is a schematic view showing a bonding apparatus for manufacturing a liquid crystal display device of the first embodiment previously filed by the present applicant

Figure 3 is a schematic view showing a bonding apparatus for manufacturing a liquid crystal display device of the second embodiment previously filed by the present applicant

4A to 4C are cross-sectional views of the process in the bonding apparatus of FIG. 2 or 3.

Figure 5 is a simplified cross-sectional view showing that the separation means are formed in the upper stage in the bonding device according to the present invention

6 is a plan view of an upper stage on which a separating means according to the invention is formed;

7 is a cross-sectional view of the upper stage taken along line II ′ of FIG. 6 according to the first embodiment of the present invention.

8 is a cross-sectional view of the upper stage taken along line II ′ of FIG. 6 according to the second embodiment of the present invention.

9 to 12 are rear views of the upper stage according to the present invention.

Explanation of symbols for the main parts of the drawings

121, 230: upper stage 550, 560: cylinder

551: power transmission member 552: pin

553: through hole 554: o-ring

555: working space 557: connecting member

558: Bar

Claims (22)

A vacuum chamber in which an outlet is formed so as to carry in or take out a substrate while selectively forming a vacuum state or an atmospheric pressure state; An upper stage and a lower stage which are respectively installed in the upper space and the lower space in the vacuum chamber so as to fix and bond the respective substrates brought into the vacuum chamber; And a separating means for separating the substrate bonded to the upper stage from the upper stage. The method of claim 1, The separating means, At least one cylinder fixed to the upper stage for elevating the separating means, A power transmission member installed in parallel with the upper stage and connected to the cylinder shaft of the cylinder; A plurality of through holes formed to penetrate the upper stage; And a plurality of pins connected to the power transmission member to vertically move through the through hole. The method of claim 1, The separating means, At least one cylinder fixed to the upper stage for elevating the separating means, A power transmission member installed in parallel with the upper stage and connected to the cylinder shaft of the cylinder; A plurality of through holes formed to penetrate the upper stage; A plurality of recesses formed in a bar shape on a lower surface of the upper stage; And a plurality of bars connected to the power transmission member and accommodated in the recessed portion so as to vertically move through the through hole. The method of claim 3, wherein And the bar is arranged in one direction. The method of claim 3, wherein And the bars are arranged in a matrix form. The method of claim 3, wherein And the bar is arranged in a ring shape. The method of claim 1, The separating means, At least one cylinder fixed to the upper stage for elevating a separating means, A through hole and a work space formed in the upper stage; A power transmission member installed in parallel with the upper stage and connected to the cylinder shaft of the cylinder; A connection member connected to the power transmission member and installed in a work space; And a plurality of pins connected to the connection member to vertically move through the through hole. The method of claim 1, The separating means, At least one cylinder fixed to the upper stage for elevating a separating means, A through hole and a work space formed in the upper stage; A power transmission member installed in parallel with the upper stage and connected to the cylinder shaft of the cylinder; A connection member connected to the power transmission member and installed in a work space; A plurality of recesses formed in a bar shape on a lower surface of the upper stage; And a plurality of bars connected to the connection member and accommodated in the recessed portion so as to vertically move through the through hole. The method of claim 8, And the bar is arranged in one direction. The method of claim 8, And the bars are arranged in a matrix form. The method of claim 8, And the bar is arranged in a ring shape. A base frame forming an appearance; A lower chamber unit mounted to the base frame and an upper chamber unit positioned above the lower chamber unit in a free state from the base frame; Chamber moving means provided in the base frame to move the upper chamber unit up and down; An upper stage and a lower stage which are respectively provided in an inner space of each chamber unit to fix a pair of substrates; Sealing means provided on a surface of at least one chamber unit to seal the space where each stage is mounted and the outer space when the chamber units are coupled; And And a separating means for separating the substrate bonded to the upper stage from the upper stage. The method of claim 12, The separating means, A cylinder fixed to the upper stage for elevating the separating means, A power transmission member installed in parallel with the upper stage and connected to the cylinder shaft of the cylinder; A plurality of through holes formed to penetrate the upper stage; A plurality of pins connected to the power transmission member to vertically move through the through holes; And an O-ring disposed between the through hole and the pin. The method of claim 12, The separating means, A cylinder fixed to the upper stage for elevating the separating means, A power transmission member installed in parallel with the upper stage and connected to the cylinder shaft of the cylinder; A plurality of through holes formed to penetrate the upper stage; A plurality of recesses formed in a bar shape on a lower surface of the upper stage; A plurality of bars connected to the power transmission member and accommodated in the recess to allow vertical motion through the through hole; And an O-ring disposed between the through hole and the power transmission member. The method of claim 14, And the bar is arranged in one direction. The method of claim 14, And the bars are arranged in a matrix form. The method of claim 14, And the bar is arranged in a ring shape. The method of claim 12, The separating means, A cylinder fixed to the upper stage for elevating a separating means, A through hole and a work space formed in the upper stage; A power transmission member installed in parallel with the upper stage and connected to the cylinder shaft of the cylinder; A connection member connected to the power transmission member and installed in a work space; A plurality of pins connected to the connection member to vertically move through the through holes; And an O-ring disposed between the through hole and the power transmission member. The method of claim 12, The separating means, A cylinder fixed to the upper stage for elevating a separating means, A through hole and a work space formed in the upper stage; A power transmission member installed in parallel with the upper stage and connected to the cylinder shaft of the cylinder; A connection member connected to the power transmission member and installed in a work space; A plurality of recesses formed in a bar shape on a lower surface of the upper stage; A plurality of bars connected to the connection member and accommodated in the recessed portion to allow vertical movement through the through hole; And an O-ring disposed between the through hole and the power transmission member. The method of claim 19, And the bar is arranged in one direction. The method of claim 19, And the bars are arranged in a matrix form. The method of claim 19, And the bar is arranged in a ring shape.