KR20040095993A - Wafer chuck and wafer fixing method therein - Google Patents
Wafer chuck and wafer fixing method therein Download PDFInfo
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- KR20040095993A KR20040095993A KR1020030028763A KR20030028763A KR20040095993A KR 20040095993 A KR20040095993 A KR 20040095993A KR 1020030028763 A KR1020030028763 A KR 1020030028763A KR 20030028763 A KR20030028763 A KR 20030028763A KR 20040095993 A KR20040095993 A KR 20040095993A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
Description
본 발명은 반도체 웨이퍼척 및 이를 이용한 웨이퍼를 웨이퍼척에 고정시키는 방법에 관한 것으로, 보다 상세하게는 상기 웨이퍼척 표면에 설치되는 진공홀이 형성된 진공틀을 다수개로 구성하여 웨이퍼가 안착될 영역 전체에 걸쳐 분포하도록 형성하여, 웨이퍼를 진공으로 고정시키는 힘을 웨이퍼 전체에 대해 균일하게 가하여 웨이퍼 고정시 웨이퍼가 휘어지지 않도록하고 파손된 웨이퍼에 대해서도 웨이퍼척에 용이하게 고정시킬 수 있도록 하는 웨이퍼척 및 이를 이용한 웨이퍼를 웨이퍼척에 고정시키는 방법에 관한 것이다.The present invention relates to a semiconductor wafer chuck and a method of fixing the wafer using the same to a wafer chuck, and more particularly, a plurality of vacuum frames in which vacuum holes are provided on the surface of the wafer chuck are formed in the entire region where the wafer is to be seated. It is formed so as to spread over, the wafer chuck is applied evenly to the entire wafer to secure the wafer in a vacuum so that the wafer does not bend when the wafer is fixed, and to easily fix to the wafer chuck also to the broken wafer A method of fixing a wafer to a wafer chuck.
일반적으로 반도체 웨이퍼라 함은 집적회로를 만들기 위한 반도체 물질의 단결정을 성장시킨 기둥 모양의 봉을 얇게 잘라서 원판 모양으로 만든 것을 의미하며, 반도체 소자 제조용 장비에는 잠입되는 웨이퍼를 지지하는 역할을 하는 웨이퍼 척이 구비된다. 이와같이 웨이퍼척을 구비하는 장비로는 노광공정을 수행하는 스캐너나 스텝퍼와 같은 노광장비나 패턴이 형성된 웨이퍼를 단위 칩으로 조립하기 전에 웨이퍼를 구성하는 각 칩의 전기적 특성을 검사하는 검사공정을 수행하는 검사장치등이 있다.In general, a semiconductor wafer means a columnar rod made by thinly cutting a columnar rod in which a single crystal of a semiconductor material for making an integrated circuit is cut into a disc shape, and a wafer chuck supporting a wafer to be submerged in a device for manufacturing a semiconductor device. Is provided. As such, a device having a wafer chuck may perform an inspection process of inspecting electrical characteristics of each chip constituting the wafer before assembling an exposure apparatus such as a scanner or a stepper that performs an exposure process or a wafer having a pattern formed into a unit chip. There is an inspection device.
도 1은 일반적인 검사장치의 구성을 개략적으로 나타낸 도면이다.1 is a view schematically showing the configuration of a general inspection apparatus.
도 1에 도시된 바와 같이, 검사장치는 기본적으로 웨이퍼척(1), 프로브 니들(20) 및 프로브카드(30)로 구성된다. 웨이퍼(100)가 위치하는 웨이퍼척(1)은 상, 하, 좌, 우로 이동이 가능하다. 프로브카드(30)에 구비되어 있는 프로브니들(20)은 웨이퍼척(1)상에 위치한 웨이퍼(100)를 구성하는 각 칩의 패드부위에 접촉되어, 칩 내부의 회로에 전기신호가 전달하여 칩의 전기적인 불량여부를 검사한다.As shown in FIG. 1, the inspection apparatus basically includes a wafer chuck 1, a probe needle 20, and a probe card 30. The wafer chuck 1 in which the wafer 100 is located is movable up, down, left, and right. The probe needle 20 included in the probe card 30 is in contact with a pad portion of each chip constituting the wafer 100 located on the wafer chuck 1, and an electrical signal is transmitted to a circuit inside the chip so that the chip Check for electrical defects.
도 2 및 도 3은 종래의 웨이퍼척을 개략적으로 도시한 단면도 및 평면도이다.2 and 3 are a cross-sectional view and a plan view schematically showing a conventional wafer chuck.
도 2및 도 3의(a)를 참조하면, 웨이퍼(100)는 웨이퍼척(1) 표면에 형성된 진공틀(2)에 안착되고 상기 진공틀에 형성된 진공홀(3)에 인가되는 진공에 의해 웨이퍼척(1)에 흡착되어 고정된다. 상기 진공홀(3)은 외부의 진공펌프와 연결되어 펌프작용에 의한 진공을 웨이퍼에 제공하게 된다. 상기 진공틀(2)은 그 일부에 한 개 또는 그 이상 형성된 진공홀(3)에 의해 진공흡착을 좋게하기 위하여 원통형 또는 다각형 도랑 형태로 형성되어 있다. 또한 진공틀(3)은 흡착 효율을 높이기 위하여 동심원 또는 동심다각형으로 구성될 수 있다.2 and 3 (a), the wafer 100 is seated in the vacuum frame 2 formed on the surface of the wafer chuck 1 and is applied by the vacuum applied to the vacuum hole 3 formed in the vacuum frame. The wafer chuck 1 is sucked and fixed. The vacuum hole 3 is connected to the external vacuum pump to provide a vacuum by the pump action to the wafer. The vacuum frame (2) is formed in the shape of a cylindrical or polygonal groove in order to improve vacuum absorption by the vacuum hole (3) formed in one or more parts thereof. In addition, the vacuum frame 3 may be of concentric circles or concentric polygons in order to increase the adsorption efficiency.
그러나 도 3(a)에 도시된 바와 같이, 종래의 웨이퍼척(1)에 있어서는 표면에 형성된 진공홀(3)이 한쪽방향으로 일렬로 배치되어있어 웨이퍼(100)를 진공으로 고정시킬 때 안착된 웨이퍼(100)에 고정시키는 힘을 전체에 대해 균일하게 가하지 못하게되어 힘의 불균형이 생기고 이에따라 미세하게 웨이퍼(100)가 휘어지게 되는 것을 방지하기 어려운 문제점이 있었다.However, as shown in FIG. 3 (a), in the conventional wafer chuck 1, the vacuum holes 3 formed on the surface are arranged in one direction in a row so that the wafer 100 is seated when the wafer 100 is fixed by vacuum. There is a problem that it is difficult to prevent the force imbalance is uniformly applied to the whole to the wafer 100 to cause the force imbalance and thus the wafer 100 is not bent finely.
또한 웨이퍼를 수동으로 검사하기위해 파손된 웨이퍼(100)를 웨이퍼척(1)에 고정시키는 경우에 도 3(b)에 도시된 바와 같이 파손된 부분에만 진공홀(3)이 존재한다면 진공홀(3)에서 발생하는 진공이 진공틀(2)을 완전하게 덮지못하여 진공상태를 유지하기 어려우며, 따라서 파손된 웨이퍼(100)를 웨이퍼척(1)에 고정하는 것이 불가능해지는 문제점이 있었다.In addition, when the broken wafer 100 is fixed to the wafer chuck 1 in order to inspect the wafer manually, as shown in FIG. 3 (b), if the vacuum hole 3 exists only in the broken part, the vacuum hole ( Since the vacuum generated in 3) does not completely cover the vacuum frame 2, it is difficult to maintain the vacuum state, and thus there is a problem in that it is impossible to fix the broken wafer 100 to the wafer chuck 1.
본 발명은 상기와 같은 문제점을 해결하고자 발명된 것으로, 진공홀이 형성되어 있는 진공틀이 표면에 설치된 반도체 웨이퍼척에 있어서 상기 진공틀 및 진공홀이 다수개로 이루어져 웨이퍼가 안착될 영역 전체에 걸쳐 균일하게 분포하므로, 안착된 웨이퍼에 균일하게 진공을 제공하여 웨이퍼가 휘어지게되는 것을 방지할 수 있고 웨이퍼가 파손된 경우에도 용이하게 고정시킬 수 있는 웨이퍼척 및 이를 이용한 웨이퍼를 웨이퍼척에 고정시키는 방법을 제공하고자 함에 그 목적이 있다.The present invention has been invented to solve the above problems, and in the semiconductor wafer chuck having a vacuum frame in which a vacuum hole is formed, the vacuum frame and the vacuum hole are formed in plural to uniformly cover the entire area where the wafer is to be seated. Since it is distributed evenly, a wafer chuck which can prevent the wafer from bending by providing a uniform vacuum to the seated wafer and can be easily fixed even if the wafer is broken, and a method of fixing the wafer using the same to the wafer chuck The purpose is to provide.
도 1은 일반적인 검사장치의 구성을 개략적으로 나타낸 도면1 is a view schematically showing the configuration of a general inspection device
도 2는 종래의 웨이퍼척을 개략적으로 도시한 단면도2 is a cross-sectional view schematically showing a conventional wafer chuck.
도 3은 종래의 웨이퍼척을 개략적으로 도시한 평면도3 is a plan view schematically showing a conventional wafer chuck
도 4는 본 발명의 일실시예에 따른 웨이퍼척을 개략적으로 도시한 평면도4 is a plan view schematically showing a wafer chuck according to an embodiment of the present invention;
도 5는 본 발명에 의한 웨이퍼척이 적용된 웨이퍼 검사용 프로브 스테이션의 분해사시도5 is an exploded perspective view of a wafer inspection probe station to which a wafer chuck according to the present invention is applied;
〈 도면의 주요부분에 대한 설명 〉<Description of Main Parts of Drawing>
1 : 웨이퍼척 2 : 진공틀1: wafer chuck 2: vacuum frame
3 : 진공홀 11 : 결합홀3: vacuum hole 11: coupling hole
12 : 기준대 14 : 리프터12: reference base 14: lifter
16 : 베이스 17 : 포서(forcer)16: base 17: forcer
20 : 프로브니들 30 : 프로브카드20: probe needle 30: probe card
100: 웨이퍼100: wafer
상기와 같은 목적을 실현하기 위한 본 발명에 의한 웨이퍼척은, 웨이퍼를 지지하는 몸체, 상기 웨이퍼가 안착되도록 상기 몸체 표면에 형성된 2개 이상의 진공틀, 상기 웨이퍼가 상기 몸체에 흡착되도록 진공을 인가하는 통로로 이용되는 상기 진공틀마다 적어도 1개 이상 형성된 진공홀, 상기 진공홀에 진공을 제공하는 적어도 1개 이상의 진공펌프를 포함하여 이루어지는 것을 특징으로 한다.Wafer chuck according to the present invention for realizing the above object, the body for supporting the wafer, at least two vacuum frame formed on the body surface so that the wafer is seated, applying a vacuum so that the wafer is adsorbed to the body At least one vacuum hole formed in each of the vacuum frame used as a passage, characterized in that it comprises at least one or more vacuum pump for providing a vacuum in the vacuum hole.
또한 상기의 발명을 이용한 본 발명에 따른 웨이퍼를 웨이퍼척에 고정시키는 방법은, 진공홀이 형성되어 있는 진공틀이 표면에 설치된 반도체 웨이퍼척이 상기 진공홀에 연결된 진공펌프를 통해 상기 진공홀에 진공을 인가하여 웨이퍼를 웨이퍼척에 고정시킴에 있어 상기 진공틀 및 진공홀이 다수개로 이루어져 웨이퍼가 안착될 영역 전체에 걸쳐 분포하도록 형성되어 상기 다수개의 진공홀에 진공을 인가하여 웨이퍼를 흡착시키는 것을 특징으로 한다.In addition, the method of fixing the wafer according to the present invention using the above invention to the wafer chuck, a semiconductor wafer chuck having a vacuum frame is formed on the surface of the vacuum chuck is vacuum in the vacuum hole through a vacuum pump connected to the vacuum hole In fixing the wafer to the wafer chuck by applying a plurality of the vacuum frame and the vacuum hole is formed so as to be distributed over the entire area where the wafer is to be seated to apply a vacuum to the plurality of vacuum holes to adsorb the wafer It is done.
이하 본 발명의 일실시예에 따른 구성 및 작용을 예시도면에 의거하여 상세히 설명한다.Hereinafter, the configuration and operation according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
도 4는 본 발명의 일실시예에 따른 웨이퍼척을 개략적으로 도시한 평면도이다.4 is a plan view schematically showing a wafer chuck according to an embodiment of the present invention.
도 4(a)에 도시된 바와 같이, 웨이퍼척(1) 표면에 설치되는 진공틀(2)은 종래의 진공틀과 달리 다수개로 이루어져 웨이퍼가 안착될 영역 전체에 걸쳐 분포하며, 상기 진공틀(2) 각각에는 진공을 제공할 수 있는 진공홀(3)이 형성되어 있다. 따라서 상기 웨이퍼척(1)에 안착된 웨이퍼는 다수의 진공홀(3)에 의해 균일하게 진공을 제공받을 수 있게되어 특정방향으로 편향된 힘을 받지않게 되므로 웨이퍼가 휘어지는 것을 방지할 수 있다.As shown in Figure 4 (a), unlike the conventional vacuum frame, the vacuum frame (2) is installed on the surface of the wafer chuck 2 is made of a plurality of distributed throughout the area where the wafer is to be placed, the vacuum frame ( 2) In each of them, a vacuum hole 3 capable of providing a vacuum is formed. Accordingly, the wafer seated on the wafer chuck 1 may be uniformly provided with the vacuum by the plurality of vacuum holes 3, so that the wafer may not be biased in a specific direction, thereby preventing the wafer from bending.
또한 도 4(b)에 도시된 바와 같이, 파손된 웨이퍼(100)를 고정시키는 경우에도 진공홀(3)이 웨이퍼가 안착될 영역 전체에 걸쳐 분포하고 있기때문에 파손되어 남아있는 웨이퍼의 형태에 상관없이 남아있는 웨이퍼의 부분에 진공홀(3)에 의한 진공이 제공될 수 있으므로, 파손된 웨이퍼를 수동으로 검사하는 경우에도 용이하게 파손된 웨이퍼(100)를 웨이퍼척(1)에 고정시킬 수 있다.In addition, as shown in FIG. 4B, even when the broken wafer 100 is fixed, the vacuum hole 3 is distributed over the entire area where the wafer is to be placed, and thus the shape of the broken wafer remains uncorrelated. Since the vacuum by the vacuum hole 3 can be provided in the remaining portion of the wafer without any damage, the broken wafer 100 can be easily fixed to the wafer chuck 1 even when the broken wafer is manually inspected. .
앞서 서술한 바와 같이, 웨이퍼를 고정시키는 웨이퍼척은 반도체 소자 제조용 장비에서 다양하게 이용된다. 일례로 반도체 웨이퍼 검사용 프로브 스테이션이 있다. 상기 프로브 스테이션은 도 1에 도시된 검사장치에서 프로브카드의 하방에 설치되어 웨이퍼가 적재된 웨이퍼척을 상하로 승강시키면서 웨이퍼를 검사할 수 있도록 한다.As described above, wafer chucks for fixing wafers are used in various devices for manufacturing semiconductor devices. An example is a probe station for semiconductor wafer inspection. The probe station is installed below the probe card in the inspection apparatus shown in FIG. 1 so that the wafer can be inspected while lifting up and down the wafer chuck on which the wafer is loaded.
도 5는 본 발명에 의한 웨이퍼척이 적용된 웨이퍼 검사용 프로브 스테이션의 분해사시도이다.5 is an exploded perspective view of a probe inspection probe station to which a wafer chuck according to the present invention is applied.
도면에 도시된 바와 같이, 프로브 스테이션은 웨이퍼를 고정시키는 웨이퍼척(1)과, 상기 웨이퍼척(1)의 외주면에 일체로 설치되는 기준대(12)와, 상기 웨이퍼척(1)을 상하로 승강시키는 리프터(14)가 구비되어 있다.As shown in the figure, the probe station includes a wafer chuck 1 for fixing a wafer, a reference table 12 integrally installed on an outer circumferential surface of the wafer chuck 1, and the wafer chuck 1 up and down. A lifter 14 for elevating is provided.
상기 웨이퍼척(1)은 중앙에 스크류(18)를 매개로 하여 리프터(14)와 체결·고정할 수 있도록 결합홀(11)이 다수개 형성되어 있다. 상기 기준대(12)는 프로빙 작업시 프로버 설비 동작상의 기준점을 바로 잡아주기 위한 것으로서, 상기 웨이퍼척(1)의 외주면 일측에 일체로 부착되는 사각기둥 형상의 기준대 본체(12a)가 마련되어 있으며, 그 상면에는 편평하고 중앙에 십자선이 새겨진 피듀셜마크(fiducial mark)(12b)가 형성되어 있다.The wafer chuck 1 has a plurality of coupling holes 11 formed at the center thereof so as to be fastened and fixed with the lifter 14 through the screw 18. The reference stage 12 is for correcting a reference point on the operation of the prober during the probing operation, and the reference base body 12a having a square pillar shape integrally attached to one side of the outer circumferential surface of the wafer chuck 1 is provided. On the upper surface thereof, a fiducial mark 12b is formed which is flat and has a crosshair engraved in the center thereof.
상기 리프터(14)는 웨이퍼척(1)과 기준대(12)를 상하방으로 승강시키기 위한 것으로서, 상면에는 웨이퍼척(1)이 결합될 수 있도록 다수개의 결합홀(14a)이 형성되어 있고, 그 외부에는 상기 리프터(14)를 지지하기 위한 베이스(16)가 설치되어 있다. 상기 베이스(16)의 하단부에는 이 베이스(16)를 X,Y방향으로 이동시키기 위한 포서(forcer)(17)가 설치되어 있다.The lifter 14 is for lifting up and down the wafer chuck 1 and the reference table 12, and a plurality of coupling holes 14a are formed on the upper surface thereof to allow the wafer chuck 1 to be coupled thereto. At its outside, a base 16 for supporting the lifter 14 is provided. At the lower end of the base 16, a forcer 17 for moving the base 16 in the X and Y directions is provided.
상술한 웨이퍼 검사용 프로브 스테이션이외에도 본 발명에 의한 웨이퍼척은 당분야의 통상의 지식을 가진 자에 의해 웨이퍼척이 구비되는 다양한 반도체 소자 제조용 장비에 적용될 수 있음은 명백하다.In addition to the above-described wafer inspection probe station, it is apparent that the wafer chuck according to the present invention can be applied to various semiconductor device manufacturing equipments equipped with wafer chucks by those skilled in the art.
이상에서 설명한 바와 같이 본 발명 웨이퍼척 및 이를 이용한 웨이퍼를 웨이퍼척에 고정시키는 방법에 의하면, 진공홀이 형성된 진공틀이 다수개로 구성되어 웨이퍼가 안착될 영역 전체에 걸쳐 분포하도록 웨이퍼척 표면에 형성되어 있어서, 안착된 웨이퍼에 균일하게 진공을 제공하여 웨이퍼가 휘어지게되는 것을 방지하고 파손된 웨이퍼에 대해서도 용이하게 고정시킬 수 있는 효과를 갖는다.As described above, according to the present invention, the wafer chuck and the method for fixing the wafer using the same are formed on the surface of the wafer chuck so that the vacuum frame in which the vacuum holes are formed is formed in a plurality and distributed over the entire area where the wafer is to be seated. In this way, the vacuum is uniformly provided on the seated wafer, thereby preventing the wafer from warping and easily fixing the broken wafer.
Claims (6)
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|---|---|---|---|
| KR1020030028763A KR20040095993A (en) | 2003-05-07 | 2003-05-07 | Wafer chuck and wafer fixing method therein |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020030028763A KR20040095993A (en) | 2003-05-07 | 2003-05-07 | Wafer chuck and wafer fixing method therein |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113299592A (en) * | 2021-05-17 | 2021-08-24 | 武汉新芯集成电路制造有限公司 | Wafer bearing device, bearing precision detection method and wafer bonding equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113299592A (en) * | 2021-05-17 | 2021-08-24 | 武汉新芯集成电路制造有限公司 | Wafer bearing device, bearing precision detection method and wafer bonding equipment |
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