KR200483480Y1 - Coin-plated device - Google Patents

Abstract

The present invention relates to a coin plating apparatus, and more particularly, to a coin plating apparatus comprising: a plating tank containing an electrolytic solution; A cathode arranged in the longitudinal direction of the plating vessel; At least one to-be-plated material receiving table provided so as to be energizable with the positive electrode and accommodating the to-be-plated body; A rotating shaft arranged in the width direction of the plating bath so as not to interfere with the anode; A coin receiving tray which is fixed to the rotating shaft and is rotatable, a cathode is connected, and a coin is guided to be rolled in a rotating direction in a state in which coins are not overlapped but are not filled; And a drive source for rotating the coin storage bin.
According to the present invention, it is possible to uniformly coat the front and back surfaces of the coin, thereby improving the plating quality.

Description

[0001] COIN-PLATED DEVICE [0002]

The present invention relates to a coin plating apparatus, and more particularly, to a coin plating apparatus capable of uniformly plating the entire surface of a coin without causing plating defects by keeping the current per coin constant, and shortening the processing time required for plating Thereby maximizing the efficiency of the coin-plating apparatus.

In general, coins are coins for currencies (coins) used as a measure of the value of commodity exchange and as a means of exchanging commodities, and commemorative coins including medals used for decorating and collecting in other commemorative events and attractions Proof, proof) is commonly used.

These coins (including currency coins, collective coins and medals) have a unique pattern embossed or engraved on both sides of the face, while they are made of precious metals such as gold or silver, or coins made of copper And coins whose surfaces are plated by an electroplating method are also widely used.

Such techniques related to coin plating include Registration No. 0392248, Registration No. 0392249, and the like.

The coin plating method including these starting techniques is a generalized electroplating method. A large amount of coin is put into a plating vessel containing an electrolytic solution such as a barrel, and a large plating is performed by rotating a barrel in a state of being energized .

However, such a coin plating method has the following problems.

First, since a large amount of coins are rolled in a barrel and plating is carried out during energization, the energizing current of the coin in contact with the negative electrode is high, and the other coils in contact with the coin are decreased in the energizing current The uniform plating is difficult.

Secondly, since a large amount of coins are mixed, some of them overlap each other. In case of overlapping, there is a disadvantage in that plating quality which is not plated on the overlapping surface occurs and the plating quality is remarkably deteriorated.

Third, since a large amount of coins are contained, the current flowing through each coin is extremely weak. Therefore, in order to increase the current, it is necessary to apply a higher current to the negative terminal. In such a case, the overcurrent flows and the plating quality becomes rough, It is necessary to additionally provide an overcurrent protection device for preventing the plating deterioration.

Fourth, when a large amount of coin is to be plated, the current flowing per one coin is very weak as described above, and the time taken until completion of plating is very long. For example, when a conventional barrel is used, a current of 0.5-0.1 A per dm 2 flows per dm 2. Therefore, it takes 8 hours or more to perform plating of 30 탆 nickel plating, resulting in a significant reduction in plating efficiency and a decrease in productivity.

The present invention has been made in view of the above-described problems in the prior art, and it is an object of the present invention to provide a plating method capable of uniformly plating a coin plating with a constant amount of current per coin while coping with a large amount of coin plating, There is a main purpose of providing a coin plating apparatus capable of shortening a processing time while improving quality.

As a means for achieving the above-mentioned object, the present invention provides a plating bath comprising an electrolytic solution; A cathode arranged in the longitudinal direction of the plating vessel; At least one to-be-plated material receiving table provided so as to be energizable with the positive electrode and accommodating the to-be-plated body; A rotating shaft arranged in the width direction of the plating bath so as not to interfere with the anode; A cylindrical receiving passage rotatably fixed to the rotating shaft and connected to the cathode and having an opening formed on one surface thereof and a plurality of through holes formed on the other surface of the opening portion and a driven gear formed around the opening; And a cover which has a plurality of through holes formed on a surface thereof facing the receiving tube and which has a shape corresponding to the receiving tube and inserts the opening of the receiving tube so as to seal the opening and to be removable, A coin receiving tray in which a peripheral portion thereof is positioned in a vertical direction; And a driving source for rotating the coin receiving bin, wherein the driving source is a motor, the power of the motor is installed to be transmitted to the driving gear through a power transmitting member including a belt or a chain, and the driving gear is fixed And the flow piece is hingedly fixed on the flow piece bracket fixed to the upper end of the plating tank to intermittent power transmission. A driven gear is formed around the coin storage bin, and the drive gear is formed to be engaged with the driven gear , The width of the coin storage bin is larger than the thickness of one coin but has such a width that the coins can not be overlapped with each other and the circumferential surfaces of the coin are in contact with each other. In a state in which the coin is not fully filled, So as to guide the player to roll the coin.

Further, the rotation shaft is installed in a form to be fitted in a slit on a bracket formed integrally with an inner wall surface of the plating vessel so as to facilitate the insertion of the coin receiving tray.

Further, the rotation shaft is constituted by an electrically conductive conductor, connected to the cathode of the plating vessel, and fixed through the center of the coin receiving chamber.

The negative electrode of the plating tank is directly connected to the coin storage bin, and one end of each of the rotation coils is fixed integrally to the center of each side of each side of the coin storage bin in a state in which the rotation axis is divided. Thereby providing a plating apparatus.

A plurality of the coin storage compartments are provided so as to be rotatable with each other in a longitudinal direction of the plating vessel, and a plurality of plated-body storage bays are provided in the same number in correspondence with the number of coin storage compartments. Thereby providing a coin plating apparatus.

A plurality of coin storage compartments are provided so as to be rotatable in mesh with each other in the longitudinal direction of the plating vessel. One set in which a plurality of plated-body storage bands are arranged in the same number as facing the coin receiving compartment corresponding to the number of coin storage bases, And a plurality of tanks are further formed at intervals in the width direction of the bath.

Further, the coin storage device is provided with a plurality of coin storage compartments which are rotatably engaged with each other in the depth direction of the plating bath.

According to the present invention, it is possible to uniformly coat the front and back surfaces of the coin, thereby improving the plating quality.

Further, since coins do not overlap each other, plating failure does not occur.

In addition, since the plating efficiency is improved over the entire surface of the coin, the plating treatment time can be shortened and the productivity can be improved. For example, in the case of nickel plating according to the present invention, a current of 10-15 A per dm 2 can be applied, thereby reducing the plating time by 10-15 times compared with the conventional plating.

1 is an exemplary partial perspective view showing a coin plating apparatus according to the present invention.
Fig. 2 is an illustration of a coin storage bin constituting a coin plating apparatus according to the present invention. Fig.
Fig. 3 is an exemplary view showing an example in which a large number of coins are stored in the coin storage bin of Fig. 2;
4 is an exemplary view showing a modified example of a coin plating apparatus according to the present invention.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

Prior to the description of the present invention, the following specific structures or functional descriptions are merely exemplified for the purpose of describing the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention may be embodied in various forms, And should not be construed as limited to the embodiments described herein.

In addition, since the embodiments according to the concept of the present invention can make various changes and have various forms, specific embodiments are illustrated in the drawings and described in detail herein. It is to be understood, however, that the appended claims are intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the appended claims, rather than limiting the embodiments in accordance with the concepts herein.

The coin plating apparatus according to the present invention is characterized in that a plurality of coins are accommodated in a cylindrical coin receiving compartment, and the coins are plated while being accommodated with a spare space so that coins are not overlapped with each other, So that uniform plating can be achieved.

More specifically, as shown in FIG. 1, the coin plating apparatus according to the present invention includes a plating bath 100.

The plating bath 100 is formed in a rectangular box shape having an open top, and an electrolyte is filled therein.

A rotating shaft 200 is installed in the width direction of the plating tank 100 and a coin storage bin 300 is fixed to the rotating shaft 200.

In particular, the coin storage bin 300 is connected to a negative electrode (not shown) so that the coin 310 (see FIG. 3) filled in the coin storage bin 300 can be energized. The coin storage bin 300 is fixed to the center of both side surfaces of the coin storage bin 300 in a state where the coin storage bin 300 is entirely not covered with the coin storage bin 300, can do.

2 (b), the rotating shaft 200 is formed of a conductor and is fixed through the center of the coin receiving bag 300. By connecting the negative pole to the rotating shaft 200, the coin receiving bin 300 The plurality of coins 310 may be configured to allow the same current to flow therethrough.

In addition, the rotation shaft 200 may be fitted in a slit SL formed in the second bracket BR so that the coin receiving bin 300 can be easily lifted.

At this time, the second bracket BR is integrally formed on one inner wall surface in the width direction of the plating tank 100, and a part of the center is cut upward to form the slit SL, So that it can be fitted into the slit SL.

Particularly, when the rotary shaft 200 is made of a conductor capable of conducting current, when the rotary shaft 200 is inserted into the second bracket BR, it is connected to a cathode (not shown) connected to the second bracket BR, As shown in FIG.

In addition, when the rotation shaft 200 is formed as a non-conductive body, the second bracket BR is simply a structural body that rotatably supports the rotation shaft 200. [

1, 2, and 3, the coin storage bin 300 includes an accommodating barrel 320 and a cover 330, 330 are formed with a plurality of first and second through holes H1, H2, respectively, so that the electrolytic solution in the plating bath 100 can be perfused.

The housing 330 and the cover 330 are detachably coupled to each other. Although not shown, the cover 330 may be screwed or hooked to the housing 320 or fixed by means such as a clip or a clamp. Or may be assembled together in a variety of ways known in the art. However, it must be a separable structure.

An open portion 321 is formed on one surface in the thickness direction and a plurality of electrolytic solutions in the plating tank 100 are allowed to flow on the other surface of the open portion 321. [ A cylindrical receiving tube 320 formed with a first through hole H1 of the plating vessel 320 and a driven gear disposed in a vertical direction with respect to the bottom of the plating vessel 100, A plurality of second through holes H2 are formed in the plating vessel 100 so as to allow the electrolytic solution in the plating vessel 100 to be perfused through the openings 321 of the plating vessel 100, And a cover (330) inserted into the opening of the receiving cylinder to be assembled so as to be hermetically closed while being separated from the opening, and the periphery around which the driven gear (G2) is formed may be vertically positioned.

The width W of the internal space of the receiving cylinder 320 is smaller than the thickness T of the coin 310, The coins 310 can not overlap each other and the coins 310 have a width W such that the respective circumferential surfaces of the coins 310 are disposed in contact with each other.

The coins 310 can be prevented from being plated due to overlapping and each coin 310 is brought into direct contact with the negative electrode (in fact, the coin storage serves as a negative electrode) The electric current can flow to maintain a uniform plating quality, and both the front and back surfaces of the coin 310 are plated with a uniform thickness to improve the plating quality.

3, it should be noted that when the coin storage bin 300 is rotated about the rotation axis 200 by partially leaving the coin 310 and not filling it, The coins 310 of the coin storage compartment 300 are rotated in the rotating direction of the coin storage bin 300 and the first and second through holes H1 and H2 opposed to each other of the coin storage bin 300, So that the surface of the coins 310 can be plated.

Further, a driven gear G2 is formed around the receiving cylinder 320.

The driven gear G2 is coupled with the driving gear G1 so that the driving gear G1 is rotatably fixed on the moving piece 400, And is rotatably hingedly coupled to the flow piece bracket 410 fixed on the upper side of the upper portion.

Therefore, when the flow piece 400 is moved up and down, the connection between the driving gear G1 and the driven gear G2 is interrupted, so that the power can be transmitted or disconnected, have. That is, when the flow piece 400 is rotated downward, the driven gear G2 is engaged with the driven gear G2 to rotate the driven gear G2 and the coin receiving basket 300 about the rotation axis 200, The connection with the driven gear G2 is interrupted and the rotation of the coin storage bin 300 is stopped.

In addition, the driving force for driving the driving gear G1, that is, the driving source may have various forms.

For example, the driving source may be various types such as an electric motor, an air motor, a hydraulic motor, a cylinder, a manual handle and the like, preferably an electric motor (not shown) And can be configured to be driven to be connected to a belt.

In order to transmit the power generated from the electric motor, the shaft of the driving gear G1 may be passed through the flow piece 400 and a sprocket or a pulley may be fixed to the end of the shaft, or an electric motor may be directly connected to the shaft .

A plating agent storage box 500 is disposed so as to face the coin storage bag 300. A storage agent 510 is fixed to both sides of the plating body storage bag 500, (510) is fixed to the anode (E).

Therefore, the anode E should be arranged in a direction orthogonal to the rotation axis 200 and should not interfere with the rotation axis 200, so that the anode E may be disposed higher than the rotation axis 200 through a separate support bracket 520 Can be supported.

In this case, it is preferable that the support bracket 520 is provided so as to protrude upward from the upper surface of the short side of the plating tank 100.

As described above, the coin plating apparatus according to the present invention includes a coin storage bin 300 rotated around a rotation axis 200 while being energized with a negative electrode in a plating vessel 100 and a coin storage bin 300 facing each other And a plated-body accommodating table 500 connected to the positive electrode (E). Thus, it is possible to uniformly coat the coin 310.

That is, the plating apparatus as shown in FIG. 1 can be implemented and processed, and the coin storage bin 300 may be arranged in multiple layers in the depth direction of the plating tank 100 while keeping the coin storage bin 300 engaged with each other A plurality of the plating baths 100 may be arranged in the longitudinal direction of the plating bath 100, and the same structure may be repeatedly arranged at intervals in the width direction of the plating bath 100. [

For example, Fig. 4 shows such a modified arrangement example.

4A, a plurality of coin storage bags 300 are continuously arranged in the longitudinal direction of the plating tank 100 so that adjacent driven gears G2 are engaged with each other, and at the same time, a plurality of coin storage compartments 300, And a plurality of plated body receiving bays 500 facing each other and facing the coin storage bin 300 can be provided in a one-to-one correspondence with each other.

At this time, as shown in FIG. 3, a large number of coins 310 are loaded in the coin storage bin 300 without being filled.

In this state, when the power source is applied, the rotational force of the motor M is transmitted to the drive gear G1 (see FIG. 1) through the power transmitting member DL and the driven gear G2 engaged with the drive gear G1, The coins 310 are rotated in the rotation direction inside the coin storage bin 300. The coin storage bin 300 is rotated in a state where the coin storage bin 300 is engaged with the coin storage bin 300 at the same time.

At the same time, the plated object ionized from the plating object receiving part 500 moves along the electrolytic solution, and is moved to the coin receiving part 300 forming the negative electrode, and then plated on the surface of the coin 310.

Therefore, if such arrangement is made, mass plating can be performed and plating can be performed quickly.

Particularly, since a uniform current flows through each coin 310, for example, a current of about 20-30 A flows through the coin 310, a large amount of coins 310 can be plated in 20-30 minutes. In the case of using the conventional barrel, as described above, since the coin 310 current flows at an average of about 0.5A due to the uneven current, it can be plated at a significantly faster rate than the plating time required for about 20 hours or more .

4 (b). In this case, a large number of coin storage compartments 300 are provided in the longitudinal direction of the plating vessel 100, and at the same time, the width of the plating vessel 100 A plurality of coins 310 may be plated by arranging a plurality of coins 310 in each of the coin storage compartments 300 so that a single driving source is provided for each of the coin storage compartments 300. In other operations, ).

As described above, the coin plating apparatus according to the present invention is expected to be extremely simple because of its simple structure, large-scale processing, plating with uniform thickness, and plating failure.

100: plating bath 200: rotating shaft
300: Coin storage bin 400:
500: Plated body storage bag

Claims (7)

A first bracket which is open at the top and contains the electrolyte solution and which is formed so as to protrude upward from the upper surface of the one inner wall in the longitudinal direction and a slit which is formed by cutting a central part in the upward direction, A plating bath including a first bracket formed of a first bracket;
A positive electrode having one end fixed to the first bracket and elongated in the longitudinal direction of the plating bath;
A plating object receiving table which is provided so as to be able to be energized by being caught by the anode and in which the object to be plated is accommodated;
A rotating shaft installed at a position lower than the anode so as not to interfere with the anode so as to be elongated in the width direction of the plating bath and connected to the cathode and fitted in such a manner that one end is inserted into the slit of the second bracket;
A coin receiving tray charged in a state in which a plurality of coins are not filled in the inside thereof, and the rotating shaft is fixed to the center; And
A driving source for rotating the coin storage bin; / RTI >
The coin storage bin,
A plurality of first through holes are formed on one surface of the plating vessel in the thickness direction so that the electrolyte solution in the plating vessel can be perfused on the other surface facing the opening, A cylindrical receiving cylinder in which a driven gear is formed; And
A plurality of second through holes are formed on the opposite surface of the plating tank so that the electrolyte solution in the plating tank can be perfused through the surface opposite to the opening of the receiving tank in the thickness direction, The cover being interlocked with the open portion of the cover to seal the opening portion and be removable; / RTI >
The drive source
motor;
A flow piece bracket fixed to the upper side of the plating bath;
A flow piece which is hingedly coupled to the flow piece bracket so as to be vertically rotatable; And
The power of the motor is transmitted to the flow piece through a power transmitting member including a belt or a chain and is rotatably fixed to the shaft. When the flow piece is rotated downward, the driven gear is engaged with the driven gear, And a driving gear which rotates the coin receiving bin and is rotated in the upward direction of the fluidized bed to stop the rotation of the coin receiving bin when the connection with the follower synchronizer is interrupted; / RTI >
The width of the receiving bin of the coin receiving bin is larger than the thickness of one coin but has a width such that the coins can not overlap with each other and the circumferential surfaces of the coin are in contact with each other, The coins loaded into the coin storage bin are rolled in the rotation direction of the receiving basket inside the coin storage bin in a state that the coin is not fully filled when the reception barrel having the driven gear is rotated, The electrolytic solution in the plating vessel is perfused through the first and second through-holes facing each other of the coin storage bin to perform plating on the coin surface,
The coin storage bin is provided with a plurality of cooperating gears which are engaged with each other in the longitudinal direction of the plating tank so as to be rotatable at the same time, and each of the coin storage bases is rotated at a ratio of 1: 1 corresponding to the number of coin storage bases, Wherein a plurality of pairs of opposing plated-metal receiving bays are provided in the same number in opposing relation to each other in the width direction of the plating vessel, and one driving source is provided for each group of the coin receiving bands. . delete The method of claim 1,
Wherein the rotating shaft is constituted by a conductive body capable of being electrically connected to the cathode of the plating vessel and is fixed through the center of the coin receiving section. The method of claim 1,
Wherein the rotating shaft is formed of a non-conductive body, the cathode of the plating vessel is directly connected to the coin receiving compartment, and one end of each of the rotating shafts is integrally fixed to the center of each side face of the coin receiving receptacle, . delete delete The method of claim 1,
Wherein the coin storage bin is provided in a plurality of states so as to be rotatable with respect to each other in the depth direction of the plating bath.

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