KR100731047B1 - Substrate bonding device for manufacturing a liquid crystal display device - Google Patents

Abstract

The present invention relates to a substrate bonding apparatus for manufacturing a liquid crystal display panel for preventing the bending of the chamber plate due to the pressure difference between the low vacuum chamber and the high vacuum chamber, the upper low vacuum chamber formed on the upper chamber plate, the lower chamber plate formed on the back A lower low vacuum chamber, a sealing member mounted to protrude to an arbitrary height along an upper surface of the lower chamber plate, contacting the upper chamber plate to form a high vacuum chamber therein, and the upper and lower chamber plates, respectively. A high vacuum state having at least two through holes formed, at least two opening and closing means for opening and closing the respective through holes, vacuuming each of the low vacuum chambers in a low vacuum state, and having a higher degree of vacuum in the high vacuum chamber than the low vacuum state Vacuum pumping means for vacuuming with; And an upper stage and a lower stage, respectively provided in the upper chamber plate and the lower chamber plate in the inner space of the high vacuum chamber to fix the substrate.

Liquid Crystal Display Panel, Substrate Bonding Device, Low Vacuum Chamber, High Vacuum Chamber, Through Hole

Description

Substrate bonding device for manufacturing a liquid crystal display device

1 and 2 is a configuration diagram showing a substrate bonding apparatus of the conventional manufacturing equipment of the liquid crystal display panel

3 is a cross-sectional view of a substrate bonding apparatus for manufacturing a liquid crystal display panel according to the present invention.

4 is a schematic structural diagram showing a vacuum pump connection state of a substrate bonding apparatus for manufacturing a liquid crystal display panel according to the present invention;

5 is a schematic structural diagram for explaining the bending of the chamber plate of the substrate bonding apparatus for manufacturing a liquid crystal display panel according to the present invention.

6 is a cross-sectional view of a substrate bonding portion of the substrate bonding apparatus for manufacturing a liquid crystal display panel according to the present invention.

Explanation of symbols for the main parts of the drawings

212: upper plate 222: lower plate

230: upper stage 240: lower stage

410: upper low vacuum chamber 420: lower low vacuum chamber

212a, 222a: Through hole 212b, 222b: Solenoid valve

250: sealing member 242,232: electrostatic chuck

The present invention relates to a substrate bonding apparatus for manufacturing a liquid crystal display panel, and more particularly, to a substrate bonding apparatus and a driving method for manufacturing a liquid crystal display panel for preventing the bending of the chamber plate due to the pressure difference between the low vacuum chamber and the high vacuum chamber.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescent (VFD) Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices. Among them, LCDs are being used a lot while replacing CRTs (Cathode Ray Tubes) for mobile image display devices due to the advantages of excellent image quality, light weight, thinness, and low power consumption.

As described above, although various technical advances have been made in the liquid crystal display panel to serve as a screen display device in many fields, the task of improving the image quality as the screen display device is often arranged with the above characteristics and advantages. .

Therefore, in order for a liquid crystal display device to be used in various parts as a general screen display device, the key to development is how much high quality images such as high definition, high brightness and large area can be realized while maintaining the characteristics of light weight, thinness and low power consumption. It can be said.                         

As a manufacturing method of the liquid crystal display panel as described above, a conventional liquid crystal injection method for injecting liquid crystal through an injection hole of a sealing agent after bonding a substrate in vacuum, and Japanese Patent Application Laid-Open No. 11-089612 (Japanese Patent Laid-Open No. 2000-). 284295) and Japanese Patent Application Laid-Open No. 11-172903 (Japanese Patent Laid-Open No. 2000-005405), for example, a liquid crystal dropping method for bonding one substrate dropping liquid crystals and sealing materials into another substrate in vacuum. It can be divided largely.

FIG. 1 illustrates a substrate bonding apparatus to which a liquid crystal dropping method is applied among the conventional liquid crystal display panel manufacturing methods as described above.

That is, in the conventional substrate bonding apparatus, the frame 10, the stage portions 21 and 22, the sealant discharge portion (not shown), the liquid crystal dropping portion 30, the chamber portion 31, 32), chamber moving means, and stage moving means.

At this time, the stage portion is divided into an upper stage 21 and a lower stage 22, respectively, the sealant discharge portion and the liquid crystal dropping portion 30 is mounted on the side of the position where the bonding process of the frame is made, the chamber The unit is divided into an upper chamber unit 31 and a lower chamber unit 32 so as to be merged with each other.

In addition, the chamber moving means is composed of a drive motor 40 for driving the lower chamber unit 32 to move to the position where the bonding process is performed, or the position where the discharge of the sealant and the dropping of the liquid crystal is performed, The stage moving means is composed of a drive motor 50 for driving the upper stage 21 to move up or down.

Hereinafter, the manufacturing process of the liquid crystal display panel using the conventional substrate bonding apparatus will be described in more detail based on the process sequence.

First, any one substrate 51 is carried in and attached to the upper stage 21 by the loader portion, and the other substrate 52 is carried in and attached to the lower stage 22 by the loader portion. It is fixed.

In this state, the lower chamber unit 32 having the lower stage 22 is moved to the process position S1 for applying the sealant and dropping the liquid crystal as shown in FIG. 1 by the chamber moving means 40. Then, when the application of the sealant by the sealant discharge portion and the liquid crystal dropping portion 30 and the liquid crystal dropping in the above state is completed, the process for bonding between the substrates as shown in FIG. 2 by the chamber moving means 40 again. It moves on the position S2.

Thereafter, the chamber units 31 and 32 are bonded to each other by the chamber moving means 40 to seal the space in which the stages 21 and 22 are located, and to make the space vacuum by a separate vacuum means. do.

The substrate 51 attached to the upper stage 21 is fixed to the lower stage 22 while the upper stage 21 moves downward by the stage moving means 50 in the vacuum state. 52) and the bonding between the substrates through continuous pressurization, the manufacturing of the liquid crystal display panel is completed.

However, the conventional substrate bonding apparatus for manufacturing a liquid crystal display panel as described above has the following problems.

First, since the conventional substrate bonding apparatus is configured to perform a separate sealing agent and a liquid crystal dropping and bonding between the substrates on the substrate on which the thin film transistor is formed and the substrate on which the color filter layer is formed, the size of the overall equipment becomes large. Has In particular, when a conventional substrate bonding apparatus is used to produce a large-size liquid crystal display panel, which has recently been required, the size of the substrate bonding apparatus is further increased.

Second, since the lower substrate unit is configured to move horizontally, the conventional substrate bonding apparatus has a problem in that alignment between the substrates is difficult during the bonding process between the substrates.

Third, in the conventional substrate bonding apparatus, if the sealing between the lower chamber unit and the upper chamber unit is not accurately sealed between each other, the damage of each substrate and the failure of the bonding may be caused during the bonding process due to the inflow of air or various foreign substances through the leakage site. There is a problem.

Fourth, the conventional substrate bonding apparatus has a problem that it takes a lot of time and power to vacuum the space because the space for performing the bonding between the substrates is unnecessarily large.

The present invention is to solve such a problem, it is possible to reduce the size of the bonding apparatus by reducing the movement of the chamber itself, and to reduce the process time and power, as well as the upper part forming the boundary between the high vacuum chamber and the low vacuum chamber And forming a through hole in the lower plate to compensate for the pressure difference between the chambers, and to provide a bonding apparatus capable of preventing the bending of each plate.

In order to achieve the above object, the apparatus for manufacturing a liquid crystal display panel according to the present invention includes an upper low vacuum chamber formed on an upper chamber plate, a lower low vacuum chamber formed on a lower chamber plate, and a lower chamber plate. A sealing member mounted to protrude to an arbitrary height along an upper surface and contacting the upper chamber plate to form a high vacuum chamber therein; at least two through holes respectively formed in the upper and lower chamber plates; At least two opening and closing means for opening and closing a hole, and vacuum pumping means for vacuuming each of the low vacuum chambers in a low vacuum state and vacuuming the high vacuum chamber in a high vacuum state having a higher degree of vacuum than the low vacuum state; In addition, the upper chamber plate and the lower chamber plate of the inner space of the high vacuum chamber are respectively provided, characterized in that it comprises an upper stage and a lower stage for fixing the substrate.

Here, the at least two through holes are formed in the central portion of each of the upper plate and the lower plate.

The upper chamber plate and the upper low vacuum chamber is characterized in that it is installed to move up and down by a drive device.

The upper stage and the lower stage are characterized by being fixed to the upper plate and the lower plate by fixing blocks, respectively.

At least one of the lower surface of the upper stage or the upper surface of the lower stage is provided with at least one electrostatic chuck (ESC) so as to be able to fix the substrate by providing a constant power and the substrate is supplied with a vacuum force At least one vacuum hole is further formed so as to allow the adsorption fixation of.

The sealing member is characterized in that it comprises an O-ring made of a rubber material.

The opening and closing means is characterized in that it comprises a solenoid valve.

A preferred embodiment of the bonding apparatus for manufacturing a liquid crystal display panel according to the present invention having the above characteristics will be described in more detail with reference to the accompanying drawings.

3 is a cross-sectional view of a substrate bonding apparatus for manufacturing a liquid crystal display panel according to the present invention, FIG. 4 is a schematic structural diagram showing a vacuum pump connection state of a substrate bonding apparatus for manufacturing a liquid crystal display panel according to the present invention, and FIG. It is a schematic structural diagram for demonstrating the curvature of the chamber plate of the board | substrate bonding apparatus for liquid crystal display panel manufacture which concerns on this.

The substrate bonding apparatus for manufacturing the liquid crystal display panel according to the present invention has been previously filed (see Korean Patent Applications 10-2002-0071366, 10-2002-0071368, 10-2002-0071370 and 10-2002-0071714).

As shown in FIGS. 3 and 4, the substrate bonding apparatus for manufacturing a liquid crystal display panel according to the present invention includes a base frame 100, an upper chamber unit 210, a lower chamber unit 220, and chamber moving means. And an upper stage 230 and a lower stage 240, a sealing means, an alignment camera, an alignment means, an interlocking means, a support means, a vacuum pumping means and a low vacuum and high vacuum chamber. do.                     

Here, the base frame 100 is fixed to the ground to form the appearance of the bonding device and to support each other configuration.

In addition, the upper chamber unit 210 and the lower chamber unit 220 are mounted on the upper and lower ends of the base frame 100, respectively, and operated to be coupled to each other.

The upper chamber unit 210 is tightly fixed to the upper base 211 exposed to the external environment and the bottom surface of the upper base 211, the inside of the upper chamber plate made of a rectangular frame having an arbitrary space 212 is configured.

At this time, the upper stage 230 is fixed in any space formed in the upper chamber plate 212, the upper stage is mounted to interlock with the upper chamber unit.

In addition, a first seal member 213 is provided between the upper base 211 and the upper chamber plate 212 constituting the upper chamber unit 210, so that the inner space and the outer space of the upper chamber plate 212 are simplified. Is blocked.

In addition, the lower chamber unit 220 is mounted on the lower base 221 fixed to the base frame 100 and on the upper surface of the lower base 221 so as to be movable in the front and rear and left and right directions. The interior is configured to include a lower chamber plate 222 made of a rectangular frame having any space.

In this case, a lower stage 240 is provided in an arbitrary space formed in the lower chamber plate 222, and the lower stage 240 is fixed to an upper surface of the lower base 221.                     

Of course, the lower chamber unit 220 may further include a support plate 223 for stable fixing between the base frame 100 and the lower base 221.

In addition, since the second seal member 224 is provided between the lower base 221 constituting the lower chamber unit 220 and the lower chamber plate 222, the lower seal 224 is lowered based on the second seal member 224. The space between the lower stage 240 provided inside the chamber plate 222 and the outer space other than the space is blocked.

The first seal member 213 and the second seal member 224 described above include a gasket, an O-ring, or the like formed of a material for sealing.

In addition, at least one support portion 225 is provided between the lower base 221 and the lower chamber plate 222, and the support portion 225 has the lower chamber plate 222 at the lower base 221. ) So as to be kept spaced apart from the predetermined interval.

In addition, one end of the support part 225 is fixed to the bottom of the lower chamber plate 222, and the other end thereof is mounted to the bottom of the lower base 221 to allow free flow in the horizontal direction.

Therefore, the lower chamber plate 222 is freely moved from the lower base 221 by the support part 225.

In addition, the chamber moving means includes a drive motor 310 fixed to the base frame 100, a drive shaft 320 axially coupled to the drive motor 310, and a direction perpendicular to the drive shaft 320. It comprises a connecting shaft 330, a connecting portion 340 for connecting the drive shaft 320 and the connecting shaft 330, and a jockey portion 350 mounted on the end of the connecting shaft 330.

At this time, the drive motor 310 is located in the inner bottom of the base frame 100 is composed of a biaxial motor protruding the axis in a direction parallel to the ground.

In addition, the drive shaft 320 is connected to each other to transmit a driving force in a horizontal direction with respect to the two axes of the drive motor 310, the connecting shaft 330 is a driving force in a direction perpendicular to the drive shaft 320 Is connected to pass.

The jockey 350 mounted at the end of the connecting shaft 330 moves upwardly or downwardly along the rotational direction of the connecting shaft 330 in contact with the upper chamber unit 210. 210 serves to move, and constitutes a nut housing.

In addition, the connection part 340 is composed of a bevel gear to transmit the rotational force of the drive shaft 320 transmitted in the horizontal direction to the connection shaft 330 connected in the vertical direction.

Each of the stages 230 and 240 may include fixed plates 231 and 241 fixed to the chamber units 210 and 220, adsorption plates 232 and 242 to which the substrates are fixed, and respective fixing plates 231 and 241 and adsorption plates 232 and 242. It is configured to include a plurality of fixed blocks (233, 243) provided between.

At this time, each of the adsorption plates 232 and 242 is composed of an electrostatic chuck (ESC) for fixing each substrate by electrostatic power.

In addition, a plurality of vacuum holes (not shown) are formed in each of the suction plates 232 and 242 to transfer the vacuum suction force.

The sealing means is an O-ring (hereinafter referred to as a “third seal member”) mounted to protrude to an arbitrary height along the upper surface of the lower chamber plate 222 of the lower chamber unit 220 ( 250, the third seal member 250 is formed of a rubber material.

At this time, the third seal member 250 is a pair of substrates (110, 120 of FIG. 4) fixed to each stage (230, 240) of the inner space when the chamber unit (210, 220) is coupled between It is formed to have a thickness that is not in close contact with each other. Of course, when the third seal member 250 is compressed, it is natural that the pair of substrates are formed to have a thickness enough to be in close contact with each other.

In addition, the alignment means is provided in the lower chamber unit 220 and performs positioning and alignment between the substrates 110 and 120.

In addition, the interlocking means 510 serves to interlock the chamber units 210 and 220 so that the chamber units 210 and 220 may be moved by the same distance in the same direction.

The interlocking means 510 has a receiving groove 222a formed on the lower chamber plate 222 surface of the lower chamber unit 220, and one end is fixed to the upper chamber unit 210 to move into the receiving groove 222a. A plurality of linear actuators 511 are included to drive 512 to be received.

Position alignment of the lower stage 240 is not made by the aligning means and the interlocking means configured as described above, but the position of the upper stage 230 is changed by the movement of the lower chamber unit 220. Sorting is performed.

The support means is configured to protrude upwardly through the lower stage 240 to seat the substrate loaded onto the lower stage 240 and to unload the bonded substrate seated on the lower stage 240. To play a role.

Of course, when the loading of the second substrate 120 is not made, the upper surface of the support means is positioned lower than the upper surface of the lower stage 240.

In addition, the vacuum pumping means (610, 621, 622) is provided in at least one chamber unit (210, 220), serves to vacuum the inner space of each chamber unit (210, 220).

Further, upper and lower low vacuum chambers 410 and 420 are further included at the bottoms of the upper and lower chamber plates 222 of the upper chamber plate 212 to prevent bending of the plates 212 and 222 as much as possible. Each of the low vacuum chambers 410 and 420 is configured to be evacuated by the respective low vacuum pumps 621 and 622.

That is, the upper chamber plate 212 is fixedly mounted on the lower portion of the upper low vacuum chamber 410, and the lower chamber plate 222 is fixedly mounted on the upper portion of the lower low vacuum chamber 420.

In the high vacuum chamber, an inner space of each of the chamber units 210 and 220 in which the substrates 110 and 120 are positioned by the third seal member 250 is sealed from the outer space.                     

The closed space is selectively in a high vacuum state by the vacuum pumping device.

Hereinafter, a process of vacuum pumping the inside of the chamber of the cementation apparatus will be described.

The first low vacuum pump 621 passes through the central portion of the upper chamber 410 and the upper chamber plate 212, the high vacuum chamber pipe for communicating the high vacuum pump 610 and the internal space of each chamber plate (212, 222) ( 630 is operated to vacuum the space to a predetermined pressure.

In addition, the second low vacuum pump 622 may include a first low vacuum chamber pipe 641 and a second low vacuum pump pipe 642 that penetrate the side of the upper chamber plate 212 and the side of the lower chamber plate 222. ) And a substrate adsorption pipe (not shown) connected to a vacuum pipe formed inside each stage 230 or 240 for vacuum adsorption of the substrates 110 and 120, respectively.

In addition, each of the pipes is preferably provided with at least one on-off valve. At this time, the high vacuum chamber pipe 630 is provided with a pressure sensor 670 to measure the pressure in the space in which the substrate 110, 120 is fixed.

In addition, each of the pipes 641, 642 and 650, through which the second low vacuum pump 622 communicates, is also used as a pipe for venting. At the time of venting, the inner space of each chamber unit 210 or 220 forming a vacuum is at atmospheric pressure. Gas (eg, N ₂ gas) is injected so that it can be changed to.

The operation of the substrate bonding apparatus will be described below.

First, when the high vacuum chamber is opened while the upper chamber unit 210 including the upper low vacuum chamber 410 and the upper chamber plate 212 moves upward by the driving means, the substrates to be bonded by the substrate loading means. The first and second substrates 110 and 120 are loaded into the upper stage 230 and the second substrate 120 is absorbed and fixed to the lower stage 240, respectively.

Subsequently, alignment of the substrate is performed, and the upper chamber unit 210 is moved downward by the driving means, so that the high vacuum chamber is sealed by the third seal member 250 and the first substrate 110 and the second substrate are sealed. 120 is coalesced. In this case, the low vacuum chambers 410 and 420 maintain a low vacuum state, and the high vacuum chamber is formed at a constant level by driving the high vacuum pump 610 after forming low vacuum by driving the first low vacuum pump 621. It is selectively maintained in a high vacuum state above the vacuum pressure.

The reason why the low vacuum chambers 410 and 420 are provided around the high vacuum chamber is to prevent the upper plate 212 and the lower plate 222 from being bent due to a sudden pressure difference between the vacuum pressure and the atmospheric pressure of the high vacuum chamber. To do this.

After the bonding of the substrates 110 and 120 is primarily performed in a high vacuum state, the vacuum pumping operation is stopped and gas is injected to reach the inside of the high vacuum chamber to an atmospheric pressure level. In this case, since the inside of the bonded first substrate 110 and the second substrate 120 is in a high vacuum state and the outside thereof is atmospheric pressure, the second and second substrates 120 are more firmly bonded by the pressure difference between the inside and the outside of the substrates 110 and 120. As a result, the bonding between the substrates is completed.

Thereafter, the high vacuum chamber is opened and the substrate bonded by the substrate loading means (not shown) is taken out to be transferred to the next process step.

However, as shown in FIG. 5, in the high vacuum chamber forming the space between the upper chamber plate 212 and the lower chamber plate 222, the vacuum pressure is in the range of 1 Pa (Pascal), and the low vacuum chambers 410 and 420 are provided. Since the vacuum pressure in the range of 1000 Pa, the upper chamber plate 212 and the lower chamber plate 222 locally bend due to the pressure difference between the high vacuum chamber and the low vacuum chamber.

As described above, when the chamber plates 212 and 222 are bent, the upper and lower stages 230 and 240 fixed to the plates are also affected, and thus, the substrates 110 and 120 to be bonded are also bent and accurately. It is difficult to bond the substrates. In particular, as the substrates 110 and 120 to be bonded are largely reduced, the area of each chamber plate 212 and 222 of the bonding apparatus is increased to increase the occurrence of the warpage phenomenon.

6 is a cross-sectional view of a substrate bonding part of the substrate bonding apparatus for manufacturing a liquid crystal display panel according to the present invention.

Therefore, through holes 212a and 222a are formed in the upper chamber plate 212 and the lower chamber plate 222 which divide the low vacuum chambers 410 and 420 and the high vacuum chamber in the substrate bonding apparatus for manufacturing a liquid crystal display panel according to the present invention. do.

Here, two or more through-holes 212a and 222a are formed to uniformly compensate the pressure difference between the chambers over the entire upper and lower chamber plates 212 and 222. Since the bending of the chamber plates 212 and 222 due to the pressure difference between the chambers is mainly concentrated in the center of each chamber plate, the plurality of through holes 212a and 222a are formed in the center of the upper and lower plates 212 and 222. It is preferable to.

Solenoid valves 212b and 222b are installed in the respective through holes 212a and 222a to open and close the through holes 212a and 222a according to an external control signal.

When the opening and closing control method of the solenoid valve (212b, 222b) of the substrate bonding apparatus according to the present invention formed as described above are as follows.

When the high vacuum chamber is opened while the upper chamber unit 210 including the upper low vacuum chamber 410 and the upper chamber plate 212 moves upward by a driving means, the solenoid valves 212b and 222b are externally controlled. It is closed by a signal. In the state in which the solenoid valves 212b and 222b are closed, the respective low vacuum chambers 410 and 420 are vacuumed inside the respective low vacuum pumps 621 and 622.

Subsequently, the substrates 110 and 120 to be bonded by the substrate loading means are loaded and the first substrate 110 is absorbed and fixed to the upper stage 230 and the second substrate 120 to the lower stage 240, respectively.

Subsequently, alignment of the substrate is performed, and the upper chamber unit 210 is moved downward by the driving means to be sealed to the outside by the third seal member 250 to form a high vacuum chamber, and the first substrate 110. ) And the second substrate 120 are bonded. When the high vacuum chamber is formed by the third seal member 250 as described above, the solenoid valves 212b and 222b formed in the through holes 212a and 222a are opened to open the low vacuum chambers 410 and 420 and the high vacuum chamber. Make sure that the vacuum level is the same.

That is, when the high vacuum chamber is maintained at a high vacuum state equal to or higher than a predetermined vacuum pressure by driving the first low vacuum pump 621 and the high vacuum pump 610 without opening the solenoid valves 212b and 222b. Similarly, there is a possibility that the upper and lower chamber plates 212 and 222 are bent by the pressure difference between the low vacuum chambers 410 and 420 and the high vacuum chamber.

Therefore, the solenoid valves 212b and 222b are opened to maintain the high vacuum chamber and the low vacuum chamber in the same vacuum state, and then the high vacuum chamber is in a low vacuum state by driving the first low vacuum pump 621. After the high vacuum pump 610 is driven, the high vacuum chamber is maintained at a high vacuum state of a predetermined vacuum pressure or more.

As such, after the bonding of the substrates 110 and 120 is primarily performed in a high vacuum state, the vacuum pumping operation is stopped and gas is injected into the high vacuum chamber to reach the inside of the high vacuum chamber to an atmospheric pressure level. In this case, since the inside of the bonded first substrate 110 and the second substrate 120 is in a high vacuum state and the outside thereof is atmospheric pressure, the second and second substrates 120 are more firmly bonded by the pressure difference between the inside and the outside of the substrates 110 and 120. As a result, the bonding between the substrates is completed.

Thereafter, the high vacuum chamber is opened and the solenoid valve is closed so that the upper and lower low vacuum chambers remain in a low vacuum state, and the substrate bonded by a substrate loading means (not shown) is taken out to be transferred to the next process step. .

The substrate bonding apparatus for manufacturing a liquid crystal display panel according to the present invention as described above has the following effects.

First, the substrate bonding apparatus of the present invention does not need to move the chamber itself, and only performs bonding of the loaded substrate, thereby reducing the size of the bonding apparatus. In particular, in the case of bonding the large-area reduced substrate, only the size of the bonding portion needs to be adjusted, so that the increase in the size of the incidental portion can be suppressed to the maximum.

Second, the substrate bonding apparatus of the present invention can facilitate the alignment between the substrates during the bonding process between the substrate because the upper chamber unit only vertical movement up and down.

Third, the substrate bonding apparatus of the present invention configures the space of the high vacuum chamber provided to the bonding portion as small as possible and minimizes the movement of the chamber during opening and closing of the high vacuum chamber, thereby reducing the inflow of air or various foreign substances during the process. Can reduce the occurrence of defects.

Fourth, since the substrate bonding apparatus of the present invention minimizes the space of the high vacuum chamber for performing the bonding between the substrates, the time and power required to vacuum the space can be greatly reduced.

Fifth, the substrate bonding apparatus of the present invention is provided with a low vacuum chamber around the high vacuum chamber in order to compensate for the pressure difference between the high vacuum chamber operated in a high vacuum state and the outside at atmospheric pressure to perform a more stable vacuum operation. .

Sixth, in the substrate bonding apparatus of the present invention, through holes are formed in upper and lower plates forming a boundary between the high vacuum chamber and the low vacuum chamber. Therefore, the bonding operation can be performed more precisely by compensating the pressure difference between the chambers and preventing the bending of each chamber plate existing between the high vacuum chamber and the low vacuum chamber.

Claims (7)

An upper low vacuum chamber formed on the upper chamber plate; A lower low vacuum chamber formed on the lower chamber plate back surface; A sealing member mounted to protrude to an arbitrary height along an upper surface of the lower chamber plate and in contact with the upper chamber plate to form a high vacuum chamber therein; At least two through holes respectively formed in the upper and lower chamber plates; At least two opening and closing means for opening and closing each through hole; Vacuum pumping means for vacuuming each of the low vacuum chambers in a low vacuum state and vacuuming the high vacuum chamber in a high vacuum state having a higher degree of vacuum than the low vacuum state; And And an upper stage and a lower stage which are respectively provided in the upper chamber plate and the lower chamber plate in the inner space of the high vacuum chamber to fix the substrate, respectively. delete The method of claim 1, And the upper chamber plate and the upper low vacuum chamber are installed to be moved up and down by a driving device. The method of claim 1, And the upper stage and the lower stage are fixed to the upper plate and the lower plate by fixing blocks, respectively. The method of claim 1, At least one of the lower surface of the upper stage or the upper surface of the lower stage is provided with at least one electrostatic chuck (ESC) so as to be able to fix the substrate by providing a constant power and the substrate receives a vacuum force At least one vacuum hole is formed so that the adsorption and fixing of the liquid crystal display panel manufacturing apparatus for bonding the substrate. The method of claim 1, The sealing member is a substrate bonding apparatus for manufacturing a liquid crystal display panel comprising an O-ring made of a rubber material. The method of claim 1, The opening and closing means substrate bonding apparatus for manufacturing a liquid crystal display panel, characterized in that it comprises a solenoid valve.

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