JP4118022B2 - Scribing method and scribing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor substrate scribing method and scribing apparatus, and more particularly to a scribing method and scribing apparatus in which the needle pressure of a scribing needle is controlled.
[0002]
[Prior art]
FIG. 6 is a side view of a conventional scribing apparatus generally indicated by 500 described in, for example, Japanese Patent Application Laid-Open Nos. 59-90940 and 60-12386.
[0003]
The scribing device 500 is provided with a lifting drive means 1. An arm 3 supported by an arm support portion 2 is attached to the lift drive means 1. The scribing device 500 is provided with a stage 4 that can move in the XY directions. A laser diode array element (hereinafter referred to as “LD array element”) 6 attached to the adhesive tape 5 is fixed on the stage. The LD array element 6 has a bar shape, and both side surfaces in the longitudinal direction are cleaved surfaces.
[0004]
The arm support 2 and the arm 3 are connected by a rotation shaft 7. A pressure spring 8 is provided between the arm 3 and the arm support portion 2. A scribe needle 10 for forming a scribe line 9 in the LD array element 6 is provided at the tip of the arm 3.
[0005]
Next, a conventional method for forming a scribe line will be described with reference to FIG. In the conventional method, first, as shown in FIG. 7A, the LD array element 6 attached to the adhesive tape 5 is fixed on the stage 4. In this state, the elevating drive means 1 lowers the arm support portion 2 along the elevating guide 16.
[0006]
Next, as shown in FIG. 7B, when the scribe needle 10 contacts the ID array element 6, the arm 3 rotates away from the contact stopper 17 around the rotation shaft 7 and is scribed by the pressure spring 8. A needle pressure is applied to the needle 10.
In a state in which a predetermined needle pressure is applied to the scribe needle 10, the lowering of the arm support portion 2 is stopped.
[0007]
Next, as shown in FIG. 7C, the stage 4 is moved horizontally to form a scribe line 9 having a substantially V-shaped cross section on the surface of the LD array element 6.
[0008]
Finally, as shown in FIG. 7 (d), after the scribe line 9 having a predetermined length is formed, the movement of the stage 4 is stopped, the arm 2 is raised by the lift drive means 1, and the LD array element 6 is The scribe needle 10 is released from the surface.
Subsequently, after the stage 4 is moved in the direction indicated by the arrow 18, the next scribe line 9 is formed by performing the steps (a) to (d) again. By repeating this process, a plurality of scribe lines 9 are formed on the LD array element 6.
[0009]
The LD array element 6 on which the scribe line 9 is formed is divided along the scribe line 9 by, for example, pressing the back surface with a roller-shaped jig after being removed from the stage 4.
[0010]
FIG. 8A shows the relationship between the position of the scribe needle and the needle load of the scribe needle in the scribe line forming step. FIG. 8B shows the position of the LD array element corresponding to the horizontal axis of FIG.
As can be seen from FIGS. 8 (a) and 8 (b), in the scribe line forming step, the scribe needle is lowered to the scribe start point separated from the cleavage surface of the LD array element by a predetermined distance and pressurized to the maximum load. . Subsequently, the LD array element moves while maintaining the maximum load, and a scribe line is formed. Finally, when the scribe needle reaches the scribe end point, the LD array element stops, the scribe needle moves up and leaves the LD array element, and the formation of the scribe line is completed.
[0011]
[Problems to be solved by the invention]
As described above, in the conventional scribe device (point scriber), since the scribe needle pressure is fixed, it is difficult to control the shape of the scribe line during formation of the scribe line on the LD array element. It was.
In particular, the scribe start point and the scribe end point are singular points where the shape of the scribe line changes depending on when the scribe needle contacts or leaves, and the scribe line shape having a substantially V-shaped cross section formed on the surface of the LD array element is At the scribe start point and the scribe end point, the shape was substantially different from the V shape.
For this reason, for example, when the back surface of the LD array element on which the scribe line is formed is pressed with a roller-shaped jig and divided along the scribe line, the singularity where the cross-sectional shape of the scribe line is different from the others is abnormal Cause cracking and chipping.
[0012]
Also, since the depth of the scribe line is determined by the compliance of the pressure spring that presses the scribe needle, the depth of the scribe line varies due to variations in the thickness of the LD array element and the elasticity of the adhesive tape, thereby dividing the element. In some cases, it was the cause of cracking and chipping.
[0013]
Furthermore, the optimum shape of the scribe line varies depending on the material of the base material, the epitaxial growth layer formed on the substrate, the electrode, and the like, and it is desired to control the shape of the scribe line.
[0014]
Accordingly, an object of the present invention is to provide a scribing method and a scribing apparatus capable of controlling the shape of a scribe line in order to solve the above problem.
[0015]
[Means for Solving the Problems]
The present invention is a scribing method for forming a scribe line on a semiconductor substrate on which a semiconductor element is formed, bringing a scribe needle into contact with the surface of the semiconductor substrate, moving the scribe needle relative to the semiconductor substrate to form a scribe line, Including a step of separating the scribe needle from the upper surface of the semiconductor substrate after forming the scribe line, and the interaction between the magnetic field generated by the current flowing through the coil of the voice coil linear motor and the magnetic field of the magnet causes the surface of the semiconductor substrate to In contrast, the scribe needle is moved in a substantially vertical direction, and the stylus pressure against which the scribe needle is pressed against the surface of the semiconductor substrate is gradually increased from the initial load during the formation of the scribe line to a constant maximum load, and the maximum load is maintained. The current flowing through the coil must be controlled so that it gradually decreases to the final load. A scribing method and forming a scribe line.
By controlling the needle pressure of the scribe needle using such a method, it is possible to form a scribe line having a uniform shape. In particular, the scribe line is prevented from becoming an abnormal shape at the scribe start point and the scribe end point, and the occurrence of abnormal cracking or the like when the LD array element is divided along the scribe line is prevented. The manufacturing yield of the element can be improved.
Also, the shape of the scribe line can be changed according to the material of the base material.
[0016]
The present invention further includes an observation step of observing the shape of the scribe line, and the initial load of the scribe needle and / or the scribe line so that the shape of the scribe line is substantially uniform based on the shape of the scribe line observed in the observation step. A scribing method including a setting step of setting a final load.
By including such an observation step and a setting step, the shape of the scribe line can be more accurately and arbitrarily controlled.
[0017]
The present invention is also a scribing method characterized in that after forming one scribe line, an observation step and a setting step are performed, and then another scribe line is formed.
[0018]
The present invention is also a scribing method characterized in that an observation step and a setting step are performed during the formation of one scribe line, and the setting conditions are applied to the formation of one scribe line.
[0019]
The present invention is a scribing apparatus for forming a scribe line with a scribe needle on the surface of a semiconductor substrate, and is supported by a stage on which the semiconductor substrate is placed and a semiconductor substrate that is movably supported in a direction substantially perpendicular to the surface of the semiconductor substrate. A scribe needle that moves with respect to the semiconductor substrate to form a scribe line in contact with the surface of the substrate; and a control means that controls a needle pressure with which the scribe needle is pressed against the semiconductor substrate. A scribe needle is fixed, and includes an arm provided with a coil, and an arm support portion provided with a magnet and supported so that the arm moves around a rotation shaft. The coil and the magnet are voice coil linear motors. The rotating shaft is formed by the interaction between the magnetic field generated by the current control that flows current through the coil and the magnetic field of the magnet. The arm is moved around, and the stylus pressure of the scribe needle fixed to the arm is gradually increased from the initial load to a constant maximum load, and after the maximum load is maintained, it is controlled to gradually decrease to the final load. It is also a scribing device characterized by this.
By using such a scribe device, a scribe line having a uniform shape can be formed. In particular, the scribe line is prevented from having an abnormal shape at the scribe start point and the scribe end point, and the occurrence of abnormal cracking or the like when the LD array element is divided along the scribe line is prevented. The manufacturing yield of the element can be improved.
It is also possible to form a scribe line having a shape suitable for the material of the base material.
Furthermore, by using a voice coil type linear motor, it is possible to control the stylus pressure of the scribe needle more easily and with high responsiveness.
[0020]
The present invention is a scribing apparatus for forming a scribe line with a scribe needle on the surface of a semiconductor substrate, and is supported by a stage on which the semiconductor substrate is placed and a semiconductor substrate that is movably supported in a direction substantially perpendicular to the surface of the semiconductor substrate. A scribe needle that moves with respect to the semiconductor substrate to form a scribe line in contact with the surface of the substrate; and a control means that controls a needle pressure with which the scribe needle is pressed against the semiconductor substrate. A coil attached to the scribe needle and an arm provided with a magnet so that the scribe needle can be moved in the substantially longitudinal direction. The coil and the magnet form a voice coil linear motor, and the coil The scribe needle is moved by the interaction between the magnetic field generated by passing an electric current through the magnet and the magnetic field of the magnet. By the needle pressure, gradually increase to become constant maximum load from an initial load, there is also a scribe device and controls to a final load gradually decreases and after the maximum load has been maintained.
[0021]
The present invention further includes observation means for observing the shape of the scribe line and setting means for setting the needle pressure of the scribe needle based on the observation result by the observation means.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
FIG. 1 is a schematic diagram of a scribing device represented as a whole by 100 according to the first embodiment of the present invention. FIG. 2 shows a part of the scribing device. FIG. 2A shows a side view and FIG. 2B shows a back view. In FIG. 1, 2, the same code | symbol as FIG. 6 shows the same or an equivalent location.
[0023]
As shown in FIG. 1, the scribing apparatus 100 includes a scribing line observation means 12 in addition to the conventional scribing apparatus 500 and can observe the shape of the scribing line formed by the scribing needle 10.
[0024]
A stage controller 21 is connected to the stage driving means 11 attached to the stage 4 and the elevation driving means 1 attached to the arm support portion 2. In addition, a needle pressure controller 22 is connected to the arm 3. An image processing device 23 is connected to the scribe line observation unit 12. The stage controller 21, the needle pressure controller 22, and the image processing device 23 are connected to the control device 24. The control device 24 controls the stage controller 21 and the needle pressure controller 22 based on data obtained from the image processing device 23.
[0025]
Further, as shown in FIGS. 2A and 2B, the arm support portion 2 is provided with a magnet 13, while the arm 3 is provided with a coil 14.
When the scribing device 100 is stopped, the tip of the scribing needle 10 attached to the arm 3 is positioned on substantially the same horizontal plane as the central axis of the rotation shaft 7 of the arm 3. The rotating shaft 7 is supported by the bearing 15 in a friction-free state.
[0026]
When a current is passed through the coil 14, the arm 3 rotates around the rotation axis 7 due to the interaction between the magnetic field generated in the coil 14 and the magnetic field of the magnet 13, and a direction substantially perpendicular to the surface of the LD array element 6. Next, the tip of the scribe needle 10 is moved. The moving distance of the scribe needle 10, that is, the needle pressure with which the scribe needle 10 pressurizes the LD array element 6 can be continuously changed according to the current value flowing through the coil 14.
[0027]
Next, a method for forming a scribe line according to the present embodiment will be described with reference to FIG.
First, as shown in FIG. 3A, in the standby state, no current is passed through the coil 14, or a very weak current is passed, and the arm 2 is held substantially horizontally. In such a state, the arm 2 is in contact with the contact stopper 17 and is stationary. The scribe needle 10 is also held at a position away from the LD array element 6.
[0028]
Next, as shown in FIG. 3B, the elevating drive means 1 lowers the arm support portion 2 along the elevating guide 16. When the scribe needle 10 contacts the LD array element 6, the arm 2 moves away from the contact stopper 17. When this is sensed and a current is passed through the coil 3, an interaction occurs between the magnetic field generated by the current flowing through the coil 14 and the magnetic field of the magnet 6, and the arm 2 has a turning moment about the rotating shaft 7. give. Thereby, at the scribe start point, the scribe needle 10 pressurizes the surface of the LD array element 6 with a predetermined needle pressure.
[0029]
Next, as shown in FIG. 3C, the stage 4 on which the LD array element 6 is mounted is moved to form a scribe line 9 in a direction substantially perpendicular to the longitudinal direction of the LD array element 6. The scribe line 9 is formed while controlling the current flowing through the coil 3 based on the position information of the stage controller 21.
When the scribe needle 10 moves to a predetermined position, the current flowing through the coil 3 is gradually reduced.
[0030]
Finally, as shown in FIG. 3 (d), at the scribe end point, the elevation drive means 1 raises the arm support portion 2 and separates the scribe needle 10 from the surface of the LD array element 6.
[0031]
FIG. 4A shows the relationship between the position of the scribe needle and the needle load of the scribe needle in the scribe line forming step. FIG. 4B shows the position of the LD array element corresponding to the horizontal axis of FIG.
As shown in the pressure profile 1 of FIG. 4A, the scribe needle is lowered to a scribe start point that is a predetermined distance away from the cleavage plane of the LD array element. At the scribe start point, the needle load is set to a predetermined initial load.
Next, the load gradually increases during the formation of the scribe line, and is kept constant at the maximum load.
Before the formation of the scribe line is completed, the load gradually decreases and reaches a predetermined final load at the scribe end point.
When the scribe needle reaches the scribe end point, the movement of the stage is completed, and the scribe needle rises and leaves the LD array element.
Note that the needle load during the formation of the scribe line may be changed in a curve, for example, as in the pressurizing profile 2 shown in FIG.
[0032]
When the formation of one scribe line is completed, the shape of the scribe line is observed by the scribe line observation means 12, and the observation result is sent to the control device 24 as image data. Based on the image data, it is determined whether or not the stylus pressure and moving speed of the scribe needle set to form the scribe line are appropriate. Based on this determination, if necessary, the conditions for forming the next scribe line are corrected.
[0033]
As described above, after the feedback is applied to the scribe line formation conditions, the next scribe line is formed by performing the steps of FIGS.
[0034]
Here, after the formation of one scribe line, the scribe line was observed and the formation conditions of the next scribe line were corrected, but the scribe line shape was observed in real time during the formation of the scribe line, and the needle pressure was adjusted. It is also possible to control.
[0035]
In this way, the scribe needle pressure at the time of scribe line formation is controlled to be small at the scribe start point and the scribe end point, for example, so that a scribe with a uniform shape that does not have a unique shape at these points is obtained. A line can be formed. As a result, it is possible to eliminate cracks and chips that occur when the LD array element is divided along the scribe line.
[0036]
In addition, since the needle pressure of the scribe needle can be set arbitrarily by changing the current flowing through the coil, for example, a scribe line having a constant shape is formed without being affected by the thickness and rigidity of auxiliary parts such as adhesive tape. be able to. As a result, it is possible to eliminate cracks and chippings that occur when the LD array element is divided.
[0037]
Further, by observing the shape of the scribe line while forming the scribe line, the needle pressure can be changed in real time according to the shape of the scribe line. For this reason, the fluctuation | variation of the shape of a scribe line can be corrected, and the scribe line with the fixed shape can be obtained.
[0038]
In the present embodiment, the stage 4 on which the LD array element 6 is mounted is moved to form the scribe line. However, the stage 4 may be fixed and the arm 3 or the like may be moved to form the scribe line. .
[0039]
In this embodiment, for example, the rotating shaft 7 of the arm 3 is supported using a ball bearing. However, by using a static pressure rotating bearing, the friction between the rotating shaft 3 and the bearing 15 is reduced. It can be almost eliminated, and more delicate control of the needle pressure becomes possible.
[0040]
In particular, by controlling the needle pressure with the voice coil type linear motor as described above, the needle pressure can be controlled easily and responsively, and a free needle pressure curve can be obtained.
[0041]
Embodiment 2. FIG.
FIG. 5 is a side view of the scribing apparatus denoted as a whole by 200 according to the second embodiment of the present invention. The same reference numerals as those in FIG. 1 denote the same or corresponding parts.
In the scribing device 200, the arm 3 is fixed to the arm support portion 2.
The scribe needle 10 is supported by a direct-acting static pressure bearing 25 provided on the arm 2. The scribe needle 10 is provided with a coil 26, while the arm 3 is provided with a magnet 27. When a current is passed through the coil 26 of the scribe needle 10, a magnetic field is generated in the coil 26, and the scribe needle 10 moves by interaction with the magnetic field of the magnet of the arm 3.
[0042]
In such a scribing device 200, since only the scribing needle 10 and the coil 26 provided on the scribing needle 10 are movable portions, the mass of the movable portion is significantly smaller than that of the scribing device 100 described above, and the influence of inertial force is reduced. Can be suppressed. For this reason, more delicate control of the needle pressure of the scribe needle 10 is possible.
It is also possible to use other general linear motion low friction bearings for the linear motion static pressure bearing 25.
[0043]
【The invention's effect】
As is clear from the above description, the scribing apparatus according to the present invention can form a scribe line having a uniform shape. In particular, the scribe line is prevented from becoming an abnormal shape at the scribe start point and the scribe end point, and the occurrence of abnormal cracking or the like when the LD array element is divided along the scribe line is prevented. The manufacturing yield of the element can be improved.
[0044]
Further, since the needle pressure of the scribe needle is controlled by a voice coil type linear motor, it is possible to control the needle pressure delicately.
[0045]
Further, by forming the scribe line while observing the shape of the scribe line, the needle pressure of the scribe needle can be controlled in real time, and the controllability of the shape of the scribe line is improved.
[0046]
Furthermore, the controllability of the scribe needle is further improved by controlling the needle pressure by moving only the scribe needle.
[Brief description of the drawings]
FIG. 1 is a schematic diagram of a scribing apparatus according to a first embodiment of the present invention.
2A and 2B are a side view and a rear view of the scribing apparatus according to the first embodiment of the present invention.
FIG. 3 is a process for forming a scribe line according to the first embodiment of the present invention;
FIG. 4 is a profile of a needle load in the scribing apparatus according to the first embodiment of the present invention.
FIG. 5 is a side view of a scribing apparatus according to a second embodiment of the present invention.
FIG. 6 is a side view of a conventional scribing device.
FIG. 7 is a conventional process for forming a scribe line.
FIG. 8 is a profile of a needle load in a conventional scribing device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Lifting drive means, 2 Arm support part, 3 Arm, 4 Stage, 5 Adhesive tape, 6 LD array element, 7 Rotating shaft, 8 Pressure spring, 9 Scribe line, 10 Scribe needle, 11 Stage drive means, 12 Scribe line Observation means, 13 magnet, 14 coil, 15 bearing, 16 lift guide, 17 contact stopper, 21 stage controller, 22 needle pressure controller, 23 image processing device, 24 control device, 100 scribe unit device.

Claims (7)

In a scribe method for forming a scribe line on a semiconductor substrate on which a semiconductor element is formed,
A step of bringing a scribe needle into contact with the surface of the semiconductor substrate, moving the scribe needle relative to the semiconductor substrate to form a scribe line, and releasing the scribe needle from the upper surface of the semiconductor substrate after the formation of the scribe line. Including
Due to the interaction between the magnetic field generated by the current flowing in the coil of the voice coil linear motor and the magnetic field of the magnet, the scribe needle is moved in a direction substantially perpendicular to the surface of the semiconductor substrate,
During the formation of the scribe line, the needle pressure with which the scribe needle is pressed against the surface of the semiconductor substrate is gradually increased from the initial load to a constant maximum load, and after the maximum load is maintained, the needle pressure is gradually decreased to the final pressure. A scribing method, wherein the scribing line is formed while controlling a current flowing through the coil so as to be a load. Furthermore, an observation step of observing the shape of the scribe line,
A setting step of setting the initial load and / or the final load of the scribe needle so that the shape of the scribe line becomes substantially uniform based on the shape of the scribe line observed in the observation step. The scribing method according to claim 1. The scribing method according to claim 2 , wherein after the formation of one scribe line, the observation step and the setting step are performed, and then another scribe line is formed. 3. The scribing method according to claim 2 , wherein the observation step and the setting step are performed during the formation of one scribe line, and the setting conditions are applied to the formation of the one scribe line. A scribing device that forms a scribe line with a scribe needle on the surface of a semiconductor substrate,
A stage on which a semiconductor substrate is placed;
A scribe needle that is supported so as to be movable in a substantially vertical direction with respect to the surface of the semiconductor substrate, and that is in contact with the surface of the semiconductor substrate to form a scribe line by moving with respect to the semiconductor substrate;
Control means for controlling the needle pressure with which the scribe needle is pressed against the semiconductor substrate,
The control means
An arm on which the scribe needle is fixed and a coil is provided;
An arm support that is supported so that the arm moves about a rotation axis and is provided with a magnet;
The coil and the magnet form a voice coil linear motor,
The arm is moved around the rotation axis by the interaction between the magnetic field generated by the current control for passing a current through the coil and the magnetic field of the magnet, and the needle pressure of the scribe needle fixed to the arm is reduced. The scribing apparatus is characterized in that it is controlled so as to gradually increase from the initial load to a constant maximum load, and to gradually decrease to the final load after the maximum load is maintained . A scribing device that forms a scribe line with a scribe needle on the surface of a semiconductor substrate,
A stage on which a semiconductor substrate is placed;
A scribe needle that is supported so as to be movable in a substantially vertical direction with respect to the surface of the semiconductor substrate, and that is in contact with the surface of the semiconductor substrate to form a scribe line by moving with respect to the semiconductor substrate;
Control means for controlling the needle pressure with which the scribe needle is pressed against the semiconductor substrate,
The control means
A coil attached to the scribe needle;
The scribe needle is attached so as to be movable in the substantially longitudinal direction and includes an arm provided with a magnet.
The coil and the magnet form a voice coil linear motor,
The scribe needle is moved by the interaction between the magnetic field generated by passing an electric current through the coil and the magnetic field of the magnet, and the needle pressure is gradually increased from the initial load to become a constant maximum load. A scribing device characterized by controlling so that the maximum load is gradually reduced to a final load after the maximum load is maintained . Furthermore, an observation means for observing the shape of the scribe line,
The scribing apparatus according to claim 5 , further comprising setting means for setting the needle pressure of the scribe needle based on an observation result by the observation means.

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