KR20050015243A - Telescopic type wafer pitch adjusting device - Google Patents

Telescopic type wafer pitch adjusting device

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Publication number
KR20050015243A
KR20050015243A KR1020030053984A KR20030053984A KR20050015243A KR 20050015243 A KR20050015243 A KR 20050015243A KR 1020030053984 A KR1020030053984 A KR 1020030053984A KR 20030053984 A KR20030053984 A KR 20030053984A KR 20050015243 A KR20050015243 A KR 20050015243A
Authority
KR
South Korea
Prior art keywords
bracket
hand
ball screw
wafers
telescopic
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Application number
KR1020030053984A
Other languages
Korean (ko)
Inventor
김경수
김기범
전인택
황찬영
안승욱
Original Assignee
에프원 주식회사
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Application filed by 에프원 주식회사 filed Critical 에프원 주식회사
Priority to KR1020030053984A priority Critical patent/KR20050015243A/en
Publication of KR20050015243A publication Critical patent/KR20050015243A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A telescopic type wafer pitch adjusting apparatus is provided to reduce manufacturing cost and to simplify design by adjusting the pitch using a ball screw. CONSTITUTION: A telescopic expansion arm is coupled with each of hand brackets(10) which are coupled with a plurality of hands(H) for extracting wafers on a cassette to outside and includes a plurality of links(22). A cross section of the links is coupled with each of the hand brackets. A bracket(30) is implemented on a first hand bracket(10-1) and an end portion of the telescopic expansion arm is coupled with the bracket. A ball screw(40) penetrates the bracket to be fixed on a second link cross section(24-1). The telescopic expansion arm is expanded/contracted by a rotation of the ball screw to adjust a distance between the hand bracket, to which the telescopic expansion arm is attached, and the hand.

Description

텔레스코픽 타입 웨이퍼 피치 조절장치{Telescopic type wafer pitch adjusting device}Telescopic type wafer pitch adjusting device

본 발명은 반도체 웨이퍼 제조공정중에 다수의 웨이퍼의 가공을 위해 웨이퍼들 사이의 피치를 조절하는 장치에 관한 것으로, 구체적으로는 카세트에서 반도체 웨이퍼를 취출하는 핸드들 사이의 피치를 볼스크류와 링크를 이용해 조정하는 장치에 관한 것이다.The present invention relates to an apparatus for adjusting the pitch between wafers for processing a plurality of wafers during a semiconductor wafer manufacturing process. More specifically, the pitch between hands for taking out a semiconductor wafer from a cassette is determined using a ball screw and a link. A device for adjusting.

일반적으로 반도체웨이퍼 제조공정에 있어서는 여러개의 반도체웨이퍼들을 장착한 카세트로부터 웨이퍼들을 취출한 뒤, 후가공을 위해 웨이퍼들을 적당한 간격으로 벌려주어야만 한다. 최근에는 기다란 카세트에 웨이퍼를 한꺼번에 200매 내지 300매 장착하곤 하는데, 이런 카세트에 장착된 웨이퍼들은 많은 웨이퍼들을 한꺼번에 장착하기 위해 필요한 것보다 좁은 피치로 장착되는 것이 일반적이다. In general, in the semiconductor wafer manufacturing process, the wafers must be taken out of a cassette equipped with several semiconductor wafers, and then the wafers must be spread at appropriate intervals for further processing. Recently, 200 to 300 wafers are loaded at one time into an elongated cassette, and wafers mounted in such a cassette are usually mounted at a narrower pitch than necessary to mount many wafers at one time.

도 1에는 이러한 웨이퍼가 장착된 카세트의 사시도가 도시되어 있다. 도시된 바와 같이, 카세트(Q)에 다수의 웨이퍼(W)(대기 200매 내지 300매)가 장착되는데, 도면에는 설명의 편의상 3개의 웨이퍼(W)만 장착된 것으로 도시하였다. 이렇게 카세트(Q)에 장착된 웨이퍼는 핸드에 의해 취출된다. 1 shows a perspective view of a cassette on which such a wafer is mounted. As shown, a plurality of wafers W (200-300 sheets of air) are mounted in the cassette Q, and only three wafers W are shown in the drawing for convenience of description. The wafer mounted on the cassette Q in this way is taken out by the hand.

도 2를 참조하여 카세트(Q)에 장착된 다수의 웨이퍼(W) 사이의 피치를 조절하는 종래의 장치에 대해 설명한다. 도면에 도시된 바와 같이, 다수의 핸드브라켓(10)에 달린 핸드(H)를 카세트(Q)에 장착된 웨이퍼(W) 사이사이로 삽입하여 웨이퍼(W)를 카세트(Q)에서 취출한다. 이렇게 핸드를 이용해 취출된 웨이퍼(W)들은 볼스크류를 이용해 그 간격이 벌어지게 되는데, 종래에는 볼스크류 하나당 두개의 핸드브라켓(10)이 연결된다. 또한, 각각의 볼스크류는 윗쪽에 연결된 볼스크류는 왼나사이고 아랫쪽에 연결된 볼스크류는 오른나사로 이루어져 있어야만 했다. 이렇게 구성해야만 동일한 구동원에서 벨트를 통해 볼스크류가 일방향으로 회전할 때 상하 각각에 연결된 핸드브라켓가 화살표 방향으로 이동하면서 핸드브라켓가 벌어지게 된다. Referring to Fig. 2, a conventional apparatus for adjusting the pitch between a plurality of wafers W mounted on the cassette Q will be described. As shown in the figure, the hands H attached to the plurality of hand brackets 10 are inserted between the wafers W mounted on the cassettes Q and the wafers W are taken out of the cassettes Q. The wafers W taken out by using the hands are spaced apart by using a ball screw. In the related art, two hand brackets 10 are connected to one ball screw. In addition, each ball screw had to be composed of a ball screw connected to the upper side and a left screw and a ball screw connected to the bottom. In this configuration, when the ball screw rotates in one direction through the belt in the same drive source, the hand bracket connected to each of the upper and lower parts moves in the direction of the arrow, and the hand bracket is opened.

따라서, 종래의 볼스크류를 이용해 웨이퍼 피치를 조절하는 방식에서는, 웨이퍼 수의 절반만큼의 볼스크류가 필요함은 물론, 왼나사형 볼스크류도 필요하게 된다. 한편, 일반적으로 왼나사는 널리 보급된 것이 아니기 때문에 구입비용도 오른나사에 비해 많이 소요된다. 즉, 많은 볼스크류가 필요할 뿐만 아니라, 오른나사와 왼나사를 동시에 구비해야만 하기 때문에, 비용이 많이 소요됨은 물론, 피치조절장치가 차지하는 공간도 많이 소요되는 문제가 있다. Therefore, in the conventional method of adjusting the wafer pitch by using a ball screw, not only the ball screw of half the number of wafers is required but also the left-handed ball screw. On the other hand, in general, since the left screw is not widely used, the purchase cost is also higher than that of the right screw. In other words, not only a large number of ballscrews are required, but also a right screw and a left screw must be provided at the same time.

본 고안은 종래의 이와 같은 문제점을 감안하여 안출된 것으로서, 왼나사 볼스크류가 전혀 불필요할 뿐만 아니라, 하나의 볼스크류로 핸드브라켓 사이의 간격을 간단히 조절할 수 있는 피치조절장치를 제공하는 것을 목적으로 한다.The present invention has been made in view of the above problems, and it is an object of the present invention to provide a pitch adjusting device that can easily adjust the distance between the hand brackets as well as the left screw ball screw. .

본 발명의 이런 목적을 달성하기 위해, 다수의 웨이퍼(W)가 적재되어 있는 웨이퍼 카세트(Q)에서 웨이퍼를 취출한 다음 후공정을 위해 웨이퍼 사이의 피치를 조정하는 웨이퍼 피치조절장치에 있어서:In order to achieve this object of the present invention, in the wafer pitch adjusting apparatus which takes out a wafer from a wafer cassette Q loaded with a plurality of wafers W, and then adjusts the pitch between wafers for a post process:

카세트(Q)에 장착된 웨이퍼(W) 사이사이에 삽입되어 웨이퍼들을 카세트 외부로 취출하기 위한 다수의 핸드(H)의 일단부에 각각 연결되어 있는 핸드브라켓(10)각각에 연결되고, 서로 교차하는 다수의 링크(22)로 이루어지며, 링크(22)의 교차부(24)가 상기 핸드브라켓(10)에 각각 연결되는 텔레스코픽 신축아암(20); Inserted between the wafers (W) mounted on the cassette (Q) is connected to each of the hand brackets (10), each connected to one end of the plurality of hands (H) for taking the wafers out of the cassette, and cross each other A telescopic telescopic arm 20 formed of a plurality of links 22, the intersections 24 of the links 22 being connected to the hand bracket 10, respectively;

첫번째 핸드브라켓(10-1)에 장착되어 상기 텔레스코픽 신축아암(20)의 일단부가 연결되는 브래킷(30); 및 A bracket 30 mounted on a first hand bracket 10-1 and connected to one end of the telescopic telescopic arm 20; And

상기 브래킷(30)을 관통해 두번째 링크교차부(24-1)에 고정되는 볼스크류(40);를 포함하고,And a ball screw 40 fixed to the second link crossing portion 24-1 through the bracket 30.

상기 볼스크류(40)의 회전에 의해 신축아암(20)이 신축함으로써, 신축아암(20)에 연결된 핸드브라켓(10) 및 핸드(H)의 간격을 조절할 수 있는 것을 특징으로 하는 텔레스코픽 타입 웨이퍼 피치조절장치가 제공된다.Telescopic type wafer pitch, characterized in that the telescopic arm 20 is stretched by the rotation of the ball screw 40, the distance between the hand bracket 10 and the hand (H) connected to the telescopic arm 20 can be adjusted. An adjustment device is provided.

이하, 첨부 도면들을 참조하여 본 발명에 대해 자세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

도 3, 4는 본 발명에 따른 장치를 보여주는 개략도로서, 도 3은 웨이퍼 피치가 좁혀진 상태를, 도 4는 웨이퍼 피치가 넓어진 상태를 보여준다.3 and 4 are schematic views showing an apparatus according to the present invention, in which FIG. 3 shows a narrowed wafer pitch, and FIG. 4 shows a widened wafer pitch.

도시된 바와 같이, 핸드브라켓(10)에는 텔레스코픽 신축아암(20)이 연결된다. 신축아암(20)은 서로 X자 형태로 교차하는 다수의 링크(22)로 이루어지며, 각 링크(22)의 교차부(24)가 핸드브라켓(10)에 각각 연결된다. 또한, 후술하는 볼스크류의 회전운동을 지지하는 브래킷(30)이 첫번째 핸드브라켓(10-1)에 장착되고, 이 브래킷에 텔레스코픽 신축아암(20)의 일단부가 연결된다. 볼스크류(40)는 브래킷(30)을 관통해 두번째 링크교차부(24-1)에 일단부가 고정된다. As shown, the telescopic telescopic arm 20 is connected to the hand bracket 10. Extension arm 20 is composed of a plurality of links 22 that cross each other in an X-shape, the intersection 24 of each link 22 is connected to the hand bracket 10, respectively. In addition, a bracket 30 for supporting the rotational movement of the ball screw, which will be described later, is mounted to the first hand bracket 10-1, and one end of the telescopic telescopic arm 20 is connected to the bracket. One end of the ball screw 40 is fixed to the second link crossing portion 24-1 through the bracket 30.

이렇게 구성된 본 발명의 장치에 의하면, 볼스크류(40)가 화살표(A) 방향으로 회전하면, 브래킷(30)과 교차점(24-1) 사이의 볼스크류의 길이가 늘어나면서 신축아암(20)이 팽창되므로, 핸드브라켓(10) 사이의 간격이 전부 벌어지게 된다. 즉, 핸드(H)의 간격이 벌어지게 되고, 핸드에 장착된 웨이퍼의 간격도 벌어지게 된다. 물론, 볼스크류가 반대로 회전하면 웨이퍼 사이의 간격이 좁아지게 된다. According to the apparatus of the present invention configured as described above, when the ball screw 40 rotates in the direction of the arrow A, the length of the ball screw between the bracket 30 and the intersection point 24-1 increases and the expansion arm 20 is moved. Since the expansion, the gap between the hand bracket 10 is all opened. That is, the interval between the hands H is widened, and the interval between wafers mounted on the hands is widened. Of course, if the ball screw rotates in reverse, the gap between the wafers becomes narrow.

이상과 같이 구성된 본 발명에 따른 피치조절장치에 의하면, 하나의 볼스크류, 특히 왼나사가 전혀 불필요한 볼스크류를 이용해 웨이퍼 사이의 피치를 필요한대로 조절할 수 있게 되므로, 종래에 비해 비용이 획기적으로 절감됨은 물론, 장치가 차지하는 공간도 줄어들게 되고, 또한 웨이퍼의 피치조절 작업도 종래의 장치에 비해 훨씬 편리하게 된다.According to the pitch adjusting device according to the present invention configured as described above, it is possible to adjust the pitch between the wafers as needed using one ball screw, in particular ball screw left unnecessary, as well as significantly reducing costs compared to the conventional In addition, the space taken up by the device is reduced, and the wafer pitching operation is much more convenient than the conventional device.

도 1은 반도체 웨이퍼 제조공정중에 다수의 웨이퍼들을 적재하기 위한 카세트의 사시도;1 is a perspective view of a cassette for loading a plurality of wafers during a semiconductor wafer fabrication process;

도 2는 종래의 피치조절장치의 개략도;2 is a schematic view of a conventional pitch adjusting device;

도 3은 본 발명에 따른 장치로서, 피치가 좁혀진 상태의 개략도;3 is a schematic view of a device according to the invention in a narrowed pitch;

도 4는 본 발명에 따른 장치로서, 피치가 넓어진 상태의 개략도.4 is a schematic view of a device in accordance with the present invention in a broadened pitch;

Claims (1)

다수의 웨이퍼(W)가 적재되어 있는 웨이퍼 카세트(Q)에서 웨이퍼를 취출한 다음 후공정을 위해 웨이퍼 사이의 피치를 조정하는 웨이퍼 피치조절장치에 있어서:In the wafer pitch adjusting apparatus which takes out a wafer from the wafer cassette Q in which the several wafer W is loaded, and adjusts the pitch between wafers for a post process: 카세트(Q)에 장착된 웨이퍼(W) 사이사이에 삽입되어 웨이퍼들을 카세트 외부로 취출하기 위한 다수의 핸드(H)의 일단부에 각각 연결되어 있는 핸드브라켓(10)각각에 연결되고, 서로 교차하는 다수의 링크(22)로 이루어지며, 링크(22)의 교차부(24)가 상기 핸드브라켓(10)에 각각 연결되는 텔레스코픽 신축아암(20); Inserted between the wafers (W) mounted on the cassette (Q) is connected to each of the hand brackets (10), each connected to one end of the plurality of hands (H) for taking the wafers out of the cassette, and cross each other A telescopic telescopic arm 20 formed of a plurality of links 22, the intersections 24 of the links 22 being connected to the hand bracket 10, respectively; 첫번째 핸드브라켓(10-1)에 장착되어 상기 텔레스코픽 신축아암(20)의 일단부가 연결되는 브래킷(30); 및 A bracket 30 mounted on a first hand bracket 10-1 and connected to one end of the telescopic telescopic arm 20; And 상기 브래킷(30)을 관통해 두번째 링크교차부(24-1)에 고정되는 볼스크류(40);를 포함하고,And a ball screw 40 fixed to the second link crossing portion 24-1 through the bracket 30. 상기 볼스크류(40)의 회전에 의해 신축아암(20)이 신축함으로써, 신축아암(20)에 연결된 핸드브라켓(10) 및 핸드(H)의 간격을 조절할 수 있는 것을 특징으로 하는 텔레스코픽 타입 웨이퍼 피치조절장치.Telescopic type wafer pitch, characterized in that the telescopic arm 20 is stretched by the rotation of the ball screw 40, the distance between the hand bracket 10 and the hand (H) connected to the telescopic arm 20 can be adjusted. Regulator.
KR1020030053984A 2003-08-05 2003-08-05 Telescopic type wafer pitch adjusting device KR20050015243A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100831263B1 (en) * 2006-12-29 2008-05-22 동부일렉트로닉스 주식회사 Apparatus for controlling an interval between wafers, and wafer cleaning machine including the same
KR100948888B1 (en) * 2007-12-05 2010-03-24 전홍희 Apparatus for processing a semiconductor substrate with a telescope type transfer unit
KR101108075B1 (en) * 2009-04-20 2012-01-31 코리아테크노(주) Wafer dumping module for having double stage apparatus
WO2023274008A1 (en) * 2021-06-29 2023-01-05 北京北方华创微电子装备有限公司 Wafer cleaning device and wafer transfer apparatus thereof
KR20230026037A (en) 2021-08-17 2023-02-24 ㈜온새미로 Apparatus for transferring wafers of vertical diffusion furnace

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100831263B1 (en) * 2006-12-29 2008-05-22 동부일렉트로닉스 주식회사 Apparatus for controlling an interval between wafers, and wafer cleaning machine including the same
KR100948888B1 (en) * 2007-12-05 2010-03-24 전홍희 Apparatus for processing a semiconductor substrate with a telescope type transfer unit
KR101108075B1 (en) * 2009-04-20 2012-01-31 코리아테크노(주) Wafer dumping module for having double stage apparatus
WO2023274008A1 (en) * 2021-06-29 2023-01-05 北京北方华创微电子装备有限公司 Wafer cleaning device and wafer transfer apparatus thereof
KR20230026037A (en) 2021-08-17 2023-02-24 ㈜온새미로 Apparatus for transferring wafers of vertical diffusion furnace

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