KR20050024959A - A solution supply method and chemical solution supply apparatus in use the semiconductor device fabrication installation - Google Patents

Abstract

PURPOSE: An apparatus and a method for supplying a chemical solution are provided to decrease the slurry cost and the filter cost using even residual of the bottom of a drum by adding a cleaning function to a filter. CONSTITUTION: An apparatus for supplying a chemical solution in a semiconductor fabrication equipment includes a chemical solution source, a first supply line, a filter unit and a filter cleaning part. The chemical solution stored in a chemical solution source(130) is supplied to a process line through the first supply line(102). The chemical solution is filtered by the filter unit(110) installed in the first supply line. Foreign matters within the filter unit are removed by the filter cleaning part.

Description

TECHNICAL SOLUTION SUPPLY METHOD AND CHEMICAL SOLUTION SUPPLY APPARATUS IN USE THE SEMICONDUCTOR DEVICE FABRICATION INSTALLATION

The present invention relates to a chemical liquid supply device and a method thereof, and more particularly, to a chemical liquid supply device and a method of a semiconductor manufacturing facility that can extend the use period of the filter and at the same time use the remaining amount of the chemical liquid drum.

The CMP process for planarizing the wafer surface has several problems. Among them, the most issue is micro scratch. It is known that the root cause of this microscratch is the slurry used for polishing.

In general, the CMP process for planarizing the substrate surface is based on the characteristics of the slurry (oxide slurry) itself, it is based on not using a portion of the drum in which the deposit is accumulated (about 10-15% of the total drum).

The reason for this is that due to the nature of the slurry itself, precipitates (slurry hardens and large particles settle at the bottom of the drum) occur due to various reasons such as transportation / storage / temperature. This deposit is the main cause of the filter feed cycle of the slurry feeder, which reduces the filtering efficiency (increasing the PM rate and increasing the filter cost). In this case, the use cycle of the filter becomes shorter, and furthermore, a problem such as a blockage of the filter and an increase in supply pressure occurs.

As such, in the current CMP process, the cost burden is being increased by not using the remaining amount of the lower drum (approximately 10-15%) for the expensive slurry (which depends on the total amount of import).

The technical problem to be achieved by the present invention is a chemical liquid supply apparatus and method of a new type of semiconductor manufacturing equipment that can be used to filter the remaining amount of the drum lower with the same level (quality) slurry while maintaining the function of the filter. To provide.

In order to achieve the above technical problem, the chemical liquid supply apparatus of the present invention includes a first supply line for supplying the chemical liquid contained in the chemical liquid supply source to the processing device; A filter unit installed on the first supply line to filter the chemical liquid; And a filter cleaning unit for removing impurities and the like inside the filter unit.

According to an embodiment of the present invention, the filter cleaning unit comprises a cleaning liquid supply source; A bag-line connected to the first supply line such that a cleaning liquid of the cleaning liquid supply source is supplied in a reverse direction of the filter unit; A front-line branched from the backline and connected to the first supply line such that the cleaning liquid is supplied in the forward direction to the filter unit, and a pump for varying the supply pressure of the cleaning liquid supplied to the filter unit.

According to an embodiment of the present invention, the filter cleaning unit further includes a purge gas supply unit for removing the cleaning liquid remaining in the filter unit.

According to an embodiment of the present invention, a chemical liquid supply apparatus of a semiconductor manufacturing facility includes a second supply line connecting the chemical liquid supply source and a semiconductor facility; A control unit which is supplied through the second supply line when the chemical liquid remains above the reference value in the chemical liquid supply source and is supplied through the first supply line when the chemical liquid remains below the reference value in the chemical liquid supply source; The apparatus may further include a vibration generator for applying vibration to the filter unit to effectively remove impurities adhering to the filter unit.

In order to achieve the above technical problem, the chemical liquid supply method of the present invention comprises the steps of supplying a chemical liquid from the chemical liquid supply source to the filter unit; Supplying the chemical liquid filtered in the filter unit to a processing device; After the chemical liquid supply is completed, the step of cleaning the filter unit.

According to an embodiment of the present invention, the supplying step comprises the steps of: detecting a chemical amount of the chemical liquid source; Controlling the flow of the chemical liquid such that the chemical liquid is supplied to the filter unit when the amount of the chemical liquid of the chemical liquid supply source is equal to or lower than a reference value, and vice versa.

According to an embodiment of the invention, the step of supplying to the processing device; Mixing the chemical liquid with ultrapure water; Circulating the chemical liquid mixed with the ultrapure water, preventing stagnation of the chemical liquid, and waiting in a supply tank for supplying the processing apparatus.

According to an embodiment of the present invention, the cleaning step may include supplying a cleaning liquid to the filter unit in a reverse direction; And a primary rinse consisting of supplying purge gas to the filter unit in a reverse direction.

According to an embodiment of the present invention, the cleaning step may include: supplying a cleaning liquid to the filter unit in a forward direction after completing the first cleaning; And a secondary cleaning step comprising supplying purge gas to the filter unit in a reverse direction.

According to an embodiment of the present invention, the cleaning step is supplied with the cleaning liquid and purge gas having a change in pressure to the filter unit.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the spirit of the present invention to those skilled in the art will fully convey. Portions denoted by like reference numerals denote like elements throughout the specification.

1 is a block diagram of a slurry supply apparatus according to a preferred embodiment of the present invention. 2 is a view for explaining a filter cleaning unit.

The slurry supply apparatus 100 of the present invention is a mixing unit for mixing a predetermined amount (200W) of the slurry (a, b), the filter unit 110, the slurry stock solution containing a predetermined amount of deionized water (DIW) is accommodated 120, the supply unit 130 for supplying the slurry to the processing apparatus in which the CMP process proceeds while circulating the slurry mixed with deionized water is not stagnant and the filter cleaning unit for regenerating the primary filter (see FIG. 2). Shown).

A first supply line 102 is connected to the drum a, and the filter unit 110 is installed in the first supply line 102. The pump 109 is installed at a position adjacent to the drum in the first supply line. This pump is a pump for supplying the slurry to the mixing section. The second supply line 104 bypassing the filter unit 110 is connected to the first supply line 102. For example, if the remaining amount of drum remains above the reference value (approximately 10-15% of the total capacity), the slurry is supplied through the second supply line 104. When the remaining amount of the drum is less than the reference value, the slurry is first filtered through the filter unit 110 of the first supply line 102 and then supplied. That is, the filter unit 110 is used to supply the remaining amount (about 10-15% of the total drum amount) of the lower drum, where a lot of sediment (particles with large particles) is accumulated.

To this end, the drum (a) and the detection unit 180 for detecting the remaining amount of the drum. It has a valve control unit 182 for controlling the valves (v1, v2) in accordance with the data detected by the detection unit, by which the slurry of the first supply line 102 and the second supply line 104 It will flow to either line. Valves installed in other lines are of course also controlled by the valve control unit.

The mixing unit 120 is a mixing tank 122 in which the slurry stock solution and the deionized water are mixed, a circulation line 124 for circulating the mixed slurry so as to mix the slurry and the deionized water more uniformly, and a mixing installed in the circulation line. Pump 126 and the like. The mixing slurry mixed in the mixing tank is provided to the supply unit 130.

The supply unit 130 is a supply tank 132 receiving the mixed slurry, a circulation line 134 for circulating the mixed slurry stored in the supply tank 132 so as not to be stagnant and a supply pump 136 installed in the circulation line. It includes, and the mixing slurry is supplied to each processing apparatus through which the CMP process is performed through the lines 138 connected to the circulation line.

As shown in FIG. 1, the slurry stock solution is filtered in the secondary filter unit 170 before being supplied to the mixing tank 122, and in the tertiary filter unit 172 before being supplied to the processing apparatus from the supply tank 132. Filtered. In other words, the slurry containing relatively less sediment is supplied to the treatment apparatus after two filtration processes through the second supply line 104, and the slurry containing a large amount of sediment is supplied to the first supply line 102. After the first filtration process separately from the filter unit 110, the filtration process is performed twice, and then supplied to the treatment apparatus.

2 is a view for explaining the configuration of the filter unit 110 and the filter cleaning unit 140 in more detail.

Referring to FIG. 2, the first supply line 102 is divided into two branch lines, and each branch line is provided with a primary filter unit 150.

As shown in FIG. 6, the primary filter unit 150 includes a filter housing 152 and a filter 154. The filter housing 152 has an inlet port 156a through which the slurry is introduced, a discharge port 156b through which the filtered slurry is discharged, an inlet drain port 156c connected to the inlet port side, and a discharge port connected to the outlet port side. Side drain port 156d, and a vent port 156e at the top of the filter housing.

The filter cleaning unit 140 supplies ultrapure water and wet nitrogen gas to the primary filter unit 150 in the reverse and forward directions, respectively, to purge the inside of the filter and purge it. The filter cleaning unit 140 has an ultrapure water supply source 142, an ultrapure water supply line 143, a wet nitrogen gas supply source 144, and a wet nitrogen gas supply line 144a. The wet nitrogen gas supply line 144a is connected to the ultrapure water supply line 143. The ultrapure water supply line 143 is branched into the back-line 143a and the front-line 143b and connected to the first supply line 102. The cleaning liquid (or wet nitrogen gas) is supplied to the reverse direction of the primary filter unit 150 through the bag-line 143a and the forward direction of the primary filter unit 150 through the front-line 143b. Is supplied. The cleaning liquid (or wet nitrogen gas) supplied to the primary filter unit 150 is discharged through the first and second drain lines 106 and 108 connected to the first supply line. For example, the lines 143a and 143b to which the cleaning liquid is supplied and the drain lines 106 and 108 from which the cleaning liquid are discharged are preferably connected to the first supply line 102 adjacent to each other.

As shown in FIG. 3, the filter cleaning unit 140 may further install a pump 147 in the cleaning solution supply line in order to increase the cleaning efficiency of the primary filter unit 150. Ultrapure water supplied to the primary filter unit 150 is a pulsation generated by the operation of the pump 147, it is possible to increase the cleaning efficiency of the filter compared to the ultrapure water supplied at a constant pressure.

In addition, as shown in FIG. 4, the filter cleaner 140 may install an ultrasonic generator 148 in the primary filter unit 150 to more effectively clean the inside of the primary filter unit 150. have. When the ultrasonic generator 148 is used, vibration is generated inside the primary filter unit to increase the filter cleaning effect. The ultrasonic generator 148 is preferably operated in the step of supplying the ultrapure water. For example, in addition to the ultrasonic generator, a vibration motor capable of generating vibration with the filter unit may be used.

When the vibration generator is installed in the primary filter unit 150, the connection portion of the filter housing 152 and the lines is preferably fixed by a bracket having a vibration pad that can withstand vibration.

As the cleaning liquid for cleaning the primary filter unit, ultrapure water or ultrapure water containing a washing solution having solubility in particles to be filtered may be used.

The supply method in the slurry supply apparatus which has the structure mentioned above is demonstrated, referring FIG.7 and FIG.2.

First, when a slurry supply signal is generated (s12), the detection unit 180 detects whether or not the slurry remains above the reference value in the drum (a) (s14). If the remaining amount of the drum (a) remains above the reference value (approximately 10-15% of the total capacity), the slurry is supplied to the mixing unit 120 through the second supply line 104 (standard slurry supply path) (s16). If the residual amount of the drum falls below the reference value, the particle (precipitate) amount (or particle size) contained in the slurry is increased, and thus, it is necessary to undergo an additional filtration process. Accordingly, the supply path of the slurry is changed from the second supply line to the first supply line by the valve controller 182. The slurry supplied to the first supply line 102 is first filtered through the primary filter unit 150 and then supplied to the mixing unit 120 (S18). When the slurry of the drum a is exhausted, the valve v3 of the drum a is closed, and the valve v4 of the other drum b filled with the slurry is opened and replaced (s20 and s22). And the slurry is supplied to the mixing unit 120 along the second supply line 104 through the replaced drum (b).

In the meantime, the cleaning of the primary filter unit 150 installed in the first supply line 102 is performed (s24). The cleaning of the filter unit consists of primary cleaning and secondary cleaning.

As shown in FIG. 5, the primary cleaning is supplied with ultrapure water for cleaning to the primary filter unit 150 through the bag-line 143a. At this time, the slurry residues adhered to the filter surface are separated. Then, wet nitrogen gas is first supplied to the primary filter unit 150 through the bag-line 143a to remove the ultrapure water and the remaining slurry residues. For reference, the wet nitrogen gas may be intermediately supplied in the step of supplying the ultrapure water. This may also be one method for increasing the cleaning efficiency. Ultrapure water, wet nitrogen gas and debris supplied to the primary filter unit 150 are discharged through the first drain line 106. This flow is indicated by the dashed line in FIG. 5.

Secondary washing is supplied to the primary filter unit 150 through the front line 143b for ultrapure water for cleaning. The wet nitrogen gas is first supplied to the primary filter unit 150 through the front line 143b to remove the ultrapure water supplied. Ultrapure water and wet nitrogen gas supplied to the primary filter unit are discharged through the second drain line 108. This flow is indicated by dashed lines in FIG. 6.

The reason for supplying the wet nitrogen gas in the secondary cleaning is to prevent the inside of the filter unit from drying out and to maintain the optimum state.

As such, when the filter regeneration process by cleaning the filter is finished, the first filter unit 150 and the first supply line wait in a state filled with wet nitrogen gas (s26), and the time required for the wetting operation of the filter unit. You can also save.

On the other hand, the present invention is a slurry supply device consisting of the above configuration can be variously modified and can take various forms. It is to be understood, however, that the present invention is not limited to the specific forms referred to in the above description, but rather includes all modifications, equivalents and substitutions within the spirit and scope of the invention as defined by the appended claims. It should be understood to do.

In the above, the configuration and operation of the slurry supply apparatus and the method according to the present invention is shown according to the above description and drawings, which are merely described for example, and various changes and modifications within the scope without departing from the technical spirit of the present invention. Of course this is possible.

As described above, according to the present invention, by adding the filter cleaning function, the entire drum amount can be used, thereby reducing the slurry cost, and reducing the filter cost and extending the filter period. In particular, the filtration efficiency can be improved by regenerating the filter function by washing the primary filter unit.

1 is a block diagram of a slurry supply apparatus according to a preferred embodiment of the present invention;

2 is a view for explaining the filter unit and the filter cleaning unit in detail;

3 shows a filter cleaner with a pump added;

4 is a view showing a filter cleaner in which an ultrasonic generator is added;

5 and 6 are views for explaining the cleaning process of the primary filter unit;

7 is a flow chart of the slurry feeding process according to the present invention.

* Explanation of symbols for the main parts of the drawings

102: first supply line

104: second supply line

110: filter unit

120: mixing section

130: supply unit

140: filter cleaning unit

150: primary filter unit

Claims (27)

1. An apparatus for supplying a chemical liquid to a processing apparatus for processing a semiconductor device using the chemical liquid: Drug source; A first supply line for supplying the chemical liquid contained in the chemical liquid supply source to the processing apparatus; A filter unit installed on the first supply line to filter the chemical liquid; And a filter cleaning unit for removing impurities and the like inside the filter unit. The method of claim 1, The filter cleaning unit Cleaning liquid source; And a back-line connected to the first supply line such that the cleaning liquid of the cleaning liquid supply source is supplied in a reverse direction of the filter unit. The method of claim 2, The filter cleaning unit And a front-line branched from the back line and connected to the first supply line such that a cleaning liquid is supplied to the filter unit in a forward direction. The method of claim 2, The filter cleaning unit And a unit for varying the supply pressure of the cleaning liquid which is provided in the back line and supplied to the filter unit. The method of claim 4, wherein And the unit is a pump. The method according to claim 2 or 3, The filter cleaning unit And a purge gas supply unit for removing the cleaning liquid remaining in the filter unit. The method of claim 6, The purge gas supply unit chemical liquid supply device of the semiconductor manufacturing equipment, characterized in that for supplying the wet nitrogen gas (wet N2) containing a lot of moisture to the back-line or front-line. The method of claim 2, The cleaning solution is a chemical liquid supply device of the semiconductor manufacturing equipment, characterized in that DIW or DIW containing a cleaning solution having solubility in the filtering target particles. The method of claim 1, The filter unit A filter housing; A filter installed in the filter housing; The filter housing may include an inlet port through which chemical liquid is introduced; A discharge port through which the filtered chemical liquid is discharged; An inlet side drain port connected to the inlet port side; And a discharge side drain port connected to the discharge port side. The method of claim 1, The chemical liquid supply device of the semiconductor manufacturing equipment A second supply line connecting the chemical liquid supply source and the semiconductor facility; If the chemical liquid remains above the reference value in the chemical supply source is supplied through the second supply line, and if the chemical liquid remains below the reference value in the chemical supply source further comprises a control unit to be supplied through the first supply line The chemical liquid supply apparatus of the semiconductor manufacturing equipment characterized by the above-mentioned. The method of claim 10, The control unit Valves installed in the first supply line and the second supply line; A detection unit for detecting a chemical liquid amount of the chemical liquid supply source; And a control unit which receives the signal detected by the detection unit and controls the valves to determine a supply direction of the chemical liquid. The method of claim 1, The chemical liquid supply device of the semiconductor manufacturing equipment And a vibration generator for applying vibration to the filter unit to effectively remove impurities adhering to the filter unit. The method of claim 12, The vibration generator is a chemical supply device of the semiconductor manufacturing equipment, characterized in that the ultrasonic generator. The method of claim 1, The chemical liquid supply device of the semiconductor manufacturing equipment A mixing tank supplied with the chemical liquid passed through the filter unit and mixed with ultrapure water; And a supply tank for receiving the chemical liquid mixed with the ultrapure water from the mixing tank and circulating the chemical liquid by a supply pump to prevent stagnation of the chemical liquid and to supply the chemical liquid to the processing apparatus. Chemical liquid supply device. 1. An apparatus for supplying a chemical liquid to a processing apparatus for processing a semiconductor device using the chemical liquid: Drug source; A first supply line for supplying the chemical liquid contained in the chemical liquid supply source to the processing apparatus; A filter unit installed on the first supply line to filter the chemical liquid; A second supply line for bypassing said filter unit and supplying it to said processing apparatus; A mixing tank configured to receive the chemical liquid from the first supply line or the second supply line and to mix the ultrapure water; A supply tank receiving the chemical liquid mixed with the ultrapure water from the mixing tank and circulating the chemical liquid by a supply pump to prevent stagnation of the chemical liquid and to supply the chemical liquid to the processing apparatus; And And a filter cleaning unit for removing impurities and the like inside the filter unit. The method of claim 15, The filter cleaning unit cleans the filter unit while the chemical liquid is supplied to the second supply line, The filter cleaning unit Cleaning liquid source; A bag-line connected to the first supply line such that a cleaning liquid of the cleaning liquid supply source is supplied in a reverse direction of the filter unit; A front-line branched from the bag-line and connected to the first supply line such that a cleaning liquid is supplied to the filter unit in a forward direction; And a purge gas supply unit for purging the filter unit and its pipe inside cleaned by the cleaning liquid. The method of claim 15, The chemical liquid supply device of the semiconductor manufacturing equipment When the amount of the chemical liquid in the chemical liquid supply source remains above the reference value, the chemical liquid is supplied through the second supply line, and when the amount of the chemical liquid in the chemical liquid supply source remains below the reference value, the chemical liquid is controlled to be supplied through the first supply line. The chemical liquid supply device of the semiconductor manufacturing equipment, further comprising a control unit. The method of claim 15, The chemical liquid supply device of the semiconductor manufacturing equipment And a vibration generator for applying vibration to the filter unit to effectively remove impurities adhering to the filter unit. In the chemical liquid supply method in a semiconductor manufacturing facility: Supplying the chemical liquid from the chemical liquid source to the filter unit; Supplying the chemical liquid filtered in the filter unit to a processing device; And after the chemical liquid supply is completed, cleaning the filter unit. The method of claim 19, Detecting a chemical amount of the chemical liquid source; Controlling the flow of the chemical liquid so that the chemical liquid is supplied to the filter unit when the amount of the chemical liquid of the chemical liquid supply source is lower than a reference value, and vice versa, and supplied by bypassing the filter unit. The method of claim 19, The washing step is characterized in that while the chemical liquid is supplied bypassing the filter unit The method of claim 19, Supplying to the processing apparatus; Mixing the chemical liquid with ultrapure water; Circulating the chemical liquid mixed with the ultrapure water, preventing stagnation of the chemical liquid, and waiting in a supply tank for supplying to the processing apparatus. The method of claim 19, The cleaning step Supplying a cleaning liquid to the filter unit in a reverse direction; The chemical liquid supply method of the semiconductor manufacturing equipment characterized by including the 1st washing | cleaning which consists of supplying purge gas to the said filter unit in the reverse direction. The method of claim 23, wherein The cleaning step After the first cleaning, supplying the cleaning liquid to the filter unit in the forward direction; And supplying purge gas to the filter unit in a reverse direction. The method of claim 23 or 24, The purge gas is a chemical liquid supply method in a semiconductor manufacturing equipment, characterized in that using a wet nitrogen gas containing moisture. The method of claim 23 or 24, The cleaning step And a cleaning liquid and a purge gas are supplied to the filter unit with a change in pressure. The method of claim 23 or 24, The cleaning step The method of claim 1 further comprising the step of applying vibration to the filter unit.