KR100766953B1 - Camera module - Google Patents

Camera module Download PDF

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Publication number
KR100766953B1
KR100766953B1 KR20060053349A KR20060053349A KR100766953B1 KR 100766953 B1 KR100766953 B1 KR 100766953B1 KR 20060053349 A KR20060053349 A KR 20060053349A KR 20060053349 A KR20060053349 A KR 20060053349A KR 100766953 B1 KR100766953 B1 KR 100766953B1
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KR
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lower
holder
lens
upper
side
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KR20060053349A
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Korean (ko)
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김광수
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서울전자통신(주)
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/2251Constructional details
    • H04N5/2254Mounting of optical parts, e.g. lenses, shutters, filters; optical parts peculiar to the presence of use of an electronic image sensor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/2257Mechanical and electrical details of cameras or camera modules for embedding in other devices
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/30Transforming light or analogous information into electric information
    • H04N5/335Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)

Abstract

A camera module is provided to prevent an image from being defected due to fine particles derived from the crack of a mother glass of an infrared ray cut-off filter, thereby improving productivity and reducing a defect rate. A camera module includes an upper holder(110), a lower holder(120), an image sensor(132), and a module PCB(130). The upper holder(110) is provided such that an upper lens(112) is fixed inside the upper holder(110). The lower holder(120) is fixed to the lower lens(122) at the lower side of the lower holder(120). The lower holder(120) is bonded to the lower part of the upper holder(110). The image sensor(132) is received in the lower portion of the lower holder(120). The module PCB(130) is bonded to the lower portion of the lower holder(120). The module PCB(130) has a top surface on which the image sensor(132) is mounted.

Description

카메라모듈{CAMERA MODULE} The camera module {CAMERA MODULE}

도 1은 종래의 카메라모듈을 보여주는 단면도, 1 is a cross-sectional view showing a conventional camera module,

도 2는 본 발명에 따른 카메라모듈의 구성 및 조립방법을 보여주는 단면도이다. 2 is a cross-sectional view showing the configuration and assembly process of the camera module according to the invention.

<도면의 주요부분에 대한 부호의 설명> <Description of the Related Art>

1 : (종래) 카메라모듈 10 : 경통 1 (prior art), the camera module 10: the column

10a : 나사부 12 : 렌즈군 10a: screw portion 12: lens group

12-1 : 상부렌즈 12-2 : 하부렌즈 12-1: upper lens 12-2: lower lens

14 : 마스크 16 : 렌즈지지체 14: mask 16: the lens support material

20 : 홀더 20a : 나사부 20: holder 20a: threaded

22 : 적외선차단필터 30 : 모듈피씨비 22: infrared cut filter 30: the module PCB

32 : 이미지센서 32: image sensor

100 : (본 발명) 카메라모듈 110 : 상부홀더 100 (present invention), the camera module 110: upper holder

112 : 상부렌즈 114 : 마스크 112: upper lens 114, a mask

120 : 하부홀더 122 : 하부렌즈 120: lower holder 122: lower lens

130 : 모듈피씨비 132 : 이미지센서 130: PCB module 132: image sensor

본 발명은 휴대폰과 같은 제품에 장착되어 카메라로 사용되어지게 되는 카메라모듈(camera module)에 관한 것으로서, 더욱 상세하게는 렌즈군의 렌즈에 대해 직접 적외선 차단 코팅을 실시하여 별도의 적외선차단필터 부품을 사용하지 않으면서, 조립과 동시에 이미지센서에 대한 렌즈 포커싱도 정확히 맞추어지도록 하여 조립과정에서 별도로 렌즈 포커싱 조정 작업을 실시할 필요도 없도록 하게 되는 카메라모듈에 관한 것이다. The present invention is mounted on the product, such as a cellular phone related to a camera module (camera module) that would be used with a camera, and more particularly, a separate infrared cut filter part subjected to direct infrared blocking coating on the lens of the lens group is not used up, to a done to fit in exactly at the same time as assembling the lens focused on the image sensor so that the need to carry out a focusing lens adjustments separately during the assembly process camera module.

일반적으로, 휴대폰, PDA, PC 카메라 및 디지털카메라 등에는 소형의 디지털 카메라모듈(camera module)이 탑재되게 된다. In general, mobile phones, PDA, PC cameras, digital cameras or the like is to be mounted in a small digital camera module (camera module).

도 1은 종래의 카메라모듈을 보여주는 단면도이다. 1 is a cross-sectional view showing a conventional camera module.

카메라모듈(1)은, 크게 렌즈(lens)군(12)과, 이미지센서(image sensor)(32)와, 화상정보를 처리하는 제어회로부로 구성된다. Is the camera module 1 is composed of a lens (lens) group 12 and the image sensor (image sensor) (32), and a control circuit section for processing the image information.

상세하게, 상하로 이격되어 배치되는 상부렌즈(12-1)와 하부렌즈(12-2)로 이루어져 피사체로부터의 반사광을 하부측의 이미지센서(32)상에 결상시키게 되는 렌즈군(12)과, 상부렌즈(12-1)와 하부렌즈(12-2) 사이에 구비되어 이들간을 적정간격 이격시키면서 불필요한 외측부분에서의 광의 진행을 차단하게 되는 마스크(14)와, 렌즈군(12) 및 마스크(14)를 내측에 고정하도록 구비되는 경통(barrel)(10)과, 하부렌즈(12-2) 하부측의 경통(10)내에 구비되어 렌즈군(12)을 하부측에서 지지하게 되는 렌즈지지체(16)와, 경통(10)에 대해 하부측에서 나사 결합을 이루게 되면서 그 내측에는 후술하는 적외선차단필터(IR cut off filter)(22)가 고정되도록 구비되고 또한 후술하는 이미지센서(32)가 그 하부측 내측에 수용되게 되는 홀더(holder)(20)와, 렌즈군(12)을 통과하여 입사되는 광중의 Specifically, that is thereby made to the upper lens 12-1 and the lower lens (12-2) spaced apart in the vertical image-forming light reflected from the object onto the image sensor 32 of the lower-side lens unit 12 and the an upper lens 12-1 and the lower lens (12-2) is provided between the mask 14 is to block the progress of light in unnecessary outer portion while spaced a proper distance between these, the lens unit 12 and the and the lens barrel (barrel) 10 that is adapted to secure the mask 14 to the inner, lower lens 12-2 are provided in the lower side of the lens barrel 10, the lens to be supported by the lens group 12 on the lower side support 16 and, as formed for screwing in the lower side with respect to the lens barrel 10, the inner side of the infrared cut-off filter to be described later (IR cut off filter) (22) is provided to secure the image sensor 32, which also will be described later At the bottom of the holder to be received in the interior side (holder) (20), photo-incident through the lens unit 12 가시광선 영역의 광은 투과시키면서 적외선(근적외선) 영역의 광은 반사시켜 불필요한 적외선 영역의 광이 하부측의 이미지센서(32)로 입사되는 것을 차단하도록 홀더(20)내에 고정되도록 구비되는 적외선차단필터(22)와, 상면상에 수광부가 형성되어 있어 광을 입사받아 이미지화하여 전기적인 영상신호로서 변환하도록 홀더(20)내의 하부측에 수용되도록 구비되는 이미지센서(32)와, 홀더(20)에 대해 하부측에서 접착되어 결합을 이루게 되며 그 상면상에는 전술한 이미지센서(32)가 전기적으로 연결되도록 탑재되어 탑재된 해당 이미지센서(32)로부터 출력되는 영상신호를 디지털 처리하게 되는 모듈피씨비(PCB ; Print Circuit Board)(30)를 포함하게 된다. Light of the visible light is transmitted, while the infrared (near-IR) infrared cut filter is provided with the light of the region by reflecting the unwanted infrared light so as to be fixed in the holder 20 to block incident on the image sensor 32 on the lower side to 22, and the image sensor 32 is provided to be received on the lower side in the holder 20 in the upper face is formed with a light-receiving unit to the imaging receiving incident light so as to convert an electrical image signal, the holder 20 for the adhesive on the bottom side is formed by coupling an upper surface formed on which the video signals outputted from the corresponding image sensor (32) mounted is mounted to the above-described image sensor 32 are electrically connected to digital processing module PCB (PCB; will contain a Print Circuit Board) (30).

이러한 구성요소들은 전체적으로 밀착되도록 조립되게 됨으로써, 하나의 카메라모듈(1)을 이루게 되며, 부언하면, 광의 입사경로를 따라서 렌즈군(12), 적외선차단필터(22), 이미지센서(32)가 순차적으로 배치되게 된다. Whereby these components are to be assembled so as to close a whole, one of a camera module (1) If, repetitions and constitute a lens group 12 along the light-incident path, an infrared cut filter 22, image sensor 32 is sequentially It is to be placed.

렌즈군(12)은 통상, 대향되는 상부렌즈(12-1)와 하부렌즈(12-2)의 조합으로 이루어지며, 물론 그 조합은 다르게 이루어질 수도 있다. Lens group 12 is composed of a combination of the upper lens 12-1 and the lower lens 12-2 is normal, the opposite, of course, may be made of combinations thereof are different.

경통(10)은 원통형으로 형성되어 그 외주연상에는 나사부(10a)가 형성되게 되고, 이에 대해 홀더(20)의 상부측 원통형 형상부의 내주연상에는 대응되는 나사부(20a)가 형성되어 있어, 하부측의 홀더(20)에 대해 상부측의 경통(10)이 삽입되면서 그들의 나사부(10a, 20a)를 통해 상호 나사 결합을 이루게 된다. The lens barrel 10 is formed in a cylindrical shape that the outer peripheral image of, the threaded portion (10a) is to be formed, and thus for the holder 20 of the upper side cylindrical in juyeonsang portion shape There is formed a corresponding male thread (20a), the bottom side as the barrel 10 of the upper side is inserted to the holder 20 is formed to cross through their threaded screw portion (10a, 20a).

적외선차단필터(22)는 하부렌즈(12-2)의 하부측에 구비되어 하부렌즈(12-2)를 통과한 광을 대부분 수용하게 되며, 그 자체 구성은 광투과율이 우수한 원판 글래스(glass)상에 적외선 차단을 위한 특수 코팅이 진공증착(vacuum evaporation)에 의해 실시된 것으로, 전술한 바와 같이 이미지센서(32)의 상부측에 구비되어 입사되는 광중의 적외선 영역의 광을 차단시켜 적외선 영역의 광이 불필요하게 이미지센서(32)측으로 입사되는 것을 방지시키게 됨과 아울러, 홀더(20)의 개구부를 폐쇄하도록 구비되어 미세 이물질이 하부측의 이미지센서(32)측으로 유입되는 것도 차단시킴으로써 미세 이물질에 의한 이미지센서(32)에서의 화상불량의 발생도 방지시키게 된다. IR cut filter 22 is provided on the lower side of the lower lens 12-2 and the majority receive light that has passed through the lower lens (12-2), the self-configuration is a glass original plate is excellent light transmittance (glass) that a special coating for the IR cut on a carried out by vacuum deposition (vacuum evaporation), to block the infrared region of the photo-incident is provided on the upper side of the image sensor 32 as described above, the light in the infrared region as soon thereby prevent the light from unnecessarily incident on the side of the image sensor 32 as well, is provided so as to close the opening of the holder 20 is blocked it is fine foreign matter from entering the side of the image sensor 32 on the lower side by using the fine particles the occurrence of image defects in the image sensor 32 is also thereby avoided.

이미지센서(32)는 입사되는 광을 이미지화하여 전기적인 영상신호로서 변환하는 것으로서, 통상적인 CCD(Charged Coupled Device) 또는 CMOS(Complementary Metal Oxide Semiconductor)의 반도체 소자로 구성되게 된다. The image sensor 32 is to be composed of a semiconductor element of the image the incident light as to convert an electrical image signal, a conventional CCD (Charged Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor).

이상과 같은 구성을 갖는 카메라모듈(1)의 조립방법에 대해 설명하면, 먼저 모듈피씨비(30)상에 이미지센서(32)를 탑재시켜 준비하고, 또한 렌즈군(12)을 내측에 구비하는 경통(10)측의 렌즈모듈과, 적외선차단필터(22)를 내측에 구비하는 홀더(20)측의 센서모듈을 각각 선조립하여 준비하게 된다. Referring to the method for assembling the camera module 1 having the above construction, first, prepared by mounting the module PCB 30, the image sensor 32 on, and further the column having the inner side of the lens group 12 10 is side of the holder 20 is prepared by each assembly line the side of the sensor module including the lens module and the inside, the infrared cut filter 22.

그 후, 선조립된 모듈피씨비(30)측과 센서모듈간을 접착에 의해 조립한 다음, 이 센서모듈의 홀더(20)에 대해 렌즈모듈의 경통(10)을 나사 결합하여 조립하게 되며, 이때 나사 결합되는 정도를 조정하여 렌즈(12-1, 12-2)측과 이미지센서(32)간의 이격거리가 조정되도록 하는 것에 의해 이미지센서(32)에 대한 렌즈 포 커싱(focusing) 조정을 실시하여 이미지센서(32)에서 획득될 영상의 해상도가 향상되도록 하게 된다. After that, the assembling line assembling the module PCB (30) side and the sensor module, between an adhesive and then is assembled by screwing the lens barrel 10 of the lens module to the holder 20 of the sensor module, wherein and by so adjusting the degree to which the screw connection, the separation distance between the lens (12-1, 12-2) side and the image sensor 32 is adjusted by carrying out the lens capsule Cushing (focusing) adjustment for the image sensor 32 of the image to be obtained from the image sensor 32 is such that improved resolution.

이어서, 렌즈 포커싱 조정 작업이 완료되면, 그 위치 조정된 상태가 유지되도록 경통(10)과 홀더(20)간을 자외선 본드의 접착제를 도포한 후 자외선 조사 큐어링(curing)을 실시하여 도포된 접착제가 경화되도록 함으로써 서로 견고히 접착 고정되도록 하여, 이로써 최종적으로 카메라모듈(1)이 제조되도록 하게 된다. Then, the lens when focusing adjustment operation is completed, the position of the adjusted state is maintained to be coated with an adhesive of the ultraviolet bond between barrel 10 and the holder 20 and then subjected to ultraviolet radiation curing (curing) applying adhesive It is to ensure that the adhesive securely fixed to each other by making the curing, and thus is such that finally the camera module 1 is manufactured.

이러한 카메라모듈(1)의 작용을 설명하면, 피사체로부터의 반사광이 입사되면, 해당 광은 렌즈군(12)의 렌즈들(12-1, 12-2)과 적외선차단필터(22)를 순차적으로 통과하게 되며, 이때 적외선차단필터(22)를 통과시 해당 광중의 적외선 영역의 광은 투과되지 못하고 가시광선 영역의 광만이 투과되어 결국 가시광선 영역의 광만이 이미지센서(32)로 입사되어 인지되게 되며, 이에 따라 해당 가시광선 영역의 광은 이미지센서(32)에서 전기적인 영상신호로서 획득되게 되고, 획득된 해당 전기적 영상신호는 이후 모듈피씨비(30)에서 디지털 처리되게 된다. Referring to the action of the camera module 1, when the reflected light from the subject is incident, the light is sequentially in the lens group 12, lens (12-1, 12-2) and the infrared cut filter 22 It is passed through, wherein the passing through the IR cut filter 22 is not being light transmitting in the infrared region of the photo-transmitting only light in the visible light region so that the end, only light in the visible region is incident to the image sensor 32 and, whereby the light of the visible light region is to be obtained as an electrical image signal from the image sensor 32, the acquired corresponding electrical video signal is to be digitally processed in the subsequent module PCB (30).

그러나, 이상과 같은 종래의 카메라모듈(1) 및 그 조립방법에 있어서는 다음과 같은 문제점이 발생되고 있다. However, the following problems are generated in the conventional camera module 1 and the assembly method as described above.

첫째, 카메라모듈(1)은 전술한 바와 같이 상대적으로 많은 다수개의 부품으로 이루어져 있어, 소형화 및 박형화에 불리할 뿐만 아니라, 제조비용이 높고, 또한 많은 부품수에 상응하는 조립공정의 복잡화로 생산성이 낮은 문제점이 있었다. First, the camera module 1 is here made up of a relatively large number of components, as described above, not only is this disadvantageous in size reduction and thickness reduction, a high manufacturing cost, and the productivity in complication of the assembly process that corresponds to the number of components can be there were low.

이와 관련하여, 특히, 적외선차단필터(22) 부품의 경우에는 원판 글래스를 이용하므로, 그 조립과정 등에서 해당 글래스의 미세한 깨짐(chipping) 등이 발생 되어 미세 파티클(particle)을 유발시키게 됨으로써, 해당 미세 파티클이 바로 하부측의 이미지센서(32)측으로 유입되어 이미지센서(32)에서의 화상불량을 야기하게 되는 문제점도 있었다. In this connection, in particular, being the case of the infrared cut filter 22 parts is because using the original plate glass, is such as a fine crack (chipping) of the glass, generated from the assembly process, thereby causing the fine particles (particle), the fine the particles are introduced directly toward the image sensor 32 on the lower side there is also a problem in that it leads to image defects in the image sensor 32.

둘째, 그 조립에 있어서는 경통(10)측과 홀더(20)측간의 나사 결합 정도를 조정하는 것에 의해 렌즈 포커싱 조정을 실시한 후 경통(10)측과 홀더(20)측간을 자외선 본딩으로 결합시켜 고정하게 되는데, 렌즈 포커싱 조정 작업은 극히 소형인 경통(10)을 파지하여 회전시키면서 조정하는 것이어서 작업이 곤란함에 따라 많은 인력과 시간이 소요되어 제조원가를 상승시키면서 생산성을 저하시키고, 사실상 최적 조정의 실현도 어려워 제품의 품질도 저하시키고 있다. Second, by combining with the assembly In the lens barrel 10 side and the holder 20, after performing lens focusing adjustment by adjusting the degree of screwing of the Toilet barrel 10 side and the holder 20, the UV bonding Toilet the fixed that there is, and operation lens focusing adjustment is extremely geotyieoseo adjusting rotating by holding the compact lens barrel 10, the operation is reduced productivity while much labor and time is required to raise the manufacturing costs according difficult as the realization of practically perfect adjustment Fig. there were also decreases the quality of the product difficult.

본 발명은 상기와 같은 제반 문제점을 해결하기 위하여 창안된 것으로서, 렌즈군의 렌즈에 대해 직접 적외선 차단용 코팅을 실시하여 별도의 적외선차단필터가 생략되도록 함으로써 소형화에 유리하면서 조립성도 향상되도록 함과 더불어, 렌즈 포커싱 조정 작업을 별도로 실시하지 않는 무조정 기술을 이용하여 조립과 동시에 포커싱이 정확히 맞추어지도록 함으로써 이 점에서도 생산성 및 품질이 향상되도록 하게 되는 카메라모듈을 제공하는데 그 목적이 있다. The present invention has been made to solve the various problems as described above, with the box so that as the glass to size reduction by ensuring subjected to coating for the direct infrared cut for the lens unit lens is omitted, a separate infrared cut filter improves assembly Chengdu , there is provided a done such that better productivity and quality in this respect, by so using the unregulated technology does not provide for lens focusing adjustment separately aligned correctly at the same time and focusing the camera module assembly.

상술한 목적을 달성하기 위한 본 발명의 카메라모듈은, 상부렌즈를 내측에 고정되도록 구비하는 상부홀더와, 하부렌즈를 개구된 상면상에 고정되도록 구비하며 상기 상부홀더에 대해 하부측에서 접착되어 결합을 이루게 되는 하부홀더와, 상기 하부홀더의 하부측 내측에 수용되게 되는 이미지센서와, 상기 하부홀더에 대해 하부측에서 접착되어 결합을 이루게 되며 상면상에는 상기 이미지센서가 탑재되게 되는 모듈피씨비를 포함하는 것을 특징으로 한다. The camera module of the present invention for achieving the above object is provided to be fixed to the upper holder and the upper face opening of the lower lens having to be fixed to the upper lens at the inner side and bonded is bonded at the lower side with respect to the upper holder a and the lower holder and the lower side inside which make acceptable image on the sensor of the lower holder to be formed, there is formed a bond is bonded at the lower side with respect to said lower holder comprises a module PCB is to be mounted, the image sensor formed on the upper surface and that is characterized.

본 발명의 상기 목적과 여러가지 장점은 이 기술분야에 숙련된 사람들에 의해 첨부된 도면을 참조하여 아래에 기술되는 발명의 바람직한 실시예로부터 더욱 명확하게 될 것이다. The above object and many advantages of the present invention will become more apparent from the preferred embodiments of the invention are described below with reference to the accompanying drawings by those skilled in the art.

이하, 첨부된 도면을 참조로 본 발명의 바람직한 실시예를 상세히 설명하기로 한다. It will be explained below, the preferred embodiment of the present invention with reference to the accompanying drawings in detail.

도 2는 본 발명의 바람직한 실시예에 따른 카메라모듈의 구성 및 그 조립방법을 보여주는 단면도이다. 2 is a cross-sectional view showing an arrangement and a method for assembling the camera module according to an embodiment of the present invention.

설명에 앞서, 종래와 동일한 구성요소에 대해서는 그 상세한 설명을 일부 생략함을 밝힌다. Prior to the description of the same components in the prior art reveals that part of detailed description thereof is omitted.

본 발명에 따르면, 종래에 하부렌즈(12-2)와 이미지센서(32) 사이에 별도 부품으로서 구비되던 적외선차단필터(22)를 생략하게 되며, 그 대신 렌즈군의 렌즈(112, 122)에 대하여 직접 적외선 차단 코팅을 실시하게 된다. According to the present invention, is to omit the infrared cut filter 22 that were provided as a separate component between the prior art lower lens 12-2 and the image sensor 32, but instead the lens (112, 122) of the lens About it is directly subjected to infrared cut coating.

상세하게, 렌즈군의 렌즈들(112, 122)에 대해 선택적이면서 적정하게 적외선 차단 코팅을 실시하게 되며, 즉 모든 렌즈들(112, 122)에 대해 코팅을 실시하거나 특정의 것에만 선택적으로 실시하고, 또한 각 렌즈(112, 122)의 상면 또는 하면에 대해 모두 또는 선택적으로 코팅을 실시하게 된다. Specifically, it is to conduct the infrared cut coating selectively, yet adequate for the lens group lens (112, 122), that is subjected to coating for all the lenses (112, 122), or only selectively carried out in particular that of the , it is also carried out by coating all or selective for the upper or lower surface of each lens (112, 122).

그리고, 물론 적외선 차단 코팅은 종래와 동일하게 진공증착(vacuum evaporation)을 이용하여 실시할 수 있다. And, of course, the infrared cut coating may be performed by using a vacuum vapor deposition (vacuum evaporation) in the same manner as the prior art.

이로써, 소정 두께를 차지하던 적외선차단필터(22) 부품을 생략할 수 있게 되므로, 카메라모듈(100)의 소형화 및 박형화를 기할 수 있게 되고, 부품 생략에 따라 제조비용을 절감할 수 있게 되며, 또한 조립공정의 단순화로 생산성을 향상시킬 수 있게 된다. Thereby, since the infrared cut filter 22 parts who occupies a predetermined thickness can be omitted, to be able to talk to the size and thickness of the camera module 100, it becomes possible to reduce the production cost depending on the parts is omitted, and it is possible to improve productivity by simplifying the assembly process.

또한, 특히 종래에 원판 글래스를 이용하는 적외선차단필터(22)에 대한 조립과정 등에서 원판 글래스의 미세한 깨짐 등에 의한 미세 파티클의 유발로 이미지센서(32)측에서 화상불량이 야기되던 문제점도 방지되어 품질도 향상시킬 수 있게 된다. In particular, it is prevented also assembled microstructure problems that were causing the image defects caused by the side image sensor 32 by the particle due to microscopic fractures of the original plate glass, etc. process for the IR cut filter 22 using the original plate glass with the prior quality is also It can be improved.

나아가, 본 발명에 따른 카메라모듈(100)은, 상부렌즈(112)를 내측에 고정되도록 구비하는 상부홀더(110)와, 하부렌즈(122)를 개구된 상면상에 고정되도록 구비하며 전술한 상부홀더(110)에 대해 하부측에서 접착되어 결합을 이루게 되는 하부홀더(120)와, 상부렌즈(112)와 하부렌즈(122) 사이에 구비되어 해당 렌즈들(112, 122)간을 적정간격 이격시키면서 불필요한 외측부분에서의 광의 진행을 차단하게 되는 마스크(114)와, 하부홀더(120)내의 하부측에 수용되도록 구비되며 후술하는 모듈피씨비(130)상에 탑재되게 되는 이미지센서(132)와, 하부홀더(120)에 대해 하부측에서 접착되어 결합을 이루게 되며 그 상면상에는 전술한 이미지센서(132)가 전기적으로 연결되도록 탑재되게 되는 모듈피씨비(130)를 포함하게 된다. Further, the camera module 100 according to the invention, comprising and above so as to be fixed to the upper holder 110 and the upper face opening of the bottom lens (122) having to be fixed to the upper lens 112 to the inner top and the holder 110 is adhered on the lower side of the lower holder 120 to be formed a bond for, provided between the upper lens 112 and the lower lens 122, the lenses 112 and 122 appropriate interval spacing between while a is provided to be received at the lower side below the module PCB 130, an image sensor is to be mounted on a 132 within the block the progress of light in unnecessary outside portion to the mask 114 is, the lower holder 120, constitute a bond is bonded at the lower side against the lower holder 120, and will include a module PCB 130 that is to be mounted such that the image sensor 132 described above formed on its upper surface electrically connected.

전술한 마스크(114)는 상부홀더(110)의 상부렌즈(112) 하부측이나 하부홀더(120)의 하부렌즈(122) 상부측, 어느 곳에 부착되도록 구비될 수도 있으나, 바람 직하게는 상부렌즈(112)를 하부측에서 지지할 수 있도록 상부홀더(110)의 상부렌즈(112) 하부측에 부착되어 구비될 수 있다. The aforementioned mask 114, but may be provided for attachment to the lower lens 122, the upper side of the upper lens 112, a lower side and the lower holder 120 of the upper holder 110, anywhere, the wind directly to the upper lens to support 112 at the bottom side is attached to the upper lens 112, a lower side of the upper holder 110 may be provided.

상부렌즈(112) 및/또는 하부렌즈(122)는 전술한 바와 같이 적정하게 적외선 차단 코팅이 실시된 것이 이용되게 되며, 한편 하부렌즈(122)는 이미지센서(132) 상부측에 구비되어 하부홀더(120)의 개구부를 폐쇄하게 됨으로써 미세 이물질이 하부측의 이미지센서(132)측으로 유입되는 것도 차단하게 된다. The upper lens 112 and / or bottom lens 122 is to be used to the two appropriately infrared blocking coating as described above carried out, whereas the lower lens 122 is provided at the upper side image sensor 132, the lower holder whereby an opening of 120 to close thereby blocking it that the fine foreign matter from entering the side of the image sensor 132 on the lower side.

본 발명에 따르면, 이상과 같은 구성으로 이루어져, 상부홀더(110), 하부홀더(120) 및 모듈피씨비(130)가 서로에 대해 단순히 접착되어 결합되게 되는 조립과정에서 이미지센서(132)에 대한 렌즈 포커싱 조정을 별도로 실시하지 않게 되는데, 이는 부품 및 조립 설계를 통해 접착 조립과 동시에 렌즈 포커싱이 정확히 이루어지도록 할 수 있기 때문이며, 이와 같이 설계를 통해 조립과 동시에 포커싱이 맞추어지도록 함으로써, 조립시점에서 별도로 포커싱 조정 작업을 실시하지 않게 되는 기술을 무조정 기술이라고 칭할 수 있다. According to the invention, consists of the arrangement above, the upper holder 110 and lower holder 120 and the module PCB 130, a lens for the image sensor 132 during the assembly process is to be combined is simply bonded to one another there is no longer subjected to the focusing adjusting separately and components and at the same time as bonding the assembly through the assembly design because it can allow for adequate exact lens focusing, since to fit the thus at the same time as assembling the focusing over the design, focusing separately from the assembly point, a technology that is not carried out the operation, may be called non-modulation technique.

이상과 같은 본 발명에 따른 카메라모듈(100)의 조립방법에 대해 설명하면, 먼저 모듈피씨비(130)상에 이미지센서(132)를 탑재시켜 준비하고, 또한 상부렌즈(112)를 내측에 구비하는 상부홀더(110)와, 하부렌즈(122)를 내측에 구비하는 하부홀더(120)를 각각 선조립하여 준비한 다음, 이후 모듈피씨비(130)측과 하부홀더(120)를 먼저 접착시켜 결합한 다음, 해당 하부홀더(120)와 상부홀더(110)간을 서로 접착시켜 고정 결합함으로써, 완제품의 카메라모듈(100)이 제조되게 된다. Referring to the method for assembling the camera module 100 in accordance with the present invention as described above, first prepared by mounting the image sensor 132 on the module PCB 130, and also having an upper lens 112 to the inner combined with the upper holder 110, with each assembly line to the lower holder (120) having a bottom lens 122 to the inner prepared next, by first bonding a subsequent module PCB 130 side and the lower holder 120, and then, by bonding to each other the lower holder 120 and the upper holder (110) between the fixed combination, it is presented the manufacturing the camera module 100 of the finished product.

이로써, 본 발명에 의하면, 조립공정이 매우 단순화되므로, 대폭적인 생산성 향상을 기할 수 있게 되고, 조립 단순화에 따라 불량발생율도 저하시킬 수 있게 된다. Thus, according to the present invention, since the assembly process is very simple, being able to talk, significantly improving productivity, poor rate are also able to be reduced in accordance with the simplified assembly.

특히, 포커싱 조정 작업을 별도로 실시할 필요가 없게 되는 점에서 큰 생산성 향상 및 불량발생율 저감 효과를 얻을 수 있게 된다. In particular, it is possible to obtain a greater productivity and defect generation rate reduction effect in that it is not necessary to perform focusing adjustment separately.

덧붙여, 이상과 같은 본 발명에 따르면, 종래에 렌즈군을 하부측에서 지지하도록 구비되던 렌즈지지체(16) 부품도 생략될 수 있게 된다. In addition, according to the present invention as described above, the lens support material (16) provided to support the release of the lens from the lower side to the prior part is possible also be omitted.

이상, 상기 내용은 본 발명의 바람직한 일 실시예를 단지 예시한 것으로 본 발명의 당업자는 본 발명의 요지를 변경시킴이 없이 본 발명에 대한 수정과 변경을 가할 수 있음을 인지해야 한다. Or more, the details, those skilled in the art that only illustrates the preferred embodiment of the invention is to be understood that this can apply to modifications and variations to the invention without having to change the subject matter of the present invention.

본 발명에 따르면, 소정 두께를 차지하던 적외선차단필터 부품을 생략할 수 있게 되므로, 카메라모듈의 소형화 및 박형화를 기할 수 있고, 제조비용을 절감할 수 있으며, 조립공정의 단순화로 생산성을 향상시킬 수 있고, 적외선차단필터를 구성하던 원판 글래스의 미세한 깨짐 등에 의한 미세 파티클의 유발로 이미지센서측에서 화상불량이 야기되던 것도 방지하여 품질도 향상시킬 수 있게 됨과 아울러, 조립과정에서 별도의 포커싱 조정 작업을 실시하지 않게 되므로, 이 점에서도 생산성 향상 및 불량발생율 저감을 기할 수 있게 되는 효과가 달성될 수 있게 된다. According to the present invention, since the infrared cut filter part was accounted for a given thickness can be omitted, it is possible to talk to the size and thickness of the camera module, to reduce the production cost, and improve productivity by simplifying the assembly process and, as soon possible to prevent also the release of the image defects caused by the cause of the fine particles the image sensor side to the improved quality due to microscopic fractures of the original glass was constituting the infrared cut filter as well, the operation separate focusing adjustment during assembly since not performed, the effect of being able to talk to the reduced productivity and poor rate at this point is able to be achieved.

Claims (4)

  1. 상부렌즈(112)를 내측에 고정되도록 구비하는 상부홀더(110)와, And the upper holder 110 provided so as to be fixed to the upper lens 112 on the inner side,
    하부렌즈(122)를 개구된 상면상에 고정되도록 구비하며 상기 상부홀더(110)에 대해 하부측에서 접착되어 결합을 이루게 되는 하부홀더(120)와, Provided so as to be fixed on the upper face an opening for the lower lens 122 and the lower holder 120 to be formed a bond is bonded at the lower side with respect to the upper holder 110,
    상기 하부홀더(120)의 하부측 내측에 수용되게 되는 이미지센서(132)와, And the image sensor 132 that is to be received in the inner lower side of the lower holder 120,
    상기 하부홀더(120)에 대해 하부측에서 접착되어 결합을 이루게 되며 상면상에는 상기 이미지센서(132)가 탑재되게 되는 모듈피씨비(130)를 포함하는 것을 특징으로 하는 카메라모듈. Constitute a bond is bonded at the lower side with respect to the lower holder 120, and the camera module comprises a module PCB 130 that is to be equipped with the image sensor 132 is formed on the upper surface.
  2. 제 1 항에 있어서, According to claim 1,
    상기 상부렌즈(112) 또는 상기 하부렌즈(122)는 적외선 차단 코팅이 실시된 것인 것을 특징으로 하는 카메라모듈. The upper lens 112 or the lower lens 122 has a camera module, characterized in that that the the infrared-rejecting coating embodiment.
  3. 제 1 항에 있어서, According to claim 1,
    상기 상부홀더(110)측의 상기 상부렌즈(112)와 상기 하부홀더(120)측의 상기 하부렌즈(122) 사이에 구비되어 불필요한 부분의 광의 진행을 차단하게 되는 마스크(114)를 더 포함하는 것을 특징으로 하는 카메라모듈. Further comprising: the upper lens 112 and the lower holder 120 is to be provided between the lower lens 122 of the side block the light traveling in the unwanted parts mask 114 of the upper holder 110 side the camera module according to claim.
  4. 제 3 항에 있어서, 4. The method of claim 3,
    상기 마스크(114)는 상기 상부홀더(110)의 상부렌즈(112) 하부측이나 상기 하부홀더(120)의 상기 하부렌즈(122) 상부측에 부착되도록 구비되는 것을 특징으로 하는 카메라모듈. The mask 114 includes a camera module, characterized in that provided for attachment to the lower lens 122, the upper side of the upper lens 112 and the lower side of the lower holder 120 of the upper holder (110).
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