KR200490415Y1 - Camera Module Vacuum Suction Device for Semiconductor Line - Google Patents

Abstract

The present invention relates to a camera module vacuum adsorption device for a semiconductor line, the housing 10 is provided with a compressed air inlet 11, compressed air outlet 12 and the coupling hole 13 on one side while receiving space is formed therein. and; A compressed air line 20 having one end connected to the compressed air inlet 11 and installed in the accommodation space, and the other end connected to the compressed air outlet 12; A solenoid valve 30 installed on the compressed air line 20; An ejector 40 installed on the compressed air line 20 between the compressed air outlet 12 and the solenoid valve 30; A vacuum line 50 having one end installed in communication with the ejector 40 and the other end installed in the coupling hole 13; A vacuum regulator (60) installed on the vacuum line (50); A first filter 70 installed on the vacuum line 50 between the ejector 40 and the vacuum regulator 60; A second filter 80 installed outside the housing 10 and connected to the compressed air outlet 12 to purify the discharged air; A vacuum hose 90 having one end installed in the coupling hole 13 while the outside of the housing 10 is installed, and the nozzle block 91 installed at the other end thereof; Including, and by such a configuration by the present invention is a defect that occurs during the assembly of the small camera module is reduced.

Description

Camera Module Vacuum Suction Device for Semiconductor Line

The present invention relates to a camera module vacuum adsorption device for semiconductor lines, and more particularly, to a semiconductor module camera adsorption device for vacuum adsorption of components for assembling a small camera module mounted on a smartphone or the like.

In general, the small camera module mounted on the smart phone is very small, the size of less than 1cm, so the process of assembling each other by holding each component needs to be made elaborate.

To this end, conventionally, both sides of the small camera module are gripped by using a gripper structure having a forceps structure, and then moved to the position of the counterpart and then assembled according to the position of the counterpart. In this case, both sides of the compact camera module are assembled. There is a problem in that the force of the tongs to be precisely adjusted.

In other words, if the force of the forceps is weak, the camera module can be easily detached during the movement process. On the contrary, if the force is high, the exterior of the camera module is scratched to make a defective product.

Therefore, vacuum adsorption devices have been developed for the sophisticated work of gripping, moving and assembling small camera modules.

The conventional vacuum adsorption device has a problem that the vacuum-adsorbed camera module does not appear hidden by the nozzle block of the vacuum adsorption device, thereby making it difficult to assemble by accurately positioning the vacuum-adsorbed parts to a position for assembling with the counterpart parts.

In addition, if the vacuum adsorption force is strong, parts may be damaged while an impact occurs during the vacuum adsorption of the camera module.

Accordingly, there is a need to develop an improved camera module vacuum adsorption device for semiconductor lines in which a vacuum adsorption device can stably adsorb and release adsorption of a camera module while enabling precise assembly of the module.

KR 10-0599373 B1 KR 10-0652815 B1 KR 10-2016-0004818 A

Therefore, the present invention was devised to solve the problems of the conventional camera module vacuum adsorption device as described above, and it is easy to check the position of parts so that the camera module can be accurately assembled by holding the small camera module in vacuum adsorption. It is an object of the present invention to provide a camera module vacuum adsorption device for a semiconductor line, in which the vacuum pressure (release pressure) can be adjusted so that the component is not damaged by the shock generated during the vacuum adsorption and desorption process of the component.

An object of the present invention as described above is a camera module vacuum adsorption device, the housing is provided with a compressed air inlet and compressed air outlet and the coupling hole on one side while the receiving space is formed therein; A compressed air line having one end connected to the compressed air inlet and installed in the accommodation space, and the other end connected to the compressed air outlet; A solenoid valve installed on the compressed air line; An ejector installed on the compressed air line between the compressed air outlet and the solenoid valve; A vacuum line having one end installed in communication with the ejector and the other end installed in the coupling hole; A vacuum regulator installed on the vacuum line; A first filter installed on a vacuum line between the ejector and the vacuum regulator; A second filter installed outside the housing and connected to the compressed air outlet to purify the discharged air; One end is installed in the coupling hole while the outer side of the housing is installed, the other end of the vacuum hose is installed nozzle block; It is achieved by configuring, including.

And the present invention is characterized in that the check valve is installed on the compressed air line between the compressed air outlet and the ejector.

In addition, the present invention is another feature that the vacuum gauge is further installed in the vacuum regulator.

In addition, the present invention is characterized in that one end of the vacuum release line is installed in communication with the compressed air line on the compressed air inlet side, and the other end of the vacuum release line is installed in communication with the vacuum line between the coupling hole and the vacuum regulator. .

On the other hand, the present invention is characterized in that the speed controller for controlling the discharge pressure of the compressed air is installed on the vacuum release line.

And the present invention is another feature that the speed controller is pressure controlled in the range of 3/100 ~ 0.5g.

In another aspect, the present invention and the tab connection portion has a vertical length of the nozzle block; A body part having a horizontal length when connected to the bottom of the tab connection part; A nozzle installation unit in which a pair is installed at a predetermined interval on the bottom of the body part; Nozzles respectively installed in the nozzle mounting unit; It is another feature to include a.

In addition, the present invention is characterized in that a third horizontal hole is formed to connect the first hole of the tab connection part and the second hole of the nozzle installation part to each other.

The present invention is another feature that the nozzle is made of any one material selected from natural rubber, flexible resin, silicone.

In addition, the present invention is characterized in that the lower inner diameter of the nozzle is 0.8mm, the upper inner diameter is coupled to the nozzle mounting portion is 1.0mm.

According to the present invention, the small camera module of the semiconductor line is vacuum-adsorbed by using two nozzles provided in the nozzle block, so that the corner part of the component can be easily checked, whereby the relative part of the camera module can be easily checked while Can be assembled correctly.

In addition, the present invention can properly adjust the vacuum pressure and the discharge pressure of the compressed air for releasing the vacuum by using a vacuum regulator and a speed controller, whereby the parts are not damaged during the vacuum adsorption and vacuum release process.

1 is a perspective view showing an example of a camera module vacuum adsorption device for a semiconductor line according to the present invention,
2 is a plan view of FIG. 1,
3 is a plan view showing the inside of the housing in FIG.
Figure 4 is a block diagram showing an example of a vacuum module for the camera module vacuum adsorption apparatus according to the present invention,
5 is a view showing a vacuum line and a handle and a nozzle block according to the present invention,
6 is a perspective view showing an example of a nozzle block according to the present invention,
7 is a cross-sectional view showing an example of a nozzle block according to the present invention,
8 is a configuration diagram showing an example of forming a vacuum by using a vacuum module for adsorption of the camera module for semiconductor lines according to the present invention,
Figure 9 is a block diagram showing an example of releasing the vacuum in the vacuum module of the camera module vacuum adsorption apparatus according to the present invention.

Hereinafter, the configuration and operation of the present invention according to the accompanying drawings showing a preferred embodiment of the present invention will be described in detail.

The present invention facilitates the identification of parts so that the camera module can be accurately assembled by holding the camera module in vacuum adsorption, and the vacuum pressure is controlled so that the parts are not damaged by the shock generated during the vacuum adsorption and desorption process. The present invention is to provide a camera module vacuum adsorption device for this possible, this invention is as shown in Figure 1 and 2, the housing 10, the compressed air line 20, the solenoid valve 30, the ejector ( 40, a vacuum line 50, a vacuum regulator 60, a first filter 70, a second filter 80, and a vacuum hose 90.

The housing 10 is formed in a rectangular box shape as shown in FIGS. 1 and 2, and an accommodation space is formed therein, and one side of the housing 10 has a compressed air inlet 11 and a compressed air outlet. 12 and the coupling hole 13 to which the vacuum hose 90 to be described later is connected are provided with spaced apart from each other.

And another side of the housing 10 is further provided with a power supply terminal (not shown) and a power switch (not shown) for supplying external power.

The compressed air line 20 is installed in the accommodation space of the housing 10, one end of the compressed air line 20 is connected to the compressed air inlet 11, and the other end is installed to be connected to the compressed air outlet 12. do.

When compressed air of high pressure is supplied through the compressed air inlet port 11 by a high pressure compressed air generator such as a compressor, the compressed air outlet port flows along the inner flow path of the housing 10 through the compressed air line 20. 12) is discharged to the outside.

At this time, a check valve CV is installed on the compressed air line 20 between the compressed air outlet 12 and the ejector 40 to be described later, and the vacuum suction force is applied to the vacuum line 50 described later by the ejector 40. And the internal air of the flow path compressed air line 20 is prevented from flowing in the reverse direction by the check valve CV.

In addition, one end of the vacuum release line 21 is installed in the compressed air line 20 at the compressed air inlet 11 side, and the other end of the vacuum is described below between the coupling hole 13 and the vacuum regulator 60 described later. It is installed to communicate with the line 50.

In addition, a control valve 21A for blocking or releasing the flow path and a speed controller 22 for adjusting the discharge pressure of the compressed air are installed on the vacuum release line 21. The user uses a control valve 21A to vacuum the valve. The release line 21 can be controlled to block the inlet or inflow of compressed air, it is possible to adjust the speed (pressure) of the compressed air in the range of 3/100 ~ 0.5g using the speed controller 22.

By the configuration of the speed controller 22 as described above, when the user vacuum-adsorbs and grips the camera module 1 and then moves to an appropriate position to move to a position to be assembled with the counterpart and releases the vacuum, the speed controller ( 22), the compressed air is controlled to be discharged through the nozzle 91D to be described later at an appropriate pressure, so that the vacuum adsorption is stably released without a large impact to the camera module 1.

The solenoid valve 30 is installed on the compressed air line 20, and the vacuum suction force is generated or stopped while the compressed air passes or blocks through the compressed air line 20 by the solenoid valve 30. The solenoid valve 30 is preferably operated by a foot switch.

The solenoid valve 30 is operated by receiving power from the power supply unit PW installed in the accommodation space of the housing 10 as shown in FIGS. 3 and 4.

The ejector 40 is installed on the compressed air line 20 between the compressed air outlet 12 and the solenoid valve 30, and the high pressure compressed air along the compressed air line 20 is fastened by the ejector 40. As it passes, a vacuum suction force is generated in the vacuum line 50 described later.

The ejector 40 uses the phenomenon that the velocity of the fluid (air) is faster and the pressure is lowered as it passes through the narrow diameter portion inside the tube by the Venturi principle. A suction chamber inside the tubular body connected to the vacuum line 50 is formed at the narrow portion, whereby the compressed air is rapidly passed through the narrow portion of the tubular body, and the air of the vacuum line 50 is passed through the suction chamber by the pressure lowered. In this way, as the air of the vacuum line 50 is sucked into the compressed air line 20, a vacuum suction force is generated through a vacuum hose 90 which will be described later, which is installed relatively downstream of the vacuum line 50. .

The ejector 40 as described above is widely used for forming a vacuum or sucking and discharging the second fluid by the flow rate of the first fluid, and thus a detailed description of the ejector 40 will be omitted.

The vacuum regulator 60 is installed on the vacuum line 50, and the vacuum pressure generated by the air inside the vacuum line 50 is controlled by the ejector 40 by the vacuum regulator 60.

The vacuum gauge 61 is installed at one side of the vacuum regulator 60, and the user can appropriately adjust the vacuum pressure by using the vacuum regulator 60 while checking the vacuum pressure appearing in the vacuum gauge 61.

The first filter 70 is installed on the vacuum line 50 between the ejector 40 and the vacuum regulator 60, and the vacuum line 50 is provided through the vacuum hose 90 described later by the first filter 70. Foreign matter such as dust (particles) contained in the air flowing into the inside of the filtration is filtered to prevent the flow into the internal flow path.

The first filter 70 is installed in a removable structure on the outside of the housing 10 so that it can be easily replaced as needed.

A second filter 80 is installed outside the housing 10, and the compressed air discharged to the compressed air outlet 12 along the compressed air line 20 through the second filter 80 is provided with a second filter ( 80 is discharged to the outside.

To this end, one end of the connection hose 81 is connected to the compressed air outlet 12, and a second filter 80 is installed at the other end of the connection hose 81.

Even if compressed air is discharged into the interior of the semiconductor line by the second filter 80 as described above, foreign substances such as dust are not discharged, thereby keeping the air clean.

As shown in FIG. 5, the vacuum hose 90 having one end installed in the coupling hole 13 while being positioned outside the housing 10 is provided with a handle portion 90A having a predetermined length at a lower portion thereof. The nozzle block 91 is assembled below the 90A.

At this time, the nozzle block 91 is a tab connecting portion 91A having a vertical length as shown in FIG. 6, a body portion 91B having a horizontal length when connected to the lower end of the tab connecting portion 91A, and a body portion ( The nozzle mounting part 91C provided with a pair at the bottom face of 91B at predetermined intervals, and the nozzle 91D provided in the nozzle installation part 91C, respectively.

As illustrated in FIG. 7, the body portion 91B has a horizontal third hole (H1) of the tab connection portion 91A and the second hole H2 of the nozzle mounting portion 91C communicating with each other. H3) is formed and one end of this third hole H3 is closed with a screw S. As shown in FIG.

In addition, the nozzle 91D is made of any one material selected from natural rubber, flexible resin, and silicone, and is configured to be easily replaced when the nozzle 91D is damaged or hardened.

In addition, the nozzle 91D has a lower inner diameter A of 0.8 mm, and the upper inner diameter B engaged with the nozzle mounting portion 91C is 1.0 mm, so that the lower end of the nozzle 91D is narrowly formed. The proper adsorption force according to the vacuum pressure and the appropriate vacuum releasing force by the discharge of the compressed air act.

When using the semiconductor module camera module vacuum adsorption device of the present invention configured as described above, if the solenoid valve 30 opens the flow path of the compressed air line 20, the compressed air inlet 11 as shown in FIG. Proper compressed air is introduced into the compressed air line 20 through the high pressure compressed air through the ejector 40, the check valve (CV), and the compressed air outlet 12 through the compressed air line 20. The second filter 80 flows along the hose 81.

In this process, air is sucked through the vacuum line 50 connected to the suction chamber of the ejector 40 and flows along the compressed air line 20 to the second filter 80, thereby vacuuming through the nozzle 91D. As the air is sucked in the direction of the hose 90 and the vacuum line 50, a vacuum suction force is generated on the nozzle 91D side.

When the nozzle 91D is positioned above the camera module 1 in this state, the upper surface of the camera module 1 is vacuum-adsorbed to the nozzle 91D by the vacuum suction force, and the high pressure compression is performed through the compressed air line 20. The vacuum suction force is maintained while the flow through which the air passes is maintained.

At this time, the user adjusts the vacuum pressure appropriately in advance using the vacuum regulator 60 according to the type of the weight of the camera module 1 and the like.

On the other hand, once the vacuum-adsorbed camera module 1 is properly moved to the position assembled with the counterpart, it is necessary to release the vacuum. At this time, when the solenoid valve 30 is locked, it is no longer through the compressed air line 20. While the high pressure compressed air does not flow, the vacuum suction force is lowered and the absorbed camera module 1 is dropped by its own weight.

In this case, the present invention can drop the camera module 1 by supplying compressed air of an appropriate pressure through the nozzle 91D as shown in FIG. 9 for quick and accurate vacuum release, and for this purpose, the solenoid valve 30 is provided. When the control valve 21A is opened in the locked state, the compressed air supplied to the compressed air line 20 is supplied to the vacuum line 50 through the vacuum release line 21, and the compressed air thus supplied is supplied to the vacuum line 50. ) And the vacuum hose 90 flows toward the nozzle 91D to release the camera module 1 from the nozzle 91D, thereby releasing the vacuum quickly.

If the intensity of the compressed air discharged through the nozzle 91D is too strong, the vacuum-adsorbed camera module 1 may drop strongly and be damaged, so that the user may use the speed controller 22 to control the speed (pressure) of the compressed air. ), It is preferable to operate in advance.

As described above, the present invention has an advantage that the assembly of the small camera module of the semiconductor line is carried out by vacuum suction using two nozzles provided in the nozzle block while easily confirming the position of the component.

Since this apparatus is used in a clean room during a semiconductor process, a vacuum filter is installed in a vacuum box, and the used air is discharged to the clean room through the exhaust filter (clean room specification) at the vacuum exhaust stage.

In the above description, for the convenience of description, reference has been made to the drawings and the components shown in the drawings showing the preferred embodiments, but with reference to the reference numerals and names, which is one embodiment according to the present invention It should be understood that the scope of the rights should not be construed as limiting, and it is extremely obvious that the simple substitution of a structure having the same function as the change from the description of the design to the various shapes predictable is within the scope of change for easy implementation by those skilled in the art. Will see.

1: camera module 10: housing
11: compressed air inlet 12: compressed air outlet
13: coupling hole 20: compressed air line
21: vacuum release line 21A: control valve
22: speed controller 30: solenoid valve
40: ejector 50: vacuum line
60: vacuum regulator 61: vacuum gauge
70: first filter 80: second filter
81: connecting hose 90: vacuum hose
90A: Handle 91: Nozzle Block
91A: Hose connection 91B: Body
91C: Nozzle Mount 91D: Nozzle
A: lower inner diameter B: upper inner diameter
CV: Check valve H1: 1st hole
H2: second hole H3: third hole
PW: Power Supply S: Screw

Claims (10)

delete delete delete delete delete delete delete delete delete A housing 10 having an accommodation space formed therein and having a compressed air inlet 11, a compressed air outlet 12, and a coupling hole 13 installed at one side thereof; A compressed air line 20 having one end connected to the compressed air inlet 11 and installed in the accommodation space, and the other end connected to the compressed air outlet 12; A solenoid valve 30 installed on the compressed air line 20; An ejector (40) installed on the compressed air line (20) between the compressed air outlet (12) and the solenoid valve (30); A vacuum line 50 having one end installed in communication with the ejector 40 and the other end installed in the coupling hole 13; A vacuum regulator (60) installed on the vacuum line (50); A first filter (70) installed on the vacuum line (50) between the ejector (40) and the vacuum regulator (60); A second filter 80 installed outside the housing 10 to purify the air discharged in connection with the compressed air outlet 12; A vacuum hose (90) having one end installed in the coupling hole (13) and a nozzle block (91) installed at the other end while being installed outside the housing (10); Including,

A check valve CV is installed on the compressed air line 20 between the compressed air outlet 12 and the ejector 40, and a vacuum gauge 61 is further installed on the vacuum regulator 60.

One end of the vacuum release line 21 is installed in the compressed air line 20 toward the compressed air inlet 11, and the other end of the vacuum release line 21 is connected to the coupling hole 13 and the vacuum. It is installed to communicate with the vacuum line 50 between the regulator 60,

On the vacuum release line 21, a speed controller 22 for adjusting the discharge pressure of the compressed air is installed, the speed controller 22 is adjusted to a pressure in the range of 3/100 ~ 0.5g,

The nozzle block 91 may include: a tab connection portion 91A having a vertical length; A body portion 91B having a horizontal length when connected to a lower end of the tab connecting portion 91A; A nozzle installation portion 91C provided with a pair at a predetermined interval on the bottom surface of the body portion 91B; Nozzles 91D respectively provided in the nozzle mounting portions 91C; Including,

The body portion 91B is provided with a horizontal third hole H3 connecting the first hole H1 of the tab connecting portion 91A and the second hole H2 of the nozzle mounting portion 91C with each other. ,

The nozzle 91D is made of any one material selected from natural rubber, flexible resin, and silicon.

The nozzle 91D has a lower inner diameter A of 0.8 mm, an upper inner diameter B coupled with the nozzle mounting portion 91C of 1.0 mm, and the solenoid valve 30 is connected to a foot switch. Camera module vacuum adsorption device for a semiconductor line, characterized in that is operated by.

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