KR200425948Y1 - Camera module - Google Patents

Abstract

The present invention relates to a camera module (camera module) that is mounted on a product such as a mobile phone to be used as a camera, the upper holder 110 and the lower lens 122 having an upper lens 112 to be fixed to the inside. And a lower holder 120 which is fixed to the opened upper surface and is bonded to the lower side with respect to the upper holder 110 to be coupled to the lower side of the lower holder 120. 132 and the lower holder 120 is bonded to the lower side to form a bond, characterized in that it comprises a module PC 130 on which the image sensor 132 is mounted on the upper surface.

Therefore, since the infrared cut filter component that occupies a predetermined thickness can be omitted, miniaturization and thinning of the camera module can be achieved, manufacturing cost can be reduced, productivity can be improved by simplifying the assembly process, and infrared Preventing image defects from occurring on the image sensor side by inducing fine particles due to the fine cracking of the original glass, which constitutes the blocking filter, and improving the quality, and avoiding any additional focusing adjustments during the assembly process. Therefore, also in this respect, there is an effect that can improve productivity and reduce the failure rate.

Mobile phone, camera, module, lens, infrared, filter, coating, focusing, image sensor, no adjustment

Description

Camera Module {CAMERA MODULE}

1 is a cross-sectional view showing a conventional camera module,

2 is a cross-sectional view showing the configuration and assembly method of the camera module according to the present invention.

<Description of the symbols for the main parts of the drawings>

1: (conventional) camera module 10: barrel

10a: screw portion 12: lens group

12-1: Upper lens 12-2: Lower lens

14 mask 16 lens support

20: holder 20a: screw portion

22: infrared cut filter 30: module PC ratio

32: image sensor

100: (invented) camera module 110: upper holder

112: upper lens 114: mask

120: lower holder 122: lower lens

130: module PC 132: image sensor

The present invention relates to a camera module (camera module) that is mounted on a product such as a mobile phone to be used as a camera, and more specifically, by applying an infrared blocking coating directly to the lens of the lens group to separate the infrared cut filter component The present invention relates to a camera module which does not need to perform lens focusing adjustment work separately during the assembly process so that the lens focusing on the image sensor can be precisely aligned at the same time of assembly.

In general, a small digital camera module (camera module) is mounted on a mobile phone, a PDA, a PC camera and a digital camera.

1 is a cross-sectional view showing a conventional camera module.

The camera module 1 is largely comprised of a lens group 12, an image sensor 32, and a control circuit unit for processing image information.

In detail, the lens group 12 includes an upper lens 12-1 and a lower lens 12-2 spaced apart from each other in the vertical direction to form reflected light from a subject on the image sensor 32 on the lower side. And a mask 14 provided between the upper lens 12-1 and the lower lens 12-2 to block the progress of light from an unnecessary outer portion while being spaced at a proper interval therebetween, the lens group 12 and A lens 10 which is provided to fix the mask 14 to the inside and a lens 10 which is provided in the barrel 10 of the lower side of the lower lens 12-2 to support the lens group 12 from the lower side. The screw 16 is formed at the lower side with respect to the support 16 and the barrel 10, and an IR cut off filter 22, which will be described later, is fixed inside the image sensor 32. Of light incident through the holder 20 and the lens group 12 in which the light is accommodated inside the lower side thereof. An infrared cut filter provided to be fixed in the holder 20 to transmit the light in the visible region while reflecting the light in the infrared (near infrared) region to prevent the unnecessary light from entering the image sensor 32 at the lower side. 22 and an image sensor 32 formed on the upper surface of the image sensor 32 and the holder 20 to be received at the lower side in the holder 20 so as to receive light and convert it into an electrical image signal. A module PC (PCB) which digitally processes an image signal output from the corresponding image sensor 32 mounted and mounted on the upper surface thereof so that the above-described image sensor 32 is electrically connected. Print Circuit Board) 30 will be included.

These components are assembled to be in close contact as a whole, thereby forming a single camera module 1, that is, the lens group 12, the infrared cut filter 22, and the image sensor 32 are sequentially formed along an incident path of light. Will be placed.

The lens group 12 is generally made of a combination of opposing upper and lower lenses 12-1 and 12-2, and of course, the combination may be different.

The barrel 10 is formed in a cylindrical shape so that the threaded portion 10a is formed on the outer circumferential edge thereof, while a corresponding threaded portion 20a is formed on the inner circumferential edge of the cylindrical portion of the upper side of the holder 20, The barrel 10 of the upper side is inserted into the holder 20 of the to form a mutual screw connection through their threaded portions (10a, 20a).

The infrared cut filter 22 is disposed on the lower side of the lower lens 12-2 to receive most of the light passing through the lower lens 12-2, and its own structure is made of a disc glass having excellent light transmittance. A special coating for blocking infrared rays on the image is performed by vacuum evaporation, and as described above, the upper side of the image sensor 32 is provided to block the light in the infrared region of the incident light, In addition to preventing light from being incident to the image sensor 32 side unnecessarily, it is provided to close the opening of the holder 20 to block the entry of the fine foreign matter to the image sensor 32 side of the lower side by the fine foreign matter It is also possible to prevent the occurrence of image defects in the image sensor 32.

The image sensor 32 converts the incident light into an electric image signal, and is composed of a semiconductor device of a conventional Charged Coupled Device (CCD) or Complementary Metal Oxide Semiconductor (CMOS).

A method of assembling the camera module 1 having the above-described configuration will be described. First, the barrel is provided by mounting the image sensor 32 on the module PC ratio 30, and further including the lens group 12 therein. The lens module on the (10) side and the sensor module on the holder 20 side having the infrared cut filter 22 inside are pre-assembled and prepared.

Thereafter, the assembly of the prefabricated module PC 30 and the sensor module is assembled by bonding, and then the tube 10 of the lens module is assembled by screwing to the holder 20 of the sensor module. The lens focusing is adjusted to the image sensor 32 by adjusting the degree of screwing so that the separation distance between the lens 12-1 and 12-2 side and the image sensor 32 is adjusted. The resolution of the image to be obtained by the image sensor 32 is to be improved.

Subsequently, when the lens focusing operation is completed, the adhesive is applied by applying an ultraviolet bond curing between the barrel 10 and the holder 20 so as to maintain the position adjustment state and then performing ultraviolet irradiation curing. By hardening the adhesive to be firmly fixed to each other, thereby finally the camera module (1) is to be manufactured.

Referring to the operation of the camera module 1, when the reflected light from the subject is incident, the light is sequentially applied to the lenses 12-1, 12-2 and the infrared cut filter 22 of the lens group 12. At this time, when passing through the infrared cut filter 22, the light in the infrared region of the corresponding light is not transmitted, only the light in the visible region is transmitted, so that only the light in the visible region is incident on the image sensor 32 to be recognized. Accordingly, the light of the visible light region is obtained as an electric image signal in the image sensor 32, and the obtained electric image signal is then digitally processed in the module PC ratio 30.

However, the following problems occur in the conventional camera module 1 and its assembly method as described above.

First, the camera module 1 is composed of a relatively large number of parts as described above, which is not only disadvantageous to miniaturization and thinning, but also high production cost, and productivity is complicated by the complexity of the assembly process corresponding to the number of parts. There was a low issue.

In this regard, in particular, in the case of the infrared cut filter 22 parts, since the original glass is used, fine chipping of the glass is generated in the assembling process and the like, causing fine particles. Particles flow directly into the image sensor 32 side of the lower side there was also a problem that causes an image defect in the image sensor 32.

Second, in the assembly, after adjusting the lens focusing by adjusting the screwing degree between the barrel 10 side and the holder 20 side, the tube 10 side and the holder 20 side is coupled and fixed by ultraviolet bonding. The lens focusing adjustment is performed by holding and rotating an extremely small barrel 10, which is difficult to work with, which requires a lot of manpower and time, lowering productivity while increasing manufacturing costs, and in fact, achieving optimal adjustment. It is difficult to reduce the quality of the product.

The present invention has been devised to solve the above problems, and by applying a coating for blocking the infrared directly to the lens of the lens group, so that the separate infrared cut filter is omitted, it is advantageous in miniaturization and improved assemblability. It is an object of the present invention to provide a camera module that improves productivity and quality in this regard by accurately adjusting focusing at the same time of assembly by using a non-adjusting technique that does not perform lens focusing adjustment.

The camera module of the present invention for achieving the above object, the upper holder having the upper lens to be fixed to the inside, and the lower lens is provided to be fixed on the opened upper surface and bonded to the lower side with respect to the upper holder A lower holder to be formed, an image sensor to be accommodated inside the lower side of the lower holder, and bonded to the lower side with respect to the lower holder to form a bond and the module PC on which the image sensor is mounted on the upper surface It is characterized by.

The above object and various advantages of the present invention will become more apparent from the preferred embodiments of the invention described below with reference to the accompanying drawings by those skilled in the art.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a cross-sectional view showing the configuration of the camera module and the assembly method according to a preferred embodiment of the present invention.

Prior to the description, it will be omitted that the detailed description of the same components as in the prior art.

According to the present invention, the infrared cut filter 22, which was conventionally provided as a separate component between the lower lens 12-2 and the image sensor 32, is omitted. Instead, the lenses 112 and 122 of the lens group are omitted. Infrared shielding coating is performed directly.

In detail, selective and appropriate infrared blocking coating is performed on the lenses 112 and 122 of the lens group, that is, all the lenses 112 and 122 are coated or selectively applied only to specific ones. In addition, the top or bottom surfaces of each lens 112 and 122 may be coated in whole or selectively.

And, of course, the infrared blocking coating can be carried out using vacuum evaporation as in the prior art.

As a result, since the infrared cut filter 22 component, which occupies a predetermined thickness, can be omitted, the camera module 100 can be miniaturized and thinned, and manufacturing cost can be reduced by omitting the component. Productivity can be improved by simplifying the assembly process.

In addition, in particular, in the assembling process for the infrared ray cut filter 22 using the original glass, the problem that the image defect is caused on the image sensor 32 by the generation of fine particles due to the minute cracking of the original glass is also prevented. It can be improved.

Further, the camera module 100 according to the present invention, the upper holder 110 having the upper lens 112 to be fixed to the inside, and the lower lens 122 is provided to be fixed on the opened image surface and the upper It is provided between the lower holder 120 and the upper lens 112 and the lower lens 122 that are bonded to the holder 110 to be bonded to the lower side and the proper distance between the lenses (112, 122) And the mask 114 to block the progress of the light from the unnecessary outer portion, the image sensor 132 is provided to be accommodated on the lower side in the lower holder 120 and mounted on the module PC 130 to be described later, The lower holder 120 is bonded to the lower side to form a bond and the upper surface includes a module PC 130 is mounted so that the above-described image sensor 132 is electrically connected.

The above-described mask 114 may be provided to be attached to either the lower side of the upper lens 112 of the upper holder 110 or the upper side of the lower lens 122 of the lower holder 120, but preferably the upper lens. It may be attached to the lower side of the upper lens 112 of the upper holder 110 to support (112) on the lower side.

As described above, the upper lens 112 and / or the lower lens 122 may be appropriately coated with infrared rays, while the lower lens 122 may be provided on the upper side of the image sensor 132 to provide a lower holder. By closing the opening of the 120, fine foreign matters are also blocked from entering the image sensor 132 side of the lower side.

According to the present invention, the lens for the image sensor 132 in the assembling process is made of the above configuration, the upper holder 110, the lower holder 120 and the module PC 130 is simply bonded and bonded to each other. The focusing adjustment is not carried out separately because the lens and the focusing can be precisely performed at the same time as the assembly through the parts and the assembly design. The technique which does not perform adjustment work can be called a non-adjustment technique.

Referring to the assembly method of the camera module 100 according to the present invention as described above, to prepare the first mounting the image sensor 132 on the module PCB 130, and also having the upper lens 112 on the inside After the upper holder 110 and the lower holder 120 having the lower lens 122 inside the pre-assembled and prepared respectively, and then bonded to the module PCB ratio 130 and the lower holder 120 first, By bonding and fixing the lower holder 120 and the upper holder 110 to each other, the camera module 100 of the finished product is manufactured.

As a result, according to the present invention, the assembly process is greatly simplified, so that the productivity can be greatly improved, and the defect generation rate can be reduced by simplifying the assembly.

In particular, since there is no need to perform the focusing adjustment work separately, it is possible to obtain a large productivity improvement and a reduction in defective rate.

In addition, according to the present invention as described above, the lens supporter 16, which was conventionally provided to support the lens group from the lower side, can be omitted.

As described above, the above description merely illustrates a preferred embodiment of the present invention, and those skilled in the art should recognize that modifications and changes can be made to the present invention without changing the subject matter of the present invention.

According to the present invention, since it is possible to omit the infrared cut filter component that occupies a predetermined thickness, the camera module can be miniaturized and thinned, manufacturing cost can be reduced, and productivity can be improved by simplifying the assembly process. In addition, it is possible to improve the quality by preventing image defects from occurring on the image sensor side by inducing fine particles due to the fine cracking of the original glass, which constitutes the infrared cut filter, and to perform separate focusing adjustments during the assembly process. Since it is not carried out, the effect which can improve productivity and reduce the incidence rate of defects also in this point can be achieved.

Claims (4)

An upper holder 110 having the upper lens 112 fixed to an inner side thereof, A lower holder 120 having a lower lens 122 fixed to an opened image surface and bonded to a lower side with respect to the upper holder 110 to form a coupling; An image sensor 132 to be received inside the lower side of the lower holder 120; The camera module, characterized in that it comprises a module PC (130) to be bonded to the lower holder 120 is bonded to the lower side and the image sensor 132 is mounted on the upper surface. The method of claim 1, The upper lens (112) or the lower lens (122) is a camera module, characterized in that the infrared coating is applied. The method of claim 1, And a mask 114 provided between the upper lens 112 on the upper holder 110 side and the lower lens 122 on the lower holder 120 side to block propagation of unnecessary portions. Camera module, characterized in that. The method of claim 3, wherein The mask module 114 is provided to be attached to the lower side of the upper lens (112) of the upper holder (110) or the upper side of the lower lens (122) of the lower holder (120).

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