KR20050003988A - Wiring pattern inspection apparatus - Google Patents

Abstract

PURPOSE: An apparatus for inspecting a wiring pattern is provided to reduce an inspection fault and to reduce an inspection time by mixing a reflective illumination inspection with a vertical illumination inspection. CONSTITUTION: An apparatus for inspecting a wiring pattern includes an illumination device for irradiating an illumination light to a substrate. An image forming device is provided to from an illumination image of the substrate by receiving an illumination light transmitted onto the substrate. The image forming device forms a vertical illumination image of the substrate by receiving a vertical illumination light reflected from the substrate. A controlling unit(4) determines a wiring pattern of the substrate on the basis of patterns of the illumination image and the vertical illumination image of the substrate formed by using the image forming device.

Description

Wiring pattern inspection device {WIRING PATTERN INSPECTION APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring pattern inspection apparatus, comprising irradiating illumination light to a tape automated bonding (TAB) tape by a tape carrier method, and imaging the wiring pattern formed on the TAB tape by an imaging means and comparing it with a reference pattern. The wiring pattern inspection apparatus which performs an external appearance inspection automatically.

In response to the demands for high integration and high-density packaging, semiconductor devices are increasingly pinned and miniaturized. The method which connects a semiconductor chip with the many lead wire | wire provided in the film-shaped TAB tape is employ | adopted from the point which is advantageous for this polyfinization and microminiaturization.

5 shows the order in which the TAB tapes are made.

As shown in Fig. 5 (a), the TAB tape 101 has a perforation hole on the resin film 102 having a thickness of about 20 to 150 m (mostly 25 to 75 m) and a width of about 35 to 165 mm. The adhesive 104 of about 10-15 micrometers in thickness is apply | excluded except the peripheral part on both sides where 103 is formed, and as shown to this figure (b), metal foil 105, such as copper foil, is adhere | attached, have.

This metal foil (copper foil) 105 is processed by exposure and etching to form a wiring pattern. At this time, as shown in this figure (c), the adhesive layer is not removed and remains as it is.

Fig. 6 shows the external appearance of the TAB tape in which the wiring pattern is formed as described above. As shown in this figure, many identical circuits are continuously produced on a strip | belt-shaped tape (TAB tape). In this figure, the white rectangle is an opening (device hole) 110 to which a semiconductor chip is attached, and 111 is a wiring circuit pattern.

In the manufacturing process of such a TAB tape 101, it is necessary to test whether the wiring pattern is formed correctly, and a test | inspection is performed by a wiring pattern inspection apparatus.

The wiring pattern inspection apparatus illuminates the TAB tape 101 to be inspected with illumination light, detects the state (appearance) of the circuit pattern with an imaging device or the eye, and determines whether or not the formed wiring pattern is compared with the reference pattern.

Recently, the automatic inspection apparatus which stores the reference pattern in advance in the storage unit of the control unit of the inspection apparatus, compares the stored reference pattern with the actual wiring pattern picked up by the imaging apparatus, and automatically determines whether or not it is successful. Has been.

In order to image a pattern, the method of irradiating illumination light with respect to a TAB tape includes the method of using fall light, and the method of using transmitted light.

The method using fall light is irradiating illumination light from the upper side of the TAB tape (surface side in which wiring is formed), and observing the wiring pattern image by the reflected light from a TAB tape in the direction to which illumination light is irradiated, For example, a wiring pattern image is picked up by an imaging device such as a CCD camera to perform image processing.

On the other hand, the method of using transmission illumination illuminates from below the TAB tape (opposite to the surface on which the wiring is formed), and the wiring pattern image by the transmitted light which permeate | transmitted the TAB tape above the TAB tape (the illumination light irradiates) From the opposite side).

The material of the resin film of the TAB tape is polyimide in most cases, and varies depending on the thickness, but transmits light having a wavelength longer than 500 nm. Therefore, when performing transmissive illumination, the light containing the wavelength of 500 nm or more is selected as illumination light.

Moreover, it is also proposed to test plate-shaped workpiece | work using both fall illumination light and transmission illumination light (for example, refer the prior art example of patent document 1).

What is described in the said patent document 1 is the fall illuminating means which irradiates the surface side of a plate-shaped workpiece, the transmissive illumination means which irradiates the back surface side of this workpiece, and the reflection image of the said workpiece by the said fall illuminating means (hereinafter a fall illumination image) And a camera for photographing the transmission image (hereinafter referred to as a transmission illumination image) of the workpiece by the transmission illumination means, and inspecting various defects of the workpiece based on the reflection image and transmission image of the workpiece. .

(Patent Document 1)

JP 2001-305074

The purpose of the inspection of the wiring pattern is to determine whether the wiring pattern is formed in a desired shape, for example, to determine whether the thickness of the formed wiring pattern is within an allowable range with respect to the reference pattern. If the thickness of the formed wiring pattern is too thick (hereinafter referred to as thickening), it may short with the neighboring wiring pattern, and if the thickness is too thin (hereinafter referred to as thinning), it may be disconnected.

On the other hand, there is also a desire to make as little false detection of the inspection apparatus as possible.

One of the causes of misdetection is dust (foreign matter) adhering to the substrate surface or the back surface. As will be described later, when there is dust, the wiring may appear thick or thin in the captured image. Although dust is also one of the causes of the defects, it can often be removed by washing in a later step. Therefore, there is a desire to detect only thickening or thinning of wirings and to eliminate false detection of thickening or thinning of wirings by appearance of dust.

In the case of the conventional test | inspection apparatus, when a test | inspection apparatus detects the thickening or thinning of wiring, an alarm sounds and stops. According to this, the worker checks with a monitor etc. visually whether the pattern is really defective or is incorrectly detected, and restarts the device (restarts) when it is falsely detected. If there are many false detections, inspection efficiency will fall very much.

Hereinafter, the thickening and thinning of wiring, and the misdetection by the dust will be described with specific examples.

For example, when checking the thickness or thinning of a pattern, it is preferable to test by transmission illumination. This is for the following reason.

As shown in FIG. 7, when the metal foils, such as copper foil, were etched and the pattern was formed, the cross section of the formed pattern becomes trapezoidal shape, and the dimension of the width | variety a of the upper width a of the pattern, and the lower width b is compared. In this case, the lower width b becomes wider. This is due to the diffusion and the speed at which the etching liquid is etched from the surface of the copper foil to the inside, and are well known.

In the case of inspecting such a pattern, in fall illumination, the imaging element captures the light reflected from the surface of the wiring pattern, and the other portions are darkened.

For this reason, as shown in Fig. 8A, even if the wiring pattern is short-circuited with the neighboring pattern on the lower side, the image to be captured is reflected as a normal pattern without short circuit.

Therefore, in fall lighting, the defect may be missed. Such a state in which the wiring pattern is short-circuited with the neighboring pattern on the lower side is called "rooting".

On the other hand, when the transmission illumination is used, the image pick-up element captures the light which permeates a resin film, and the other part becomes dark.

Therefore, as shown in Fig. 8 (b), when the wiring pattern is short-circuited with the neighboring pattern from the lower side, the portion does not transmit illumination light, and the image to be imaged is reflected by the thick strange wiring pattern, thus eliminating defects. It can be detected. Of course, the defect by tapering of wiring can also be detected.

However, the transmitted light has the following drawbacks.

When dust (dust) adheres to the substrate surface or back surface, the dust does not transmit light. Therefore, the part to which dust adheres becomes dark, and becomes the same as the case where a wiring is thick in the image imaged. In the inspection by the transmission illumination, dust adhesion and the thickness of the wiring cannot be distinguished, and dust adhesion is incorrectly detected by the thickness of the wiring.

On the other hand, in fall illumination, when the dust adheres to the back surface of a board | substrate, false detection does not generate | occur | produce since illumination light is reflected on the surface of a wiring pattern.

However, when the dust is on the surface of the substrate, that is, on the wiring pattern, the dust diffuses the illumination light, and the part where the dust adheres becomes dark. In the image picked up by fall illumination light, since a pattern image is reflected brightly and the other part is reflected dark, dust adhesion is incorrectly detected by tapering of wiring.

As described above, only one of the inspection by the fall illumination light or the inspection by the transmission illumination light makes it difficult to inspect the thickness and tapering of the wiring pattern without erroneous detection by dust adhesion.

As described in Patent Document 1, it is considered that if the inspection is performed using both the fallen light and the transmitted light and the fall light image and the transmissive light image, the false detection can be prevented, but it is formed on the light transmissive substrate. It is not known how to judge the quality of the wiring pattern by using a fall illumination image and a transmission illumination image.

This invention is made | formed in view of the said situation, The objective is providing the test | inspection apparatus of the wiring pattern which combines the test | inspection by a fall lighting and the test | inspection by reflected light, and there is little misdetection and can shorten an inspection time. will be.

1 is a block diagram of a wiring pattern inspection apparatus of an embodiment of the present invention;

2 is a flowchart showing a determination algorithm for inspection of wiring patterns according to the embodiment of the present invention;

3 is a diagram illustrating an example of an inspection method of a wiring pattern;

4 is a diagram showing an example of a transmission illumination image and a fall illumination image when there are thinning, thickening, foreign matters, etc .;

5 is a view showing an example of the structure of a TAB tape;

6 is a view showing an example of a patterned TAB tape;

7 is a view showing a cross section of a formed pattern when a metal foil such as copper foil is etched to form a pattern;

It is a figure explaining the defect of the pattern missed when using fall light as illumination light.

<Explanation of symbols for main parts of drawing>

1: Inspection part 1a: Transmission lighting means

1b: fall lighting means 1c: imaging means (CCD line sensor)

2: scanning means 3: marker portion

4: control unit 5: TAB tape

5a: Inspection pattern 10: Tape conveyance mechanism

11: feeding reel 12: winding reel

In the present invention, the above problems are solved as follows.

Illuminating means for irradiating illumination light onto a substrate, and transmitted illumination light irradiated from the illuminating means and transmitted through the substrate to obtain a transmission illumination image of the substrate, and receiving reflected illumination light reflected from the substrate. And image acquisition means comprising imaging means for obtaining a fall-off illumination image of the substrate.

And the light transmission board | substrate, such as a TAB tape and a flexible printed circuit board in which a wiring pattern was formed, imaged a wiring pattern using transmission illumination, and imaged the pattern of the same part using fall illumination, and the image of a transmission illumination image The pattern and the pattern of the falloff illumination image are acquired.

Next, the quality of the wiring pattern of the board | substrate is determined as follows.

(i) The pattern of the said transmissive image is inspected by comparing the pattern of the transmissive image image picked up by the transmissive illumination with the 1st reference pattern memorize | stored previously.

(ii) In the inspection, when there is no defect and it is determined to be positive, the wiring pattern is positive.

(iii) In addition, when it is determined that there is a defect, when the defective portion is thinned, the wiring pattern is regarded as defective. Moreover, when the defect part is thickening wiring, the 2nd reference pattern which previously memorize | stored the pattern image | photographed by the fall-off illumination of the position corresponding to the part about the part which became a defect candidate as a bad candidate. The test is carried out in comparison with.

And based on the inspection result by this fall lighting, the quality of the part which became the poor candidate by transmission light is determined.

For example, when the inspection is performed in comparison with the second reference pattern, when the portion which becomes the defective candidate is thickened, the wiring pattern is regarded as defective.

Moreover, as a result of the inspection compared with the 2nd reference pattern, when the part which became a defective candidate was thinning wiring, it determined with the foreign material the cause judged as wiring thickening by the inspection of the pattern of a transmission illumination image, The wiring pattern is positive.

In addition, as a result of the inspection compared with the second reference pattern, if the wiring thickening or the wiring thinning are not found in the defective candidate portion, the cause determined as the wiring thickening is determined by the inspection of the pattern of the transmission illumination image. It is judged that the defect is caused by thickening on the lower side. In this case, it is also possible to determine that the wiring pattern is positive by making the cause determined by the thickness of the wiring in the inspection of the pattern of the transmission illumination image due to the spreading of the substrate.

In the present invention, as described above, the inspection of the wiring pattern is performed by combining the inspection of the pattern of the transmission illumination image captured by the transmission illumination and the inspection of the pattern of the falloff illumination image, so that the thickness of the wiring pattern becomes thinner and thinner. The inspection of the baggage can be carried out with fewer false detections.

Moreover, since the inspection of the pattern of the transmission illumination image image | photographed by transmission illumination is performed, and the pattern of the fall-off illumination image in the position corresponding to this wiring pattern is inspected about the wiring pattern determined as a defective candidate, The quality of the wiring pattern can be determined without inspecting the entire area with respect to the pattern of the illumination image, and the inspection time can be shortened.

1 is a block diagram of a wiring pattern inspection apparatus of an embodiment of the present invention.

In addition, although the following Example demonstrates the case where a board | substrate is a TAB tape, this invention is applicable to the test | inspection of various board | substrates by transmitted illumination light other than a TAB tape.

As shown in this figure, the pattern inspection apparatus of this embodiment is a tape conveyance mechanism 10, a delivery reel 11 which consists of a delivery reel 11, a winding reel 12, etc. which convey a TAB tape 5, and the like. An inspection unit 1 for irradiating the TAB tape 5 transmitted from the transmission illumination light and the fall illumination light to image the pattern 5a, and the scanning means 2 for scanning the inspection unit 1 on the inspection pattern 5a of the TAB tape. And a marker portion 3 for displaying a defective pattern.

In the marker part 3, you may punch with the pattern judged to be defective, or you may display coloring etc. so that the part may immediately confirm that it is a defective article.

Moreover, by comparing the picked-up transmission image pattern, the fall illumination image pattern, and the reference | standard master pattern, the quality of a product is judged, and the inspection part 1, the scanning means 2, the marker part 3, and the tape The control part 4 which controls the operation | movement of the conveyance mechanism 10 is provided. In the control part 4, the reference pattern used as a reference | standard of a pattern inspection is previously input. There are two types of reference patterns, one for fall illumination and one for transmission illumination. In addition, the reference pattern may be an image which picked up the actual pattern judged as good quality, and may use CAD data.

The inspection unit 1 transmits through two transmission illumination means 1a for illuminating the TAB tape 5 on the back side, two fall illumination means 1b for illuminating the surface side, and the TAB tape 5. Patterns 5a such as circuits formed on the TAB tape 5 by illumination light transmitted through the TAB tape 5 and fallen illumination light reflected from the TAB tape 5 provided at positions facing the illumination means 1a. Is constituted by the imaging means 1c.

The light source of the transmissive illumination means 1a appropriately selects the radiation of the wavelength transmitted through the resin film of the TAB tape 5, but in this embodiment, an LED emitting light having a wavelength of 850 nm or more is used.

The imaging means 1c is, for example, a CCD line sensor having a light receiving sensitivity at a wavelength of illumination light, and a case of using the CCD line sensor as the imaging means 1b will be described below. In addition, as long as the light quantity of the transmissive illumination means 1a and the fall illumination illuminator 1b can fully enlarge, you may use the CCD sensor which can image | photograph the whole inspection pattern whole surface instead of a CCD line sensor.

The scanning means 2 scans the CCD line sensor 1c, the transmissive illumination means 1a, and the fallout illumination means 1b on the inspection pattern 5a of the TAB tape 5 in the left and right directions of the drawing of this figure. , Image of the entire TAB tape 5 is obtained.

In addition, the scanning direction by the scanning means 2 may be the front-back direction of the drawing paper, and in this case, the said transmission illumination means 1a and the fall illuminating means 1b axis | shaft the optical axis of CCD line sensor 1c. It is arrange | positioned in the state which rotated 90 degrees.

Fig. 2 is a flowchart showing a determination algorithm for inspecting the wiring pattern in the embodiment of the present invention. The inspection of the wiring pattern in the present embodiment will be described with reference to this figure.

As shown in FIG. 6, a plurality of identical wiring patterns are successively produced on the TAB tape 5, and the control unit 4 drives the tape conveyance mechanism 10 to drive the TAB tape 5 to the inspection unit ( Return to 1).

When the test pattern 5a which becomes the test object of the TAB tape 5 is conveyed to the predetermined position of the test | inspection part 1 by the said tape conveyance mechanism 10, the TAB tape 5 stops at that position.

Illumination light is irradiated below the TAB tape 5 (the side in which the wiring pattern is not provided) by the transmission illumination means 1a. Then, the scanning means 2 scans the transmission illuminating means 1a, the fall illuminating means 1b, and the CCD line sensor 1c in the left and right directions of the drawing of this drawing. As a result, the illumination light emitted from the transmitted light illuminating means 1a passes through the TAB tape 5 and is received by the CCD line sensor 1c, so that the image of the inspection pattern 5a is received by the CCD line sensor 1c. (Step S1 of FIG. 2).

In the image received by the CCD line sensor 1c, the part with a wiring pattern is dark, and the other part shines brightly. This image is stored in the control unit 4 as a transmission illumination image.

Next, illumination light is irradiated to the same area above the TAB tape 5 (side on which the wiring pattern is provided) by the fall illumination means 1b, and the scanning means 2 transmits the illumination light means ( 1a), the fall illuminating means 1b and the CCD line sensor 1c are scanned. In addition, by scanning in the direction opposite to the scanning direction at the time of imaging the said transmissive illumination image, the inspection part 1 can be returned to an original position.

The CCD line sensor 1 receives the reflected light from the TAB tape 5 and receives the image of the inspection pattern 5a into the CCD line sensor 1c (step S2 in FIG. 2). In the image, the pattern portion reflects the illumination light, and the other portion is dark.

The image is contrast-inverted and stored in the controller 4 as a fall illumination image (step S3 in FIG. 2).

In addition, the reason for inverting contrast is as follows.

In the transmission illumination image and the falloff illumination image, contrast is reversed as described above. This is because it is easier to compare the contrast in such a way that the dark part is the part in which the pattern exists when comparing the image by the transmission illumination and the image by the fall illumination in the later step.

Next, the control part 4 compares the memorize | transmitted illumination image and the reference pattern for transmission illumination, and checks whether the wiring pattern of a transmission illumination image exists in the range of predetermined dimension with respect to a reference pattern (step S4).

An example of a test | inspection method is shown in FIG. As shown in this figure, the widths w1, w2, w3, ... of the wiring pattern are obtained at predetermined intervals δ, and the width of the wiring is compared with the width of the reference pattern.

For example, what is ± 30% or more with respect to the width | variety of a reference pattern is made into defect of "thickness" or "thinning". Hereinafter, such a test is called a thinning and thickening test of a pattern.

And according to the result of the said test, the quality of a wiring pattern is determined as follows.

(a) When there is no tapering or thickening (no defect), the inspected wiring pattern is judged to be good, and the process goes from step S5 to step S15. In this case, since the wiring pattern is good, the TAB tape 5 is conveyed, the inspection pattern 5a to be the next inspection object is sent to the inspection unit 1, and the next wiring pattern is inspected.

(b) If there is a defect, the following judgment is made as follows (i) or (ii) depending on whether the defect is tapered or thickened.

(i) When there is tapering

When the width | variety of the wiring pattern of a transmissive illumination image is thinner than a predetermined dimension range, the cause can only be a fall of wiring.

Therefore, the inspected wiring pattern is judged to be a defective article of wiring omission (step S7), and the position of the wiring pattern is stored, and when the wiring pattern is sent to the marker part 3 shown in FIG. (Step S13), the process goes to step S15.

An example of the transmission illumination image in the case of thinning wiring is shown in FIG.4 (a). In addition, although a fall illumination image is also shown in this figure, in this case, it can determine without using a fall illumination image.

(ii) If there is thickening

When the width of the wiring pattern of the transmitted illumination image is larger than the predetermined dimension range, it is determined that the inspected wiring pattern is a defective candidate. Then, from step S6 to step S8, the position of the area A including the thickened portion of the wiring pattern of the defective candidate is stored.

Next, the image of the fall illumination image of the predetermined range (for example, the range of 10 pixels radius from the water surface of the CCD camera 1c) of the position corresponding to the said area A, and the same position of the reference pattern for fall illumination The images are compared and the thinning and the thickening are examined.

As a result of this inspection, when thickening is detected similarly to the inspection result by the transmission illumination image (step S10), it is determined that the wiring pattern is a defective product which may be shorted by thickening (step S12), and in step S12 In step S13, as described above, the position of the wiring pattern is stored, and when the wiring pattern is sent to the marker part 3 shown in FIG.

FIG. 4B shows an example of a transmission illumination image and a fallout illumination image when the thickness is detected in the transmission illumination image and the thickness is also detected in the fall illumination image.

In contrast to the inspection result by the transmission illumination image, when thinning is detected (step S11), the cause of the thickening by the transmission illumination image is determined as "foreign substance" on the pattern (step S14), and the wiring pattern Judges that it is good quality, and goes to step S15 as mentioned above, conveys the TAB tape 5, sends the test pattern 5a used as the next test | inspection object to the test | inspection part 1, and examines the next wiring pattern.

This is because when there is dust on the pattern as described above, it is detected as thickening in the transmission illumination image and thinning in the falloff illumination image.

Fig. 4C shows an example of a transmission illumination image and a fallout illumination image when the thickness is detected in the transmission illumination image and the tapering is detected in the falloff illumination image.

In addition, when neither thickening nor thinning is detected, it is determined that the cause of the thickening by the transmission illumination image is due to the thickening (remaining root) at the lower side of the pattern (step S12), and the wiring pattern is determined to be defective. In step S13, a defective display is performed on the wiring pattern as described above.

Fig. 4 (d) shows an example of the transmission illumination image and the falloff illumination image when the thickness is detected in the transmission illumination image and neither the thickness nor the thickness is detected in the falloff illumination image.

In addition, the determination algorithm of the said embodiment is an example, You may make other determination.

For example, in the inspection by transmission illumination, diffuse reflection may occur by the minute unevenness | corrugation which exists in the surface of the adhesive bond layer after copper foil peeling shown in the said FIG. 5, and bleeding and a stain may generate | occur | produce in a transmission illumination image. Also in this case, as shown in Fig. 4 (d), thickening is detected in step 6 of Fig. 2 in the transmitted illumination image, and neither thickening nor thinning is detected in the fall-off illumination images in steps 10 and 11.

In the case of such a smudged or uneven substrate, the smeared or unevenness is incorrectly detected as the thickness of the wiring in the subsequent step 12, and it is judged as defective.

In such a case, the determination of step 12 when neither thickening nor thinning in the above embodiment is detected is made "the cause of the thickening by the transparent illumination image is caused by the spreading or unevenness of the adhesive layer", It is determined that the wiring pattern is good and the flow goes to step 15. This is because the use of fall lighting enables to obtain an image that is not affected by the surface state of the adhesive layer.

What is necessary is just to select the said determination algorithm suitably according to the user's request, such as the state of the board | substrate used as a test object, and when there exists a possibility of a defect in wiring pattern, whether all are treated as a defect.

As described above, in the present embodiment, the inspection is performed by using the fallen illumination image on the portion of the transmission illumination image that is a defective candidate, starting from the inspection by the transmission illumination image. By doing so, the inspection time can be shortened.

The reason for this is as follows.

(1) If neither the thickness nor the thickness of the wiring pattern is detected in the inspection by the penetrating illumination, it can be judged as a good product immediately, and the inspection by the fall illumination is unnecessary.

On the other hand, even if thickening or thinning are not detected by inspection by fall lighting, there may be roots, so inspection by transmission illumination is necessary.

(2) If the wiring pattern has tapered in the inspection by the transmission illumination, it can be immediately judged as a defective product, and the inspection by the fall illumination is unnecessary.

On the other hand, even if thinning is detected by inspection by fall lighting, there is a possibility of false detection by dust on a pattern, and inspection by transmission illumination is necessary.

(3) Actually, the wiring pattern to be inspected has many good products. Therefore, as in the present embodiment, it is efficient to perform inspection by fall-off illumination to determine whether the wiring pattern which may be defective (of defective candidate) is a false detection by dust or the like or a real failure.

Moreover, in the said Example, although the case where one imaging means (CCD camera) was provided was demonstrated, you may provide the imaging means which image | photographs a transmission illumination image, and the imaging means which image | photographs a fall illumination image, respectively. Moreover, when imaging means is provided in the both sides of a TAB tape, a transmission illumination image and a fall illumination image can also be obtained by the illumination light of one illumination means.

As described above, in the present invention, the following effects can be obtained.

(1) Since the quality of the wiring pattern is determined by combining the inspection of the pattern of the transmission illumination image captured by the transmission illumination and the inspection of the fallen illumination image captured by the fall illumination, the thickness of the wiring pattern becomes thinner and thinner. The inspection of the baggage can be carried out with fewer false detections.

(2) The pattern of the transmission illumination image picked up by the transmission illumination is inspected, and the pattern of the fall-off illumination image is inspected at the position corresponding to this wiring pattern with respect to the wiring pattern determined as the defective candidate, Since the quality of the wiring pattern is determined, the inspection time can be shortened.

In addition, by appropriately selecting the determination algorithm according to the substrate to be inspected, it is possible to determine the presence or absence of foreign matters in addition to the thickness and thickness of the wiring pattern, and the abnormality due to the presence or absence of smears on the substrate, roots, etc. May be detected.

Claims (1)

In the wiring pattern inspection apparatus which automatically inspects the quality of the wiring pattern formed on the light transmissive substrate, Illumination means for irradiating illumination light onto the substrate; Image acquisition means for receiving the transmission illumination light irradiated from the illumination means and passing through the substrate to obtain a transmission illumination image of the substrate, and receiving the fall illumination illumination light reflected from the substrate to obtain a fall illumination image of the substrate; , And a control unit for determining whether the wiring pattern of the substrate is good or not, based on the pattern of the transmission illumination image of the substrate obtained by the image acquisition means and the pattern of the fall illumination image. The control unit, The pattern of the said transmission illumination image is compared with the 1st reference pattern, and the wiring pattern of the said board | substrate is examined, By the inspection, the wiring pattern determined as the defective candidate is inspected by comparing the pattern of the fallen illumination image and the second reference pattern at a position corresponding to the portion of the defective candidate to determine the wiring pattern of the substrate. The wiring pattern inspection apparatus characterized by the determination of quality.