KR20050004134A - Micro-type fluid circulation system and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A micro type fluid circulation system and a method are provided to achieve improved cooling effect by permitting a fluid to be quickly heat exchanged between a high temperature region and a low temperature region and lowering the temperature of an electronic unit from one side of an adjacent printed circuit board. CONSTITUTION: A micro type fluid circulation system comprises a printed circuit board(1) on which at least one insulation layer, a metal layer, and a circulation route(10) are formed. The circulation route includes a heat collecting channel(101) arranged in the vicinity of at least one high temperature region(82); a heat dissipation channel(102) arranged in the vicinity of at least one low temperature region; a low temperature transfer channel(103) communicated from the heat dissipation channel to the heat collecting channel; and a high temperature transfer channel(104) communicated from the heat collecting channel to the heat dissipation channel. A fluid is contained in the circulation route such that heat of the high temperature region is transferred to the low temperature region.

Description

Micro-type fluid circulation system and manufacturing method thereof

The present invention relates to a micro-fluid circulation system and a method of manufacturing the same, and more particularly, to a micro-fluid circulation system and a method of manufacturing the same.

The level of science and technology in each field is rapidly increasing thanks to the electronic technology that is developing day by day. In the electronic and semiconductor industry, especially in the manufacture of equipment for end products, printed circuit boards can be equipped with other electronic and semiconductor units to form a passage, and provide a stable circuit working environment for individual units and entire systems. It's a very important place because it's fully functional.

In order to achieve the purpose of mounting other units and providing a good circuit working environment, applications of conventional printed circuit board manufacturing include an insulating layer and a printed circuit board of a metal layer installed on the insulating layer. Focusing on the stability and miniaturization and multi-layer, the electrical connection effect of the metal circuit made of metal layer is emphasized.The high temperature problem caused by the waste heat of each electronic unit and semiconductor unit is treated with a separate cooling device. come.

However, a general cooling device cannot actually cool an electrically conductive portion that directly generates waste heat because the electronic unit and semiconductor unit in the vicinity are already completely enclosed and sealed. Therefore, it is difficult to cool the temperature on the printed circuit board side of the electronic and semiconductor unit parts, and only the temperature of the insulation outer portion having the lowest thermal conductivity among the units can be lowered. In addition, the increase in unit density caused by the trend of miniaturization and the high frequency current generated by the high-speed circuits currently limit the operation temperature of each unit and the semiconductor system, so that it is not practically effective.

Applications of microsystem technology include Micro-Electro-Mechanical System (MEMS), Micro-Optic-Mechanical System (MOMS) and Micro-Electro-Mecha-Optic System, MEMOS), such micro coolers not only have high demand for precision of manufacturing, but also have high production cost, and also have a physical limitation of working capacity to transfer calories and actual volume and mass proportion. Although the type chiller has a higher cooling efficiency, it is difficult to exclude waste heat generated from several electronic and semiconductor units since the volume mass is also dropped only for individual units.

Therefore, even if all units install this micro-cooler system, the micro-cooler is inherently limited in size, so the distance to transfer waste heat is limited, which does not completely eliminate the waste heat generated in the entire system. .

On the other hand, German Patent DE19739717 and DE19739722 has proposed a method of manufacturing a micro induction structure with a printed circuit board manufactured for a kind of printed circuit board, as shown in FIG. The micro-induction structure 90 is formed using the upper cover and the lower substrate, and the metal circuit 92 is a side wall. The metal circuit 92 is a side wall, and a colloid layer is formed on the inner surface thereof. 93 is attached, the cutting area of the micro induction structure 90 is limited to the thickness of the metal circuit 92 and the collimating layer 93 during the manufacturing process of the printed circuit board so that the cutting area is smaller than the thickness of the insulating layer cooling It is very unsuitable for the progression of, and the design of the cutting area is limited, especially when a storage groove structure with a relatively large cutting area is formed, which makes it difficult to control the quality and defect rate considerably.

At the same time, the above-described micro induction structure 90 has the insulating layer 91 up and down and the metal circuit 92 as the side wall, so that when applied to the temperature drop of the electronic and semiconductor units (not shown in the figure), the multilayer It can only be applied to a circuit board of the present invention, and cannot be applied to a single insulating layer and a single-sided substrate of a single metal layer (not shown) or a double-sided substrate having a single insulating layer and two metal layers (not shown).

In addition, when applying a cooling device that transfers the heat amount must be provided with a dissipation module (not shown in the figure). If the micro induction structure 90 is designed as a cooling system, the micro induction structure 90 is a colloid layer ( 93 and the relatively thick insulating layer 91 is limited, the thermal effect is extremely poor and can not directly form the above-described dissipation module as a micro induction structure (90). Therefore, the cooling system composed of the micro induction structure 90 is difficult to exert an effective transfer function of calories.

It is a main object of the present invention to provide a microfluidic circulation guiding system and a method of manufacturing the same, which are fabricated on a printed circuit board.

It is still another object of the present invention to provide a microfluidic circulation induction system and a method of manufacturing the same, which are used for a kind of heat transfer.

1 is a cross-sectional view of a micro-fluidic induction structure made of a conventional printed circuit board

2 is a cross-sectional view of a microfluidic fluid circulation induction system of the present invention and a method of manufacturing the same according to a first embodiment of the present invention

3 is a cross-sectional view taken along line 3-3 of FIG.

Figure 4 is a sectional view showing another embodiment of the heat collection induction as a first embodiment

5 is a cross-sectional view showing another embodiment of the heat collection induction as a first embodiment

6 is a cross-sectional view showing still another embodiment of the circulation guide route as the first embodiment;

7 is a cross-sectional view showing still another embodiment of the circulation guide route as the first embodiment;

8 is a cross-sectional view showing another embodiment of the circulation guide route as the first embodiment;

9 is a cross-sectional view showing that the circulation inducing route has a plurality of vent holes penetrating the metal layer as the first embodiment.

FIG. 10 is a cross-sectional view showing that the circulation inducing route has a plurality of vent holes penetrating the insulating layer as the first embodiment.

11 is a manufacturing process diagram of the first embodiment

12 is a cross-sectional view showing a printed circuit board having one insulating layer, a metal layer, and a light blocking layer as a first embodiment;

FIG. 13 is a cross-sectional view showing defining a predetermined shape in an insulating layer as a first embodiment. FIG.

14 is a cross-sectional view showing the first embodiment to form a circulation induction route by removing a portion of the insulating layer.

FIG. 15 is a cross-sectional view showing that the circulation inducing route is sealed by installing a cover as a first embodiment; FIG.

16 is a system schematic diagram of a second embodiment of a microfluidic fluid circulation induction system of the present invention and a method of manufacturing the same;

17 is a partial sectional view of a second embodiment

18 is a manufacturing process diagram of the second embodiment;

19 is a sectional view showing a printed circuit board having a main insulating layer, a metal layer, and a light blocking layer as a second embodiment;

Fig. 20 is a sectional view of defining a predetermined shape in the main insulating layer as the second embodiment.

FIG. 21 is a cross-sectional view showing a main circulation induction route by removing a portion of the main insulating layer as a second embodiment; FIG.

22 is a cross-sectional view showing that the main circulation guide route is sealed by installing a cover as a second embodiment;

FIG. 23 is a cross-sectional view showing a plurality of vent holes formed in a cover as a second embodiment;

FIG. 24 is a cross-sectional view illustrating that a sub insulation layer is installed on a cover as a second embodiment; FIG.

FIG. 25 is a cross-sectional view showing a predetermined shape in a sub insulating layer as a second embodiment. FIG.

FIG. 26 is a cross-sectional view illustrating a primary circulation induction route by removing a portion of a sub insulation layer as a second embodiment; FIG.

FIG. 27 is a cross-sectional view showing the installation of a metal grid within a heat collection guide as a second embodiment; FIG.

<Explanation of symbols for main parts of drawing>

1: printed circuit board 10: circulation induction route

1001: main circulation induction route 1002: main circulation induction route

101: heat collection induction 102: acid heat induction

103 ： Low temperature transport induction 1031 ： Storage compartment

1032 ： Transportation group 104 ： High temperature transport induction

1041 ： extended end 1042 ： neck end

1043 ： Mixed end 1044 ： Large cutting end

1045 ： Small cut end 105 ： Low temperature induction

11: insulating layer 110: ventilation hole

1101: main insulation layer 112: sub insulation layer

12: metal layer 120: ventilation hole

1201 ： Vent hole 13 ： Metal grid

14: projecting particle 2: cover

21: cover plate 4: drive device

41: Micro type pump 5: Light blocking layer

6.7 ： Light cover 60,70 ： Precision type

81: Electronic unit 82: High temperature area

83 ： Low temperature zone 90 ： Micro guide structure

91: insulating layer 92: metal circuit

93: colloidal layer

300, 302, 304, 306, 308, 310, 312, 314, 316 ： Sequence

400, 402, 404, 406, 408, 410, 412, 414 ： Sequence

416, 418, 420, 422, 424, 426, 428 ： Sequence

The microfluidic fluid circulation induction system of the present invention transfers heat from the hot zone to the cold zone, and the microfluidic fluid circulation induction system includes one printed circuit board and one fluid. The printed circuit board has at least one insulating layer, a metal layer provided on the at least one insulating layer, and a circulation induction route in which the insulating layer and the metal layer are commonly bounded.

The circulation induction route includes a heat collection induction adjacent to at least one hot zone, a heat induction adjacent to at least one low temperature zone, a low temperature transport induction from one acid heat induction to a heat collection induction, and a heat induction from at least one heat collection induction. Includes high temperature transport induction in communication. This fluid is contained in the circulation induction route and is used to transfer the heat of the hot zone to the cold zone.

The fabrication method for manufacturing the micro-fluid circulation system includes the following procedure.

a) define a predetermined pattern in the insulating layer,

b) The part corresponding to this predetermined figure of the insulating layer is removed to form a circulation induction route.

The effect of the present invention is to manufacture a microcirculation induction system on a printed circuit board using a printed circuit board manufacturing process to provide transfer of heat, and to lower the temperature of the unit installed thereon.

Other technical details, features and effects of the present invention will be described in detail with reference to the following drawings and two specific embodiments. Before presenting the detailed description, it is to be noted that in the following description, similar units are denoted by the same numbers.

2 and 3 illustrate a microfluidic fluid circulation induction system of the present invention and a method of manufacturing the same, which are installed on a plurality of printed circuit boards 1 supplied to fabricate one printed circuit board. The heat generated from the electronic unit 81 is transferred from the high temperature zone 82 to the low temperature zone 83. The microfluidic circulation guiding system includes a printed circuit board (1) and a cover installed on the printed circuit board (1). 2) a fluid used to transfer heat and a driving device 4 installed in the printed circuit board 1 to drive the fluid.

The printed circuit board 1 includes an insulating layer 11 made of one epoxy resin material, a metal layer 12 provided on one of the insulating layers 11, and one insulating layer 11 and a metal layer. (12) is provided in common and has a circulation guide route (10) used for fluid movement.

In this embodiment, the metal layer 12 forms a circuit (not shown in the figure) in which the electronic unit 81 is connected to each other, and at the same time, the printed circuit board 1 has the metal layer 12 as the lower wall and the insulating layer ( Using 11 as a side wall, a circulation induction route 10 is formed in the insulating layer 11.

The circulation induction route 10 includes a heat collecting induction 101 adjacent to a plurality of high temperature zones 82 and arranged in parallel, an acid heat induction 102 adjacent to a plurality of low temperature zones and arranged in parallel, and a single heat induction ( A low temperature transport induction 103 that communicates from the heat collection induction 101 to the heat collection induction 101, a high temperature transport induction 104 that communicates from the one heat collection induction 101 to the acid heat induction 102, and one low temperature transport induction 103. And a low temperature induction flow 105 in communication with the high temperature transport induction 104.

The low temperature transport induction 103 has a storage compartment 1031 adjacent to the heat dissipation induction 102, a storage compartment 1031 and a transport stage 1032 communicating with the heat collection induction 101. The storage compartment 1031 The cutting area of the c) is larger than the cutting area of the transport stage 1032, thereby storing more fluid.

The high temperature transport induction 104 has an extended end 1041 in communication with the partial collecting induction 101 of each of the heat collection induction 101 in a plurality of parallel arrangements, and a neck portion in communication with each of the plurality of expansion ends 1041 respectively. A mixing chamber stage 1043 is in communication with the segments 1042 and 1042 'and all neck ends 1042 and 1042'.

The cutting area of the expansion end 1041 is larger than the cutting area of each of the heat collecting induction 101 and the transport end 1032, and at the same time, it is reduced in the direction of each neck end 1042, 1042 '. The cutting area of each neck end 1042, 1042 'is all smaller than the cutting area of each expansion end 1041, and the cold induction 105 is in communication with one of the neck ends 1042', and at the same time a partial fluid Is directly transported to the mixing chamber stage 1043 through the neck end 1042 'in a situation where it does not directly pass through the high temperature zone 82 from the low temperature flotation degree 103.

The high temperature transport induction 104 furthermore comprises a large cutting surface end 1044 which is in communication with and parallel to the plurality of mixing chamber ends 1043 and a small cutting surface end 1045 which is in communication with each of the plurality of large cutting surface ends 1044. The cutting area of each small cutting end 1045 is smaller than the cutting area of each large cutting end 1044 and is adjacent to the heat dissipation induction 102. Compared to the small cut end 1045, this large cut end 1044 is far from the heat dissipation induction 102. The above-described fluid is contained in the circulation induction route 10 to transfer the heat of the hot zone 82 to the cold zone 83.

In this embodiment, the fluid is distilled or deionized water, but is not limited thereto, and organic solvents such as methanol and acetone or other coolants (or refrigerants), and even air, are used as heat transfer fluids in the microfluidic circulation induction system of the present invention. Used.

The cover 2 is provided on the insulating layer 11 and is separated from the side surface of the metal layer 12 to seal the circulation induction route 10. In this embodiment, when the cover 2 is made of the same material as the metal layer 12, the printed circuit board 1 is formed of a so-called double-sided board, and of course, the material of the cover 2 is not limited thereto. It can be made of a material.

This drive device 4 has a control chip (not shown in the drawing) and a micro pump 41 in communication with one another and a low temperature transport induction 103 installed on the printed circuit board 1. The circuit formed of one metal layer 12 and the micro pump 41 are connected to each other, and at the same time, the micro pump 41 is controlled to have an effect of controlling the fluid when the fluid flows in the circulation induction route 10.

Therefore, when this fluid is filled in the circulation induction route 10, most of it is stored in the storage compartment 1031, the fluid temperature here is relatively low, reveals the liquid state, and the temperature and room temperature are close, and at the same time transport chamber ( It moves to the heat collection induction 101 through the flow of 1032. Because the collection induction 101 exhibits a zone distribution, the total contact area of the fluid and the metal layer 12 located therein becomes relatively large, so that the fluid occurs relatively easily in the electronic unit 81 at the same position as the high temperature zone 82. It will absorb calories.

When the waste heat generated in the electronic unit 81 accumulates and the temperature rises and exceeds the boiling point of the working fluid (about 100 ° C in the case of water), the temperature of the fluid is increased after being absorbed by the fluid through heat exchange. Exposed.

By design, the cutting area of the expansion stage 1041 is larger than the cutting area of the heat collecting induction 101 and the transport end 1032, thereby lowering the pressure relatively, thereby allowing the fluid in the steam state in the heat collecting induction 101 to be naturally This causes the flow to the expansion stage 1041, and at the same time generates a force to be absorbed by the low-temperature fluid in the transport stage 1032, so that the fluid in the low-temperature transport induction 103 is moved toward the heat collection induction 101.

As the fluid absorbs heat and exposes the vapor state, when the fluid flows from the extended end 1041 to the neck ends 1042 and 1042 ', the cutting area gradually decreases, and thus the velocity of the fluid is gradually increased. 1042,1042 ') is approaching the speed of sound, so that the high-speed fluid will form a relatively low pressure at this time, so that the low pressure at the neck end 1042' has a force to absorb the fluid in the low temperature induction 105 As a result, the liquid fluid in the low-temperature floatation degree 105 is sucked into the neck end 1042 ', and at the same time, the fluid in the vapor state from the neck ends 1042 and 1042' enters the mixing chamber end 1043 together.

As a result, the fluid temperature located in the mixing chamber stage 1043 is already lowered, and the low temperature fluid and the high temperature fluid do not move calories into the fluid due to the thermal equilibrium effect, so that the fluid in the mixing chamber stage 1043 must be hot induction. Guided by 104, it enters into the heat spreading induction 102 and is scattered.

Since the cutting area of each small cutting surface end 1045 is smaller than the cutting area of each large cutting surface end 1044, each small cutting surface end 1045 has a large capillary force generated by a cohesive force from the outside. Greater than the capillary force of the fluid, which causes the fluid in the mixing chamber stage 1043 to naturally be attracted by the capillary force and flow from each large cut end 1044 to each small cut end 1045 and finally to the heat dissipation induction 102. The amount of heat introduced into and absorbed by the fluid enters the low temperature zone 83 by heat exchange, thereby completing the transfer of heat.

It will be explained here that the above-mentioned amount of the heat collection induction 101 is large and the cutting area is relatively small, and its purpose is to increase the area in contact with the metal layer 12 and to absorb the low temperature fluid in the transport stage 1032. As such, the aspect is not limited thereto, and in another embodiment of the present embodiment as shown in FIG. 4, the printed circuit board 1 is welded and installed in the above-described heat collecting induction 101 to absorb and attach the fluid. In another embodiment of the present embodiment as shown in FIG. 5, the inside of the heat collecting induction 101 described above is provided in the metal layer 12, the insulating layer 11, and the cover 2 of the printed circuit board 1. The crystal protruding particles 14 protruded toward each other are formed, and all have the same effect as described above through the absorption adhesion phenomenon generated by the surface tension between the fluid and other materials.

In addition, as shown in Figure 3, the low-temperature floating induction 105, each of the neck end (1042, 1042 ') and the mixing chamber stage 1043 is installed in combination with each other for the purpose of the low-temperature fluid located in the storage compartment 1031 The high temperature fluid flowing out from the heat collecting induction 101 is mixed to reach a purpose of rapidly lowering the temperature. As a result, the high temperature fluid is released from the high temperature zone 82 and the temperature is rapidly lowered, thereby reducing the temperature of the printed circuit board 1. It is possible to prevent the temperature of other parts adjacent to the high temperature zone 82 from increasing, thereby indicating that the low temperature induction 105, the neck ends 1042 and 1042 ', and the mixing chamber end 1043 are not necessary units. . Thus, embodiments of the present invention are still possible without installing them.

At the same time, although the driving device 4 of the microfluidic circulation guiding system of the present embodiment is installed, this is also not an essential unit, and as can be seen, the microcirculation guiding system needs a completely external driving force. The amount of heat can be transferred from the hot zone 82 to the cold zone 83 without having to do so.

However, the microfluidic circulation induction system naturally performs the above-described calorie transfer function, so that the high temperature zone 82 must reach a certain high temperature or higher, where so-called high temperature generally indicates the boiling point of the fluid.

Thus, if the temperature of the high temperature zone 83 does not reach the above-mentioned high temperature, cooling is performed through the microcirculation induction system or the microfluidic circulation induction system performs other control to achieve this by the driving device 4. do.

The above-described circulation inducing route 10 is formed in the insulating layer 11 in this embodiment, but is not limited thereto. As shown in FIG. 6, the other insulating layer 11 is used as the bottom wall and the metal layer 12 is the sidewall. As a result, the circulation inducing route 10 is formed in the metal layer 12.

As illustrated in FIGS. 7 and 8, it is further possible to employ a multilayer printed circuit board 1 having a plurality of insulating layers 11 and a plurality of metal layers 12, the circulation inducing route 10 simultaneously. One of the insulating layer 11 and the metal layer 12 is formed to increase the average cutting area of the circulation induction route (10).

In addition, the circulation induction route 10 is not necessarily limited to the same plane, and as shown in FIG. 9, the printed circuit board 1 having a multi-layered type having a plurality of insulating layers 11 and a plurality of metal layers 12 is formed. In use, a vent hole 1201 is formed in one of the vent holes 120 penetrating the plurality of metal layers 12 to communicate with the circulation induction route 10 of the different insulation layers 11 or as shown in FIG. 10. In addition, one of the vent holes 110 penetrating the plurality of insulating layers 11 includes a vent hole end 1101 and at the same time forms a circulation inducing route 10 communicating with different metal layers 12.

Before introducing the manufacturing method of the microfluidic fluid circulation induction system described above, the electronic unit 81 generating the above-described heat amount in the present embodiment is a printed circuit board 1 after the microfluidic circulation induction system is completed. The high temperature zone 82 is installed at a predetermined position. As shown in Figure 11, this manufacturing method includes the following procedure,

Step 300 prepares a printed circuit board 1, as shown in FIG. 12, which is provided on one insulating layer 11 and forms a circuit layer 12 (not shown). Equipped with.

Step 302 produces a photomask 6 with one pattern 60, which in this embodiment is the same as the circulation induction route 10 described above.

Step 304 applies a photoresist 5 to one side away from the metal layer 12 of the insulating layer.

Step 306 transfers (copy) the predetermined shape 60 of the light cover 6 to the light shielding layer 5 as shown in FIG. 13, and defines the predetermined shape 60 in the insulating layer 11. The predetermined shape 60 is exposed to the light blocking layer 5 and exposed to a shadow so that the predetermined shape 60 is exposed on one side away from the metal layer 12 of the insulating layer 11.

Step 308 removes the portion 11 ′ (see FIG. 13) corresponding to the predetermined shape 60 of the insulating layer 11, as shown in FIG. 14, so that the metal layer 12 and other portions of the insulating layer 11 are removed. The circulating induction route 10 which is commonly bounded is made. In this embodiment, the circulating induction route 10 has the light blocking layer 5 as a shield, and further, the insulating layer 11 in a dry etching manner. By removing the portion corresponding to the predetermined shape 60 of the to expose the surface of the insulating layer 11 adjacent to the metal layer 12, and finally remove the light blocking layer (5) again.

Naturally, the portion 11 ′ corresponding to the predetermined shape 60 of the insulating layer 11 is also removed by wet etching or laser ablation.

In step 310, the cover 2 covering the circulation induction route 10 described above is fixed to one side away from the metal layer 12 of the insulating layer 11, so that the metal layer 12 and the insulating layer 11 are fixed. ) And a cover (2) forms a circulation induction route (10).

In the present embodiment, the material of the cover 2 and the metal layer 12 are the same, and are fixed to the insulating layer 11 by an adhesive method. Naturally, the material of the cover 2 is not limited thereto, and other insulating materials or other materials such as glass may be used.

Step 312 is to install the micro pump 41 of the drive device 4 in the circulation guide route 10 as shown in Figs. 2 and 3, in which the control chip of the drive device 4 is a circulation guide. After the root 10 is completed, it is installed in a circuit formed of the metal layer 12 together with the electronic unit 81.

In step 314, the fluid is injected into the circulation induction route 10. In this embodiment, distilled water is introduced into the circulation induction route 10 through the micro pump 41 of the driving device 4, Being distilled water must complete the fluid injection to the circulating induction route (10) and then exhaust the air at the same time. However, when air is adopted, since the air naturally fills the circulation induction route 10 in the above-described step 308, this step can be omitted.

Step 316 is to complete the microfluidic circulation system.

In addition, as shown in FIG. 7, when the microcirculation induction system is manufactured on the printed circuit board 1 having the plurality of metal layers 12, the insulating layer 11 is partially removed by using the metal layer 12. Under these conditions, step 304 must be applied to the light shielding layer 5 (see FIG. 12) on one side away from the insulating layer 11 of the metal layer 12, and the light shielding layer 5 is first screened. The figure 60 (FIG. 12) must be moved to the metal layer 12 to partially remove the insulating layer 11 with the metal layer 12 as a shade.

In addition to the step 308 of removing the insulating layer 11 from the manufacturing procedure of the microfluidic fluid circulation induction system described above, all the other steps are the manufacturing process of a general printed circuit board, and thus, the application of the microfluidic circuit circulation process is quite easy. It is possible to reduce the cost by mass production, have significant accuracy and cooling effect, and can greatly improve the added value of the printed circuit board 1 and the printed circuit board manufactured thereby.

16 and 17 illustrate a second embodiment of the manufacturing method of the microfluidic fluid circulation system according to the present invention. The main unit is generally the same as the first embodiment. The difference is that in the present embodiment, by operating the printed circuit board 1 having the plurality of insulating layers 11 and the plurality of metal layers 12, the main circulation inducing route 1001 and the main circulation inducing route 1001 communicate with each other. Induction routes 1002 are formed in the main insulating layer 111 and the sub insulating layer 112 of the printed circuit board 1, respectively, and are used to transfer heat from the high temperature zone 82 to the low temperature zone 83 in the same manner. It should be noted that the high temperature zone 82 and the low temperature zone 83 are located at opposite sides of the printed circuit board 1 in this embodiment.

The main circulation induction route 1001 is mutually associated with the acid heat induction 102 adjacent to the plurality of low temperature zones 83, the cold transport induction 103 in communication with one acid heat induction 102, and one cold transport induction 103. It includes a low temperature floating induction 105 in communication.

This circulation induction route 1002 is adjacent to one high temperature zone 82, and at the same time, the heat collection induction 101, which is in communication with the low temperature transport induction 103, from the one heat collection induction 101 to the acid heat induction 102. It is in communication with, and at the same time includes a low temperature transport induction 103 and the high temperature transport induction 104 in communication with each other.

The microfluidic fluid circulation induction system further has a metal grid 13 which is contained in the heat collection induction 101 to absorb and attach the fluid.

As illustrated in FIG. 18, this manufacturing method includes the following procedure.

19, first, as shown in FIG. 19, a printed circuit board 1 having one main insulating layer 111 and one metal layer 12 is prepared, and the metal layer 12 is provided on the main insulating layer 111. A circuit (not shown) is formed.

Step 402 prepares the light cover 6 having one predetermined shape 60, in this embodiment, the predetermined shape 60 and the above-described main circulation induction route 1001 (see FIG. 16) are the same.

Step 404 applies one light blocking layer 5 to the main insulating layer 111.

Step 406 transfers (copy) the predetermined shape 60 of the light cover 6 to the main insulating layer 111, as shown in FIG. 20, in which the predetermined shape 60 is used as the light cover 6 as a shade. Exposed from the light blocking layer (5) and exposed to the shadow so that the main insulating layer 111 reveals the predetermined shape (60).

Step 408 removes the portion corresponding to the predetermined shape 60 of the main insulating layer 111, as shown in FIG. 21, so that the main circulation induction route which is commonly bounded from the metal layer 12 and the remaining portions of the main insulating layer 111 ( 1001).

In the present embodiment, the main circulation induction route 1001 uses the light blocking layer 5 as a shield to remove the portion corresponding to the predetermined shape 60 of the main insulating layer 111 by dry etching, thereby revealing the metal layer of the exposed portion. (12) to be the adjacent surface of the main insulating layer (111). Naturally, the portion corresponding to the predetermined shape 60 of the main insulating layer 111 may also be removed by wet etching or laser ablation.

In step 410, as shown in FIG. 22, the cover 2 covering one of the above-described main circulation induction routes 1001 is fixedly installed on one side away from the metal layer 12 of the main insulation layer 111, and the main layer is cut. A main circulation induction route 1001 is formed between the soft layer 111 and the cover 2 in common.

In the present embodiment, the material of the cover 2 is the same as that of the metal layer 12, but is not limited thereto, and may be the same as the other main insulating layer 111, or may be other materials such as glass.

In step 412, as shown in FIG. 23, the vent holes 120 penetrating the plurality of lids 2 are formed to form the vent hole ends 1201 in communication with the plurality of main circulation guide routes 1001.

In step 414, as shown in FIG. 24, one sub insulation layer 112 is provided on one side away from the main insulation layer 111 of the cover 2.

Step 416 defines the predetermined shape 70 in the sub-insulation layer 112, as in FIG. 25, which in this embodiment first forms another light blocking layer 5, and then again one predetermined shape. Exposing the light cover 7 with 70 and revealing it with a shadow so that the sub-insulation layer 112 is partially exposed to form the predetermined shape 70, among which the predetermined shape 70 and the above-mentioned inductive circulation route ( 1002) (see FIG. 16) is the same.

Step 418 removes a portion corresponding to the predetermined shape 70 of the sub insulating layer 112 and a portion covering the vent hole 120, so that the vent hole end 1201 and the main circulation induction route ( And a circulation induction route 1002 in communication with each other, and at the same time forms a circulation induction route 10 including a main circulation induction route 1001, a vent hole end 1201, and a circulation induction route 1001. .

In step 420, as shown in FIG. 27, the metal grid 13 is installed in the heat collecting guide 101 of the circulation inducing route 10, wherein the crystal projecting particles 14 protruding and extending in the plurality of circulation inducing routes 10 ( 5 may be formed on the sub-insulation layer 112 and the cover 2 in a burning manner in this order.

In step 422, as shown in Fig. 17, the cover plate 21 is fixed to one side away from the cover 2 of the sub-insulation layer 112 to seal the circulation induction route 10.

Step 424 installs the micro pump 41 of the drive device 4 in the low temperature transport induction 103 of the circulation induction route 10.

Sequence 426 injects fluid into the circulating induction route 10.

Step 428 completes the microfluidic fluid induction system.

As can be seen from the above-described sequence, when the microfluidic circulation guide system attempts to fabricate a multilayered printed circuit board 1 in this embodiment, if the above-described steps 410 and 418 are repeated several times, the circulation guide route 10 ) Can be formed on more insulating layers 11 and metal layers 12, and also reveals more complex three-dimensional interlocking forms, allowing sufficient mixing and use with various circuits and printed circuit boards. It is fully functional and is operated in various electronic equipments at the same time.

As described above, when the microfluidic circulation induction system of the present invention is applied to a single-sided substrate having a single insulation layer and a single metal layer, a double-sided substrate having a single insulation layer and two metal layers, and a multilayer circuit board, other electronic units In addition to providing the working circuits corresponding to each other, the electronic unit 81 can reduce the temperature of the high temperature generated by the work in a situation where a cooling device is not added. .

The fluid in the microfluidic circulation guiding system of the present invention flows in the circulating induction route 10 formed in the printed circuit board 1, and the metal layer 12 moves to the upper and lower surfaces where the contact area is relatively large and the coating thickness is thin. Due to the good thermal properties of the direct metal material, the fluid exchanges heat in the high temperature zone 82 and the low temperature zone 83 at a high speed, and also at the high speed, the adjacent printed circuit board 1 of each electronic unit 81. From one side of the temperature of the electronic unit 81 is lowered to have a quick cooling effect.

In addition, the electrical layer of the metal layer 12 and the lead frame of each electronic unit 81 forming a circuit through the design is possible, and at the same time the fluid is in direct contact with each electronic unit 81 The micro-circulation induction system of the present invention, such as to cool the energized portion of the waste heat generated actually shows an excellent cooling effect.

In addition, the precision of the conventional printed circuit board manufacturing process satisfies the demand of the microfluidic fluid circulation induction system of the present invention. The lower cost, higher heat capacity and cooling effect, and the distance of cryogenic heat exchange have distant advantages.

In addition to the existing cooling apparatus, such as a separate fan and heat pipe, the present invention has a merit such as the micro-fluid circulation system further reduces the space and does not need to add a separate power source.

Since the circulation induction route 10 proceeds with assembling of the electronic unit 81 only after the printed circuit board 1 is first formed, the cooling device to be added separately or at the same time saves the technology and cost of the cooling device to be added separately. The operation of the cooling unit can reduce the risk of damage to the electronic unit (81).

Claims (31)

At least one insulating layer, a metal layer provided on the insulating layer, and a circulation induction route forming a common boundary between the insulating layer and the metal layer are formed on the printed circuit board, and the circulation induction route includes at least one heat collection induction adjacent to the at least one hot zone; It is composed of the acid heat induction adjacent to one low temperature zone, the low temperature transport induction from the acid heat induction to the collection induction, and the high temperature transport induction from the collection induction to the acid heat induction. Micro fluid circulation induction system, characterized in that to transfer the heat to the cold zone. The micro-fluid circulation guide system of claim 1, further comprising a cover installed on the printed circuit board and simultaneously closing a circulation guide route. The micro-fluid circulation guide system according to claim 1, wherein the circulation guide route is formed in an insulating layer. The micro-fluid circulation guide system according to claim 1, wherein the circulation guide route is formed in a metal layer. The printed circuit board of claim 1, wherein the printed circuit board has a plurality of insulating layers and a plurality of metal layers, and the circulation induction route has a common boundary between the insulating layer and the metal layer, and the circulation induction route is any one of the plurality of insulating layers and the metal layers. Micro-type fluid circulation guide system comprising a vent hole for penetrating. 2. The microfluidic fluid circulation induction system according to claim 1, comprising a drive device in communication with said cold transport induction and flowing said fluid within a circulation induction route. The microfluidic circulation guide system of claim 1, wherein the circulation guide route includes a plurality of heat collection guides. 8. The microfluidic fluid circulation induction system according to claim 7, wherein the high temperature transport induction has an extended end in communication with a partial collection induction of each of the plurality of collection inductions. 2. The microfluidic fluid circulation system of claim 1, wherein said circulation induction route comprises a plurality of acid heat induction. 2. The microfluidic fluid circulation system according to claim 1, wherein the printed circuit board has a metal grid which is welded in the heat collecting induction and absorbs and attaches the fluid. The microfluidic circulation system of claim 1, wherein the printed circuit board has protruding particles formed on any one of a plurality of metal layers, an insulating layer, and a cover, and at the same time protruding to extend into the heat collecting induction. The microfluidic fluid of claim 1, wherein the low temperature transport induction is adjacent to the storage compartment end of the heat dissipation induction, and has a transport end communicating with the storage compartment end and the heat collection induction, and the cut surface of the storage compartment end is larger than the cut end of the transport end. Circulation Induction System. The microfluidic circulation induction system according to claim 1, wherein the high temperature transport induction is in communication with at least one heat collection induction, and the cut surface has an extended end larger than the cut surface of the heat collection induction. 2. The high temperature transport induction has a mixing chamber stage, and the circulation induction route has a low temperature induction in communication with the low temperature transport induction and the mixing chamber stage. Micro fluid flow induction system characterized in that for transporting to the mixing chamber stage. The low temperature part of claim 13, wherein the high temperature transport induction communicates with the mixing chamber end, the expansion end, and the mixing chamber end, and the cutting surface has a neck end smaller than the cutting end of the expansion end, and the circulation induction route communicates with the low temperature transport induction and the neck end. A microfluidic circulation guiding system comprising induction, wherein the cold induction transports fluid directly from the cold transport induction to the mixing chamber stage without passing through the high temperature zone. 2. The microfluidic fluid circulation induction system according to claim 1, wherein the high temperature transport induction has a small cutting edge that is adjacent to the large cutting edge and away from the heat dissipation and at least one scattering induction and whose cutting surface is smaller than the large cutting edge. 17. The microfluidic fluid circulation system according to claim 16, wherein the high temperature transport induction has a plurality of small cutting edge ends. 2. The high temperature transport induction according to claim 1, wherein the high temperature transport induction has a large cut face end spaced from a plurality of heat dissipation induction and a small cut face end adjacent to the plurality of diffuse heat inductions, and the area of the small cut face end is smaller than the cut area of the large cut face end. A micro fluid circulation induction system. 2. The microfluidic fluid circulation system of claim 1, wherein the fluid is one selected from the group consisting of air, methanol, acetone and water. On the printed circuit board a) defining a predetermined pattern on the main insulating layer with a metal layer, and b) removing the portion corresponding to the predetermined figure of the main insulating layer to form a main circulation induction route. The method of claim 20, wherein the order a) a-1) prepare a photomask with the intended geometry, a-2) After forming a photoresist on the main insulating layer, a-3) a method of manufacturing a micro-fluid circulation system comprising the step of transferring a predetermined shape of the light cover to a light blocking layer. The method of claim 20, wherein the order a) a-1) prepare the light cover with the intended shape, a-2) after forming the light blocking layer on the metal layer, a-3) transferring the predetermined shape of the light cover to a metal layer, a-4) a method of manufacturing a micro-fluid circulation system comprising the step of transferring a predetermined shape of the metal layer to a main insulating layer. 21. The method of claim 20, wherein in step b), the portion corresponding to the predetermined figure of the main insulating layer is removed by one of laser and etching. The method of claim 20, wherein after step b), c) a method of manufacturing a microfluidic fluid circulation system comprising the step of fixing the cover on one side away from the metal layer of the main insulation layer. The method of claim 24, wherein after step a), d) penetrate a plurality of covers and form vent holes in communication with the main circulation route; e) after installing the sub insulation layer on one side away from the main insulation layer of the cover, f) define the intended geometry in the sub insulation layer, g) a microfluidic circulation guide system comprising the steps of removing a portion corresponding to a predetermined figure of the secondary insulating layer and a portion of the vented hole to form a secondary circulation guide route communicating with the main circulation guide route. Manufacturing method. The method of claim 25, wherein after step g), h) A method of manufacturing a micro-fluid circulation system comprising the step of fixing the cover plate on one side away from the cover of the sub insulation layer. The method of claim 20, wherein after step b), i) A method of manufacturing a micro-fluid circulation guide system comprising the step of installing the drive unit in the main circulation guide route. The method of claim 20, wherein after step b), j) A method of manufacturing a microfluidic fluid circulation system comprising the step of installing a metal grid in a main circulation guide route. The method of claim 20, wherein after step b), k) A method of making a microfluidic fluid circulation system, comprising: forming on one of a plurality of metal layers and a cover by a method of burning protruding particles protruding into the main circulation inducing route. The method of claim 20, wherein after sequence a), l) A method of making a microfluidic fluid circulation system comprising the step of injecting fluid into a main circulation route. 31. The method of claim 30, wherein the fluid is one of air and water.