KR20050023843A - Apparatus for transferring wafer - Google Patents

Apparatus for transferring wafer Download PDF

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Publication number
KR20050023843A
KR20050023843A KR1020030061373A KR20030061373A KR20050023843A KR 20050023843 A KR20050023843 A KR 20050023843A KR 1020030061373 A KR1020030061373 A KR 1020030061373A KR 20030061373 A KR20030061373 A KR 20030061373A KR 20050023843 A KR20050023843 A KR 20050023843A
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KR
South Korea
Prior art keywords
wafer
blade
protrusion
seating surface
protrusions
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KR1020030061373A
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Korean (ko)
Inventor
이정희
Original Assignee
삼성전자주식회사
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Priority to KR1020030061373A priority Critical patent/KR20050023843A/en
Publication of KR20050023843A publication Critical patent/KR20050023843A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Abstract

PURPOSE: An apparatus for transferring a wafer is provided to guide a wafer placed unstably due to the moving speed to a wafer loading area by forming protrusions on the blade surface of a robot arm. CONSTITUTION: An apparatus for transferring a wafer includes a wafer loading surface and a plurality of protrusions. The wafer loading area is formed on the upper surface of a blade. At least one of protrusion is formed on the upper surface of the blade for guiding a wafer to a wafer loading area. Six of the protrusions are formed around the wafer loading area. The plurality of protrusions are made of the same material as the blade. The plurality of protrusions are made of ceramics.

Description

웨이퍼 이송 장치{Apparatus for transferring wafer}Wafer transfer device {Apparatus for transferring wafer}

본 발명은 웨이퍼 이송 장치에 관한 것으로, 보다 구체적으로는 웨이퍼 이송 장치의 블레이드 구조에 관한 것이다. The present invention relates to a wafer transfer device, and more particularly, to a blade structure of a wafer transfer device.

최근에, 반도체 소자가 미세화 및 고집적화되고, 반도체 생산이 대량화됨에 따라서, 작업자에 의한 웨이퍼의 오염을 방지하고, 생산성을 향상시키기 위하여 로봇(Robot)을 이용하여 반도체 소자의 제조 공정을 진행한다. In recent years, as semiconductor devices have been miniaturized and highly integrated, and semiconductor production has been mass-produced, manufacturing processes of semiconductor devices are performed using robots to prevent wafer contamination by workers and to improve productivity.

도 1은 일반적인 반도체 식각 설비의 로봇 암 상측을 개략적으로 나타낸 사시도이다.1 is a perspective view schematically showing an upper side of a robot arm of a general semiconductor etching facility.

도 1을 참조하면, 웨이퍼(도시되지 않음)가 거치되는 2개의 블레이드(Blade:10)와 셔틀(shuttle:12)이 나사 결합되어 있다. 블레이드(10)은 세라믹 제질로 구성될 수 있으며, 각 블레이드(10)와 셔틀(12)이 나사결합되는 부위의 블레이드 상부에는 홀(16,17)이 설치되어 있다. 이때, 블레이드(10)의 상면에는 웨이퍼 안착면(10a)이 마련되어 있다. Referring to FIG. 1, two blades 10 mounted on a wafer (not shown) and a shuttle 12 are screwed together. The blade 10 may be made of ceramic material, and holes 16 and 17 are installed in the upper portion of the blade where the blade 10 and the shuttle 12 are screwed. At this time, the wafer seating surface 10a is provided on the upper surface of the blade 10.

또한, 블레이드(10)가 연결되지 않은 셔틀(12)단부에는 셔틀(12)과 수직 연장되는 중앙축(18)이 바닥판(18) 상부에 형성되어 있다. 또한, 중앙축내부에는 관통홀(도시되지 않음)이 위치되고, 관통홀내에 셔틀 샤프트(도시되지 않음)가 삽입 고정된다. In addition, a central shaft 18 extending perpendicular to the shuttle 12 is formed on the bottom plate 18 at the end of the shuttle 12 to which the blade 10 is not connected. Further, a through hole (not shown) is located inside the central shaft, and a shuttle shaft (not shown) is inserted and fixed in the through hole.

이러한 로봇암의 블레이드(10)는 웨이퍼 카세트(도시되지 않음)에 위치한 웨이퍼를 픽업(pick-up)하여 반도체 식각 설비로 이송한다.The blade 10 of the robot arm picks up a wafer located in a wafer cassette (not shown) and transfers the wafer to a semiconductor etching facility.

그러나, 웨이퍼 이송시, 식각 설비 문제로 인해, 웨이퍼가 블레이드(10)의 안착면(10a)으로부터 이탈되는 경우가 종종 발생된다. 이러한 경우, 웨이퍼가 블레이드상에 불안정하게 위치되므로 이송중 추락되거나, 손상되는 문제점이 있다.However, during wafer transfer, there are often cases in which the wafer is separated from the seating surface 10a of the blade 10 due to etching equipment problems. In this case, since the wafer is unstablely positioned on the blade, there is a problem of falling or damaging during transfer.

따라서, 본 발명이 이루고자 하는 기술적 과제는 웨이퍼가 블레이드상에 불안정한 상태로 놓여지더라도, 안착면으로 용이하게 이동되도록 하여, 웨이퍼 이송시 웨이퍼의 추락 및 손상을 방지할 수 있는 웨이퍼 이송 장치를 제공하는 것이다. Therefore, the technical problem to be achieved by the present invention is to provide a wafer transfer apparatus that can be easily moved to the seating surface, even if the wafer is placed in an unstable state on the blade, thereby preventing the fall and damage of the wafer during wafer transfer. will be.

상기한 본 발명의 목적을 달성하기 위하여, 본 발명은, 웨이퍼를 이송하는 블레이드를 포함하는 웨이퍼 이송 장치에 있어서, 상기 블레이드는 웨이퍼가 안착되는 웨이퍼 안착면을 포함하고, 상기 블레이드 표면에는 상기 웨이퍼를 웨이퍼 안착면으로 가이들링하기 위한 적어도 하나의 돌기부가 형성되어 있다.In order to achieve the above object of the present invention, the present invention, in the wafer transfer apparatus comprising a blade for transferring the wafer, the blade includes a wafer seating surface on which the wafer is seated, the blade surface on the wafer At least one protrusion is formed for guiding to the wafer seating surface.

상기 돌기부는 상기 웨이퍼 안착면 주위로 6개 배치될 수 있다. 상기 돌기부는 블레이드와 동일한 재질, 예를 들어 세라믹으로 구성될 수 있다.Six protrusions may be disposed around the wafer seating surface. The protrusion may be made of the same material as the blade, for example, ceramic.

(실시예)(Example)

이하 첨부한 도면에 의거하여 본 발명의 바람직한 실시예를 설명하도록 한다. 그러나, 본 발명의 실시예들은 여러 가지 다른 형태로 변형될 수 있으며, 본 발명의 범위가 아래에서 상술하는 실시예들로 인해 한정되어지는 것으로 해석되어져서는 안 된다. 본 발명의 실시예들은 당업계에서 평균적인 지식을 가진 자에게 본 발명을 보다 완전하게 설명하기 위해서 제공되어지는 것이다. 따라서, 도면에서의 요소의 형상 등은 보다 명확한 설명을 강조하기 위해서 과장되어진 것이며, 도면상에서 동일한 부호로 표시된 요소는 동일한 요소를 의미한다. Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape and the like of the elements in the drawings are exaggerated to emphasize a more clear description, and the elements denoted by the same reference numerals in the drawings means the same elements.

도 2는 본 발명의 블레이드를 나타낸 평면도이다.2 is a plan view showing a blade of the present invention.

도 2에 도시된 바와 같이, 본 발명의 블레이드(110)는 웨이퍼가 안착될 만큼의 폭, 예를 들어, 웨이퍼의 직경과 같거나 큰 폭을 가진다. 이러한 블레이드(110)의 중앙 부위에는 홀(160 또는 170)이 형성되어 있고, 홀(160,170)이 형성된 부분에 웨이퍼 안착면(115)이 마련된다. As shown in FIG. 2, the blade 110 of the present invention has a width sufficient to seat the wafer, for example, a width equal to or greater than the diameter of the wafer. Holes 160 or 170 are formed in the central portion of the blade 110, and a wafer seating surface 115 is provided in a portion where the holes 160 and 170 are formed.

이때, 웨이퍼 이송시, 설비상의 문제점으로 인하여 블레이드(110)상의 웨이퍼가 안착면(115)에서 벗어나 틀어질 수 있다.At this time, during the wafer transfer, the wafer on the blade 110 may be displaced from the seating surface 115 due to equipment problems.

본 실시예에서는 이러한 문제점을 해결하기 위하여 블레이드(110) 표면에 웨이퍼를 안착면으로 가이드(guide)하기 위한 적어도 하나의 돌기부(117)가 마련된다. 이때, 돌기부(117)는 홀(160,170)을 중심으로 상하 3개씩 총 6개일 수 있고, 블레이드(110)와 동일한 재질로 형성됨이 바람직하다. 본 실시예에서의 블레이드(110) 및 돌기부(117)는 예를 들어 세라믹(ceramic)으로 구성될 수 있다. In this embodiment, at least one protrusion 117 is provided on the surface of the blade 110 to guide the wafer to the seating surface. At this time, the protrusion 117 may be a total of six each of the top and bottom three around the holes (160,170), it is preferably formed of the same material as the blade 110. In the present embodiment, the blade 110 and the protrusion 117 may be made of, for example, ceramic.

이렇게 웨이퍼가 안착되는 블레이드(110) 표면에 웨이퍼 안착면 주위로 돌기부(117)가 형성되면, 웨이퍼 이송시 로봇(블레이드)의 움직이는 속도에 의해 웨이퍼가 움직이게 될 때, 돌기부(117)들이 웨이퍼를 웨이퍼 안착면으로 가이들링함으로써, 웨이퍼가 이동중 추락되는 문제를 감소시킬 수 있다. When the protrusion 117 is formed around the wafer seating surface on the surface of the blade 110 on which the wafer is seated, when the wafer is moved by the moving speed of the robot (blade) during wafer transfer, the protrusions 117 move the wafer. By guiding to the seating surface, it is possible to reduce the problem of the wafer falling during movement.

도 3은 본 발명에 따른 블레이드가 결합된 반도체 식각 설비의 로봇 암을 나타낸 사시도이다.3 is a perspective view of a robot arm of a semiconductor etching apparatus combined with a blade according to the present invention.

도 3에 도시된 바와 같이, 돌기부(117)을 구비하는 블레이드(110)는 셔틀(120)과 나사결합된다. 블레이드(110) 및 돌기부(117)는 상술한 바와 같이 세라믹 재질로 구성되며, 돌기부(117)는 웨이퍼 이송시 웨이퍼를 웨이퍼 안착면으로 가이들링하는 역할을 한다. 각 블레이드(110)와 셔틀(120)이 나사결합되는 부위의 블레이드 상부에는 홀(160,170)이 설치되어 있으며, 블레이드(110) 상면에는 웨이퍼가 용이하게 안착될 수 있도록 웨이퍼 안착면(115)이 단차를 가지고 마련되어 있다. 또한, 블레이드(110)가 연결되지 않은 셔틀(120) 단부에는 셔틀(120)과 수직 연장되는 중앙축(180)이 바닥판(190) 상부에 형성된다.As shown in FIG. 3, the blade 110 having the protrusion 117 is screwed with the shuttle 120. The blade 110 and the protrusion 117 are made of a ceramic material as described above, and the protrusion 117 guides the wafer to the wafer seating surface during wafer transfer. Holes 160 and 170 are installed in the upper portions of the blades at which the blades 110 and the shuttles 120 are screwed, and the wafer seating surface 115 is stepped on the upper surface of the blades 110 so that the wafers can be easily seated. It is prepared with. In addition, at the end of the shuttle 120 to which the blade 110 is not connected, a central axis 180 extending vertically with the shuttle 120 is formed on the bottom plate 190.

이러한 로봇암의 블레이드(110)는 얕은 두께에 의하여 웨이퍼 카세트(도시되지 않음)로부터 식각설비로, 또는 식각 설비로부터 웨이퍼 카세트로 움직이면서 웨이퍼를 픽업(pick-up)하여 이송한다. 이때, 웨이퍼 이송시 웨이퍼가 블레이드상에 불완전하게 안착되더라도, 블레이드가 움직이는 속도 및 블레이드 표면에 설치된 가이드용 돌기부에 의해 안착면으로 움직이게 되므로, 웨이퍼의 추락 및 이로 인한 손상을 방지할 수 있다.The blade 110 of the robot arm picks up and transports the wafer while moving from the wafer cassette (not shown) to the etching facility or from the etching facility to the wafer cassette by a shallow thickness. At this time, even if the wafer is incompletely seated on the blade during the transfer of the wafer, since the blade is moved to the seating surface by the moving speed and the guide protrusion installed on the blade surface, it is possible to prevent the fall of the wafer and the damage caused by the wafer.

이상에서 자세히 설명한 바와 같이, 본 발명에 의하면, 웨이퍼를 이송시키는 로봇암의 블레이드 면에 블레이드와 동일한 재질로 돌기부를 설치한다. 돌기부는 이동 속도에 의해서 불안정하게 배치된 웨이퍼를 웨이퍼 안착면으로 가이들링시키는 역할을 한다. As described in detail above, according to the present invention, the protrusion is formed on the blade surface of the robot arm for transferring the wafer with the same material as the blade. The protrusions serve to guide the wafers unstablely placed by the moving speed to the wafer seating surface.

이에따라, 웨이퍼 이송중 웨이퍼의 추락이나 이로 인한 손상을 방지할 수 있다. Accordingly, it is possible to prevent the fall of the wafer during the wafer transfer or the damage caused by the wafer.

이상 본 발명을 바람직한 실시예를 들어 상세하게 설명하였으나, 본 발명은 상기 실시예에 한정되지 않고, 본 발명의 기술적 사상의 범위 내에서 당 분야에서 통상의 지식을 가진 자에 의하여 여러가지 변형이 가능하다.Although the present invention has been described in detail with reference to preferred embodiments, the present invention is not limited to the above embodiments, and various modifications may be made by those skilled in the art within the scope of the technical idea of the present invention. .

도 1은 일반적인 반도체 식각 설비의 로봇 암 상측을 개략적으로 나타낸 사시도이다.1 is a perspective view schematically showing an upper side of a robot arm of a general semiconductor etching facility.

도 2는 본 발명의 블레이드를 나타낸 평면도이다.2 is a plan view showing a blade of the present invention.

도 3은 본 발명에 따른 블레이드가 결합된 반도체 식각 설비의 로봇 암을 나타낸 사시도이다.3 is a perspective view of a robot arm of a semiconductor etching apparatus combined with a blade according to the present invention.

-도면의 주요 부분에 대한 부호의 설명-Explanation of symbols on main parts of drawing

110 : 블레이드 115 : 웨이퍼 안착면110: blade 115: wafer seating surface

117 : 돌기부 120 : 셔틀117: protrusion 120: shuttle

160, 170 : 홀 180 : 중앙축160, 170: hole 180: center axis

Claims (4)

웨이퍼를 이송하는 블레이드를 포함하는 웨이퍼 이송 장치에 있어서,In a wafer transfer apparatus comprising a blade for transferring a wafer, 상기 블레이드는 웨이퍼가 안착되는 웨이퍼 안착면을 포함하고, The blade includes a wafer seating surface on which the wafer is seated, 상기 블레이드 표면에는 상기 웨이퍼를 웨이퍼 안착면으로 가이들링하기 위한 적어도 하나의 돌기부가 형성되어 있는 것을 특징으로 하는 웨이퍼 이송 장치.And at least one protrusion is formed on the blade surface for guiding the wafer to a wafer seating surface. 제 1 항에 있어서, 상기 돌기부는 상기 웨이퍼 안착면 주위로 6개 배치되는 것을 특징으로 하는 웨이퍼 이송 장치.The wafer transfer apparatus of claim 1, wherein six protrusions are disposed around the wafer seating surface. 제 1 항 또는 제 2 항에 있어서, 상기 돌기부는 블레이드와 동일한 재질로 구성되는 것을 특징으로 하는 웨이퍼 이송 장치.The wafer transfer apparatus of claim 1 or 2, wherein the protrusion is made of the same material as that of the blade. 제 3 항에 있어서, 상기 돌기부는 세라믹으로 구성되는 것을 특징으로 하는 웨이퍼 이송 장치.The wafer transfer apparatus of claim 3, wherein the protrusion is made of ceramic.
KR1020030061373A 2003-09-03 2003-09-03 Apparatus for transferring wafer KR20050023843A (en)

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