KR20040080017A - wafer fixing apparatus of ion-implanter - Google Patents

Abstract

PURPOSE: A wafer fixing apparatus of ion implantation equipment is provided to form a contact state between a lateral part of a wafer and a finger and reduce the damage of the wafer by sliding a slider to press a wafer toward a fence. CONSTITUTION: A block(30) is fixed on the back side of a disk(10). A slider is used for performing a sliding guide operation to block. A finger is fixed to the slider and penetrates the front side of the disk. An extended part of the finger is opposite to a lateral part of the wafer. An elastic member(42) is used for providing the elastic force for the slider in order to press the wafer toward a fence on a pad. A lift(44) is used for sliding the slider by pressing the elastic member to the opposite direction of the elastic member.

Description

Wafer fixing apparatus of ion-implanter

The present invention relates to a wafer holding device of an ion implantation facility for fixing the wafer to prevent the separation of the wafer with respect to the implant disk that rotates at a high speed so that ions are uniformly injected to the surface of the wafer.

In general, the ion implantation process in the semiconductor device manufacturing process is a process to add the impurities into the wafer substrate in addition to the thermal diffusion process so that the device has an electrical characteristic. In particular, due to the advantages of easy control of the concentration of impurities and precise control of the implantation depth of impurities, it has been spotlighted as a very useful technology in terms of trends and aspects of high integration and density.

As shown in FIG. 1, the general configuration of the in-ion implantation apparatus for performing the ion implantation process described above includes a disk 10 configured to rotate at a high speed in a chamber (not shown) constituting a process atmosphere. Usually, a plurality of pads 1 are provided to mount one wafer W each. In addition, one side of the disk 10 is provided with a transfer unit 14 for sequentially mounting the wafer (W) on the corresponding pad (12).

Meanwhile, on the pad 12 described above, as shown in FIG. 1 or 2, the fence 16 supporting the side of the wafer W placed on the pad 12 at one edge portion of the pad 12. The other side portion of the fence 16, that is, the center of the pad 12, is in contact with the side portion of the corresponding wafer W and elastically pushes in the direction of the fence 16 described above. Finger 18 is provided.

At this time, the relationship between the finger 18 and the fence 16 with respect to the wafer W is to press elastically against the wafer W placed therebetween, and from the centrifugal force due to the high speed rotation of the disk 10, the wafer ( It plays the role of catching to prevent departure of W).

Here, the fence 16 is in a fixed state, and the fingers 18 are relatively spaced apart in the process of placing the wafer W on the pad 12 and then facing the wafer W after the wafer W is placed. It has an elastic position change which presses the side part of the to the fence 16 direction.

In the above-described configuration, the prior art of the configuration of the operation relationship of the finger 18 for fixing the wafer W, that is, the configuration of the wafer W fixing device will be described with reference to FIG.

As shown in FIG. 3, the rod-shaped finger 18 contacts the wafer W side by penetrating the disk 10 at an upper portion thereof facing the fence 16 with the wafer W therebetween. Laid out possibly, the lower part of the finger 18 is elastically supported by the elastic member 22 fixed to the fixing member 20 at the bottom of the disk 10. The lower end of the finger 18 is connected with a lever 24 having a shape extending from the finger 18. The lever 24 is interlocked with the finger 18 and connected with the elastic force of the elastic member 22. The lift 26 which drives up and down from the lower side is configured to rotate in a predetermined angle range. Here, the elastic member 22 provides a force to which the upper end of the finger 18 pushes the side of the wafer W in the direction of the fence 16, and lifts the lever 24 connected to the finger 18 as described above. 26) provide an elastic force to remain in contact with it.

Looking at the mounting process of the wafer (W) from such a configuration, when the wafer (W) is transferred from the transfer unit 14, the above-mentioned lift 26 is driven up and down to push up the lever 24, and accordingly the lever 24 and The connected fingers 18 are spaced apart to enable the wafer W to rest on the pad 12 in cooperation. Subsequently, when the wafer W is placed on the pad 12, the lift 26 is driven downward, and at the same time, the finger 18 and the lever 24, which receive the elastic force of the elastic member 22, interlock with each other and the finger 18. The wafer W is fixed by pressing the side of the wafer W to push it toward the fence 16.

However, in the process of fixing the wafer, the finger is elastically rotated based on the portion supported by the leaf spring to locally press the edge side of the wafer, and the position of the lever according to the driving of the lift and the elastic force of the leaf spring. If the motion of the finger is not in the correct setting relationship, the finger strikes the wafer with a stronger force and causes a problem of damaging the wafer. This is due to the finger contacting or colliding at an angle corresponding to the side of the wafer, and the angle made by the finger relative to the wafer is caused by damage or deformation of the leaf spring from continuous use. In addition, there is also a problem in that the rod generated while pushing the above-mentioned lever acts as a rod of the motor for driving the lift, thereby shortening the replacement cycle of the motor.

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art, by sliding the finger horizontally with respect to the surface on which the wafer is placed by the sliding action of the reciprocating movement of the lift, and pressing the wafer in the fence direction, It is to provide a wafer holding device of the ion implantation equipment to widen the contact area to reduce the damage of the wafer, thereby improving the productivity, and to extend the service life of each component in conjunction with the finger.

1 is a plan view schematically illustrating a wafer mounting relationship in a general ion implantation facility.

FIG. 2 is a plan view schematically illustrating the fixing relationship of the wafer illustrated in FIG. 1.

3 is a schematic cross-sectional view for explaining the configuration of the wafer holding apparatus according to the prior art and the coupling relationship between these configurations with reference to the III-III line shown in FIG.

4 is a cross-sectional view schematically showing the configuration of the wafer holding apparatus and its coupling relationship according to an embodiment of the present invention.

5 is a cross-sectional view schematically showing a configuration of a wafer holding apparatus and a coupling relationship thereof according to another embodiment of the present invention.

6 is a cross-sectional view schematically showing a configuration of a wafer holding apparatus and a coupling relationship thereof according to still another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10: disc 12: pad

14: transfer unit 16: fence

18, 40, 64, 86: finger 20: holding member

22, 42, 56a, 56b, 80: elastic member 24: lever

26, 44, 62, 84: lift 30, 50a, 50b, 50c, 70a, 70b: block

52, 72: gap adjusting member 54: guide hole

60, 82: roller 66: guide rail

A characteristic configuration of the present invention for achieving the above object is a block fixed to the rear of the disk; A slider for sliding guide the block; A finger which is fixed to the slider and extends through the front surface of the disk and faces the side of the wafer placed on the pad; An elastic member receiving the support of the block and providing an elastic force to the slider such that the finger presses the wafer against the fence on the pad; And a lift for sliding the slider by pressing in a direction opposite to the elastic member in a reciprocating motion.

Hereinafter, a wafer fixing apparatus of an ion implantation apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

4 is a cross-sectional view schematically showing the configuration and the coupling relationship of the wafer holding device according to an embodiment of the present invention, Figure 5 is a schematic view of the configuration and the coupling relationship of the wafer holding device according to another embodiment of the present invention 6 is a cross-sectional view schematically showing a configuration and a coupling relationship of a wafer holding device according to still another embodiment of the present invention. The same reference numerals are given to the same parts as in the prior art, and detailed description thereof will be omitted. Let's do it.

As shown in FIGS. 4 to 6, the wafer holding device configuration of the ion implantation apparatus according to the present invention has blocks 30 and 50a having a predetermined shape on the bottom surface of the disk 10 proximate to the outer periphery of the lower portion of the pad 12. , 50b, 50c, 70a, 70b) are fixed by a conventional method. In addition, a slider is mounted on the blocks 30, 50a, 50b, 50c, 70a, 70b, which are guided by the blocks 30, 50a, 50b, 50c, 70a, 70b to the center direction of the pad 12. That is, the shape of the wafer W may be slid in a direction in which the side of the wafer W is supported to be supported by the fence 16. Fingers 40, 64, and 86 are mounted on the slider, and the fingers 40, 64, and 86 are placed on the pad 12 by penetrating holes formed on the disk 10 with upper ends thereof. It is opposed to the side of W), and is approached or spaced apart by the side of the wafer W by sliding movement of a slider. In addition, between the blocks 30, 50a, 50b, 50c, 70a, 70b and the slider, the fingers 40, 64, 86 face each other with the support of the blocks 30, 50a, 50b, 50c, 70a, 70b. Elastic members 42, 56a, 56b, and 80 are provided to provide elasticity to the slider to push the wafer W in the direction of the fence 16. One side of the slider is configured to receive a force corresponding to the elastic force of the elastic members 42, 56a, 56b, and 80 from the lowering and lowering of the lifts 44, 62, and 84 from the bottom of the pad 12. .

Here, the side shape of the lift 44 corresponding to the slider shown in FIG. 4 forms an inclined surface at a predetermined angle with respect to the up / down driving direction and the direction corresponding to the elastic force of the elastic member 42. The side of the slider has an inclined surface in contact with each other to induce sliding movement of the slider by sliding action.

As another example, the implementation configuration between the sliders 62 and 84 shown in FIG. 5 or 6 forms the inclined surfaces of the lifts 62 and 84 and the rollers 60 and 82 on the side of the slider corresponding thereto. It is more preferable that the configuration to reduce the friction of the slider against the inclined surface of the lift (62, 84).

Meanwhile, the configurations of the blocks 50a, 50b, 50c, 70a, and 70b shown in Figs. 5 and 6 include the first blocks 50a and 70a and the first block (fixed to the outer periphery where the pad 12 is located). Supported by the gap adjusting member 52, 72 from the 50a, 70a to form a shape extending in the center direction of the pad 12, the guide hole 54 for guiding the sliding movement of the slider in the extension direction It may be made of a second block (50b, 70b) having a).

In the above-described configuration, the elastic members 42, 56a, 56b, and 80 may be formed of blocks (see Figs. 4 to 6) such that the fingers 40, 64, and 86 are in a direction approaching the side of the wafer W. 30, 50a, 50b, 50c, 70a, 70b, which can be formed by a compression coil spring that pushes the slider, and the blocks 30, 50a, at positions close to the lifts 44, 62, 84 in the configuration of FIG. One side is fixed to 50b, 50c, 70a, and 70b, and the other side is fixed to the slider and may be configured as a tension coil spring that pulls the slider toward the pad 12 center, or a combination thereof. In the configuration in which the elastic members 42, 56a, 56b and 80 are supported by the block 50c proximate to the lifts 44, 62 and 84, the second blocks 50b and 70b are the elastic members 42 and 56a. , 56b, 80 may be configured to be separated from the first block (50a, 70a) to the lift (44, 62, 84) to the third block (50c) to adjust the elastic force and thus the sliding position of the slider. In this case, the third block 50c is preferably adjusted to be spaced apart from the second blocks 50b and 70b through the gap adjusting members 52 and 72.

In the configuration shown in FIG. 5, the above-described guide hole is provided between the first blocks 50a and 70a and the second blocks 50b and 70b or between the first blocks 50a and 70a and the third block 50c. It may be configured to further comprise a guide rail 66 for guiding the sliding movement of the slider in place of or in parallel with (54).

Looking at the operation process of this configuration, in response to the transfer of the wafer W from the transfer unit 14, the lift (44, 62, 84) is driven up and down, formed on the upper portion of the lift (44, 62, 84) In the slider corresponding to the inclined surface, the inclined surface or the rollers 60 and 82 are subjected to pressure relative to the elastic force of the elastic members 42, 56a, 56b and 80 according to the change in contact displacement of the inclined surface. From this, the slider is guided by blocks 30, 50a, 50b, 50c, 70a, 70b to slide the wafer 40 relative to the pad 12 by sliding the fingers 40, 64, 86 in a direction away from the pad 12. A state in which (W) can be placed is achieved. When the wafer is placed and seated through this process, the above-mentioned lifts 44, 62, and 84 are driven downward, and the sliders provided with the elastic force of the elastic members 42, 56a, 56b, and 80 are lifts 44, 62, and 84. ), The upper portion of the mounted fingers 40, 64, 86 moves in contact with the side of the opposite wafer W. In this process, the fingers 40, 64, and 86 press the wafer W toward the fence 16 with the appropriate elastic force of the elastic members 42, 56a, 56b, and 80, and from this, the wafer against the pad 12 (W) is fixed. On the contrary, when the process is completed, the wafer W may be taken out in the reverse order of the above-described process.

Therefore, according to the present invention, as the finger slides together with the slider due to the sliding action by the reciprocating movement of the lift and presses the wafer in the fence direction, the finger contacts with the wafer side, thereby reducing damage to the wafer, including the finger. There is an effect of preventing damage to each component and thereby extending the life.

Although the present invention has been described in detail only with respect to specific embodiments, it will be apparent to those skilled in the art that modifications and variations can be made within the scope of the technical idea of the present invention, and such modifications or changes belong to the claims of the present invention. something to do.

Claims (8)

A block fixed to the rear of the disk; A slider for sliding guide the block; A finger which is fixed to the slider and extends through the front surface of the disk and faces the side of the wafer placed on the pad; An elastic member receiving the support of the block and providing an elastic force to the slider such that the finger presses the wafer against the fence on the pad; And And a lift for sliding the slider by pressing in a direction opposite to the elastic member in a reciprocating motion. The method of claim 1, The inclined surface with respect to the sliding direction is further formed on the slide side corresponding to the lift, The lift is a wafer holding device of the ion implantation equipment, characterized in that by further forming a slope corresponding to the sliding contact with the inclined surface so that the sliding movement of the slider by a reciprocating motion. The method of claim 1, Further provided with a roller on the slide side corresponding to the lift, The lift is a wafer holding device of the ion implantation facility, characterized in that further formed by the inclined surface corresponding to the roller contact so that the sliding movement of the slider by the reciprocating motion. The method of claim 1, The block is a first block fixed to the periphery of the pad; The second block is supported by the gap adjusting member from the first block, and consists of a second block having a guide hole for guiding the sliding movement of the slider in the direction extending to the pad center. Wafer fixing device of the ion implantation equipment. The method of claim 4, wherein The elastic member is a wafer holding device of the ion implantation equipment, characterized in that consisting of a compression coil spring which is supported by the first block and pushes the slider placed on the guide hole. The method of claim 4, wherein And a tension coil spring provided on the second block to pull the slider toward a pad center direction. The method of claim 6, In response to the elastic member configured to pull the slider from the extended side of the second block with a tensile force, the second block extends the elastic force of the elastic member and thus adjusts the sliding position of the slider. Separating in a configuration having a third block, and configured to be adjusted to the gap through the gap adjusting member with respect to the third block. The method of claim 4, wherein And a guide rail for guiding sliding movement of the slider on the first block and the second block.