KR20050016728A - A process for preparation of metal sticker - Google Patents

A process for preparation of metal sticker

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Publication number
KR20050016728A
KR20050016728A KR1020050005229A KR20050005229A KR20050016728A KR 20050016728 A KR20050016728 A KR 20050016728A KR 1020050005229 A KR1020050005229 A KR 1020050005229A KR 20050005229 A KR20050005229 A KR 20050005229A KR 20050016728 A KR20050016728 A KR 20050016728A
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KR
South Korea
Prior art keywords
metal
sticker
layer
film
mold
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KR1020050005229A
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Korean (ko)
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KR100498262B1 (en
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김광곤
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김광곤
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Application filed by 김광곤 filed Critical 김광곤
Priority to KR10-2005-0005229A priority Critical patent/KR100498262B1/en
Publication of KR20050016728A publication Critical patent/KR20050016728A/en
Application granted granted Critical
Publication of KR100498262B1 publication Critical patent/KR100498262B1/en
Priority to CNA2005100904717A priority patent/CN1831202A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00Processes for producing special ornamental bodies
    • B44C5/005Processes for producing special ornamental bodies comprising inserts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00Processes for producing special ornamental bodies
    • B44C5/04Ornamental plaques, e.g. decorative panels, decorative veneers
    • B44C5/0469Ornamental plaques, e.g. decorative panels, decorative veneers comprising a decorative sheet and a core formed by one or more resin impregnated sheets of paper
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Making Paper Articles (AREA)

Abstract

PURPOSE: A manufacturing method of a metal sticker is provided to decrease deposition of metal in plating, and to product the flat and clean metal sticker by preventing corrosion of the photosensitive film in plating. CONSTITUTION: A photosensitive film(2) is formed by spreading photosensitive solution on the uneven surface of a metal substrate(1), and the printed film with the sticker type design is mounted on the photosensitive film after drying. The design is printed by irradiating ultraviolet rays, and the transparent region is exposed to the light and hardened. After removing the film, the metal sticker manufacturing die is formed by washing the portion of the photosensitive film not to be exposed to the light and drying with heating. A thin nickel film layer is formed in the uneven part in which the photosensitive film is removed, and a conductive plating layer is formed on the thin nickel film layer. The color pint layer is formed on the conductive plating layer, and a protection tape is covered thereon. An adhesive layer is covered in the lower part of the plating layer and covered by a release tape.

Description

금속스티커 제조방법{A process for preparation of metal sticker}A process for preparation of metal sticker

본 발명은 금속스티커의 제조방법에 관한 것으로서, 특히 금속스티커 제조에서 금속스티커의 모형을 음각되게(음각스티커) 제조할때에는 스티커형 도안외의 넓은 부위는 망상형의 도안을 형성한 스티커 제조용 필름을 사용하므로서 스티커형 도금시에 금속이 망상형으로 석출되게하여 도금용 금속소요량이 적게들게하고 완성된 금속스티커용 금형은 무수크롬산 수용액에 침지시켜 금형의 감광막에 침투되게하여 금속도금시에 금형의 경화된 감광막이 도금액에의해 부식되는 것을 방지하여 금속도금층이 일그러지거나 거칠게되지 않고 선명하고 평활하게 도금되게하고, 금속스티커 제조용 금형에서 금속도금층이 형성된 직후 그 도금층의 표면을 바로 보호테이프로 보호하거나, 그 도금층의 표면에는 각종 색상의 칼라인쇄층을 형성한 다음 보호테이프로 보호하므로서 스티커를 사용시 다양한 색상을 나타낼 수가 있는 금속스티커를 제조하는 방법에 관한 것이다.The present invention relates to a method of manufacturing a metal sticker, in particular, when manufacturing a metal sticker model (engraved sticker) engraved (engraved sticker) in the metal sticker, a wide area other than the sticker-type pattern is used for the film for sticker production in the form of a reticulated pattern Therefore, the metal is precipitated into a reticulated form during sticker plating, so that the metal requirement for plating is reduced, and the finished metal sticker mold is immersed in an aqueous solution of chromic anhydride and penetrated into the photosensitive film of the mold to harden the mold during metal plating. It prevents the photoresist from being corroded by the plating solution so that the metal plating layer is plated clearly and smoothly without distorting or roughening, and immediately protects the surface of the plating layer with a protective tape immediately after the metal plating layer is formed in a metal sticker manufacturing mold, or the plating layer Form a color printing layer of various colors on the surface of the When using the Pro protecting hameuroseo sticker to a method for producing a metal sticker that can exhibit a variety of colors.

종래에는 금속스티커 제조를 위해서는 금속기판상에 감광막을 형성하고 그 감광막 위에 각종 금속스티커 형태의 도안이 인쇄된 필름을 적층한 다음 그 위에 자외선을 조사하여 도안이 인쇄된 불투명부위를 제외한 나머지 투명부위를 감광시킨 후 필름을 제거하여 물로 세척하므로서 스티커형 도안으로 인하여 노광되지 않은 불투명부위는 세척되어 금형의 요부(금속기판)가 노출되고, 투명하여 자외선에의해 감광된 부위는 경화되어 금속기판에 부착된 상태로 구성되어 스티커형 요부가 형성된 금속스티커 제조용 금형을 얻고, 그 얻어진 금형에의해 전기도금을 하여 금속도금층을 형성한 다음, 그 도금층이 형성된 금형 상부에 보호테이프를 부착하여 금형으로부터 그 보호테이프와 그것의 저면에 부착된 금속스티커형 도금층을 박리한 다음, 그 저면에 접착제를 도포하고 그 접착제 저면에는 이형지를 부착하여 사용전까지 보관, 유지되도록하여 왔으나, 상기와 같은 종래의 금속스티커 제조방법에서는 금속스티커가 양각일때는 금속스티커형 금형면적이 넓지 않으므로 그 금형으로 금속스티커를 성형하기위해 도금을 행할때에 도금에 필요한 금속소비량(석출양)이 적어서 문제가 없었으나, 금속스티커를 음각으로 제조할때에는 그 금속스티커형 음각부보다 그 주변의 양각 면적이 넓어서, 즉 도6(a)에 도시된 바와같이, 그 스티커 제조를 위한 필름은 스티커형 도안외에 필름의 대부분이 불투명부위(a)(a')여서 그 필름으로 스티커를 제조시에 스티커용 금형의 넓은 면적(a)(a')을 금속도금층으로 형성해야하므로 그 넓은 면적의 금속도금층 전체에 도금을 위한 금속석출양이 엄청나게 많아지게되어 도금용 금속소모가 많은 결점이 있었고, 또한 종래의 방식대로 스티커형 요부가 형성된 금형을 얻은 다음, 그 금형을 아무런 약품 처리없이 그대로 금속스티커 성형용 금형으로 사용하여 금속도금을 하게되면 감광, 경화된 감광막(PVA+감광제)이 금속도금액에의해 부식되어 금속스티커형 금속도금층이 평활하고 매끈하게 성형되지 못하고 감광막이 부식된 부위만큼 지그재그형태로 일그러지거나 거친 형태로 금속스티커형 금속도금층이 성형되는 결점이 있게되고, 또한 종래의 금속스티커 제조방법에 의해서는 도금용으로 사용하는 금속의 색상에 의해서면 금속스티커의 색상이 달라질 뿐 사용되는 금속색상외의 임의의 색상으로 금속스티커 표면에 각종 색상을 표시하는 것은 불가능하여 스티커의 색상이 단조로운 결점도 있었다.Conventionally, in order to manufacture a metal sticker, a photoresist film is formed on a metal substrate, and various metal sticker patterns are printed on the photoresist film, and then the ultraviolet rays are irradiated on the photoresist to expose the transparent parts except for the opaque areas where the designs are printed. After removing the film and washing it with water, the opaque parts that are not exposed due to the sticker-type pattern are washed to expose the recessed part (metal substrate) of the mold, and the part exposed to ultraviolet rays is cured and attached to the metal substrate. A metal mold for manufacturing a metal sticker having a sticker-shaped recess formed thereon, and electroplating with the obtained mold to form a metal plating layer, and then attaching a protective tape on the upper part of the metal mold on which the plating layer is formed, and the protective tape and the same from the mold. Peel off the metal sticker type plating layer attached to the bottom of the It has been applied to the adhesive and attached to the bottom of the adhesive to maintain and maintain until the use, but in the conventional metal sticker manufacturing method as described above, when the metal sticker is embossed, since the metal sticker-type mold area is not wide, the metal into the mold When plating to form a sticker, there was no problem because the amount of metal consumed (plating amount) required for plating was small, but when manufacturing a metal sticker in an intaglio, the area of the embossed area was larger than that of the metal sticker type intaglio. As shown in Fig. 6 (a), the film for manufacturing the sticker has a large area of the sticker mold when the sticker is manufactured with the film because most of the film is an opaque part (a) (a ') in addition to the sticker type pattern. Since (a) (a ') must be formed of a metal plating layer, the amount of metal deposition for plating on the entire metal plating layer of a large area may be enormously increased. There was a drawback that there was a lot of metal consumption for gold, and after obtaining the mold with the sticker-shaped recess in the conventional manner, and then using the mold as a metal sticker molding mold without any chemical treatment, the metal plating was performed. (PVA + photosensitive agent) is corroded by the metal plating solution so that the metal sticker type metal plating layer is not smooth and smooth, and the metal sticker type metal plating layer is zigzag-shaped or coarse as the photosensitive film is corroded. In addition, according to the conventional metal sticker manufacturing method, the color of the metal sticker varies depending on the color of the metal used for plating, and it is impossible to display various colors on the surface of the metal sticker with an arbitrary color other than the metal color used. The color of the sticker was monotonous.

본 발명은 상기한 바와같은 종래의 금속스티커 제조에 있어서, 음각 금속스티커의 제조시에 과량의 금속 석출양을 필요로하게되는 불편함과, 금속스티커 제조용 금형을 얻은 후 아무런 약품처리없이 금속스티커형 금속도금을 하게됨에 따라 그 금속도금시에 PVA와 중크롬산 칼륨을 주성분으로한 감광막이 금속도금액에의해 부식되어 금속스티커형 도금층이 평활하고 매끈하게 도금되지 못하는 결점과, 완성된 금속스티커의 표면에 각종 필요한 색상을 나타낼 수 없는 결점을 해소하여, 음각 스티커성형용의 필름은 스티커형 도안외의 부위를 망상형으로 도형한 필름을 사용하여 금속스티커 제조용 금형을 얻고 그 금형을 사용하여 금속스티커를 제조하므로써 금속스티커가 음각되게 도금되어 스티커도안 표시부위보다 훨씬 넓은 주변의 나머지 부위가 망상형이 되게 제조되므로 이와같이 금속스티커를 제조하게되면 망상형 도금구조에 따라 최소량으로 금속이 석출되게하고, 또한 금속스티커 제조용 금형을 완성후 그 금형을 스티커 제조용으로 사용하기전에 금형이 완성됨과 동시에 무수크롬산 용액에 침지시켜 그 감광막표면에 피막이 형성되게한 후 가열처리하여 고정하므로서 감광막을 닉켈과 같은 금속도금액에의해 부식되지 않도록 보호한 상태에서 염산수용액과 염화닉켈로된 혼합물속에서 순간 전기도금처리하여 닉켈박막도금층(스트라이크)을 형성시킨후, 니켈이나 기타 금속으로 전주도금(電鑄鍍金)을 행하므로써 금속도금액에 의해 PVA와 중크롬산 카리(또는 암모늄)가 주성분인 감광막이 부식되지 않도록 보호하면서 도금을 할 수가 있게하고, 또한 금속스티커 제조용 금형으로 소정의 스티커형태의 금속도금층, 즉 금속스티커를 성형한 다음 그 금속스티커가 성형된 금형 상면에 직접 보호테이프를 부착하거나 상기 금속도금층(금속스티커층)의 상면에 필요로하는 소정의 색상으로 칼라인쇄를 한 후 그 위에 보호테이프를 부착한 다음 그 금속스티커층(도금층)이 부착된 보호테이프를 금형으로부터 박리시킨 후 금속스티커층 저면에 관용의 방법으로 접착제를 도포한 다음 그 저면에 이형지를 부착한 것으로 구성된 금속스티커 제조방법에 관한 것으로서 이를 첨부된 도면을 참조하면서 실례를 들어 상세히 설명하면 다음과 같다.According to the present invention, in the manufacture of a conventional metal sticker as described above, the inconvenience of requiring an excessive amount of metal precipitation during the production of the engraved metal sticker, and the metal sticker type without any chemical treatment after obtaining a metal sticker manufacturing mold As metal plating is applied, the photoresist film containing PVA and potassium dichromate as the main component during metal plating is corroded by the metal plating solution, so that the metal sticker type plating layer cannot be smoothly and smoothly plated, and on the surface of the finished metal sticker. By eliminating the defects that cannot express various necessary colors, the film for the intaglio sticker molding is obtained by using a film in which the parts other than the sticker pattern are drawn in a mesh shape to obtain a metal sticker manufacturing mold and manufacturing the metal sticker using the mold. Metal sticker is engraved negatively so that the rest of the surrounding area is much wider than the sticker marking area. Since the metal stickers are manufactured in this way, when the metal sticker is manufactured in this way, the metal is precipitated in a minimum amount according to the network type plating structure, and after the metal mold manufacturing mold is completed, the mold is completed and used before the mold is used for sticker manufacturing. Immerse in chromic acid solution to form a film on the surface of the photoresist, and then heat-fix and fix the photoresist in a mixture of aqueous hydrochloric acid solution and nickel chloride while protecting the photoresist from corrosion by metal plating solution such as Nickel. By forming a nickel film plating layer (strike), and then electroplating with nickel or another metal to protect the photosensitive film containing PVA and bichromic acid (or ammonium) as a main component from corrosion by the metal plating solution. It is possible to make plating, and also to make a metal mold The metal plated layer in the form of a sticker, that is, a metal sticker is formed, and then a protective tape is directly attached to the upper surface of the metal mold on which the metal sticker is formed or color printed in a predetermined color required on the upper surface of the metal plated layer (metal sticker layer). After that, a protective tape was attached on it, and then the protective tape on which the metal sticker layer (plating layer) was attached was peeled from the mold, and then an adhesive was applied to the bottom of the metal sticker layer by conventional methods, and then a release paper was attached to the bottom. Regarding the metal sticker manufacturing method, it will be described in detail by way of example with reference to the accompanying drawings.

대한민국 선등록 특허 특0140941 및 등록번호 10-0310576에서 게시되어 있는 바와같이, 금속스티커 제조용 금속기판(1)을 각종 관용수단으로 연마, 탈지처리한 다음, 그 위에 PVA와 중크롬산 카리가 주성분인 감광액을 도포하여 감광막(2)을 형성한 후 가열 건조하고(도1참조), 그 위에 소정의 금속스티커 형태의 도안(4)이 인쇄된 필름(3)을 접착 적층한 다음(도2참조), 거기에 자외선(UV)을 조사하여 불투명한 도안부위(4)를 제외한 투명부위(5)가 자외선에의해 노광되어 감광되게한 후, 그 필름을 제거하고 감광되어 경화된 감광막부위(7)를 제외한 불투명한 스티커형 도안에의해 감광되지 않은 감광막을 물로 세척, 제거하여 스티커 형태의 요부(8)가 형성된 금형(6)을 얻고(도3참조), 그것을 가열경화하여 감광막을 고정시킨 후 그 금형을 염산수용액과 염화니켈의 혼합용액에서 순간 전기도금하여 그 금형(1)의 스티커형 요부(기판)(8)에 니켈박막도금층(9)을 형성시킨 다음, 물로 세척한 후, 물과 설파민산니켈액, 염화니켈, 붕산 및 제1,2광택제로된 전주도금액(電鑄鍍金液)으로 닉켈도금을 비롯한 각종 금속도금을 행하여 금속도금층(10)을 형성한 다음(도4(a)참조), 그 스티커형 금형의 경화된 감광막부위(7)와 거기에 형성된 금속도금층(스티커층)(10)위에 보호테이프(11)를 부착한 다음(도4(b)참조), 그 보호테이프(11)를 금속도금층(스티커층)과 함께 금형(6)으로부터 박리시켜(도4(c)참조), 상기 금속스티커층(10)(금속도금층)의 저면에 접착제(13)를 도포하고(도4(d)참조), 그 위에 이형지(12)를 부착한 것(도4(e)참조)으로 구성되는 금속스티커 제조방법에 있어서, As disclosed in Korean Patent Registration No. 0140941 and Registration No. 10-0310576, the metal substrate 1 for metal sticker manufacturing is polished and degreased by various conventional means, and then the photoresist mainly composed of PVA and carbochromic acid is applied thereon. After coating and forming the photosensitive film 2, it is heated and dried (see Fig. 1), and thereafter adhesively laminated the film 3 on which the pattern 4 in the form of a predetermined metal sticker is printed (see Fig. 2). Irradiated with ultraviolet (UV) light so that the transparent portion (5) except the opaque pattern portion (4) was exposed to ultraviolet light and then exposed to light, and then the film was removed and the opaque except the photosensitive film portion (7) cured to be photosensitive was removed. One sticker-type pattern washes and removes the unsensitized photoresist with water to obtain a mold 6 having a recessed portion 8 in the form of a sticker (see FIG. 3), heat-cure it to fix the photoresist, and then fix the mold with hydrochloric acid. Of aqueous solution and nickel chloride Instantaneous electroplating from the solution to form a nickel thin plated layer 9 on the sticky recess (substrate) 8 of the mold 1, followed by washing with water, nickel and sulfamate solution, nickel chloride and boric acid And various metal platings including nickel coating with first and second varnish electroplating solutions to form the metal plating layer 10 (see Fig. 4 (a)). A protective tape 11 is attached to the cured photosensitive film portion 7 and the metal plating layer (sticker layer) 10 formed thereon (see Fig. 4 (b)), and then the protective tape 11 is attached to the metal plating layer (sticker). Layer) together with the mold 6 (see Fig. 4 (c)) to apply an adhesive 13 to the bottom of the metal sticker layer 10 (metal plating layer) (see Fig. 4 (d)), In the metal sticker manufacturing method comprising the release paper 12 attached thereon (see Fig. 4 (e)),

상기 감광막(2)대신에 감광액을 필름화한 드라이필름을 가열하여 접착시킬 수도 있고, 도6(a)(b)에 도시된 바와같이, 음각 금속스티커를 성형하기 위해서는, 금속스티커 제조용 금형에서 음각 금속스티커부위보다 더 넓은 면적을 갖는 나머지 부위의 면적에 적은 양의 도금용 금속이 석출되도록, 금속스티커형 도안(4)을 제외한 나머지부위(a)(a')가 모두 망상형으로 인쇄된 망상필름(15)을 사용하여 금속스티커 성형용 금형(6)을 제조하고, 상기 얻어진 금형은 그 감광막이 경화되기 전에 무수크롬산(CrO3)수용액에 5~30초간 침지하여 그 감광막부위(7)에 크롬산(산화크롬)피막이 형성되게한 후, 그것을 온도가 150~300℃로 상승할때까지 가열처리하여 고정한 다음, 니켈에의한 통상의 박막니켈도금(스트라이크)를 실시한 다음, 공지의 전도금속도금과정을 거쳐 금속스티커층(금속도금층)(10)을 성형후, 그 금속스티커층(10)상면에 직접 보호테이프를 부착하거나(도4(b)참조), 그 금속스티커층(10)상면에 칼라인쇄층(14)을 형성한 다음(도5(a)참조), 보호테이프(11)로 보호한 후(도5(b)참조), 상기 금속스티커층(10)이 부착된 보호테이프(11)를 금형(6)으로부터 박리시킨 다음(도4(c) 및 도5(c)참조), 상기 금속스티커층(10)의 저면에 통상의 방법으로 접착제(13)를 도포하고(도4(d) 및 도5(d)참조), 그 저면에 이형지(12)를 부착한 것(도4(e) 및 도5(e)참조)으로 구성된다.Instead of the photosensitive film 2, a dry film filmed with a photosensitive liquid may be heated to be bonded, and as shown in FIG. 6 (a) and (b), in order to mold the intaglio metal sticker, it is engraved in a metal sticker manufacturing mold. Reticle printed all of the remaining portions (a) and (a ') except the metal sticker-like pattern 4 so as to deposit a small amount of metal for plating in the area of the remaining portion having a larger area than the metal sticker portion. mold to manufacture the film 15 is a metal sticker die (6) for forming by using, and the thus obtained on the photosensitive film is prior to curing to 5-30 seconds immersed in chromic anhydride (CrO 3) aqueous solution of the photosensitive film portion (7) After the chromic acid (chromium oxide) film is formed, it is fixed by heat treatment until the temperature rises to 150-300 ° C, followed by ordinary thin film nickel plating (strike) by nickel, followed by known conductive metal plating. Through the process After molding the fast sticker layer (metal plating layer) 10, a protective tape is directly attached to the upper surface of the metal sticker layer 10 (see FIG. 4 (b)), or a color printing layer is formed on the upper surface of the metal sticker layer 10. (14) is formed (see FIG. 5 (a)), and then protected with a protective tape 11 (see FIG. 5 (b)), and then the protective tape 11 to which the metal sticker layer 10 is attached. After peeling from the mold 6 (refer FIG. 4 (c) and FIG. 5 (c)), the adhesive 13 is apply | coated to the bottom face of the said metal sticker layer 10 by a conventional method (FIG. 4 (d)). And (d) of FIG. 5 and a release paper 12 attached to the bottom thereof (see FIGS. 4 (e) and 5 (e)).

상기에서 무수크롬산 수용액은 물1ℓ에 무수크롬산 5wt%~10wt%를 첨가한 것으로 한다.In the above chromic anhydride aqueous solution, 5 wt% to 10 wt% of chromic anhydride is added to 1 L of water.

이상과 같이 구성되는 본 발명 금속스티커 제조방법에서의 하나의 특징은 금속스티커 제조용 필름중 음각 금속스티커 제조용외 필름은 금속스티커도안(4)을 제외한 나머지 부위를 망상형으로 인쇄한 망상필름(15)을 사용하므로서, 이 필름에의해 금속스티커 제조용 금형을 제조하게되면, 금형의 음각금속스티커형 모형외의 부분이 망상으로되어 그 부분에 도금되는 금속석출양이 현저히(50~80%) 줄어들게되는 장점이 있고, 또한 완성된 금형, 특히 경화된 감광막부위(7)를 스트라이크 처리전에 무수크롬산 수용액으로 처리하므로서 중크롬산카리가 주성분으로 포함된 감광막에 동종성질의 크롬산이 침투되어 감광막을 고정시키게되고 따라서 전주니켈도금액등 전주금속도금액에 의해서 감광막이 부식되지 않게하는 특징이 있으며, 또한 금속스티커층(10)의 상면에 각종 색상의 칼라인쇄층(14)을 형성하게되면 종래의 도금시에 사용되는 금속색상에 의해서면 스티커 색상이 결정되는 것에 비해 본 발명에서는 필요로하는 다양한 색상을 인쇄할 수가 있으므로 스티커를 필요한 물품이나 장소에 부착하게되면 다양하고 선명한 색감으로 생동감을 주게되는 특징이 있는 것이다.One feature in the metal sticker manufacturing method of the present invention constituted as described above is a reticulated film for manufacturing a negative metal sticker of a film for producing a metal sticker, the reticulated film (15) of which the remaining portions except for the metal sticker pattern (4) are printed in a reticular shape. When using the film to manufacture the metal sticker manufacturing mold, the advantage of reducing the amount of metal deposition plated on the portion of the mold other than the negative metal sticker type model of the mold is reticular In addition, by treating the finished mold, in particular the hardened photoresist part 7 with an aqueous solution of chromic anhydride before the strike treatment, homochromic chromic acid penetrates into the photoresist film containing primary bichromate as a main component, thereby fixing the photoresist film. The photoresist film is prevented from being corroded by the electroplating metal plating solution such as the amount of metal, and the metal sticker layer 10 When the color printing layer 14 of various colors is formed on the upper surface of the sticker, the color of the surface sticker is determined by the metal color used in the conventional plating, and thus, the present invention can print various colors required for the sticker. When attached to the necessary items or places, it is characterized by a variety of vivid colors give life.

상기한 바와같은 본 발명 금속스티커 제조방법에 의해서 제조되는 금속스티커는 음각 금속스티커금형 제조시에도 스티커형 도안외의 부분이 망상형의 도아으로 형성되므로 도금에의해 금속스티커를 제조시에 석출금속양이 적게 소요되게되고 감광되어 경화된 감광막부위(7)를 스트라이크처리전에 무수크롬산 수용액으로 처리하였으므로 도금시에 도금액에의해 감광막이 부식되지 않게되어 선명하고 평활한 금속스티커를 제조할 수 있는 효과가 있으며, 금속스티커 표면에는 각종 색상으로 칼라표시를 하게되면 스티커 부착시 칼라풀한 효과를 얻을 수 있는 것이다.As described above, the metal sticker produced by the method of manufacturing the metal sticker of the present invention is a portion of the shape of the reticulated shape, except for the sticker-shaped pattern, even when manufacturing the engraved metal sticker mold. Since the photoresist film portion 7 which is less required and hardened by photoresist was treated with an aqueous solution of chromic anhydride before the strike treatment, the photoresist film was not corroded by the plating solution during plating, thereby producing a clear and smooth metal sticker. If the metal sticker surface is colored in various colors, a colorful effect can be obtained when the sticker is attached.

도 1 은 금속스티커 제조용 금속기판에 감광막을 도포한 상태의 단면도.1 is a cross-sectional view of a state where a photosensitive film is applied to a metal substrate for producing a metal sticker.

도 2 는 금속스티커 제조용 금속기판에 감광막과 금속스티커 도안이 인쇄된 필름을 적층하여 감광시킨 상태의 단면도.2 is a cross-sectional view of a state in which a photosensitive film and a film on which a metal sticker pattern is printed are laminated on a metal substrate for producing a metal sticker and exposed to light;

도 3 은 도2에서 필름을 제거한 후 물로 세척하고 니켈박막을 형성한 상태의 금속스티커 제조용 금형.Figure 3 is a mold for producing metal stickers in a state in which the film is washed with water and formed a nickel thin film after removing the film in FIG.

도 4(a) 는 도3의 금속스티커 제조용 금형에 금속도금층(금속스티커층)을 형성한 단면도.Figure 4 (a) is a cross-sectional view of the metal plating layer (metal sticker layer) formed on the metal sticker manufacturing mold of FIG.

도 4(b) 는 도4(a)의 상면에 보호테이프를 부착한 상태의 종단면도.Figure 4 (b) is a longitudinal cross-sectional view of the protective tape attached to the upper surface of Figure 4 (a).

도 4(c) 는 금속스티커층이 부착된 보호테이프를 금형으로부터 박리시키는 상태의 단면도.Fig. 4C is a cross-sectional view of the protective tape with a metal sticker layer peeled from the mold.

도 4(d) 는 금형에서 박리시킨 보호테이프가 부착된 금속스티커층 저면에 접착제를 도포한 상태의 단면도.Figure 4 (d) is a cross-sectional view of the adhesive applied to the bottom surface of the metal sticker layer with a protective tape peeled from the mold.

도 4(e) 는 도4(d)의 상태에서 접착제층 저면에 이형지를 부착한 상태의 단면도.Figure 4 (e) is a cross-sectional view of the release paper attached to the adhesive layer bottom surface in the state of Figure 4 (d).

도 5(a) 는 도4(a)의 상태에서 금속스티커층 위에 칼라인쇄층을 형성한 상태의 단면도.Fig. 5A is a cross-sectional view of a state in which a color printing layer is formed on a metal sticker layer in the state of Fig. 4A.

도 5(b) 는 도5(a)의 상면에 보호테이프를 부착한 상태의 단면도.Figure 5 (b) is a cross-sectional view of a protective tape attached to the upper surface of Figure 5 (a).

도 5(c) 는 금속스티커층이 부착된 보호테이프를 금형으로부터 박리시키는 상태의 단면도.Fig. 5 (c) is a cross-sectional view of the protective tape with a metal sticker layer peeled from the mold;

도 5(d) 는 금형으로부터 박리된 보호테이프가 부착된 금속스티커의 저면에 접착제를 도포한 상태의 단면도.Fig. 5 (d) is a sectional view of a state where an adhesive is applied to the bottom of a metal sticker with a protective tape peeled from the mold;

도 5(e) 는 도5(d)의 상태에서 접착제층 저면에 이형지를 부착한 상태의 단면도.Fig. 5 (e) is a cross-sectional view of the release paper attached to the bottom of the adhesive layer in the state of Fig. 5 (d).

도 6(a) 는 종래의 음각 금속스티커 제조용 필름의 평면도.Figure 6 (a) is a plan view of a film for producing a conventional negative metal sticker.

도 6(b) 는 본 발명에 따른 음각 금속스티커 제조용 필름의 평면도.Figure 6 (b) is a plan view of a film for producing an intaglio metal sticker according to the present invention.

*도면중 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

1 : 금속기판 2 : 감광막1 metal substrate 2 photosensitive film

3 : 필름 4 : 금속스티커 도안3: film 4: metal sticker pattern

5 : 투명부위 6 : 금형5: transparent part 6: mold

7 : 경화된 감광막 부위 8 : 요부7: hardened photoresist part 8: recess

9 : 박막도금층 10 : 전주 금속도금층(스티커층)9: thin film plating layer 10: electric pole metal plating layer (sticker layer)

11 : 보호테이프 12 : 이형지11: protective tape 12: release paper

13 : 접착제 14 : 칼라인쇄층13: adhesive 14: color printing layer

15 : 망상필름15: reticular film

Claims (2)

금속스티커 제조용 금속기판(1)을 각종 관용수단으로 연마, 탈지처리한 다음, 그 위에 PVA와 중크롬산 카리가 주성분인 감광액을 도포하여 감광막(2)을 형성한 후 가열 건조하고, 그 위에 소정의 금속스티커 형태의 도안(4)이 인쇄된 필름(3)을 접착 적층한 다음, 거기에 자외선(UV)을 조사하여 불투명한 도안부위(4)를 제외한 투명부위(5)가 자외선에의해 노광되어 감광되게한 후, 그 필름을 제거하고 감광되어 경화된 감광막부위(7)를 제외한 불투명한 스티커형 도안에의해 감광되지 않은 감광막을 물로 세척, 제거하여 스티커 형태의 요부(8)가 형성된 금형(6)을 얻고 그것을 가열경화하여 감광막을 고정시킨 후 그 금형을 염산수용액과 염화니켈의 혼합용액에 잠시 침지하여 그 금형(1)의 스티커형 요부(기판)(8)에 니켈박막도금층(9)을 형성시킨 다음, 물로 세척한 후, 물과 설파민산니켈액, 염화니켈, 붕산 및 제1,2광택제로된 전주도금액(電鑄鍍金液)으로 닉켈도금을 비롯한 각종 금속도금을 행하여 금속도금층(10)을 형성한 다음, 그 스티커형 금형의 경화된 감광막부위(7)와 거기에 형성된 금속도금층(스티커층)(10)위에 보호테이프(11)를 부착한 다음, 그 보호테이프(11)를 금속도금층(스티커층)과 함께 금형(6)으로부터 박리시켜, 상기 금속스티커층(10)(금속도금층)의 저면에 접착제(13)를 도포하고 그 위에 이형지(12)를 부착한 것으로 구성되는 금속스티커 제조방법에 있어서, The metal substrate 1 for metal sticker manufacturing is polished and degreased by various conventional means, and thereafter, a photoresist composed mainly of PVA and bichromic acid is applied to form a photoresist film 2, followed by heating and drying. After sticking and laminating the printed film 3 on which the sticker 4 is printed, the transparent part 5 except for the opaque design part 4 is irradiated with ultraviolet rays and irradiated with ultraviolet rays (UV). After removing the film, the mold (6) having the recessed portion (8) in the form of a sticker was formed by washing and removing the unsensitized photosensitive film with water by an opaque sticker type pattern except for the photosensitive and hardened photosensitive film portion (7). After fixing the photosensitive film by heating and curing it, the mold was briefly immersed in a mixed solution of aqueous hydrochloric acid solution and nickel chloride to form a nickel thin plated layer 9 on the sticky recess (substrate) 8 of the mold 1. Then wash with water Then, various types of metal plating, including nickel plating, are performed with electroplating solution made of water, nickel sulfamate solution, nickel chloride, boric acid, and the first and second varnishes to form a metal plating layer 10. The protective tape 11 is attached to the cured photosensitive film portion 7 of the sticker mold and the metal plating layer (sticker layer) 10 formed thereon, and then the protective tape 11 is attached to the metal plating layer (sticker layer). In the metal sticker manufacturing method consisting of peeling from the mold 6 together with the adhesive 13 to the bottom surface of the metal sticker layer 10 (metal plating layer) and attaching the release paper 12 thereon, 상기 감광막(2)대신에 감광액을 필름화한 드라이필름을 가열하여 접착시킬 수도 있고, 음각 금속스티커를 성형하기 위해서는, 금속스티커 제조용 금형에서 음각 금속스티커부위보다 더 넓은 면적을 갖는 나머지 부위의 면적에 적은 양의 도금용 금속이 석출되도록, 금속스티커형 도안(4)을 제외한 나머지 부위(a)(a')가 모두 망상형으로 인쇄된 망상필름(15)을 사용하여 금속스티커 성형용 금형(6)을 제조하고, 상기 얻어진 금형은 그 감광막이 경화되기 전에 무수크롬산(CrO3)수용액에 5~30초간 침지하여 그 감광막부위(7)에 크롬산(산화크롬)피막을 형성시킨 후, 온도가 150~300℃로 상승할때까지 가열처리하여 고정시킨 다음 니켈에의한 박막니켈도금(스트라이크)를 실시한 다음, 공지의 전도금속도금과정을 거쳐 금속스티커층(10)을 성형후, 그 금속스티커층(10)상면에 직접 보호테이프를 부착하거나, 그 금속스티커층(10)상면에 칼라인쇄층(14)을 형성한 다음, 그 위에 보호테이프(11)를 부착한 후, 상기 금속스티커층(10)이 부착된 보호테이프(11)를 금형으로부터 박리시킨 다음 상기 금속스티커층(10)의 저면에 통상의 방법으로 접착제(13)를 도포후 그 저면에 이형지(12)를 부착한 것으로 구성됨을 특징으로하는 금속스티커 제조방법.Instead of the photosensitive film 2, a dry film filmed with a photosensitive liquid may be heated to be bonded to each other, and in order to mold the intaglio metal sticker, the area of the remaining portion having a larger area than the intaglio metal sticker portion in the metal sticker manufacturing mold The mold for forming the metal sticker by using the reticular film 15 in which all the portions (a) and (a ') except the metal sticker-shaped pattern 4 are printed in a reticular shape so that a small amount of plating metal is deposited (6). ), And the obtained mold was immersed in an aqueous solution of chromic anhydride (CrO 3 ) for 5 to 30 seconds before the photosensitive film was cured to form a chromic acid (chromium oxide) film on the photosensitive film portion 7, and then the temperature was 150. Heat-fixed and fixed until it rises to ~ 300 degreeC, followed by nickel plating (strike) by nickel, and after forming the metal sticker layer 10 through the well-known conductive metal plating process, the metal sticker layer ( 10) a protective tape is directly attached to the upper surface, or a color printing layer 14 is formed on the upper surface of the metal sticker layer 10, and then a protective tape 11 is attached thereto, and then the metal sticker layer 10 is attached. The attached protective tape 11 is peeled from the mold, and then the adhesive 13 is applied to the bottom surface of the metal sticker layer 10 in the usual manner, and then the release paper 12 is attached to the bottom surface. Metal sticker manufacturing method. 제1항에 있어서, 무수크롬산 수용액은 물1ℓ에 무수크롬산 5wt%~10wt%를 첨가한 것으로 구성됨을 특징으로하는 금속스티커 제조방법.The method of claim 1, wherein the aqueous solution of chromic acid is prepared by adding 5 wt% to 10 wt% of chromic anhydride to 1 liter of water.
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KR100869289B1 (en) * 2007-05-16 2008-11-19 김원철 Manufacturing method of metal sticker
KR100900929B1 (en) * 2007-08-07 2009-06-08 주식회사 엠.지.피 Manufacturing method of metal sticker
KR101389454B1 (en) * 2007-09-03 2014-04-28 김영준 metal sticker projected picture image and fabricating method the same
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KR100869289B1 (en) * 2007-05-16 2008-11-19 김원철 Manufacturing method of metal sticker
KR100900929B1 (en) * 2007-08-07 2009-06-08 주식회사 엠.지.피 Manufacturing method of metal sticker
KR101389454B1 (en) * 2007-09-03 2014-04-28 김영준 metal sticker projected picture image and fabricating method the same
CN106782181A (en) * 2017-01-05 2017-05-31 深圳市源隆光学科技有限公司 Label and preparation method thereof

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