KR20040091626A - 슬러리 분배를 위한 굴곡면을 가진 유지링을 구비한화학적 물리적 연마장치 및 방법 - Google Patents

슬러리 분배를 위한 굴곡면을 가진 유지링을 구비한화학적 물리적 연마장치 및 방법 Download PDF

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Publication number
KR20040091626A
KR20040091626A KR10-2004-7011284A KR20047011284A KR20040091626A KR 20040091626 A KR20040091626 A KR 20040091626A KR 20047011284 A KR20047011284 A KR 20047011284A KR 20040091626 A KR20040091626 A KR 20040091626A
Authority
KR
South Korea
Prior art keywords
polishing
retaining ring
substrate
polishing head
subcarrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2004-7011284A
Other languages
English (en)
Korean (ko)
Inventor
몰로니제라르드에스.
가지와라지로
Original Assignee
멀티-플레이너 테크놀로지즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 멀티-플레이너 테크놀로지즈 인코포레이티드 filed Critical 멀티-플레이너 테크놀로지즈 인코포레이티드
Publication of KR20040091626A publication Critical patent/KR20040091626A/ko
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR10-2004-7011284A 2002-01-22 2003-01-21 슬러리 분배를 위한 굴곡면을 가진 유지링을 구비한화학적 물리적 연마장치 및 방법 Ceased KR20040091626A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35167102P 2002-01-22 2002-01-22
US60/351,671 2002-01-22
PCT/US2003/001803 WO2003061904A1 (en) 2002-01-22 2003-01-21 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution

Publications (1)

Publication Number Publication Date
KR20040091626A true KR20040091626A (ko) 2004-10-28

Family

ID=27613520

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7011284A Ceased KR20040091626A (ko) 2002-01-22 2003-01-21 슬러리 분배를 위한 굴곡면을 가진 유지링을 구비한화학적 물리적 연마장치 및 방법

Country Status (5)

Country Link
US (1) US7118456B2 (https=)
JP (1) JP2005515904A (https=)
KR (1) KR20040091626A (https=)
TW (1) TWI289494B (https=)
WO (1) WO2003061904A1 (https=)

Families Citing this family (30)

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Publication number Priority date Publication date Assignee Title
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US6869335B2 (en) * 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
TWI393209B (zh) 2003-02-10 2013-04-11 荏原製作所股份有限公司 研磨基板之方法
RU2240280C1 (ru) 2003-10-10 2004-11-20 Ворлд Бизнес Ассошиэйтс Лимитед Способ формирования упорядоченных волнообразных наноструктур (варианты)
US7768018B2 (en) * 2003-10-10 2010-08-03 Wostec, Inc. Polarizer based on a nanowire grid
US20050126708A1 (en) * 2003-12-10 2005-06-16 Applied Materials, Inc. Retaining ring with slurry transport grooves
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US20070224864A1 (en) * 2005-05-24 2007-09-27 John Burns CMP retaining ring
US7520795B2 (en) * 2005-08-30 2009-04-21 Applied Materials, Inc. Grooved retaining ring
US7326105B2 (en) 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
JP2008177248A (ja) * 2007-01-16 2008-07-31 Tokyo Seimitsu Co Ltd 研磨ヘッド用リテーナリング
US7520796B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
DE102007026292A1 (de) 2007-06-06 2008-12-11 Siltronic Ag Verfahren zur einseitigen Politur nicht strukturierter Halbleiterscheiben
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD634719S1 (en) 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD711330S1 (en) 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
KR101775464B1 (ko) * 2011-05-31 2017-09-07 삼성전자주식회사 화학 기계적 연마 장치의 리테이너 링
WO2013006077A1 (en) 2011-07-06 2013-01-10 Wostec, Inc. Solar cell with nanostructured layer and methods of making and using
EP2740162B1 (en) 2011-08-05 2019-07-03 Wostec, Inc. Light emitting diode with nanostructured layer, method of making a light emitting diode and nanomask used in the method.
US9057704B2 (en) 2011-12-12 2015-06-16 Wostec, Inc. SERS-sensor with nanostructured surface and methods of making and using
WO2013109157A1 (en) 2012-01-18 2013-07-25 Wostec, Inc. Arrangements with pyramidal features having at least one nanostructured surface and methods of making and using
US9050700B2 (en) 2012-01-27 2015-06-09 Applied Materials, Inc. Methods and apparatus for an improved polishing head retaining ring
US9134250B2 (en) 2012-03-23 2015-09-15 Wostec, Inc. SERS-sensor with nanostructured layer and methods of making and using
WO2014142700A1 (en) 2013-03-13 2014-09-18 Wostec Inc. Polarizer based on a nanowire grid
EP3161857B1 (en) 2014-06-26 2021-09-08 Wostec, Inc. Method of forming a wavelike hard nanomask on a topographic feature
US10672427B2 (en) 2016-11-18 2020-06-02 Wostec, Inc. Optical memory devices using a silicon wire grid polarizer and methods of making and using
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
WO2018156042A1 (en) 2017-02-27 2018-08-30 Wostec, Inc. Nanowire grid polarizer on a curved surface and methods of making and using
CN113276018B (zh) * 2021-06-15 2022-10-04 北京烁科精微电子装备有限公司 一种化学机械抛光用保持环
WO2024049890A1 (en) * 2022-09-01 2024-03-07 Applied Materials, Inc. Retainer for chemical mechanical polishing carrier head

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2826009A (en) * 1954-12-10 1958-03-11 Crane Packing Co Work holder for lapping machines
US5597346A (en) 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
US5643061A (en) * 1995-07-20 1997-07-01 Integrated Process Equipment Corporation Pneumatic polishing head for CMP apparatus
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
US5944593A (en) * 1997-09-01 1999-08-31 United Microelectronics Corp. Retainer ring for polishing head of chemical-mechanical polish machines
US6241582B1 (en) * 1997-09-01 2001-06-05 United Microelectronics Corp. Chemical mechanical polish machines and fabrication process using the same
US6527624B1 (en) * 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
US6267643B1 (en) * 1999-08-03 2001-07-31 Taiwan Semiconductor Manufacturing Company, Ltd Slotted retaining ring for polishing head and method of using
EP1177859B1 (en) 2000-07-31 2009-04-15 Ebara Corporation Substrate holding apparatus and substrate polishing apparatus

Also Published As

Publication number Publication date
US20030171076A1 (en) 2003-09-11
TWI289494B (en) 2007-11-11
JP2005515904A (ja) 2005-06-02
WO2003061904B1 (en) 2003-10-09
WO2003061904A1 (en) 2003-07-31
TW200402348A (en) 2004-02-16
US7118456B2 (en) 2006-10-10

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