KR20040084287A - Mother board of apparatus for testing probe card - Google Patents

Abstract

PURPOSE: A mother board of a probe card test apparatus is provided to reduce the exchanging cost by exchanging only a pogo block PCB without exchanging a lower plate. CONSTITUTION: A pogo block PCB(200) including a pogo block(210) is coupled to a lower plate(300). A probe card(400) is installed between the pogo block PCB and the lower plate. A guide screw is installed at a predetermined position of the pogo block in order to align the probe card and the pogo block. Only a PCB is exchanged when the probe card is exchanged. The pogo block PCB further includes a vacuum lock unit for coupling the pogo block PCB to the lower plate in a vacuum state. The vacuum lock unit is installed at an edge of the pogo block.

Description

Mother board of apparatus for testing probe card

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a mother board structure of a probe card inspection device.

In general, a probe card is an interface element that connects a wafer with a tester for checking device characteristics. Such a probe card is mounted on a prober, which is a wafer alignment facility, and serves to test a chip of a wafer by a memory tester facility.

At this time, since the wafer is tested by the probe card, whether or not the probe card is defective is very important. That is, when testing a wafer with a defective probe card, the measurement data is not reliable and the test analysis time (TAT) is increased. Accordingly, prior inspection of the probe card is very important before wafer testing.

In general, the inspection of the probe card is performed in the probe card inspection equipment, and the probe card is subjected to the electrical characteristic and the physical characteristic inspection while mounted in the motherboard in the probe card inspection equipment.

1 is a perspective view showing a motherboard of a conventional probe card inspection equipment.

As shown in FIG. 1, the motherboard 10 includes an upper plate 20 and an opposite lower plate 30. Pogo blocks 40 are provided at predetermined portions of the upper plate 20 facing the lower plate 30. This motherboard 10 is composed of a large set of the upper plate 20, the lower plate 30 and the pogo block 40, the upper plate 20 and the lower plate 30 is a cylinder (15) By the one axis is mechanically connected, the upper plate 20 is closed when the probe card 50 is inserted.

The lower plate 30 facing the pogo block 40 is provided with a PCB guide screw 60 indicating the part where the probe card 50 is to be placed. That is, the PCB guide screw 60 is inserted and fixed to the connection piece (not shown) of the probe card 50 to fix the probe card 50 and correspond to the pogo block 40.

The predetermined portion of the upper and lower plates 20 and 30 is provided with a fastening portion 70 for joining and fastening the upper plate 20 and the lower plate 30. The fastening part 70 fastens the upper plate 20 and the lower plate 30, and fixes the probe card 50 interposed between the upper plate 20 and the lower plate 30. In addition, the fastening part 70 is a screw locking device, and fastens the upper and lower plates 20 and 30 by manual operation of an operator.

A PMU connection terminal 80 connected to the channel contact terminal of the inspection equipment is installed on the upper portion of the upper plate 20, and a support plate 90 supporting the above-described motherboard 10 is provided at the bottom of the lower plate 30. Is attached.

The probe card inspection by the motherboard 10 proceeds in the following manner.

The probe card is mounted on the PCB guide screw 60 of the lower plate 30, and then the pore block 40 and the probe card 50 are contacted by covering the upper plate 20. Thereafter, the screw locking device, which is the fastening part 70, is turned to lock and fix the probe card 50 in the motherboard 10, and then the flatness of the motherboard is measured to compensate for the error. Then, the probe card is checked.

However, the motherboard 10, as described above, the upper, lower plates 20, 30 and the pogo block 40 forms a set, every time the type of the probe card is replaced, the set Since the entire motherboard 10 to be configured must be replaced, the cost of replacing the motherboard is increased.

Furthermore, after replacing the motherboard, before performing the probe test, new measurements such as the flatness of the motherboard must be newly performed, so the system check time is long.

In addition, since the fastening portion 70 that fixes the probe card 50 is a screw, when the wear occurs on the screw or when the force is less applied to the header when the screw is operated, the probe card 50 and the pogo Contact failures may occur between the blocks 40.

Accordingly, it is an object of the present invention to provide a motherboard of a probe card inspection apparatus, which makes it possible to reduce the cost and time of replacing the motherboard when inspecting probe cards of different types.

1 is a perspective view showing a motherboard of a conventional probe card inspection apparatus.

Figure 2 is a perspective view showing the motherboard of the probe card inspection apparatus according to the present invention.

3 is a cross-sectional view of the pogo block PCB of FIG.

4 is a cross-sectional view illustrating a coupling relationship between the pogo pad and the PMU connector of FIG. 3.

(Explanation of symbols for the main parts of the drawing)

100: motherboard 200: pogo block PCB

210: pogo block 220: vacuum lock

230: pogo pad 300: lower plate

310: stage 320: PMU connector

In order to achieve the above object of the present invention, the motherboard of the present invention, the lower plate, the lower plate is formed separately, and has a PCB including a pogo block bonded to the lower plate with the probe card therebetween. A guide screw for aligning the probe card and the pogo block is installed at a predetermined portion of the pogo block, and when replacing the probe card, only the PCB is replaced to match the corresponding probe card.

The PCB further includes a vacuum locking device that seals the edge of the pogo block by applying a vacuum when the bottom plate is attached to the edge of the pogo block, and an alignment hole is installed at selected corners of the PCB, and the lower plate corresponds to the connection hole. The position fixing screw inserted in the connection hole is provided.

A pogo pad is further installed at a predetermined portion of the PCB to electrically connect the PCB and an external PMU channel, and a PMU connector is further installed at a portion corresponding to the pogo pad of the lower plate.

(Example)

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape and the like of the elements in the drawings are exaggerated to emphasize a more clear description, and the elements denoted by the same reference numerals in the drawings means the same elements.

Figure 2 is a perspective view showing the motherboard of the probe card inspection apparatus of the present invention. 3 is a cross-sectional view of the pogo block PCB of Figure 2, Figure 4 is a cross-sectional view showing a coupling relationship of the pogo pad and PMU connector of FIG.

As shown in FIG. 2, the motherboard 100 of the present invention includes a pogo block PCB (Pogo block print circuit board) 200 and a lower plate 300 separately configured with the pogo block PCB 200. .

The pogo block PCB 200 includes a pogo block 210 to be contacted with the probe card 400 and a vacuum lock device 220 surrounding the pogo block 210. In this embodiment, a guide screw 215 may be installed on the surface of the pogo block PCB 200, preferably the pogo block 215, to guide and fix the portion to which the probe card 400 is to be placed.

3 is a cross-sectional view of a pogo block PCB 200 including a pogo block 210 and a vacuum locking device 210. According to FIG. 3, a pogo block 210 is formed at the center of the pogo block PCB 200. Referring to FIG. It is positioned, and the vacuum lock device 210 is formed at the edge thereof to protrude by a predetermined thickness. The vacuum locking device 210 has a structure in which a vacuum line is wrapped by a stiffener, and then, when the lower plate 300 and the pogo block PCB 200 are contacted, the inside of the motherboard through the vacuum line, that is, the lower plate. The vacuum is applied between the 300 and the pogo block PCB 200 to serve to seal.

In addition, a pogo pad 230 is installed on the pogo block PCB 200 on the outer side of the vacuum lock device 210, and the selected position of the pogo block PCB 200 is aligned for bonding with the lower plate 500 at the selected corners. The connection hole 240 is provided.

On the other hand, a stage 300 on which the probe card 400 is placed is provided on the upper surface of the lower plate 300 (the surface opposite to the pogo block PCB). The stage 300 is installed on a surface facing the pogo block 210.

The PMU connector 320 to be coupled with the pogo pad 230 is installed at a portion of the edge portion of the stage 300 corresponding to the pogo pad 230. The PMU connector 320 serves to connect the PMU channel (not shown) and the pogo block PCB 230, and a coupling structure of the pogo block PCB 230 and the PMU connector 320 is illustrated in FIG. 4. As shown in FIG. 4, the PMU connector 320 includes a plurality of protrusions 325, and the pogo pad 230 includes a plurality of holes 235 into which the plurality of protrusions 325 are inserted. The protrusions 325 are coupled to each other by being inserted into the hole 235.

In addition, alignment screws 330 are respectively installed in the connection hole 240 and the lower plate 300 of the pogo block PCB 200, and the alignment screws 330 are inserted into and fixed to the connection hole 240. To align the pogo block PCB 200 and the lower plate 300.

A predetermined portion of the lower plate 300 is provided with a PMU connection auxiliary unit 340 for minimizing leakage current and contact resistance when the pogo block PCB 300 and the lower plate 300 contact each other. In addition, the back plate of the lower plate 300 is formed with a support plate 500 for supporting the lower plate 300.

Such a method of testing by mounting the probe card on the motherboard of the present invention is as follows.

After placing the probe card 400 on the stage 310, the PCB guide screw 215 of the pogo block PCB 210 is aligned and fixed to be inserted into the connection hole of the probe card 400. Next, the pogo block PCB 210 is covered to be integrated with the lower plate 300, and then a vacuum is applied from the vacuum locking device 220 to contact the probe card 400 and the pogo block 210.

At this time, in the present invention, as the lower plate 300 and the pogo block PCB 200 is formed separately, and the PCB guide screw 215 indicating the position of the probe card 400 is installed in the pogo block PCB 200. When the motherboard 100 is replaced because the type of the probe card 400 is changed, only the pogo block PCB 200 of the upper portion need not be replaced without replacing the entire motherboard 100. Accordingly, since there is no need to replace the lower plate 300, the cost of manufacturing and replacing the lower plate 300 is reduced.

In addition, since only the top pogo block PCB 200 needs to be replaced while the bottom plate 300 is fixed, it is possible to exclude the process of measuring the bottom plate 300 fine every time the replacement is performed, thereby reducing the system check time. Therefore, it is possible to reduce the trouble of having to make fine measurements.

Since the upper pogo block PCB 200 and the lower plate 300 are sealed by the vacuum locking device 220, it is possible to prevent contact wear due to screw wear and manual operation.

As described above in detail, according to the present invention, the lower plate and the PCB to which the pogo block to be bonded are mounted separately between the lower plate and the probe card are separately formed, and a guide screw for indicating the position of the probe card is poised. Install on the block PCB.

Accordingly, when the motherboard needs to be replaced due to the change of the probe card type, only the pogo block PCB needs to be replaced, not the lower plate, thereby reducing the cost of manufacturing and replacing the lower plate. In addition, since the lower plate is not changed, the system check time can be reduced.

In addition, since the lower plate and the pogo block PCB are bonded by a vacuum, contact failure between the pogo block and the probe card can be prevented.

Although the present invention has been described in detail with reference to preferred embodiments, the present invention is not limited to the above embodiments, and various modifications may be made by those skilled in the art within the scope of the technical idea of the present invention. .

Claims (4)

Bottom plate; A PCB formed separately from the bottom plate and including a pogo block bonded to the bottom plate with the probe card interposed therebetween; And A guide screw for aligning the probe card and the pogo block is installed at a predetermined portion of the pogo block. Motherboard of the probe card inspection apparatus, characterized in that when replacing the probe card only the PCB to match the corresponding probe card. The motherboard of claim 1, wherein the PCB further comprises a vacuum lock device which seals the edge of the pogo block by applying a vacuum when the bottom plate is bonded to the bottom plate. According to claim 1 or 2, wherein the selected connection portion of the PCB is provided with a connection hole for alignment, The lower plate corresponding to the connection hole is a mother board of the probe card inspection apparatus, characterized in that the position fixing screw is inserted into the connection hole is installed. According to claim 1 or 2, Pogo pad is further provided in a predetermined portion of the PCB for electrically connecting the PCB and the external PMU channel, the portion corresponding to the pogo pad of the lower plate PMU connector The motherboard of the probe card inspection apparatus, characterized in that is further installed.